Bonding alignment assembly and bonding device
By designing a bonding alignment component, high-precision alignment between the chip and the wafer is achieved using positioning and detection components, solving the problems of low precision and long time consumption in existing technologies and improving the bonding efficiency of small-sized semiconductor devices.
Patent Information
- Application Number
- CN202422685061.8
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-11-04
- Publication Date
- 2025-12-02
- Estimated Expiration
- 2034-11-04
AI Technical Summary
In existing technologies, the bonding accuracy between chips and packaging substrates is low and the bonding time is long, making it difficult to meet the high precision requirements of small-sized semiconductor devices.
A bonding alignment assembly, including a bonding head, a chip holder, and a wafer holder, is used. Precise alignment is achieved by setting first and second positioning elements, combined with a horizontal detection element and an optical module for real-time correction, thus realizing high-precision alignment between the chip and the wafer.
It improves the alignment accuracy and efficiency between chips and wafers, reduces alignment time, and is suitable for high-precision bonding of small-sized semiconductor devices.
Smart Images
Figure CN223624930U_ABST
Abstract
Description
Technical Field
[0001] This application relates to the field of semiconductor fabrication technology, and more specifically, to a bonding alignment component and bonding apparatus. Background Technology
[0002] In advanced packaging technologies, there is a chip bonding technology called flip-chip bonding. As the name suggests, it involves directly connecting the chip face down to the packaging substrate or wafer. In practical applications, bonding devices are typically used to bond the chip and the packaging substrate. Specifically, the bonding head picks up the chip and transfers it onto the packaging substrate or wafer, and then performs the bonding. During this process, the positions of the chip and the packaging substrate must correspond one-to-one.
[0003] As the size and pattern of semiconductor devices and circuits shrink, with feature sizes ranging from 3nm to 7nm, the size of input / output connectors is also decreasing. This necessitates extremely high mounting accuracy during pick-and-place operations. Current technology uses two bonding heads to position the chip and the package substrate separately before bonding. This bonding method has low accuracy and is time-consuming. Utility Model Content
[0004] The purpose of this application is to provide a bonding alignment component and bonding device that can improve bonding accuracy and efficiency.
[0005] One embodiment of this application provides a bonding alignment assembly, including a bonding head and a chip holder and a wafer holder spaced apart. The bonding head is used to attract a chip by the chip holder and transfer the chip above the wafer holder, and bond it to the wafer on the wafer holder. The chip holder is also provided with a first positioning member for positioning the relative position of the chip and the bonding head, and the wafer holder is also provided with a second positioning member for positioning the relative position of the chip and the wafer.
[0006] As one feasible approach, the bonding alignment assembly also includes a controller and a horizontal detection element disposed between the bonding head and the wafer holder. The horizontal detection element is connected to the controller and is used to detect the surface flatness of the chip on the bonding head. The controller controls the adsorption state of the bonding head on the chip based on the detection structure of the horizontal detection element.
[0007] As one feasible approach, the horizontal detection element comprises multiple elements spaced apart.
[0008] As one feasible approach, during the process of the bonding head bringing the chip closer to the wafer, the positions of the chip and the wafer are aligned at at least three preset distances.
[0009] As an feasible approach, the bonding head is equipped with multiple adsorption ports for adsorbing different parts of the chip.
[0010] As one possible implementation, the first positioning element includes a first transmitter fixed to the bottom of the wafer holder and a first receiver fixed to the bonding head. The signal emitted by the first transmitter is received by the first receiver through a mark located on the chip, and the initial position of the chip is determined based on the mark signal received by the first receiver.
[0011] As one feasible approach, the first transmitter is an infrared light source.
[0012] As one possible implementation, the second positioning element includes an optical module disposed on the side of the wafer holder away from the bonding head and a first receiver on the bonding head. Part of the signal emitted by the optical module is received by the first receiver through a mark located on the chip, and part of the signal is received by the optical module after being reflected by the wafer. The controller obtains the chip offset based on the signals received by the first receiver and the optical module and performs correction and compensation.
[0013] As one possible approach, the optical module includes a light source and a lens assembly disposed on the light-emitting side of the light source.
[0014] Another embodiment of this application provides a bonding apparatus including the aforementioned bonding alignment component.
