Light module and electronic equipment

Abstract

The embodiment of the utility model provides a light module and electronic equipment, and relates to the technical field of electronics. The lamplight module comprises a circuit board, a first light source assembly, a first steel sheet and a heat dissipation body. The first light source assembly is arranged on the first face of the circuit board, the first steel sheet is located on the second face of the circuit board, the first face is opposite to the second face, and at least part of the second face of the circuit board and the side, away from the circuit board, of the first steel sheet are attached to the heat dissipation body. The orthographic projection of the first light source assembly on the circuit board is located in the orthographic projection of the first steel sheet on the circuit board. The first steel sheet can rapidly conduct heat generated by the first light source assembly so as to effectively dissipate heat of the first light source assembly, the face, away from the circuit board, of the first steel sheet and the part, away from the second face of the circuit board, of the first steel sheet are attached to the heat dissipation body, and the heat dissipation body can further dissipate heat of the circuit board and the first light source assembly. Therefore, the heat dissipation effect of the light module is improved.

Description

TECHNICAL FIELD

[0001] The present disclosure relates to the technical field of electronics, and in particular, to a light module and an electronic device. BACKGROUND

[0002] Currently, the market has higher and higher requirements for the light function of electronic devices such as mobile phones. In order to meet the needs of consumers, multi-color-temperature and high-brightness flashlights have been widely used in many electronic devices. Moreover, in order to improve the attractiveness of products, many electronic devices are also provided with RGB decorative lights that can be customized in color and effect. When the flashlight or RGB light is turned on for a long time, the temperature of the light assembly gradually rises, which leads to an increase in the overall temperature of the electronic device.

[0003] In related technologies, in order to improve the heat dissipation effect of the light assembly, a heat-conducting silicone is arranged between the lamp beads and the circuit board, so that the temperature of the lamp beads is more quickly conducted to the circuit board, thereby dissipating heat for the light assembly. However, the circuit board is usually made of resin, and the heat dissipation effect is not good. Moreover, long-term local high temperature will affect the work of other devices on the circuit board. CONTENT OF THE UTILITY MODEL

[0004] In view of this, the present disclosure provides a light module and an electronic device, which can improve the heat dissipation effect when the light module is working.

[0005] Specifically, the technical solutions include the following:

[0006] In a first aspect, the embodiments of the present disclosure provide a light module, comprising a circuit board, a first light source assembly, a first steel sheet and a heat dissipation main body.

[0007] The first light source assembly is arranged on a first surface of the circuit board, the first steel sheet is located on a second surface of the circuit board, the first surface and the second surface are opposite to each other, at least part of the second surface of the circuit board and a side of the first steel sheet away from the circuit board are attached to the heat dissipation main body, and a normal projection of the first light source assembly on the circuit board is located within a normal projection of the first steel sheet on the circuit board.

[0008] Optionally, the heat dissipation main body is made of metal, or the heat dissipation main body is embedded with a metal piece.

[0009] Optionally, a first positioning column is arranged on the heat dissipation main body, the circuit board is provided with a first positioning hole, the first steel sheet is provided with a second positioning hole, the first positioning hole and the second positioning hole coincide, and the first positioning column passes through the first positioning hole and the second positioning hole.

[0010] Optionally, the light module further comprises a first colloid, and the first colloid is located between the first steel sheet and the heat dissipation main body.

[0011] Optionally, the light module further comprises a second light source assembly, and the second light source assembly is arranged on the first surface of the circuit board.

[0012] Optionally, the first light source assembly comprises a flashlight, and the second light source assembly comprises an RGB lamp bead.

[0013] Optionally, the light module further comprises a second steel sheet, the second steel sheet is arranged on the second surface of the circuit board, one surface of the second steel sheet away from the circuit board is attached to the heat dissipation main body, and the orthographic projection of the second light source assembly on the circuit board is located in the orthographic projection of the second steel sheet on the circuit board.

[0014] Optionally, the second steel sheet is provided with a first positioning groove and a second positioning groove at opposite edges of the second steel sheet respectively, the heat dissipation main body is provided with a second positioning column and a third positioning column, the second positioning column is located in the first positioning groove, and the third positioning column is located in the second positioning groove.

[0015] Optionally, the light module further comprises a second adhesive, and the second adhesive is arranged between the second steel sheet and the heat dissipation main body.

[0016] Optionally, metal powder is added in the first adhesive and the second adhesive.

