Electronic equipment

Abstract

The embodiment of the utility model relates to the technical field of electronics, and particularly discloses electronic equipment, which comprises a shell, a circuit board, a chip assembly and a heat dissipation assembly, the circuit board is arranged on the shell and is provided with a grounding part; the chip assembly is arranged on the circuit board, and the chip assembly and the grounding part are arranged at an interval; the heat dissipation assembly comprises a heat dissipation piece and a grounding spring, the heat dissipation piece is arranged on the circuit board, the grounding spring is arranged between the circuit board and the heat dissipation piece, one end of the grounding spring is connected with the heat dissipation piece, the other end of the grounding spring is connected with the grounding part, and the circuit board, the heat dissipation piece and the grounding spring jointly define an electromagnetic shielding space. The chip assembly is at least partially located in the electromagnetic shielding space. Compared with a grounding structure of conductive foam and conductive gum, the grounding spring can reduce the contact impedance, improve the conductivity of the heat dissipation assembly and the circuit board, and enhance the grounding effect of the heat dissipation assembly and the circuit board, thereby enhancing the electromagnetic shielding effect of the heat dissipation assembly on the chip assembly.

Description

TECHNICAL FIELD

[0001] The embodiment of the utility model relates to electronic technical field, especially a kind of electronic equipment. BACKGROUND

[0002] Electronic equipment refers to a kind of equipment that realizes data processing, signal conversion, communication, display and other functions by electronic components and circuit, is widely applied in consumer, communication, medical treatment, industry or national defense and other fields.

[0003] In consumer electronic equipment, generally including circuit board, chip component and heat dissipation component etc., chip component is installed on circuit board, in the working process of chip component, a large amount of electromagnetic radiation is easy to produce, in order to reduce the electromagnetic radiation of chip component to leak, generally first through heat dissipation component covers chip component, then through the grounding point connection of heat dissipation component and circuit board, to form electromagnetic shielding structure to chip component, reach the purpose of absorbing and shielding the electromagnetic radiation of chip component, reduce the electromagnetic radiation of chip component to leak.

[0004] At present, the grounding point of heat dissipation component and circuit board is connected by using conductive foam, wherein one side of conductive foam is bonded with heat dissipation component through conductive back glue, the other side of conductive foam is bonded with the grounding point of circuit board through conductive back glue, to realize the grounding of heat dissipation component and circuit board. However, the contact impedance of conductive foam and conductive back glue is large, which leads to poor conductivity of heat dissipation component and circuit board, resulting in poor grounding effect of heat dissipation component and circuit board, so that the electromagnetic shielding effect of heat dissipation component on chip component is weak. UTILITY MODEL CONTENT

[0005] The technical problem solved by the embodiment of the utility model is to provide an electronic device that can enhance the electromagnetic shielding effect.

[0006] To solve the above technical problem, one technical scheme adopted by the embodiment of the utility model is to provide an electronic device, which comprises a shell, a circuit board, a chip component and a heat dissipation component. The circuit board is arranged in the shell, and the circuit board is provided with a grounding part. The chip component is arranged on the circuit board, and the chip component is arranged in a spaced manner with the grounding part. The heat dissipation component comprises a heat dissipation piece and a grounding spring. The heat dissipation piece is arranged on the circuit board, and the grounding spring is arranged between the circuit board and the heat dissipation piece. One end of the grounding spring is connected to the heat dissipation piece, and the other end of the grounding spring is connected to the grounding part. The circuit board, the heat dissipation piece and the grounding spring jointly form an electromagnetic shielding space, and the chip component is at least partially located in the electromagnetic shielding space.

[0007] Optionally, along a first direction, the diameter of the grounding spring gradually increases, and the first direction is the direction of the heat dissipation piece towards the circuit board.

[0008] Optionally, the heat dissipation member is provided with a screw hole; the heat dissipation assembly comprises a screwing member, the grounding spring is sleeved on the screwing member, and the screwing member is screwed into the screw hole after penetrating through the grounding spring away from the circuit board.

