Aluminum-zinc high-sheet-resistance metallized film

Abstract

According to the aluminum-zinc high-sheet-resistance metallized film provided by the utility model, the metallized films are arranged on the upper side and the lower side of the base film, so that the thickness of the metal layer can be increased, and the current bearing capability of a capacitor can be improved; the metal layer in the metallized film is connected with the heat-conducting sheet, the heat-conducting sheet adopts any one of the heat-conducting silica gel sheet or the heat-conducting graphite sheet, and the heat-conducting sheet can dissipate heat of the metal layer, so that the metal layer is prevented from being always in a high-temperature environment, and the problem that the metal layer is easy to lose efficacy in the high-temperature environment is solved; the buffer layer is arranged on the outer wall of the metal layer, the buffer layer is formed by plating any one of SiO2 and Si3N4, the buffer layer is very thin, and the buffer layer not only has certain buffer capacity to prevent the metal layer from being damaged by external force, but also can provide an anti-oxidation protective film for the metal layer.

Description

TECHNICAL FIELD

[0001] The utility model belongs to capacitor production base material technical field especially relates to a kind of aluminium-zinc high square resistance metallized film. BACKGROUND

[0002] Thin-film capacitor is widely used due to its good voltage resistance and self-healing, and the metallized film is an important material for the production of thin-film capacitor. High-purity metal is melted, evaporated and deposited on the dielectric base film in a high vacuum state to form a very thin metal plating layer on the surface of the dielectric base film. The thin film after the above process is a metallized film. The resistance value of the metal plating layer on the metallized film per square is called square resistance, i.e. sheet resistance.

[0003] According to the search, the authorized patent number CN209471833U discloses a kind of capacitor with gradually changing square resistance zinc-aluminum metallized film, including base film, base film is evaporated with a layer of metal film, and form edge retention on both sides, gradually thickening from both sides to middle;Metal film is provided with thickening area consistent with its width, thickening area includes oxidation-resistant film and wave-shaped elastic sheet, oxidation-resistant film is provided with wave-shaped groove for lamination with wave-shaped elastic sheet, wave-shaped elastic sheet and wave-shaped groove are connected by adhesion, the bottom of wave-shaped elastic sheet is connected with metal film by evaporation deposition. The base film of the capacitor with gradually changing square resistance zinc-aluminum metallized film of the utility model is evaporated with metallized film, and the oxidation-resistant film is provided on the metallized film to protect the metal film, effectively prevent its oxidation. Secondly, wave-shaped elastic sheet is provided between oxidation-resistant film and metal film, which can play a buffering role and increase the compression strength of the entire metallized film.

[0004] The above-mentioned comparative document also has the following deficiencies: first, since the metallized film layer is thinner than the metal foil, the capacitor with a layer of metal film has weak ability to carry large current;Second, the capacitance of the metallized film capacitor changes greatly with temperature, and it is easy to fail in high temperature environment. Therefore, the utility model provides an aluminium-zinc high square resistance metallized film to solve the above problems. UTILITY MODEL CONTENTS

[0005] The utility model provides an aluminium-zinc high square resistance metallized film, which aims to solve the problems raised in the background art.

[0006] The utility model is implemented as follows: an aluminium-zinc high square resistance metallized film, comprising a film assembly and a heat-conducting sheet.

[0007] The film assembly comprises a base film and a metallized film, and the base film is provided with the metallized film on both upper and lower sides. The metallized film comprises a metal layer and a buffer layer. The metal layer is evaporated on the outer wall of the base film, and the buffer layer is plated on the outer wall of the metal layer.

[0008] The metal layer is connected with a heat-conducting sheet, and the heat-conducting sheet is fixed with the base film.

[0009] Preferably, the base film is an insulating film, and any one of polypropylene film, polystyrene film, polyphenylene sulfide film, polyester film and polycarbonate film is adopted.

[0010] Preferably, a flash is arranged at a longitudinal edge of one side of the metalized film, and the flash exposes the surface of the base film.

[0011] Preferably, the metal layer is made of zinc-aluminum composite material.

[0012] Preferably, the buffer layer is plated with any one of SiO2 and Si3N4.

[0013] Preferably, the heat-conducting sheet is any one of heat-conducting silica gel sheet or heat-conducting graphite sheet.

[0014] Compared with the prior art, the utility model has the beneficial effects that:

[0015] The metalized film is arranged on the upper and lower sides of the base film, so that the thickness of the metal layer is increased, and the capacity of the capacitor to bear current is increased; the heat-conducting sheet is connected with the metal layer in the metalized film, the heat-conducting sheet is any one of heat-conducting silica gel sheet or heat-conducting graphite sheet, the heat-conducting sheet can dissipate the heat of the metal layer, so that the metal layer is prevented from being in a high-temperature environment for a long time and from being easily damaged in the high-temperature environment; the buffer layer is arranged on the outer wall of the metal layer, the buffer layer is plated with any one of SiO2 and Si3N4, the buffer layer is very thin, and the buffer layer not only has a certain buffering capacity to prevent the metal layer from being damaged by external force, but also provides an oxidation-resistant protective film for the metal layer. BRIEF DESCRIPTION OF DRAWINGS

[0016] Figure 1 It is an overall structure front view of the utility model;

[0017] Figure 2 It is an overall structure front view of the utility model;

[0018] Figure 3 It is Figure 2 It is an enlarged view of A in the middle.

