Package structure
By adopting a two-layer dielectric structure, the problem of uneven thickness of thick circuit boards after the dielectric material is filled into the accommodating groove is solved, and the uniform thickness and depression-free effect of the packaging structure are achieved.
Patent Information
- Application Number
- CN202422835699.5
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-11-20
- Publication Date
- 2025-12-05
- Estimated Expiration
- 2034-11-20
AI Technical Summary
After the dielectric material is filled into the receiving groove, it is difficult to meet the thickness requirements of other areas of the thick circuit board at the same time, and depressions may occur near the receiving groove.
A two-layer dielectric structure is adopted, in which the first dielectric layer is disposed on the surface of the core layer, and the second dielectric layer is partially filled in the accommodating groove and connected to the first dielectric layer. The two layers are made of the same material and form an irregular boundary to ensure that the package structure maintains the required thickness in other areas and avoids depression.
This achieves uniform thickness of the encapsulation structure in other areas after filling the accommodating groove, avoids the formation of depressions, and meets the specifications of the circuit board.
Smart Images
Figure CN223639435U_ABST
Abstract
Description
TECHNICAL FIELD
[0001] The utility model relates to a circuit board field, especially a packaging structure. BACKGROUND
[0002] In recent years, in order to meet the demand of high efficiency, high signal quality, high rigidity or a large number of buried components, electronic equipment such as servers or base stations has generated the demand of using thick circuit boards.
[0003] However, such thick circuit boards are often difficult to meet the required specifications after the dielectric material is filled into the accommodation groove for accommodating the buried component. In detail, after the dielectric material is filled into the accommodation groove, the circuit board has a problem of insufficient thickness in other areas without the accommodation groove. If more dielectric material is used to solve the above problem, the circuit board will have a problem of excessive thickness in other areas without the accommodation groove. Or, after the dielectric material is filled into the accommodation groove, even a depression will be generated near the accommodation groove. SUMMARY
[0004] The utility model provides a packaging structure to meet the required specifications when the second dielectric layer is partially filled into the accommodation groove.
[0005] The packaging structure disclosed in an embodiment of the utility model comprises a core layer, a first dielectric layer and a second dielectric layer. The core layer has a first surface, a second surface and at least one accommodation groove. The first surface is opposite to the second surface. The at least one accommodation groove penetrates the first surface and the second surface. The first dielectric layer is arranged on the first surface of the core layer. The second dielectric layer is at least partially filled in the at least one accommodation groove and connected to the first dielectric layer.
[0006] In an embodiment of the utility model, the first dielectric layer and the second dielectric layer are made of the same material.
[0007] In an embodiment of the utility model, the first dielectric layer and the second dielectric layer are made of ABF.
[0008] In an embodiment of the utility model, an irregular boundary is formed between the first dielectric layer and the second dielectric layer.
[0009] In an embodiment of the utility model, part of the second dielectric layer is located outside the at least one accommodation groove and on the first surface.
[0010] In an embodiment of the utility model, the number of the at least one accommodation groove is multiple. The accommodation grooves are arranged in an array, and the second dielectric layer is at least partially filled in the accommodation grooves.
[0011] In an embodiment of the utility model, the packaging structure further comprises a buried component. The buried component is accommodated in the accommodation groove.
[0012] Another embodiment of this utility model discloses a packaging structure comprising a core layer, a first dielectric layer, a second dielectric layer, and a support layer. The core layer has a first surface, a second surface, and at least one receiving groove. The first surface is opposite to the second surface. The at least one receiving groove extends through both the first surface and the second surface. The first dielectric layer is disposed on the first surface of the core layer. The second dielectric layer at least partially fills the at least one receiving groove and is connected to the first dielectric layer. The support layer is disposed on the second surface.
[0013] In one embodiment of this utility model, the support layer is adhesive tape, dielectric layer, copper foil, or green paint.
[0014] In one embodiment of the present invention, the first dielectric layer and the second dielectric layer are made of the same material.