[0009] Optionally, the heat dissipation member is provided with a groove, the screw hole is communicated with the groove bottom, and the grounding spring away from the circuit board is at least partially inserted into the groove, and the grounding spring away from the circuit board abuts against the groove bottom.

[0010] Optionally, the depth of the groove is less than or equal to two-thirds of the length of the grounding spring.

[0011] Optionally, the grounding spring comprises a spring body and a first conductive layer covering the surface of the spring body; and / or the screwing member comprises a screwing body and a second conductive layer covering the surface of the screwing body.

[0012] Optionally, the heat dissipation assembly comprises a heat conduction member arranged between the chip assembly and the heat dissipation member, one end of the heat conduction member abutting against the surface of the chip assembly, and the other end of the heat conduction member abutting against the surface of the heat dissipation member.

[0013] Optionally, the electronic device comprises a fastening assembly, one end of the fastening assembly being connected to the circuit board, and the other end of the fastening assembly being connected to the heat dissipation member, so that the heat dissipation member is fixed to the circuit board.

[0014] Optionally, the heat dissipation member is provided with a mounting groove; the fastening assembly comprises a fastening spring, a stud, a nut and a gasket, one end of the fastening spring being connected to the groove bottom of the mounting groove, the fastening spring being sleeved on the stud, one end of the stud abutting against one end of the fastening spring away from the groove bottom of the mounting groove, the other end of the stud penetrating through the groove bottom of the mounting groove and the circuit board and being screwed into the nut, and the gasket being arranged between the circuit board and the heat dissipation member.

[0015] Optionally, the number of grounding parts is multiple, the multiple grounding parts are arranged at intervals, and the multiple grounding parts are arranged around the periphery of the chip assembly; the number of grounding springs is multiple, one end of one grounding spring being connected to the heat dissipation member, and the other end of one grounding spring being connected to one grounding part.

[0016] The embodiment of the utility model provides an electronic equipment, including casing, circuit board, chip component and heat dissipation component, the circuit board sets up in the casing, the circuit board is provided with grounding part, the chip component sets up in the circuit board, chip component and grounding part interval setting, the heat dissipation component includes heat dissipation piece and ground spring, heat dissipation piece sets up in the circuit board, ground spring sets up between the circuit board and heat dissipation piece, one end of ground spring connects heat dissipation piece, the other end of ground spring connects grounding part, the circuit board, heat dissipation piece and ground spring jointly enclose and form electromagnetic shield space, and chip component is located at least partially in electromagnetic shield space. BRIEF DESCRIPTION OF DRAWINGS

[0017] In order to more clearly illustrate the technical scheme in the specific embodiment of the utility model or prior art, the following will briefly introduce the drawing needed to be used in the specific embodiment or prior art description. In all the drawings, similar elements or parts are generally identified by similar reference numerals. In the drawings, each element or part is not necessarily drawn according to the actual proportion.

[0018] Figure 1 It is the whole structure schematic diagram of electronic equipment provided by the utility model embodiment;

[0019] Figure 2 It is the whole structure explosion drawing of electronic equipment provided by the utility model embodiment;

[0020] Figure 3 It is the whole structure cross section of electronic equipment provided by the utility model embodiment Figure 1 ;

[0021] Figure 4 It is the whole structure cross section of electronic equipment provided by the utility model embodiment Figure 2 ;

[0022] Figure 5 It is Figure 4 the local enlarged view of A in the figure.

[0023] Mark explanation:

[0024] 1 circuit board, 11 grounding part;

[0025] 2 chip component;

[0026] 3 heat dissipation component, 31 heat dissipation piece, 311 screw hole, 312 recess, 313 installation slot, 32 ground spring, 33 screw piece, 34 heat conduction piece.

[0027] 4 electromagnetic shielding space;

[0028] 5 fastening assembly, 51 fastening spring, 52 stud, 53 nut, 54 gasket;

[0029] 100 electronic device. DETAILED DESCRIPTION

[0030] For the convenience of understanding the present application, the present application will be described in more detail below in conjunction with the drawings and specific embodiments. It should be noted that when an element is described as "fixed to" another element, it can be directly on the other element or one or more intervening elements can be present therebetween. When an element is described as "connected to" another element, it can be directly connected to the other element or one or more intervening elements can be present therebetween. The terms "upper", "lower", "inner", "outer", "vertical", "horizontal" and the like used in the specification indicate the orientation or positional relationship shown in the drawings, and are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the devices or elements referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore cannot be understood as limiting the present application. In addition, the terms "first", "second" and the like are only for the purpose of description and cannot be understood as indicating or implying relative importance.