[0015] The beneficial effects of the embodiments of this application include:
[0016] The bonding alignment assembly provided in this application includes a bonding head and a chip holder and a wafer holder spaced apart. The bonding head is used by the chip holder to attract the chip and transfer the chip above the wafer holder for bonding with the wafer on the wafer holder. The chip holder is also provided with a first positioning member for positioning the relative position of the chip and the bonding head. During the process of placing the chip in the chip holder, the first positioning member positions the relative position and relative angle of the chip and the chip holder by using marks on the chip and the chip holder, and adjusts the position and angle of the chip to ensure precise alignment between the chip and the chip holder and the bonding head. The wafer holder is also provided with a second positioning member for positioning the relative position of the chip and the wafer. During the process of the chip moving closer to the wafer, the second positioning member positions the relative position and relative angle of the chip and the wafer by using marks on the chip and the wafer, and adjusts the position and angle of the chip to ensure precise alignment between the chip and the wafer. In summary, the embodiments of this application achieve chip-wafer alignment by aligning the chip with the bonding head and then transferring the chip over the wafer. Compared with the prior art method of using two bonding heads to pick up the wafer and chip separately for alignment, this method has the advantages of higher alignment accuracy and less time consumption. Attached Figure Description
[0017] To more clearly illustrate the technical solutions of the embodiments of this application, the accompanying drawings used in the embodiments will be briefly introduced below. It should be understood that the following drawings only show some embodiments of this application and should not be regarded as a limitation of the scope. For those skilled in the art, other related drawings can be obtained based on these drawings without creative effort.
[0018] Figure 1 This is a schematic diagram of the structure of a bonding alignment component provided in an embodiment of this application;
[0019] Figure 2 A diagram illustrating the operational state of a bonding alignment assembly structure during alignment, provided in an embodiment of this application.
[0020] Figure 3 This is one of the state diagrams provided in the embodiments of this application for a bonding alignment component during alignment;
[0021] Figure 4 This is a second state diagram of a bonding alignment component during alignment, provided in an embodiment of this application.
[0022] Icons: 100-Bonding alignment assembly; 110-Bonding head; 120-Chip holder; 130-Wafer holder; 140-First positioning element; 141-First transmitter; 142-First receiver; 150-Second positioning element; 151-Optical module; 152-Lens group; 160-Horizontal detection element; 210-Chip; 220-Wafer. Detailed Implementation
[0023] To make the objectives, technical solutions, and advantages of the embodiments of this application clearer, the technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments. The components of the embodiments of this application described and shown in the accompanying drawings can generally be arranged and designed in various different configurations.
[0024] Furthermore, terms such as "horizontal" and "vertical" do not imply that components must be absolutely horizontal or suspended, but rather that they can be slightly tilted. For example, "horizontal" simply means that its direction is more horizontal than "vertical," and does not mean that the structure must be completely horizontal, but can be slightly tilted.
[0025] In the description of this application, it should also be noted that, unless otherwise expressly specified and limited, the terms "set up," "install," "connect," and "link" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in this application based on the specific circumstances.
[0026] During the bonding process of chip 210 to wafer 220, the positions of chip 210 and wafer 220 need to be precisely aligned to ensure bonding accuracy. In the prior art, in order to align chip 210 and wafer 220, two bonding heads 110 are usually used to pick up chip 210 and wafer 220 respectively and position them to achieve alignment. This bonding method has high precision but is relatively time-consuming.
[0027] This application provides a bonding alignment component 100, such as... Figure 1 and Figure 2 As shown, the device includes a bonding head 110 and a chip holder 120 and a wafer holder 130 spaced apart. The bonding head 110 is used to attract the chip 210 by the chip holder 120 and transfer the chip 210 above the wafer holder 130, and bond it with the wafer 220 on the wafer holder 130. The chip holder 120 is also provided with a first positioning member 140 for positioning the relative position of the chip 210 and the bonding head 110, and the wafer holder 130 is also provided with a second positioning member 150 for positioning the relative position of the chip 210 and the wafer 220.
[0028] The bonding alignment component 100 provided in this application embodiment is applied in a bonding apparatus. Specifically, the bonding apparatus further includes a conveying component, which is used to transport the chip 210 and the wafer 220 to the bonding alignment component 100 respectively. After the chip 210 and the wafer 220 are aligned and bonded to form a bonded component at the bonding alignment component 100, the conveying component transports the bonded component to the next station for the next step of operation.
