Surface-mounted film NTC (Negative Temperature Coefficient) thermosensitive resistor

Abstract

The utility model relates to the technical field of thermistors, in particular to an SMD (Surface Mount Device) film NTC (Negative Temperature Coefficient) thermistor which comprises a resistor chip, a top plate is arranged at the top of the resistor chip, first side plates are fixedly connected to the left end and the right end of the top plate, buckle plates are fixedly connected to the bottoms of the first side plates, and second side plates are clamped to the bottoms of the first side plates; a bottom plate is fixedly connected to the bottom of the second side plate, heat dissipation holes are formed in the bottom plate, and positioning plates are fixedly connected to the four corners of the top plate and the four corners of the bottom plate. The heat dissipation structure has the advantages that the top plate and the bottom plate can be prevented from being in contact with the resistor chip through the positioning plate, normal heat dissipation of the resistor chip is guaranteed, hot air at the interval of the resistor chip and the top plate can enter the interval of the bottom plate and the resistor chip through the through grooves, and the hot air can be exhausted outwards through the heat dissipation holes; the height increasing layer can increase the height of the bottom surface of the resistor chip, so that the resistor chip does not make contact with the bottom PC circuit board, and the purpose of protecting the PC circuit board is achieved.

Description

TECHNICAL FIELD

[0001] The utility model relates to thermistor technical field especially a patch type film NTC thermistor. BACKGROUND

[0002] NTC temperature sensitive material is the most widely used thermistor material at present, is widely used in temperature measurement, temperature compensation and suppresses the aspects such as surge current, traditional thermistor generally adopts straight insertion type installation, although heat dissipation is good, but occupies space, height is high, therefore, patch type thermistor appears, patch type thermistor occupies small space, height is short.

[0003] Although the existing patch type thermistor has the advantages of small space occupation and convenient installation, but the temperature of the resistance body can reach 200 DEG C or even higher, such high temperature PCB often cannot bear. UTILITY MODEL CONTENTS

[0004] The utility model aims at solving one of the technical defects.

[0005] The utility model aims at overcoming the defects of prior art, solving the problems mentioned in the background art, and providing a patch type film NTC thermistor.

[0006] The utility model discloses the following technical scheme to realize the purpose: a patch type film NTC thermistor, including resistance chip, the top of resistance chip is provided with the top board, both ends of the top board are fixedly connected with first side plate, the bottom of first side plate is fixedly connected with the buckle board, the bottom of first side plate is connected with the second side plate, the bottom of second side plate is fixedly connected with the bottom plate, the inside of bottom plate is provided with the heat dissipation hole, the four corners of top board and bottom plate are fixedly connected with the positioning plate, the center of first side plate and second side plate is provided with the through slot, the top of second side plate is provided with the buckle board slot;

[0007] The left side of resistance chip is fixedly connected with first pin, and the right side of resistance chip is fixedly connected with second pin, and the bottom of first pin and second pin is fused with the heightening layer.

[0008] Preferably, the number of the first side plate and the second side plate is two, the two first side plates are respectively welded on the left and right sides of one side of the top plate, the spacing of the two first side plates is adapted to the width of the resistance chip, the two second side plates are respectively welded on the left and right sides of one side of the bottom plate, and the spacing of the two second side plates is adapted to the width of the resistance chip.

[0009] By adopting the above technical scheme, the two side plates can be connected with the resistance chip, and the positioning effect is achieved.

[0010] Preferably, the number of the buckling plates is two groups, the number of the buckling plates in each group is four, two buckling plates are welded at two corners of the first side plate respectively, the buckling plate is matched with the buckling plate groove, the top plate, the first side plate, the bottom plate and the second side plate are all high-temperature-resistant materials.

[0011] By adopting the above technical scheme, the buckling of the buckling plate and the buckling plate groove can connect the top plate and the bottom plate, the high-temperature-resistant material can withstand the high temperature of the resistance chip, and the bottom PC circuit board is protected.

[0012] Preferably, the positioning plate is a rectangular plate, the top surface of the positioning plate is overlapped with the outer surface of the resistance chip, the welding angle between the positioning plate and the first side plate is ninety degrees, and the height of the positioning plate is half of the height of the first side plate.

[0013] By adopting the above technical scheme, the positioning plate is set to avoid the contact between the top plate, the bottom plate and the resistance chip.

[0014] Preferably, the through groove is a rectangular groove, the depth of the through groove is the same as the height of the first side plate, and the through groove on one side of the first side plate is communicated with the through groove on one side of the second side plate.

[0015] By adopting the above technical scheme, the through groove is set to make the hot air in the interval between the resistance chip and the top plate enter the interval between the bottom plate and the resistance chip, and the hot air can be discharged outward through the heat dissipation hole.

[0016] Preferably, the material of the height-increasing layer is the same as that of the first pin, and the cross section of the height-increasing layer is the same as that of the first pin.

[0017] By adopting the above technical scheme, the height-increasing layer can increase the height of the bottom surface of the resistance chip, so that the resistance chip does not contact the bottom PC circuit board, and the PC circuit board is protected.

