Wafer calibration device

Abstract

The utility model discloses a wafer calibration device, which belongs to the technical field of wafer calibration and comprises a workbench, and a wafer feeding bin, a wafer discharging bin, a single plate carrier bin, a combined calibration station, a single plate calibration station, a combined carrier bin and a wafer calibration station are sequentially arranged at the top end of the workbench around the center. Correction mechanisms are arranged in the combined calibration station, the single plate calibration station and the wafer calibration station, and detection cameras are fixedly connected to the top ends of the combined calibration station, the single plate calibration station and the wafer calibration station; according to the utility model, the three correction mechanisms cooperate with the three detection cameras to calibrate wafers and carriers of different types respectively, and the calibrated wafers can be placed in the wafer storage bin to be used in subsequent processes and can also be placed in a single-plate carrier and a combined carrier to be used in the subsequent processes. The wafer calibration device has multiple working modes and diversified functions, and can meet the simultaneous calibration work of multiple types of wafer products.

Description

Technical Field

[0001] This utility model relates to the field of wafer calibration technology, and more specifically, to a wafer calibration device. Background Technology

[0002] A wafer is a silicon wafer used to manufacture silicon semiconductor integrated circuits. It is called a wafer because of its circular shape. Various circuit element structures can be fabricated on silicon wafers to become IC products with specific electrical functions.

[0003] Currently, during wafer processing, calibration devices are generally used to adjust the wafers to ensure processing accuracy. The principle of wafer edge-finding calibration is to ensure the consistency of the wafer's position when it is grasped by a robotic arm through various detection and correction methods. This ensures that the wafer can be smoothly grasped by the robotic arm and that the wafer is in the correct position in the reaction chamber, thereby improving the efficiency and accuracy of wafer processing and reducing economic losses. However, most existing calibration devices only have one working mode and can only process the same wafer product at a time. Their functions are limited and they cannot calibrate wafers with different processing requirements at the same time. Utility Model Content

[0004] 1. Technical problems to be solved

[0005] To address the problems existing in the prior art, the purpose of this utility model is to provide a wafer calibration device, which aims to solve the problem that the existing calibration devices only have one working mode, can only process the same wafer product at a time, have limited functions, and cannot calibrate wafers with different processing requirements at the same time.

[0006] 2. Technical Solution

[0007] To solve the above problems, the present invention adopts the following technical solution:

[0008] A wafer calibration device includes a worktable. Around the center of the top of the worktable are arranged a wafer loading bin, a wafer unloading bin, a single-board carrier bin, a combined calibration station, a single-board calibration station, a combined carrier bin, and a wafer calibration station. Each of the combined calibration station, single-board calibration station, and wafer calibration station is equipped with a calibration mechanism. Each of the combined calibration station, single-board calibration station, and wafer calibration station has a detection camera fixedly connected to its top, with each of the three detection cameras corresponding to one of the three calibration mechanisms. A robotic arm is located in the middle of the worktable, positioned between the wafer loading bin, wafer unloading bin, single-board carrier bin, combined calibration station, single-board calibration station, combined carrier bin, and wafer calibration station.

[0009] As a preferred embodiment of this utility model, each of the correction mechanisms includes a fixed support, a lifting cylinder, a lifting frame, a rotary motor, a suction cup assembly, a clamping motor, and a gripper assembly. The fixed support is fixedly connected to the top of the worktable, the lifting cylinder is fixedly connected to one side of the fixed support, the lifting frame is fixedly connected to the output end of the lifting cylinder, the rotary motor is fixedly connected to the top wall of the lifting frame, and the output end of the rotary motor extends movably through to the upper side of the lifting frame, the suction cup assembly is fixedly connected to the output end of the rotary motor, and the suction cup assembly is located on the upper side of the lifting frame, the clamping motor is fixedly connected to one side of the fixed support, and the clamping motor is located inside the lifting frame, and the gripper assembly is disposed at the output end of the clamping motor, and the suction cup assembly is located inside the gripper assembly.

[0010] As a preferred embodiment of this utility model, a sliding sleeve assembly is fixedly connected to one side of the fixed support, and the lifting frame slides through the sliding sleeve assembly.

[0011] As a preferred embodiment of this utility model, both the single-board calibration station and the wafer calibration station are fixedly connected to a lower ring light, and both the top of the single-board calibration station and the wafer calibration station are fixedly connected to a light plate, with the two light plates corresponding to the two lower ring lights respectively.