[0029] Specifically, the bonding alignment assembly 100 in this application embodiment includes a chip holder 120 and a wafer holder 130, such as... Figure 1As shown, the transport assembly moves the chip 210 and wafer 220 to be bonded onto the chip holder 120 and wafer holder 130, respectively. The chip holder 120 is also equipped with a first positioning element 140. During the process of the transport assembly placing the chip 210 onto the chip holder 120, the first positioning element 140 positions the relative position and angle of the chip 210 and the chip holder 120 based on the markings on the chip 210 and the chip holder 120, and adjusts the position and angle of the chip 210 to ensure precise alignment between the chip 210, the chip holder 120, and the bonding head 110. At this time, the bonding head 110 descends to contact the chip 210, adsorbing the chip 210. After adsorbing the chip 210, the bonding head 110... Driven by the rotating device, the chip 210 rotates to a position above the wafer holder 130. At this time, the bonding head 110 moves closer to the wafer holder 130 under the drive of the extension component. A wafer 220 is placed on the wafer holder 130. The second positioning member 150 is provided on the wafer holder 130. During the process of the chip 210 moving closer to the wafer 220, the second positioning member 150 positions the relative position and relative angle of the chip 210 and the wafer 220 by the markings on the chip 210 and the wafer 220, and adjusts the position and angle of the chip 210 so that the chip 210 and the wafer 220 are precisely aligned.
[0030] In this embodiment, the chip 210 is aligned with the bonding head 110, and then the chip 210 is transferred above the wafer 220 to achieve alignment between the chip 210 and the wafer 220. Compared with the prior art, which uses two bonding heads 110 to pick up the wafer 220 and the chip 210 respectively, this method has the advantages of higher alignment accuracy and less time consumption.
[0031] As can be seen from the working process of the bonding alignment assembly 100 described above, the bonding head 110 can move above the chip holder 120 and the wafer holder 130 under the action of the rotating device. Furthermore, the bonding head 110 can also move closer to or further away from the chip holder 120 and the wafer holder 130 in a vertical direction. Also, when the chip 210 and the wafer 220 are aligned, the bonding head 110 drives the chip 210 to rotate around itself to align the chip 210 and the wafer 220. Therefore, the bonding head 110 includes multiple movement modes during operation. Thus, the bonding head 110 is connected to the rotating device through an extension component, and the adsorption component of the bonding head 110 is rotatably connected to the end of the extension component. Specifically, the specific structure and movement mode of the rotating device, production assembly, and rotatable connection are not limited in this embodiment; those skilled in the art can make specific settings according to actual conditions or existing technology.
[0032] It should be noted that, in order to improve the working efficiency of the bonding alignment assembly 100, it can be done as follows: Figure 1As shown, two bonding heads 110 are arranged on a rotating device. When one bonding head 110 picks up the chip 210, the other bonding head 110 rotates to be above the wafer 220 and aligned with the wafer 220. In this way, the positioning of one chip 210 and the alignment of the chip 210 with the wafer 220 can be completed within the same time period, so that the alignment of each chip 210 and wafer 220 only occupies one time period of the bonding alignment assembly 100.
[0033] The bonding alignment assembly 100 provided in this application includes a bonding head 110 and a chip holder 120 and a wafer holder 130 spaced apart. The bonding head 110 is used to attract a chip 210 by the chip holder 120 and transfer the chip 210 above the wafer holder 130, and bond it with the wafer 220 on the wafer holder 130. The chip holder 120 is also provided with a first positioning member 140 for positioning the relative position of the chip 210 and the bonding head 110. During the process of placing the chip 210 in the chip holder 120, the first positioning member 140 positions the relative position and relative angle of the chip 210 and the chip holder 120 by the markings on the chip 210 and the chip holder 120, and adjusts the position and angle of the chip 210 so that the chip 210 is precisely aligned with the chip holder 120 and the bonding head 110. The wafer holder 130 is also provided with a second positioning member 150 for positioning the relative positions of the chip 210 and the wafer 220. As the chip 210 approaches the wafer 220, the second positioning member 150 positions the relative positions and angles of the chip 210 and the wafer 220 using marks on the chip 210 and the wafer 220, and adjusts the position and angle of the chip 210 to ensure precise alignment of the chip 210 and the wafer 220. In summary, this embodiment of the application achieves alignment of the chip 210 and the wafer 220 by aligning the chip 210 with the bonding head 110 and then transferring the chip 210 above the wafer 220. Compared to the prior art method where two bonding heads 110 separately pick up the wafer 220 and the chip 210 for alignment, this method has the advantages of higher alignment accuracy and less time consumption.
[0034] Optional, such as Figure 2 As shown, the bonding alignment assembly 100 also includes a controller and a horizontal detection element 160 disposed between the bonding head 110 and the wafer holder 130. The horizontal detection element 160 is connected to the controller and is used to detect the surface flatness of the chip 210 on the bonding head 110. The controller controls the adsorption state of the bonding head 110 on the chip 210 according to the detection structure of the horizontal detection element 160.