[0018] Compared with the prior art, the utility model has the following advantages:

[0019] 1. The patch type thin film NTC thermistor, through the setting buckling plate, when in use, the top plate, the first side plate, the bottom plate and the second side plate are connected through the buckling plate, the top plate, the first side plate, the bottom plate and the second side plate wrap the resistance chip, the top plate, the first side plate, the bottom plate and the second side plate are all high-temperature-resistant materials, the high-temperature-resistant material can withstand the high temperature of the resistance chip, and the bottom PC circuit board is protected, the positioning plate is set to avoid the contact between the top plate, the bottom plate and the resistance chip, the normal heat dissipation of the resistance chip is guaranteed, the through groove is set to make the hot air in the interval between the resistance chip and the top plate enter the interval between the bottom plate and the resistance chip, and the hot air can be discharged outward through the heat dissipation hole.

[0020] 2. The patch type thin film NTC thermistor, by setting the height increasing layer, the left side of the resistance chip is fixedly connected with the first pin, the right side of the resistance chip is fixedly connected with the second pin, the bottom of the first pin and the second pin is fused with the height increasing layer, the height increasing layer can promote the height of the bottom surface of the resistance chip, so that it does not contact with the bottom PC circuit board, and the purpose of protecting the PC circuit board is achieved, after the installation of the bottom plate, the bottom surface of the bottom plate still does not contact with the PC circuit board, and the space for heat dissipation hole is left for heat dissipation exhaust. BRIEF DESCRIPTION OF DRAWINGS

[0021] Figure 1 It is a structure schematic view of the utility model;

[0022] Figure 2 It is a structure schematic view of the utility model top plate;

[0023] Figure 3 It is a structure schematic view of the utility model bottom plate;

[0024] Figure 4 It is a structure schematic view of the utility model height increasing layer.

[0025] In the drawing: 1-resistance chip, 2-top plate, 3-first side plate, 4-clamping plate, 5-second side plate, 6-bottom plate, 7-heat dissipation hole, 8-positioning plate, 9-through slot, 10-clamping plate slot, 11-first pin, 12-second pin, 13-height increasing layer. DETAILED DESCRIPTION

[0026] The additional aspects and advantages of the utility model will be further given in the following description of the drawings, part will become obvious from the following description, or be understood by the practice of the utility model.

[0027] As Figures 1-3 Shown, a kind of patch type thin film NTC thermistor, it includes resistance chip 1, the top of resistance chip 1 is equipped with top plate 2, the left and right ends of top plate 2 are fused with first side plate 3, the bottom of first side plate 3 is fused with clamping plate 4, the bottom of first side plate 3 is clamped with second side plate 5, the bottom of second side plate 5 is fused with bottom plate 6, and heat dissipation hole 7 is arranged in bottom plate 6, positioning plate 8 is fused at the four corners of top plate 2 and bottom plate 6, through slot 9 is arranged at the center of first side plate 3 and second side plate 5, and clamping plate slot 10 is arranged at the top of second side plate 5.

[0028] Through the above setting, in use, the top plate 2, the first side plate 3, the bottom plate 6 and the second side plate 5 are connected through the buckle plate 4, the top plate 2, the first side plate 3, the bottom plate 6 and the second side plate 5 wrap the resistance chip 1, the top plate 2, the first side plate 3, the bottom plate 6 and the second side plate 5 are high-temperature-resistant materials, the high-temperature-resistant material can withstand the high temperature of the resistance chip, protect the bottom PC circuit board, the setting of the positioning plate 8 can avoid the top plate 2 and the bottom plate 6 from contacting the resistance chip 1, ensure the normal heat dissipation of the resistance chip 1, the setting of the through slot 9 can make the hot air at the interval between the resistance chip 1 and the top plate 2 enter the interval between the bottom plate 6 and the resistance chip 1, and the hot air can be discharged outward through the heat dissipation hole 7;

[0029] As shown in Figure 1 and Figure 4 The left side of the resistance chip 1 is welded with the first pin 11, the right side of the resistance chip 1 is welded with the second pin 12, and the bottom of the first pin 11 and the second pin 12 is fused with the height increasing layer 13.

[0030] Through the above setting, the height increasing layer 13 can lift the height of the bottom surface of the resistance chip 1, so that the resistance chip 1 does not contact the bottom PC circuit board, and the purpose of protecting the PC circuit board is achieved; after the bottom plate 6 is installed, the bottom surface of the bottom plate 6 still does not contact the PC circuit board, and space for heat dissipation and exhaust is left for the heat dissipation hole 7.

[0031] As a preferred technical scheme of the utility model, the number of the first side plate 3 and the second side plate 5 is two, two first side plates 3 are welded on the left and right sides of one side of the top plate 2, the interval of the two first side plates 3 is adapted to the width of the resistance chip 1, and two second side plates 5 are welded on the left and right sides of one side of the bottom plate 6, the interval of the two second side plates 5 is adapted to the width of the resistance chip 1.