[0012] In a preferred embodiment of this utility model, the two gripper assemblies are located on the inner and outer sides of the two lower ring lights, respectively, and the two detection cameras are located on the inner sides of the two light panels, respectively.

[0013] As a preferred embodiment of this utility model, an upper ring light is fixedly connected to the top of the combined calibration station, and a detection camera is located inside the upper ring light.

[0014] 3. Beneficial effects

[0015] Compared with existing technologies, the advantages of this utility model are:

[0016] (1) In this solution, by placing the wafer in the wafer loading bin, the single-board wafer carrier in the single-board carrier bin, and the combined wafer carrier in the combined carrier bin, the three calibration mechanisms, together with three inspection cameras, can calibrate the wafer and different types of carriers respectively. The calibrated wafer can be placed in the wafer unloading bin for subsequent processing, and can also be placed in the single-board carrier and the combined carrier for subsequent processing. It has multiple working modes and diverse functions, and can meet the simultaneous calibration work of multiple wafer products, realizing wafer calibration for different needs. Attached Figure Description

[0017] Figure 1 This is the front view of the present invention;

[0018] Figure 2 This is a structural diagram of the correction mechanism in this utility model.

[0019] Explanation of the labels in the diagram:

[0020] 1. Workbench; 2. Wafer loading bin; 3. Wafer unloading bin; 4. Single board carrier bin; 5. Assembly calibration station; 6. Single board calibration station; 7. Assembly carrier bin; 8. Wafer calibration station; 9. Calibration mechanism; 91. Fixed support; 92. Lifting cylinder; 93. Lifting frame; 94. Rotary motor; 95. Suction cup assembly; 96. Clamping motor; 97. Gripper assembly; 10. Inspection camera; 11. Robotic arm; 12. Sliding sleeve assembly; 13. Lower ring light; 14. Light board; 15. Upper ring light. Detailed Implementation

[0021] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present utility model, not all embodiments. All other embodiments obtained by those skilled in the art based on the embodiments of the present utility model without creative effort are within the scope of protection of the present utility model.

[0022] In the description of this utility model, it should be noted that the terms "upper," "lower," "inner," "outer," "top / bottom," etc., indicating the orientation or positional relationship are based on the orientation or positional relationship shown in the accompanying drawings, and are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this utility model. Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance.

[0023] In the description of this utility model, it should be noted that, unless otherwise explicitly specified and limited, the terms "installed," "equipped with," "sleeved / connected," "connected," etc., should be interpreted broadly. For example, "connection" can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium; it can be a connection within two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model based on the specific circumstances.

[0024] Example:

[0025] Please see Figure 1-2A wafer calibration device includes a workbench 1. Around the center of the top of the workbench 1 are arranged a wafer loading bin 2, a wafer unloading bin 3, a single-board carrier bin 4, a combined calibration station 5, a single-board calibration station 6, a combined carrier bin 7, and a wafer calibration station 8. Each of the combined calibration station 5, single-board calibration station 6, and wafer calibration station 8 is equipped with a calibration mechanism 9. Each of the combined calibration station 5, single-board calibration station 6, and wafer calibration station 8 has a detection camera 10 fixedly connected to its top, with each of the three detection cameras 10 corresponding to one of the three calibration mechanisms 9. A robotic arm 11 is located in the middle of the workbench 1, between the wafer loading bin 2, wafer unloading bin 3, single-board carrier bin 4, combined calibration station 5, single-board calibration station 6, combined carrier bin 7, and wafer calibration station 8.

[0026] In this embodiment, the wafer is placed in the wafer loading bin 2, the single-board wafer carrier is placed in the single-board carrier bin 4, and the combined wafer carrier is placed in the combined carrier bin 7. The robotic arm 11 removes the wafer from the wafer loading bin 2 and places it on the calibration mechanism 9 in the wafer calibration station 8. The inspection camera 10 on the wafer calibration station 8 identifies the wafer edges, and the calibration mechanism 9 in the wafer calibration station 8 adjusts and calibrates the wafer. The calibrated wafer is then removed by the robotic arm 11 and placed in the wafer unloading bin 3. When the wafer needs to be placed in the single-board carrier for processing, the robotic arm 11 places the wafer on the calibration mechanism 9 in the wafer calibration station 8. The wafer carrier is placed on the calibration mechanism 9 in the single-board calibration station 6. The two calibration mechanisms 9 work with the two inspection cameras 10 to calibrate the wafer and the single-board carrier. The robotic arm 11 accurately places the calibrated wafer into the single-board carrier for processing. When the wafer needs to be placed in the combined carrier for processing, the robotic arm 11 places the wafer on the calibration mechanism 9 in the wafer calibration station 8. The carrier in the combined carrier compartment 7 is placed on the calibration mechanism 9 in the combined calibration station 5. The two calibration mechanisms 9 work with the two inspection cameras 10 to calibrate the wafer and the combined carrier. The robotic arm 11 accurately places the calibrated multiple wafers into the combined carrier for combined processing.