[0035] In practical applications, during the process of the bonding head 110 adsorbing and moving the chip 210, the chip 210 may not be horizontal, resulting in a certain angle between the chip 210 and the wafer 220 when they come into contact. This is detrimental to the alignment of the chip 210 and the wafer 220. To further improve the alignment accuracy of the chip 210 and the wafer 220, this embodiment of the application provides a horizontal detection element 160 between the controller and the bonding head 110. The horizontal detection element 160 detects the surface flatness of the chip 210, and the controller controls the adsorption state of the bonding head 110 on the chip 210 based on the detection of the horizontal detection element 160, so that the chip 210 is horizontal.
[0036] Specifically, when the bonding head 110 is provided with multiple adsorption ports, which are used to adsorb different parts of the chip 210, the controller can control the adsorption force of the multiple adsorption ports on different parts of the chip 210 to adjust the distance between the chip 210 and the bonding head 110, thereby adjusting the plane on which the chip 210 is located. Specifically, when a certain position of the chip 210 is high, the controller can reduce the adsorption force of the adsorption port at that position, causing that position to drop so that the chip 210 is horizontal.
[0037] In one possible implementation of the embodiments of this application, such as Figure 2 As shown, the horizontal detection element 160 includes multiple elements spaced apart.
[0038] To further improve the levelness of chip 210, multiple level detection elements 160 are set, which are spaced apart and located on the same horizontal plane, such as... Figure 1 As shown, multiple leveling detectors 160 simultaneously detect the surface flatness of the chip 210. The controller adjusts the adsorption assembly based on the detection results of the multiple leveling detectors 160 to further improve the levelness of the chip 210.
[0039] The specific number of the horizontal detection components 160 is not limited in this embodiment, but those skilled in the art can make specific settings according to actual circumstances. For example, it could be... Figure 1 Two or three of them.
[0040] Optionally, during the process of the bonding head 110 bringing the chip 210 closer to the wafer 220, the positions of the chip 210 and the wafer 220 are aligned at at least three preset distances.
[0041] To further improve the alignment accuracy of chip 210 and wafer 220, during the process of bonding head 110 driving chip 210 closer to wafer 220, the positions of chip 210 and wafer 220 are aligned at at least three preset distances. After multiple alignments, the alignment accuracy of chip 210 and wafer 220 can be improved.
[0042] Specifically, such as Figure 3 and Figure 4 As shown, in Figure 3 and Figure 4 In the diagram, the shaded area is the diagonal line of chip 210, and the cross on chip 210 is its mark; the white-filled area is wafer 220, and the cross on wafer 220 is its mark. When the cross on chip 210 and the cross on wafer 220 coincide, it means that chip 210 and wafer 220 are perfectly aligned.
[0043] In addition, those skilled in the art can set markings according to the actual situation, as long as they can indicate the positions of wafer 220 and chip 210.
[0044] In one possible implementation of this application embodiment, the bonding head 110 is provided with multiple adsorption ports for adsorbing different parts of the chip 210.
[0045] The adsorption pressure of multiple adsorption ports can be controlled separately to adjust the adsorption force of each adsorption port corresponding to different parts of the chip 210, thereby improving the flexibility of the bonding head 110 in adsorbing the chip 210.
[0046] Optional, such as Figure 1 As shown, the first positioning member 140 includes a first transmitter 141 fixed to the bottom of the wafer holder 130 and a first receiver fixed to the bonding head 110. The signal emitted by the first transmitter 141 is received by the first receiver through a mark located on the chip 210, and the initial position of the chip 210 is determined according to the mark signal received by the first receiver.
[0047] Specifically, when chip 210 is placed on chip holder 120, first transmitter 141 transmits a signal. The signal penetrates the mark on chip 210 and is received by first receiver. The controller compares the signal from the first receiver with the mark on chip holder 120, calculates the distance and direction that chip 210 needs to move based on the comparison result, and controls chip 210 to move according to the calculation result so that chip 210 corresponds to chip holder 120. Furthermore, the positions of chip 210, chip holder 120 and bonding head 110 are precisely aligned.
[0048] Using transparent markers and optical signals to locate chip 210 simplifies the positioning process.
[0049] In one possible implementation of the embodiments of this application, such as Figure 1 As shown, the first transmitter 141 is an infrared light source.