[0017] Optionally, the heat dissipation main body is provided with a recess, and the first light source assembly, the first steel sheet and part of the circuit board are located in the recess.

[0018] In a second aspect, the embodiments of the present disclosure provide an electronic device, and the electronic device comprises the light module of any one of the first aspect.

[0019] The technical scheme provided by the embodiments of the present disclosure has at least the following beneficial effects:

[0020] In the light module provided by the embodiments of the present disclosure, the first steel sheet is arranged on the side of the circuit board away from the first light source assembly, the first steel sheet can quickly conduct the heat generated by the first light source assembly, thereby effectively dissipating heat for the first light source assembly. Moreover, one surface of the first steel sheet away from the circuit board and part of the second surface of the circuit board are attached to the heat dissipation main body, and the heat dissipation main body can further dissipate heat for the circuit board and the first light source assembly, thereby improving the heat dissipation effect of the light module. BRIEF DESCRIPTION OF DRAWINGS

[0021] In order to more clearly illustrate the technical solutions in the embodiments of the present disclosure, the drawings needed to be used in the embodiments description will be briefly introduced. Obviously, the drawings in the following description are only some embodiments of the present disclosure, and for those skilled in the art, other drawings can be obtained from these drawings without any creative effort.

[0022] Figure 1 An exploded view of the light module provided by the embodiments of the present disclosure is shown.

[0023] Figure 2 A partial schematic view of the light module provided by the embodiments of the present disclosure is shown.

[0024] Figure 3 A partial schematic view of the light module provided by the embodiments of the present disclosure is shown.

[0025] Figure 4 A schematic view of the light module provided by the embodiments of the present disclosure is shown.

[0026] The reference signs in the drawings represent the following:

[0027] 1-circuit board; 2-first light source assembly; 3-first steel sheet; 4-heat dissipation main body; 5-second light source assembly; 6-second steel sheet; 7-first colloid; 8-second colloid;

[0028] 101-first positioning hole; 102-first region; 103-second region; 104-first bending part; 105-second bending part; 106-joint; 301-second positioning hole; 401-first positioning column; 402-second positioning column; 403-third positioning column; 404-recess; 601-first positioning groove; 602-second positioning groove.

[0029] The above drawings have shown the specific embodiments of the present disclosure, and more detailed description will be given hereinafter. These drawings and textual description are not intended to limit the scope of the concept of the present disclosure by any means, but to illustrate the concept of the present disclosure to those skilled in the art by referring to specific embodiments. DETAILED DESCRIPTION

[0030] The technical solutions in the embodiments of the present disclosure will be described clearly and completely in combination with the drawings in the embodiments of the present disclosure. Obviously, the described embodiments are only some of the embodiments of the present disclosure, but not all the embodiments. Based on the embodiments in the present disclosure, all other embodiments obtained by those skilled in the art without any creative effort are within the scope of protection of the present disclosure.

[0031] Figure 1 A schematic view of the light module provided by the embodiments of the present disclosure is shown. As shown in the figure, Figure 1As shown, the lighting module includes a circuit board 1, a first light source assembly 2, a first steel sheet 3, and a heat dissipation body 4. The first light source assembly 2 is disposed on a first surface of the circuit board 1, and the first steel sheet 3 is located on a second surface of the circuit board 1. The first surface and the second surface are opposite to each other. At least a portion of the second surface of the circuit board 1 and the side of the first steel sheet 3 away from the circuit board 1 are in contact with the heat dissipation body 4, and the orthographic projection of the first light source assembly 2 on the circuit board 1 is located within the orthographic projection of the first steel sheet 3 on the circuit board 1.

[0032] In the lighting module provided in this embodiment, a first steel sheet 3 is provided on the side of the circuit board 1 facing away from the first light source assembly 2. The first steel sheet 3 can quickly conduct heat generated by the first light source assembly 2, thereby effectively dissipating heat from the first light source assembly 2. Moreover, the side of the first steel sheet 3 facing away from the circuit board 1 and a portion of the second side of the circuit board 1 are attached to the heat dissipation body 4. The heat dissipation body 4 can further dissipate heat from the circuit board 1 and the first light source assembly 2, thereby improving the heat dissipation effect of the lighting module.

[0033] To make the technical solutions and advantages of this disclosure clearer, the embodiments of this disclosure will be described in further detail below with reference to the accompanying drawings.