[0032] As a preferred technical scheme of the utility model, the number of the buckle plate 4 is two groups, the number of each group of buckle plate 4 is four, two buckle plates 4 are welded at the corners of the first side plate 3, the buckle plate 4 is adapted to the buckle groove 10, and the top plate 2, the first side plate 3, the bottom plate 6 and the second side plate 5 are high-temperature-resistant materials.

[0033] As a preferred technical scheme of the utility model, the positioning plate 8 is a rectangular plate, the top surface of the positioning plate 8 is overlapped with the outer surface of the resistance chip 1, the welding angle between the positioning plate 8 and the first side plate 3 is ninety degrees, and the height of the positioning plate 8 is half of the height of the first side plate 3.

[0034] As a preferred technical scheme of the utility model, the through slot 9 is a rectangular slot, the depth of the through slot 9 is the same as the height of the first side plate 3, and the through slot 9 on one side of the first side plate 3 is communicated with the through slot 9 on one side of the second side plate 5.

[0035] As a preferred technical scheme of the utility model, the material of the height increasing layer 13 is the same as that of the first pin 11, and the cross section of the height increasing layer 13 is the same as that of the first pin 11.

[0036] The working process of the utility model is as follows:

[0037] S1, the top plate 2, the first side plate 3, the bottom plate 6 and the second side plate 5 are connected through the buckle plate 4, the top plate 2, the first side plate 3, the bottom plate 6 and the second side plate 5 wrap the resistance chip 1, the material of high temperature resistance can withstand the high temperature of the resistance chip, and the bottom PC circuit board is protected.

[0038] S2, the setting of the positioning plate 8 can avoid the top plate 2 and the bottom plate 6 from contacting the resistance chip 1, guarantee the normal heat dissipation of the resistance chip 1, the setting of the through slot 9 can make the hot air at the interval between the resistance chip 1 and the top plate 2 enter the interval between the bottom plate 6 and the resistance chip 1, and the hot air can be discharged outward through the heat dissipation hole 7;

[0039] S3, the height increasing layer 13 can lift the bottom surface height of the resistance chip 1, so that the resistance chip 1 does not contact the bottom PC circuit board, and the purpose of protecting the PC circuit board is achieved.

[0040] Although the embodiments of the utility model have been shown and described, it can be understood by those skilled in the art that various changes, modifications, replacements and variations can be made to the embodiments without departing from the principles and spirits of the utility model, and the scope of the utility model is defined by the appended claims and their equivalents.

Claims

1. A chip thin film NTC thermistor, characterized by: The utility model relates to a kind of resistance chip, the top of resistance chip (1) is provided with top plate (2), the left and right ends of the top plate (2) are fixedly connected with first side plate (3), the bottom of the first side plate (3) is fixedly connected with buckle plate (4), the bottom of the first side plate (3) is clamped with second side plate (5), the bottom of the second side plate (5) is fixedly connected with bottom plate (6), the inside of the bottom plate (6) is equipped with heat dissipation hole (7), the four corners of the top plate (2) and bottom plate (6) are fixedly connected with positioning plate (8), the center of the first side plate (3) and second side plate (5) is equipped with through slot (9), the top of the second side plate (5) is equipped with buckle slot (10); The left side of the resistance chip (1) is fixedly connected with first pin (11), the right side of the resistance chip (1) is fixedly connected with second pin (12), and the bottom of the first pin (11) and the second pin (12) is fused with the heightening layer (13).

2. A chip thin film NTC thermistor according to claim 1, characterized in that: The number of the first side plate (3) and the second side plate (5) is two, the left and right sides of the top plate (2) on one side of the two first side plates (3) are welded respectively, the interval of the two first side plates (3) is adapted to the width of the resistance chip (1), the left and right sides of the bottom plate (6) on one side of the two second side plates (5) are welded respectively, and the interval of the two second side plates (5) is adapted to the width of the resistance chip (1).

3. A chip thermistor according to claim 1, wherein: The number of the buckle plate (4) is two groups, the number of the buckle plate (4) in each group is four, the two buckle plates (4) are welded at the two corners of the first side plate (3) respectively, the buckle plate (4) is adapted to the buckle slot (10), and the top plate (2), the first side plate (3), the bottom plate (6) and the second side plate (5) are all high-temperature-resistant materials.

4. A chip thermistor according to claim 1, wherein: The positioning plate (8) is rectangular plate, the top surface of the positioning plate (8) is overlapped with the outer surface of the resistance chip (1), the welding angle between the positioning plate (8) and the first side plate (3) is ninety degrees, and the height of the positioning plate (8) is half of the height of the first side plate (3).

5. A chip thermistor according to claim 1, wherein: The through slot (9) is rectangular slot, the depth of the through slot (9) is same with the height of the first side plate (3), and the through slot (9) on one side of the first side plate (3) is communicated with the through slot (9) on one side of the second side plate (5).

6. A chip thermistor according to claim 1, wherein: The material of the heightening layer (13) is same with the material of the first pin (11), and the section of the heightening layer (13) is same with the section of the first pin (11).

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