[0027] Specifically, each calibration mechanism 9 includes a fixed support 91, a lifting cylinder 92, a lifting frame 93, a rotary motor 94, a suction cup assembly 95, a clamping motor 96, and a gripper assembly 97. The fixed support 91 is fixedly connected to the top of the worktable 1. The lifting cylinder 92 is fixedly connected to one side of the fixed support 91. The lifting frame 93 is fixedly connected to the output end of the lifting cylinder 92. The rotary motor 94 is fixedly connected to the top wall of the lifting frame 93, and the output end of the rotary motor 94 extends movably through to the upper side of the lifting frame 93. The suction cup assembly 95 is fixedly connected to the output end of the rotary motor 94, and the suction cup assembly 95 is located on the upper side of the lifting frame 93. The clamping motor 96 is fixedly connected to one side of the fixed support 91, and the clamping motor 96 is located inside the lifting frame 93. The gripper assembly 97 is located at the output end of the clamping motor 96, and the suction cup assembly 95 is located inside the gripper assembly 97.

[0028] In this embodiment, when the calibration mechanism 9 calibrates the wafer, the wafer is placed on the suction cup assembly 95, which adsorbs the wafer. The rotary motor 94 controls the suction cup assembly 95 to rotate for wafer calibration. The lifting cylinder 92 controls the lifting frame 93 to move down, so that the wafer adsorbed by the suction cup assembly 95 corresponds to the gripper assembly 97. The clamping motor 96 controls the gripper assembly 97 to center the wafer. The rotary motor 94 again uses the suction cup assembly 95 to adsorb the wafer and rotate for fine adjustment, thus achieving the final calibration of the wafer. When the calibration mechanism 9 calibrates the carrier, the carrier is calibrated in the same way as the wafer. After the carrier is calibrated, the gripper assembly 97 positions the carrier, the lifting cylinder 92 controls the lifting frame 93 to rise, and the rotary motor 94 controls the suction cup assembly 95 to rotate, so that the suction cup assembly 95 passes through the through hole on the carrier. Then, the wafer is placed on the suction cup assembly 95 for adsorption. The lifting cylinder 92 controls the lifting frame 93 to descend, so that the wafer adsorbed by the suction cup assembly 95 is placed on the carrier.

[0029] Specifically, a sliding sleeve assembly 12 is fixedly connected to one side of the fixed support 91, and the lifting frame 93 slides through the sliding sleeve assembly 12.

[0030] In this embodiment, the sliding sleeve assembly 12 assists the lifting frame 93 in sliding, so that the lifting frame 93 remains stable when sliding.

[0031] Specifically, both the single-board calibration station 6 and the wafer calibration station 8 are fixedly connected to a lower ring light 13. Both the top of the single-board calibration station 6 and the wafer calibration station 8 are fixedly connected to a light board 14, and the two light boards 14 correspond to the two lower ring lights 13 respectively. The two gripper assemblies 97 are located inside and outside the two lower ring lights 13 respectively, and the two inspection cameras 10 are located inside the two light boards 14 respectively.

[0032] In this embodiment, two lower ring lights 13 and two light boards 14 provide supplementary lighting for the single-board calibration station 6 and the wafer calibration station 8, which facilitates the identification of the wafer and the single-board carrier by the two inspection cameras 10.

[0033] Specifically, an upper ring light 15 is fixedly connected to the top of the combined calibration station 5, and a detection camera 10 is located inside the upper ring light 15.

[0034] In this embodiment, the upper ring light 15 provides supplementary lighting to the combined calibration station 5, which facilitates the identification of the combined carrier and wafer by the inspection camera 10 on the combined calibration station 5.