[0034] like Figure 1 As shown, the lighting module provided in this embodiment includes a circuit board 1, a first light source assembly 2, a first steel sheet 3, and a heat dissipation body 4. The circuit board 1 has a first surface and a second surface facing each other. The first light source assembly 2 is disposed on the first surface of the circuit board 1, and the heat dissipation body 4 is located on the second surface of the circuit board 1. Most of the second surface of the circuit board 1 is in contact with the heat dissipation body 4. The first steel sheet 3 is located between the heat dissipation body 4 and the second surface of the circuit board 1, and the orthographic projection of the first light source assembly 2 on the circuit board 1 lies within the orthographic projection of the first steel sheet 3 on the circuit board 1. The heat dissipation body 4 and the first steel sheet 3 simultaneously serve a heat dissipation function, providing better heat dissipation for the circuit board 1 and the first light source assembly 2.

[0035] In some embodiments of this disclosure, the heat dissipation body 4 is made of metal, or a metal component is embedded in the heat dissipation body 4. A metal component is provided on the side of the heat dissipation body 4 closest to the circuit board 1. The heat dissipation body 4 is formed by injection molding. The metal component can improve the heat conduction efficiency between the heat dissipation body 4, the circuit board 1, and the first steel sheet 3, thereby improving the heat dissipation effect of the lighting module.

[0036] For example, the heat dissipation body 4 is the antenna bracket of an electronic device.

[0037] In some embodiments of this disclosure, such as Figure 1As shown, the heat dissipation main body 4 is provided with a first positioning column 401, the circuit board 1 is provided with a first positioning hole 101, the first steel sheet 3 is provided with a second positioning hole 301, the first positioning hole 101 coincides with the second positioning hole 301, and the first positioning column 401 passes through the first positioning hole 101 and the second positioning hole 301. The first positioning column 401 is used to determine the mounting position of the first steel sheet 3 and the circuit board 1 on the heat dissipation main body 4, and can prevent displacement of the circuit board 1 and the first steel sheet 3 relative to the heat dissipation main body 4.

[0038] In some embodiments of the present disclosure, referring to Figure 1 , the light module further comprises a first adhesive 7 located between the first steel sheet 3 and the heat dissipation main body 4. The first adhesive 7 can bond the first steel sheet 3 and the heat dissipation main body 4, so that the first steel sheet 3 is fixed to the heat dissipation main body 4. Moreover, the first adhesive 7 can fill the gap between the first steel sheet 3 and the heat dissipation main body 4, thereby improving the heat conduction efficiency between the first steel sheet 3 and the heat dissipation main body 4.

[0039] In some embodiments of the present disclosure, as shown in Figure 1 , the light module further comprises a second light source assembly 5, which is arranged on the first surface of the circuit board 1.

[0040] Figure 2 Part of the schematic diagram of the light module provided by the embodiments of the present disclosure. In some embodiments of the present disclosure, as shown in Figure 2 , the first light source assembly 2 is located in the first area 102 of the circuit board 1, and the second light source assembly 5 is located in the second area 103 of the circuit board 1. The first area 102 and the second area 103 are spaced apart from each other and connected by a strip-shaped circuit board. The first light source assembly 2 comprises a flash lamp, and the second light source assembly 5 comprises an RGB lamp bead. The arrangement of the first light source assembly 2 and the second light source assembly 5 can adapt to the internal structure of the electronic device to provide the functions of flash lamp and RGB indicator lamp in different areas.

[0041] For example, referring to Figure 2 , the second light source assembly 5 comprises four RGB lamp beads, which are used to increase the coverage area of the light source and improve the lighting effect.

[0042] Figure 3 Part of the schematic diagram of the light module provided by the embodiments of the present disclosure. In some embodiments of the present disclosure, as shown in Figure 3 , the light module further comprises a second steel sheet 6, which is located on the second surface of the circuit board 1. The second steel sheet 6 is attached to the heat dissipation main body 4 on the side away from the circuit board 1, and the orthographic projection of the second light source assembly 5 on the circuit board 1 is located within the orthographic projection of the second steel sheet 6 on the circuit board 1. The second steel sheet 6 is used to connect the circuit board 1 and the heat dissipation main body 4, thereby dissipating heat for the second light source assembly 5.