[0050] The infrared light source emits infrared rays, which serve as a signal. The infrared rays pass through the mark on the chip 210 and are received by the first receiver. Infrared rays have strong penetrating power, which can improve the accuracy of alignment.
[0051] Optional, such as Figure 1 and Figure 2 As shown, the second positioning element 150 includes an optical module 151 disposed on the side of the wafer holder 130 away from the bonding head 110 and a first receiver on the bonding head 110. Part of the signal emitted by the optical module 151 is received by the first receiver through a mark located on the chip 210, and part of the signal is received by the optical module 151 after being reflected by the wafer 220. The controller obtains the offset of the chip 210 based on the signals received by the first receiver and the optical module 151 and performs correction and compensation.
[0052] Specifically, as the chip 210 approaches the wafer 220, the optical module 151 emits a signal. The light signal that illuminates the mark on the wafer 220 passes through the mark and is received by the first receiver. Part of the signal is reflected by the wafer 220 and then received by the optical module 151. The controller is connected to the first receiver and the optical module 151, acquires the signal, calculates the offset of the chip 210, and controls the bonding head 110 to move the chip 210 according to the offset, so that the wafer 220 and the chip 210 are aligned.
[0053] It is understandable that the first receiver is both the receiver of the first positioning element 140 and the receiver of the second positioning element 150. In addition, in order for the transmitted signal to illuminate the wafer 220 and be reflected by the wafer 220, the wafer holder 130 is made transparent so as not to affect the normal propagation of light.
[0054] In one possible implementation of the embodiments of this application, such as Figure 2 As shown, the optical module 151 includes a light source and a lens group 152 disposed on the light-emitting side of the light source.
[0055] Specifically, the light source can be the same as the first transmitter 141, configured as an infrared light source. The lens group 152 is used to process and receive the light reflected from the wafer 220.
[0056] This application also discloses a bonding apparatus, including a bonding alignment component 100 as described above. This bonding apparatus has the same structure and beneficial effects as the bonding alignment component 100 in the foregoing embodiments. The structure and beneficial effects of the bonding alignment component 100 have been described in detail in the foregoing embodiments and will not be repeated here.
[0057] The above description is merely a preferred embodiment of this application and is not intended to limit this application. Various modifications and variations can be made to this application by those skilled in the art. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of this application should be included within the protection scope of this application.
Claims
1. A bonding alignment assembly, characterized in that, The device includes a bonding head and a chip holder and a wafer holder spaced apart. The bonding head is used to attract a chip by the chip holder and transfer the chip above the wafer holder for bonding with the wafer on the wafer holder. The chip holder is also provided with a first positioning element for positioning the relative position of the chip and the bonding head, and the wafer holder is also provided with a second positioning element for positioning the relative position of the chip and the wafer.
2. The bonding alignment assembly according to claim 1, characterized in that, It also includes a controller and a horizontal detection element disposed between the bonding head and the wafer holder. The horizontal detection element is connected to the controller and is used to detect the surface flatness of the chip on the bonding head. The controller controls the adsorption state of the bonding head on the chip according to the detection structure of the horizontal detection element.
3. The bonding alignment assembly according to claim 2, characterized in that, The horizontal detection element comprises multiple elements spaced apart.
4. The bonding alignment assembly according to claim 1, characterized in that, During the process of the bonding head bringing the chip closer to the wafer, the positions of the chip and the wafer are aligned at at least three preset distances.
5. The bonding alignment assembly according to claim 1, characterized in that, The bonding head is provided with multiple adsorption ports for adsorbing different parts of the chip.
6. The bonding alignment assembly according to claim 1, characterized in that, The first positioning element includes a first transmitter fixed to the bottom of the wafer holder and a first receiver fixed to the bonding head. The signal emitted by the first transmitter is received by the first receiver through a mark located on the chip, and the initial position of the chip is determined based on the mark signal received by the first receiver.
7. The bonding alignment assembly according to claim 6, characterized in that, The first transmitter is an infrared light source.
8. The bonding alignment assembly according to claim 1, characterized in that, The second positioning element includes an optical module disposed on the side of the wafer holder away from the bonding head and a first receiver on the bonding head. Part of the signal emitted by the optical module is received by the first receiver through a mark located on the chip, and part of the signal is received by the optical module after being reflected by the wafer. The controller obtains the chip offset based on the signals received by the first receiver and the optical module and performs correction and compensation.
9. The bonding alignment assembly according to claim 8, characterized in that, The optical module includes a light source and a lens group disposed on the light-emitting side of the light source.
10. A bonding device, characterized in that, Includes the bonding alignment component as described in any one of claims 1-9.