[0019] In the drawing:

[0020] 1, film assembly; 11, base film; 12, metalized film; 13, metal layer; 14, buffer layer;

[0021] 2, heat-conducting sheet; 3, flash. DETAILED DESCRIPTION

[0022] The technical solutions of the present application will be described clearly and completely in connection with the drawings. Obviously, the described embodiments are some of the embodiments of the present application, but not all the embodiments.

[0023] The components of the embodiments of the present application described and shown in the accompanying drawings can be arranged and designed in various different configurations. Therefore, the following detailed description of the embodiments of the present application provided in the accompanying drawings is not intended to limit the scope of the claimed present application, but merely represents selected embodiments of the present application.

[0024] Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without creative labor fall within the scope of the present application.

[0025] In the description of the present application, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer" and the like indicate the orientation or positional relationship based on the orientation or positional relationship shown in the drawings, and are merely for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the devices or elements referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore cannot be understood as limiting the present application. In addition, the terms "first", "second", "third" are only for descriptive purposes and cannot be understood as indicating or implying relative importance.

[0026] In the description of the present application, it should be noted that unless otherwise explicitly specified and limited, the terms "mounting", "connection", "connection" should be understood broadly, for example, it can be fixedly connected, or it can be detachably connected, or integrally connected; it can be mechanically connected, or it can be electrically connected; it can be directly connected, or it can be indirectly connected through an intermediate medium; it can be the communication between two elements inside. For those skilled in the art, the specific meaning of the above terms in the present application can be understood according to the specific circumstances.

[0027] Please refer to Figures 1 to 3 The present application provides a technical solution: an aluminum-zinc high-ohmic metalized film, comprising a film assembly 1 and a heat-conducting sheet 2; the film assembly 1 comprises a base film 11 and a metalized film 12, the upper and lower sides of the base film 11 are provided with the metalized film 12, the metalized film 12 comprises a metal layer 13 and a buffer layer 14, the metal layer 13 is evaporated on the outer wall of the base film 11, and the buffer layer 14 is plated on the outer wall of the metal layer 13; the metal layer 13 is connected with the heat-conducting sheet 2, and the heat-conducting sheet 2 is fixed with the base film 11.

[0028] In the embodiment, the metalized film 12 is arranged on both sides of the base film 11, so that the thickness of the metal layer 13 is increased, and the capacity of the capacitor to bear current is increased; the metal layer 13 in the metalized film 12 is connected with the heat-conducting sheet 2, the heat-conducting sheet 2 is made of any one of heat-conducting silica gel sheet and heat-conducting graphite sheet, the heat-conducting sheet 2 can dissipate the heat of the metal layer 13, so that the metal layer 13 is not always in a high-temperature environment, and the problem that the metal layer 13 is easy to fail in a high-temperature environment is avoided; the buffer layer 14 is arranged on the outer wall of the metal layer 13, the buffer layer 14 is plated with any one of SiO2 and Si3N4, the buffer layer 14 is very thin, and the buffer layer 14 not only has a certain buffering capacity to avoid damage of the metal layer 13 by external force, but also provides the metal layer 13 with an oxidation-resistant protective film.

[0029] Further, the base film 11 is an insulating film made of any one of polypropylene film, polystyrene film, polyphenylene sulfide film, polyester film and polycarbonate film.

[0030] In the embodiment, the base film 11 is made of any one of polypropylene film, polystyrene film, polyphenylene sulfide film, polyester film and polycarbonate film, and is made of insulating material, so that the two metalized films 12 do not affect each other.

[0031] Further, as shown in Figure 2 , the metalized film 12 is arranged on both sides of the base film 11, so that the thickness of the metal layer 13 is increased, and the capacity of the capacitor to bear current is increased; the metal layer 13 in the metalized film 12 is connected with the heat-conducting sheet 2, the heat-conducting sheet 2 is made of any one of heat-conducting silica gel sheet and heat-conducting graphite sheet, the heat-conducting sheet 2 can dissipate the heat of the metal layer 13, so that the metal layer 13 is not always in a high-temperature environment, and the problem that the metal layer 13 is easy to fail in a high-temperature environment is avoided; the buffer layer 14 is arranged on the outer wall of the metal layer 13, the buffer layer 14 is plated with any one of SiO2 and Si3N4, the buffer layer 14 is very thin, and the buffer layer 14 not only has a certain buffering capacity to avoid damage of the metal layer 13 by external force, but also provides the metal layer 13 with an oxidation-resistant protective film.