[0043] In some embodiments of the present disclosure, as shown in Figure 3 The light module further comprises a connector 106 located at the end of the second surface of the circuit board 1, the connector 6 is used to electrically connect the circuit board 1 with the mainboard of the electronic device, so as to control the operation of the light module.

[0044] Optionally, referring to Figures 2-3 The circuit board 1 is provided with a first bending part 104 and a second bending part 105, the first bending part 104 is located between the connector 106 and the second area 103, and the second bending part 105 is located between the first area 102 and the second area 103, the first bending part 104 and the second bending part 105 are used to adjust the spatial structure of the circuit board 1, so as to adapt the circuit board 1 to the internal structure of the heat dissipation main body 4 and the electronic device.

[0045] Figure 4 The schematic diagram of the light module provided by the embodiments of the present disclosure. In some embodiments of the present disclosure, as shown in Figures 3-4 The opposite two side edges of the second steel sheet 6 are respectively provided with a first positioning groove 601 and a second positioning groove 602, and the heat dissipation main body 4 is provided with a second positioning column 402 and a third positioning column 403, the second positioning column 402 is located in the first positioning groove 601, and the third positioning column 403 is located in the second positioning groove 602. The second positioning column 402 and the third positioning column 403 are used to position the second steel sheet 6, and can prevent the circuit board 1 and the second steel sheet 6 from being displaced relative to the heat dissipation main body 4.

[0046] Optionally, as shown in Figure 1 The light module further comprises a second adhesive 8 located between the second steel sheet 6 and the heat dissipation main body 4. The second adhesive 8 can bond the second steel sheet 6 and the heat dissipation main body 4, so that the second steel sheet 6 is fixed to the heat dissipation main body 4. Moreover, the second adhesive 8 can fill the gap between the second steel sheet 6 and the heat dissipation main body 4, and improve the heat conduction efficiency between the second steel sheet 6 and the heat dissipation main body 4.

[0047] It should be noted that the adhesive can also be provided between the second steel sheet 6 and the circuit board 1, and between the first steel sheet 3 and the circuit board 1, the adhesive is used to bond the first steel sheet 3, the second steel sheet 6 and the circuit board 1, and improve the heat conduction efficiency between the circuit board 1 and the first steel sheet 3 and the second steel sheet 6.

[0048] Optionally, metal powder is added to the first adhesive 7 and the second adhesive 8. The metal powder can be copper powder, silver powder, other metal powder and / or alloy powder. The metal powder can improve the heat conduction effect of the adhesive, and thus improve the heat dissipation effect of the light module.

[0049] In some embodiments of the present disclosure, the heat dissipation body 4 is provided with a recess 404, and the first light source assembly 2, the first steel sheet 3 and part of the circuit board 1 are located in the recess 404. The recess 404 can reduce the local thickness of the light module, so as to adapt to the internal structure of the electronic device and arrange various devices in the electronic device more compactly.

[0050] In a second aspect, the embodiments of the present disclosure further provide an electronic device, which comprises the light module in any of the embodiments of the first aspect.

[0051] It should be noted that the electronic device provided by the embodiments of the present disclosure can be, but is not limited to, a remote controller, a tablet computer, an MP3 player (Moving Picture Experts Group Audio Layer III), an MP4 player (Moving Picture Experts Group Audio Layer IV), and a notebook computer. The electronic device can also be referred to as a user device, a portable terminal, a laptop terminal, or other names.

[0052] In the electronic device provided by the embodiments of the present disclosure, the heat dissipation body 4 is made of metal or has a metal piece embedded therein. The heat dissipation body 4 is provided with a metal piece on the side close to the circuit board 1, and the heat dissipation body 4 is formed by an injection molding process. The metal piece can improve the heat conduction efficiency between the heat dissipation body 4, the circuit board 1 and the first steel sheet 3, thereby improving the heat dissipation effect of the light module.

[0053] It should be noted that in the present disclosure, "several", "at least one" means one or more, "several", "at least two" means two or more. "And / or" describes the association between the associated objects, which means that there can be three relationships, for example, A and / or B can represent the following three cases: A exists alone, A and B exist together, and B exists alone. The character " / " generally represents an "or" relationship between the front and rear associated objects.

[0054] In the description of the present disclosure, it should be noted that, unless otherwise explicitly specified and limited, the terms "mounting", "connection", "connection" should be understood in a broad sense, for example, it can be fixed connection, or detachable connection, or integral connection; it can be mechanical connection; it can be direct connection, or indirect connection through intermediate medium; it can be the internal connection of two elements or the interaction relationship between two elements. For those skilled in the art, the specific meaning of the above terms in the present disclosure can be understood according to the specific circumstances.