[0015] According to the packaging structure disclosed in the above embodiments, the second dielectric layer at least partially fills the receiving groove and is connected to the first dielectric layer. In other words, this invention employs a two-layer structure comprising a first dielectric layer and a second dielectric layer to fill the receiving groove. Therefore, the packaging structure can maintain the required thickness in areas without receiving grooves, and no depressions will occur near the receiving grooves. In this way, the required specifications can be met while completing the filling of the receiving groove. Attached Figure Description
[0016] Figure 1 This is a perspective view of the packaging structure according to an embodiment of the present invention.
[0017] Figure 2 for Figure 1 A partially enlarged view of the side cross-sectional schematic diagram of the packaging structure.
[0018] Figures 3 to 6 Presentation Figure 1 The manufacturing method and corresponding structure of the packaging structure in the document. Detailed Implementation
[0019] The following detailed description of the embodiments of this utility model outlines its features and advantages, sufficient to enable any person skilled in the art to understand the technical content of the embodiments and implement them accordingly. Furthermore, based on the disclosure, claims, and drawings in this specification, any person skilled in the art can easily understand the related objectives and advantages of this utility model. The following embodiments further illustrate the viewpoints of this utility model in detail, but are not intended to limit the scope of this utility model in any way.
[0020] Please see Figure 1 and Figure 2 . Figure 1 This is a perspective view of the packaging structure according to an embodiment of the present invention. Figure 2 for Figure 1Figure 2 is a partial enlarged view of a side sectional schematic view of the packaging structure in Figure 1. In this embodiment, the packaging structure 10 comprises a core layer 100, a first dielectric layer 200, a second dielectric layer 300, a support layer 400, and a plurality of embedded components 500. It should be noted that, in order to clearly present the internal structure of the packaging structure 10, Figure 1 Figure 3 is a partial enlarged view of a side sectional schematic view of the packaging structure in Figure 1, in which the second dielectric layer 300 is omitted.
[0021] In this embodiment, the core layer 100, for example, has a first surface 110, a second surface 120, and a plurality of accommodation grooves 130. The first surface 110 is opposite to the second surface 120. The accommodation grooves 130 penetrate through the first surface 110 and the second surface 120, and are arranged in an array. The embedded components 500, for example, are respectively accommodated in the accommodation grooves 130, and can be, for example, wafers, capacitors, or other components. The support layer 400 is disposed on the second surface 120, and is, for example, any structure capable of providing support function, such as an adhesive tape, a dielectric layer, a copper foil, or a green paint. In other embodiments, the core layer can also only comprise one accommodation groove, and the packaging structure can also only comprise one embedded component. In other embodiments, the accommodation grooves can also be arranged randomly, as long as the accommodation grooves are closely arranged. In addition, in other embodiments, a plurality of embedded components can also be accommodated in one accommodation groove.
[0022] The first dielectric layer 200 is disposed on the first surface 110 of the core layer 100. The second dielectric layer 300 at least partially fills in the accommodation grooves 130 and is connected to the first dielectric layer 200. That is, the packaging structure 10 of the present application adopts a two-layer structure comprising the first dielectric layer 200 and the second dielectric layer 300 to fill the accommodation grooves 130. Therefore, the packaging structure 10 can maintain the required thickness in other areas without the accommodation grooves 130, and the vicinity of the accommodation grooves 130 will not be recessed. In this way, the required specifications can be met while the filling of the accommodation grooves 130 is completed.
[0023] In addition, in this embodiment, part of the second dielectric layer 300, for example, is located outside the accommodation grooves 130 and on the first surface 110, to ensure the alignment accuracy of the second dielectric layer 300 when being pressed into the accommodation grooves 130. However, in other embodiments, if the process conditions allow, the second dielectric layer can also be completely filled into the accommodation grooves, and the boundary between the first dielectric layer and the second dielectric layer can also be flush with the first surface. It should be noted that, in other embodiments, the support layer 400 can also be omitted. Figure 2In the drawings, in order to clearly present the technical features of the present application, the first dielectric layer 200 and the second dielectric layer 300 are presented in different forms of section lines, but the first dielectric layer 200 and the second dielectric layer 300 are not limited to the forms of section lines. Further, in the present embodiment, the first dielectric layer 200 and the second dielectric layer 300 are made of the same material, such as ABF (Ajinomoto Build-up Film). In this way, the process of the packaging structure 10 can be more convenient and fast, and the inconvenience of selecting different materials can be saved.
