LED high-voltage lamp bead

Abstract

An LED high-voltage lamp bead comprises a shell, a first conductive metal piece, a second conductive metal piece, a middle conductive plate, a resistor and a light-emitting chip, and gaps are formed between the first conductive plate and the middle conductive plate and between the conductive plate and the second conductive plate. The first conductive metal piece, the second conductive metal piece and the middle conductive plate are pre-buried in the shell, the first conductive plate and the middle conductive plate are opposite to the resistor cavity, and the middle conductive plate and the second conductive plate are opposite to the chip light source cavity; the resistor is welded with the first current-conducting plate and the middle current-conducting plate and is packaged in the resistor cavity; the light-emitting chip is arranged in the chip light source cavity, is welded with the current-conducting plate and the second current-conducting plate and is packaged in the chip light source cavity; the first terminal plate and the second terminal plate are fitted to the first terminal hole and the second terminal hole, respectively. The first conductive metal piece, the second conductive metal piece and the middle conductive plate are pre-buried in the shell, the electro-optical chip is arranged in the chip light source cavity, the resistor is arranged in the resistor cavity and is sealed, and therefore manufacturing is convenient, the insulation performance is high, and the heat dissipation performance is high.

Description

Technical Field

[0001] This utility model relates to a lamp, and more particularly to an LED lamp bead for a lamp. Background Technology

[0002] Current technology, specifically Chinese patent 202420417884.X, describes a dual-bead integrated LED lamp bead with a built-in resistor. This bead includes a plastic support body, LED chips, an LED chip support metal sheet, and a resistor. The LED chips are arranged within the plastic support body for emitting light. The LED chip support metal sheet is placed within the plastic support body to house the LED chips and provides electrical and thermal conductivity. The resistor is arranged on a resistor support metal sheet located on the side of the LED chip support metal sheet. The resistor and the resistor are connected by a conductive connector to provide current-limiting protection for the LED chips. This application integrates the resistor with the LED lamp bead by binding the resistor to the LED support body. The LED chips can be placed separately on two LED chip support metal sheets, significantly improving heat dissipation. The space in the resistor support metal sheet can accommodate larger resistors, greatly increasing the power of the LED lamp bead and resulting in a larger luminous area. This also greatly simplifies the requirements for LED lamp bead application circuitry. However, the problem is that the structure is complex and assembly is inconvenient. Utility Model Content

[0003] The purpose of this invention is to provide an LED high-voltage lamp bead that has high heat dissipation performance and is easy to assemble.

[0004] This invention is implemented as follows: an LED high-voltage lamp bead, characterized in that it includes a housing, a first conductive metal component, a second conductive metal component, a middle conductive plate, a resistor, and a light-emitting chip.

[0005] The housing includes a first terminal hole and a second terminal hole at one end, and a chip light source cavity and a resistor cavity at the other end.

[0006] The first conductive metal component includes a first terminal plate and a first conductive plate;

[0007] The second conductive metal component includes a second terminal plate and a second conductive plate;

[0008] The first terminal board and the second terminal board are opposite each other and in the same plane. The first conductive plate, the middle conductive plate, and the second conductive plate are disposed in the same plane. There are gaps between the first conductive plate and the middle conductive plate, and between the conductive plate and the second conductive plate. The first conductive metal component, the second conductive metal component, and the middle conductive plate are embedded in the housing. The first conductive plate and the middle conductive plate are opposite to the resistor cavity, and the middle conductive plate and the second conductive plate are opposite to the chip light source cavity. The resistor is welded to the first conductive plate and the middle conductive plate and encapsulated in the resistor cavity. The light-emitting chip is disposed in the chip light source cavity and welded to the conductive plate and the second conductive plate and encapsulated in the chip light source cavity. The first terminal board and the second terminal board are respectively fitted with the first terminal hole and the second terminal hole.

[0009] The LED high-voltage lamp bead described above is characterized in that: the first terminal plate and the first conductive plate of the first conductive metal component are connected by a first support strip;

[0010] The second terminal plate and the second conductive plate of the second conductive metal component are connected by the second support strip.

[0011] The LED high-voltage lamp bead described above is characterized in that: the suspended end of the second conductive plate is provided in the through groove and the protrusions located at the ends on both sides.

[0012] The housing is provided with a first heat dissipation groove, a raised surface and the inside of the heat dissipation groove.

[0013] The LED high-voltage lamp bead is characterized in that: the housing is further provided with a second heat dissipation groove, and one surface of the suspended end of the first conductive plate and the intermediate conductive plate is located within the second heat dissipation groove.

[0014] This utility model discloses an LED high-voltage lamp bead, in which a first conductive metal component, a second conductive metal component, and a middle conductive plate are embedded in a housing, an electro-optical chip is disposed in a chip light source cavity, and a resistor is disposed in a resistor cavity and sealed. It is easy to manufacture, has high insulation performance, and high heat dissipation performance. Attached Figure Description

[0015] Figure 1 This is the front view of this utility model.

[0016] Figure 2 This is one of the perspective views of this utility model.

[0017] Figure 3 This is one of the exploded perspective views of this utility model.

[0018] Figure 4 This is the second exploded perspective view of this utility model.

[0019] Figure 5 This is the second perspective view of this utility model.