[0055] In the present disclosure, unless specifically defined otherwise, the terms "on", "under", "above", "below", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counter-clockwise", "axial", "radial", "circumferential" and the like, indicate relative positions after the positions or orientation relationships based on the positions shown in the drawings are taken into account, and are merely used to facilitate the description of the present application and simplify the description, and do not indicate or imply that the referred device or element must have a particular position, be constructed and operated in a particular position, and therefore cannot be understood as a limitation on the present disclosure.

[0056] In the description of the present disclosure, it should be understood that the orientation or positional relationship indicated by the terms "center", "longitudinal", "transverse", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counter-clockwise", "axial", "radial", "circumferential" and the like is based on the orientation or positional relationship shown in the drawings, and is merely used to facilitate the description of the present application and simplify the description, and does not indicate or imply that the referred device or element must have a particular orientation, be constructed and operated in a particular orientation, and therefore cannot be understood as a limitation on the present disclosure.

[0057] In the description of the present disclosure, the description of the terms "certain embodiments", "one embodiment", "some embodiments", "illustrative embodiments", "example", "specific example", or "some examples" means that the specific features, structures, materials or characteristics described in connection with the described embodiments or examples are included in at least one embodiment or example of the present disclosure.

[0058] The above description is only an embodiment of the present disclosure and is not intended to limit the present disclosure. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present disclosure shall be included in the protection scope of the present disclosure.

Claims

1. A light module, characterized in that The application relates to a light module, which comprises a circuit board (1), a first light source assembly (2), a first steel sheet (3) and a heat dissipation main body (4). The first light source assembly (2) is arranged on a first surface of the circuit board (1), the first steel sheet (3) is arranged on a second surface of the circuit board (1), the first surface is opposite to the second surface, at least part of the second surface of the circuit board (1) and a side of the first steel sheet (3) away from the circuit board (1) are attached to the heat dissipation main body (4), and the orthographic projection of the first light source assembly (2) on the circuit board (1) is located in the orthographic projection of the first steel sheet (3) on the circuit board (1).

2. The light module of claim 1, wherein, The heat dissipation main body (4) is made of metal or has a metal piece embedded therein.

3. The light module of claim 1, wherein, The heat dissipation main body (4) is provided with a first positioning column (401), the circuit board (1) is provided with a first positioning hole (101), the first steel sheet (3) is provided with a second positioning hole (301), the first positioning hole (101) coincides with the second positioning hole (301), and the first positioning column (401) penetrates through the first positioning hole (101) and the second positioning hole (301).

4. The light module of claim 1, wherein, The light module further comprises a first adhesive (7) arranged between the first steel sheet (3) and the heat dissipation main body (4).

5. The light module of claim 4, wherein, The light module further comprises a second light source assembly (5) arranged on the first surface of the circuit board (1).

6. The light module of claim 5, wherein, The first light source assembly (2) comprises a flash lamp, and the second light source assembly (5) comprises an RGB lamp bead.

7. The light module of claim 5, wherein, The light module further comprises a second steel sheet (6) arranged on the second surface of the circuit board (1), a side of the second steel sheet (6) away from the circuit board (1) is attached to the heat dissipation main body (4), and the orthographic projection of the second light source assembly (5) on the circuit board (1) is located in the orthographic projection of the second steel sheet (6) on the circuit board (1).

8. The light module of claim 7, wherein, The second steel sheet (6) is provided with a first positioning groove (601) and a second positioning groove (602) at opposite side edges, the heat dissipation main body (4) is provided with a second positioning column (402) and a third positioning column (403), the second positioning column (402) is located in the first positioning groove (601), and the third positioning column (403) is located in the second positioning groove (602).

9. The light module of claim 7, wherein, The light module further comprises a second adhesive (8) arranged between the second steel sheet (6) and the heat dissipation main body (4).

10. The light module of claim 9, wherein, Metal powder is added to the first adhesive (7) and the second adhesive (8).

11. The light module of claim 1, wherein, The heat dissipation main body (4) is provided with a recess (404), the first light source assembly (2), the first steel sheet (3) and part of the circuit board (1) are located in the recess (404).

12. An electronic device, comprising: The light module comprises the light module according to any one of claims 1-11.

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