[0024] As shown in Figure 2 , for example, irregular boundaries B are formed between the first dielectric layer 200 and the second dielectric layer 300. Please refer to Figures 3 to 6 . Figures 3 to 6 The manufacturing method of the packaging structure in Figure 1 and the corresponding structure are presented. Figures 3 to 6 The manufacturing method of the packaging structure 10 according to an embodiment of the present application in comprises the following steps.
[0025] As shown in Figure 3 , the core layer 100, the first dielectric layer 200, the second dielectric layer 300, the support layer 400 and the embedded element 500 are provided. The support layer 400 is arranged on the second surface 120 of the core layer 100. The first dielectric layer 200 and the second dielectric layer 300 are located on the side of the core layer 100 away from the support layer 400. The embedded element 500 is accommodated in the accommodation groove 130 of the core layer 100.
[0026] Then, as shown in Figure 4 and Figure 5 , the first dielectric layer 200 and the second dielectric layer 300 are moved towards the core layer 100 along the moving direction M.
[0027] Then, as shown in Figure 2 and Figure 6 , the first dielectric layer 200 and the second dielectric layer 300 are pressed on the core layer 100 along the pressing direction P, so that the second dielectric layer 300 is at least partially filled in the accommodation groove 130 and connected to the first dielectric layer 200. At this point, the manufacturing of the packaging structure 10 is completed. It should be noted that the support layer 400 can also be removed after the above pressing step, or the support layer 400 can be retained and subsequent build-up operation can be performed.
[0028] According to the package structure disclosed in the above embodiments, the second dielectric layer at least partially fills the accommodation groove and is connected to the first dielectric layer. That is, the utility model adopts a two-layer structure including the first dielectric layer and the second dielectric layer to fill the accommodation groove. Therefore, the package structure can maintain the required thickness in other areas without the accommodation groove, and no recess is generated near the accommodation groove. In this way, the required specifications can be met while the filling of the accommodation groove is completed.
[0029] SYMBOL DESCRIPTION
[0030] 10: package structure
[0031] 100: core layer
[0032] 110: first surface
[0033] 120: second surface
[0034] 130: accommodation groove
[0035] 200: first dielectric layer
[0036] 300: second dielectric layer
[0037] 400: support layer
[0038] 500: embedded element
[0039] B: boundary
[0040] M: moving direction
[0041] P: pressing direction
Claims
1. A package structure, characterized by, A core layer having a first surface, a second surface, and at least one receiving slot, the first surface being opposite to the second surface, the at least one receiving slot penetrating through the first surface and the second surface; a first dielectric layer disposed on the first surface of the core layer; and a second dielectric layer at least partially filled in the at least one receiving slot and connected to the first dielectric layer. wherein the first dielectric layer and the second dielectric layer are made of the same material. wherein the first dielectric layer and the second dielectric layer are made of ABF.
2. The package structure of claim 1, wherein, wherein an irregular boundary is formed between the first dielectric layer and the second dielectric layer.
3. The package structure of claim 2, wherein, wherein a portion of the second dielectric layer is located outside the at least one receiving slot and on the first surface.
4. The package structure of claim 1, wherein, wherein the at least one receiving slot is a plurality of receiving slots arranged in an array and the second dielectric layer is at least partially filled in the plurality of receiving slots.
5. The package structure of claim 1, wherein, further comprising an embedded element accommodated in the receiving slot.
6. The package structure of claim 1, wherein, A core layer having a first surface, a second surface, and at least one receiving slot, the first surface being opposite to the second surface, the at least one receiving slot penetrating through the first surface and the second surface; 7. The package structure of claim 1, wherein, a first dielectric layer disposed on the first surface of the core layer; 8. A package structure, characterized by, a second dielectric layer at least partially filled in the at least one receiving slot and connected to the first dielectric layer; and a support layer disposed on the second surface. wherein the support layer is an adhesive tape, a dielectric layer, a copper foil, or a green paint. wherein the first dielectric layer and the second dielectric layer are made of the same material. 9. The package structure of claim 8, wherein, 10. The package structure of claim 8, wherein,