[0032] In the embodiment, the metalized film 12 is arranged on both sides of the base film 11, so that the thickness of the metal layer 13 is increased, and the capacity of the capacitor to bear current is increased; the metal layer 13 in the metalized film 12 is connected with the heat-conducting sheet 2, the heat-conducting sheet 2 is made of any one of heat-conducting silica gel sheet and heat-conducting graphite sheet, the heat-conducting sheet 2 can dissipate the heat of the metal layer 13, so that the metal layer 13 is not always in a high-temperature environment, and the problem that the metal layer 13 is easy to fail in a high-temperature environment is avoided; the buffer layer 14 is arranged on the outer wall of the metal layer 13, the buffer layer 14 is plated with any one of SiO2 and Si3N4, the buffer layer 14 is very thin, and the buffer layer 14 not only has a certain buffering capacity to avoid damage of the metal layer 13 by external force, but also provides the metal layer 13 with an oxidation-resistant protective film.

[0033] Further, the metal layer 13 is made of zinc-aluminum composite material.

[0034] In the embodiment, the metal layer 13 is made of zinc-aluminum composite material, and in another embodiment, the metal layer 13 can also be made of aluminum material.

[0035] Further, the buffer layer 14 is plated with any one of SiO2 and Si3N4.

[0036] In the embodiment, the buffer layer 14 is plated with any one of SiO2 and Si3N4, and the buffer layer 14 is very thin, and the buffer layer 14 not only has a certain buffering capacity to avoid damage of the metal layer 13 by external force, but also provides the metal layer 13 with an oxidation-resistant protective film.

[0037] Further, the heat-conducting sheet 2 is made of any one of heat-conducting silica gel sheet and heat-conducting graphite sheet.

[0038] In the embodiment, the heat-conducting sheet 2 is made of any one of heat-conducting silica gel sheet or heat-conducting graphite sheet, and the heat-conducting sheet 2 can dissipate the heat of the metal layer 13, so as to avoid the metal layer 13 being in high temperature environment all the time and the problem that the metal layer 13 is easy to fail in high temperature environment

[0039] The working principle and use process of the utility model are as follows: the metalized film 12 is arranged on the upper and lower sides of the base film 11, so that the thickness of the metal layer 13 can be increased, and the capacity of the capacitor to bear current can be increased; the heat-conducting sheet 2 is connected to the metal layer 13 in the metalized film 12, the heat-conducting sheet 2 is made of any one of heat-conducting silica gel sheet or heat-conducting graphite sheet, the heat-conducting sheet 2 can dissipate the heat of the metal layer 13, so as to avoid the metal layer 13 being in high temperature environment all the time and the problem that the metal layer 13 is easy to fail in high temperature environment; the buffer layer 14 is arranged on the outer wall of the metal layer 13, the buffer layer 14 is plated with any one of SiO2 and Si3N4, the buffer layer 14 is very thin, and the buffer layer 14 not only has a certain buffering capacity to avoid the metal layer 13 being damaged by external force, but also can provide the metal layer 13 with an oxidation-resistant protective film.

[0040] The above only describes the preferred embodiment of the utility model, and does not limit the utility model, and any modification, equivalent replacement and improvement within the spirit and principle of the utility model should be included in the protection scope of the utility model.

Claims

1. An aluminum-zinc high sheet resistance metallization film, characterized by: The film assembly (1) and the heat-conducting sheet (2) are connected. The film assembly (1) comprises a base film (11) and a metalized film (12), the upper and lower sides of the base film (11) are provided with the metalized film (12), the metalized film (12) comprises a metal layer (13) and a buffer layer (14), the metal layer (13) is evaporated on the outer wall of the base film (11), and the buffer layer (14) is plated on the outer wall of the metal layer (13). The metal layer (13) is connected with the heat-conducting sheet (2), and the heat-conducting sheet (2) is fixed with the base film (11).

2. The aluminum-zinc high-sheer metallization film according to claim 1, characterized in that: The base film (11) is an insulating film, and any one of polypropylene film, polystyrene film, polyphenylene sulfide film, polyester film and polycarbonate film can be adopted.

3. The aluminum-zinc high-shear-strength metallization film according to claim 1, characterized in that: The metalized film (12) is provided with a reserved edge (3) exposing the surface of the base film (11) at the longitudinal edge of one side.

4. The aluminum-zinc high-shear-strength metallization film according to claim 1, characterized in that: The metal layer (13) is made of zinc-aluminum composite material.

5. The aluminum-zinc high-shear-strength metallization film according to claim 1, characterized in that: The buffer layer (14) is plated with any one of SiO2 and Si3N4.

6. The aluminum-zinc high-shear-strength metallization film according to claim 1, characterized in that: The heat-conducting sheet (2) adopts any one of heat-conducting silica gel sheet or heat-conducting graphite sheet.

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