[0035] Working principle: Wafers are placed in wafer loading bin 2, single-board wafer carriers are placed in single-board carrier bin 4, and combined wafer carriers are placed in combined carrier bin 7. A robotic arm 11 removes the wafers from wafer loading bin 2 and places them onto the suction cup assembly 95 in the wafer calibration station 8. The suction cup assembly 95 adsorbs the wafers. The inspection camera 10 on the wafer calibration station 8 identifies the wafer edges. A rotary motor 94 controls the rotation of the suction cup assembly 95 to adjust the wafer. A lifting cylinder 92 controls the lifting frame 93 to move downwards, aligning the wafer adsorbed by the suction cup assembly 95 with the gripper assembly 97. A clamping motor 96 controls the gripper assembly 97 to center and position the wafer. The rotary motor 94 once again uses the suction cup assembly 95 to adsorb the wafer and rotate it for fine adjustment, thereby calibrating the wafer. After calibration, the wafer is taken out by the robotic arm 11 and placed in the wafer loading bin 3. When the wafer needs to be placed in the carrier, the carrier is calibrated in the same way as the wafer. After the carrier is calibrated, the gripper assembly 97 positions the carrier, the lifting cylinder 92 controls the lifting frame 93 to rise, and the rotary motor 94 controls the suction cup assembly 95 to rotate, so that the suction cup assembly 95 passes through the through hole on the carrier. Then, the wafer is placed on the suction cup assembly 95 for adsorption. The lifting cylinder 92 controls the lifting frame 93 to descend, so that the wafer adsorbed by the suction cup assembly 95 is placed on the carrier.

[0036] The above description is only a preferred embodiment of the present utility model, but the protection scope of the present utility model is not limited thereto. Any equivalent substitutions or changes made by those skilled in the art within the technical scope disclosed in the present utility model based on the technical solution and its improved concept should be covered within the protection scope of the present utility model.

Claims

1. A wafer calibration apparatus, comprising a stage (1), characterized in that: The top of the workbench (1) is arranged around the center with a wafer loading bin (2), a wafer unloading bin (3), a single board carrier bin (4), a combined calibration station (5), a single board calibration station (6), a combined carrier bin (7), and a wafer calibration station (8). Each of the combined calibration station (5), the single board calibration station (6), and the wafer calibration station (8) is equipped with a calibration mechanism (9). Each of the combined calibration station (5), the single board calibration station (6), and the wafer calibration station (8) is fixedly connected with a detection camera (10), and the three detection cameras (10) correspond to the three calibration mechanisms (9). A robotic arm (11) is arranged in the middle of the workbench (1), and the robotic arm (11) is located between the wafer loading bin (2), the wafer unloading bin (3), the single board carrier bin (4), the combined calibration station (5), the single board calibration station (6), the combined carrier bin (7), and the wafer calibration station (8).

2. The wafer calibration device according to claim 1, characterized in that: Each of the aforementioned calibration mechanisms (9) includes a fixed support (91), a lifting cylinder (92), a lifting frame (93), a rotary motor (94), a suction cup assembly (95), a clamping motor (96), and a gripper assembly (97). The fixed support (91) is fixedly connected to the top of the workbench (1), the lifting cylinder (92) is fixedly connected to one side of the fixed support (91), the lifting frame (93) is fixedly connected to the output end of the lifting cylinder (92), and the rotary motor (94) is fixedly connected to the top of the lifting frame (93). The wall, and the output end of the rotary motor (94) extends through to the upper side of the lifting frame (93), the suction cup assembly (95) is fixedly connected to the output end of the rotary motor (94), and the suction cup assembly (95) is located on the upper side of the lifting frame (93), the clamping motor (96) is fixedly connected to one side of the fixed support (91), and the clamping motor (96) is located on the inner side of the lifting frame (93), the gripper assembly (97) is located at the output end of the gripper motor (96), and the suction cup assembly (95) is located on the inner side of the gripper assembly (97).

3. The wafer calibration device according to claim 2, characterized in that: The fixed support (91) is fixedly connected to a sliding sleeve assembly (12) on one side end, and the lifting frame (93) slides through the sliding sleeve assembly (12).

4. A wafer calibration device according to claim 3, characterized in that: Both the single-board calibration station (6) and the wafer calibration station (8) are fixedly connected with lower ring lights (13), and both the top of the single-board calibration station (6) and the wafer calibration station (8) are fixedly connected with light plates (14), and the two light plates (14) correspond to the two lower ring lights (13) respectively.

5. A wafer calibration device according to claim 4, characterized in that: The two gripper assemblies (97) are located inside and outside the two lower ring lights (13), respectively, and the two detection cameras (10) are located inside the two light panels (14), respectively.

6. A wafer calibration device according to claim 5, characterized in that: The top of the combined calibration station (5) is fixedly connected to an upper ring light (15), and a detection camera (10) is located inside the upper ring light (15).

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