[0020] Figure 6 This is a rear view of the present invention. Detailed Implementation

[0021] Embodiments of the present invention are described in detail below. Examples of these embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the present invention, and should not be construed as limiting the present invention.

[0022] In the description of this invention, it should be noted that, unless otherwise explicitly specified and limited, the terms "installation," "connection," and "joining" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal communication between two components. Those skilled in the art can understand the specific meaning of the above terms in this invention based on the specific circumstances.

[0023] like Figure 1 , Figure 3 As shown, an LED high-voltage lamp bead includes a housing 1, a first conductive metal component 2, a second conductive metal component 3, a middle conductive plate 4, a resistor (not shown in the figure), and a light-emitting chip.

[0024] The housing 1 includes a first terminal hole 11 and a second terminal hole 12 at one end, and a chip light source cavity 13 and a resistor cavity 14 at the other end.

[0025] The first conductive metal component 2 includes a first terminal plate 21 and a first conductive plate 22;

[0026] The second conductive metal component 3 includes a second terminal plate 31 and a second conductive plate 32;

[0027] The first terminal plate 21 and the second terminal plate 31 are opposite each other and in the same plane; the first conductive plate 22, the middle conductive plate 4 and the second conductive plate 32 are disposed in the same plane; there are gaps between the first conductive plate 22 and the middle conductive plate 4 and between the conductive plate and the second conductive plate 32; the first conductive metal part 2, the second conductive metal part 3 and the middle conductive plate 4 are embedded in the housing 1, one end of the first conductive plate 22 and the middle conductive plate 4 are opposite to the resistor cavity 14, and the other end of the middle conductive plate 4 and the second conductive plate 32 are opposite to the chip light source cavity 13; the resistor is welded to the first conductive plate 22 and the middle conductive plate 4 and encapsulated in the resistor cavity 14, and the light-emitting chip is disposed in the chip light source cavity 13 and welded to the middle conductive plate 4 and the second conductive plate 32 and encapsulated in the chip light source cavity 13; the first terminal plate 21 and the second terminal plate 31 are respectively fitted with the first terminal hole 11 and the second terminal hole 12.

[0028] As a further improvement of this utility model: the first terminal plate 21 and the first conductive plate 22 of the first conductive metal part 2 are connected by the first support strip 23, the first support strip is perpendicular to the first terminal plate 21 and the first conductive plate 22, and the first terminal plate 21 and the first conductive plate 22 are parallel.

[0029] The second terminal plate 31 and the second conductive plate 32 of the second conductive metal component 3 are connected by a second support strip 33. The second support strip 33 is perpendicular to the second terminal plate 31 and the second conductive plate 32, and the second terminal plate 31 and the second conductive plate 32 are parallel. This structure improves heat dissipation performance.

[0030] As a further improvement of this utility model: the second conductive plate 32 is provided with a through groove 321 at the suspended end and protrusions 322 at the ends on both sides.

[0031] The housing 1 is provided with a second heat dissipation groove 152, and one surface of the protrusion 322 is located inside the heat dissipation groove. This structure improves heat dissipation performance.

[0032] As a further improvement of this utility model: the housing 1 is also provided with a first heat dissipation groove 151, and one surface of the suspended end of the first conductive plate 22 and the intermediate conductive plate 4 is located in the first heat dissipation groove 151.

[0033] Although embodiments of the invention have been shown and described, those skilled in the art will understand that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the invention, the scope of which is defined by the claims and their equivalents.

Claims

1. An LED high-voltage lamp bead, characterized in that: It includes a housing, a first conductive metal component, a second conductive metal component, a middle conductive plate, a resistor, and a light-emitting chip. The housing includes a first terminal hole and a second terminal hole at one end, and a chip light source cavity and a resistor cavity at the other end. The first conductive metal component includes a first terminal plate and a first conductive plate; The second conductive metal component includes a second terminal plate and a second conductive plate; The first terminal board and the second terminal board are opposite each other and in the same plane. The first conductive plate, the middle conductive plate, and the second conductive plate are disposed in the same plane. There are gaps between the first conductive plate and the middle conductive plate, and between the conductive plate and the second conductive plate. The first conductive metal component, the second conductive metal component, and the middle conductive plate are embedded in the housing. The first conductive plate and the middle conductive plate are opposite to the resistor cavity, and the middle conductive plate and the second conductive plate are opposite to the chip light source cavity. The resistor is welded to the first conductive plate and the middle conductive plate and encapsulated in the resistor cavity. The light-emitting chip is disposed in the chip light source cavity and welded to the conductive plate and the second conductive plate and encapsulated in the chip light source cavity. The first terminal board and the second terminal board are respectively fitted with the first terminal hole and the second terminal hole.

2. The LED high-voltage lamp bead according to claim 1, characterized in that: The first terminal plate and the first conductive plate of the first conductive metal component are connected by a first support strip; The second terminal plate and the second conductive plate of the second conductive metal component are connected by the second support strip.

3. The LED high-voltage lamp bead according to claim 1, characterized in that: The second conductive plate has a through groove at its suspended end and protrusions at both ends. The housing is provided with a second heat dissipation groove, and a raised surface is located inside the heat dissipation groove.

4. The LED high-voltage lamp bead according to claim 3, characterized in that: The housing is also provided with a first heat dissipation groove, and one surface of the suspended end of the first conductive plate and the intermediate conductive plate is located in the first heat dissipation groove.

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