[0031] Unless otherwise defined, all technical and scientific terms used in the specification have the same meaning as commonly understood by one of ordinary skill in the art to which the present application belongs. The terms used in the specification of the present application are only for the purpose of describing specific embodiments and are not intended to limit the present application. The term "and / or" used in the specification includes any and all combinations of one or more related listed items.

[0032] Electronic device refers to a device that realizes data processing, signal conversion, communication, display and other functions through electronic components and circuits, which is widely used in consumer, communication, medical, industrial or national defense fields.

[0033] In consumer electronic devices, there are usually circuit boards, chip assemblies and heat dissipation assemblies, etc. The chip assembly is mounted on the circuit board. During the working process of the chip assembly, a large amount of electromagnetic radiation is easily generated. In order to reduce the electromagnetic radiation leakage of the chip assembly, the chip assembly is first covered by the heat dissipation assembly, and then the heat dissipation assembly is connected to the grounding point of the circuit board, so as to form an electromagnetic shielding structure for the chip assembly, so as to achieve the purpose of absorbing and shielding the electromagnetic radiation of the chip assembly and reducing the electromagnetic radiation leakage of the chip assembly.

[0034] At present, the grounding point of the heat dissipation assembly and the circuit board is connected by using conductive foam, wherein one side of the conductive foam is bonded with the heat dissipation assembly through conductive back glue, and the other side of the conductive foam is bonded with the grounding point of the circuit board through conductive back glue, so as to realize the grounding of the heat dissipation assembly and the circuit board. However, the contact impedance of the conductive foam and the conductive back glue is large, which leads to poor conductivity of the heat dissipation assembly and the circuit board, and causes poor grounding effect of the heat dissipation assembly and the circuit board, so that the electromagnetic shielding effect of the heat dissipation assembly on the chip assembly is weak.

[0035] Therefore, the utility model provides an embodiment of electronic equipment 100, can improve the conductivity of heat dissipation assembly 3 and circuit board 1, enhance the grounding effect of heat dissipation assembly 3 and circuit board 1, thereby enhancing the electromagnetic shielding effect of heat dissipation assembly 3 on chip assembly 2

[0036] For the above-mentioned electronic equipment 100, please refer to Figures 1 to 3 , electronic equipment 100 includes housing (not shown in the figure), circuit board 1, chip assembly 2 and heat dissipation assembly 3;Circuit board 1 is arranged in the housing, and the circuit board 1 is provided with a grounding part 11;Chip assembly 2 is arranged on the circuit board 1, and the chip assembly 2 is arranged apart from the grounding part 11;Heat dissipation assembly 3 includes heat dissipation piece 31 and grounding spring 32, heat dissipation piece 31 is arranged on the circuit board 1, grounding spring 32 is arranged between the circuit board 1 and heat dissipation piece 31, one end of grounding spring 32 is connected with heat dissipation piece 31, the other end of grounding spring 32 is connected with grounding part 11, circuit board 1, heat dissipation piece 31 and grounding spring 32 jointly enclose to form electromagnetic shielding space 4, and chip assembly 2 is at least partially located in electromagnetic shielding space 4, so that heat dissipation piece 31 at least partially covers chip assembly 2.

[0037] Specifically, the housing is provided with a receiving space, the circuit board 1, the chip assembly 2 and the heat dissipation assembly 3 are all received in the receiving space, the circuit board 1 is grounded connected with the housing, the chip assembly 2 includes but is not limited to being fixed on the circuit board 1 by one or more of the connection modes such as welding, plugging, bonding or clamping, the heat dissipation piece 31 includes but is not limited to being fixed on the circuit board 1 by one or more of the connection modes such as screwing, welding, plugging, bonding or clamping, the grounding part 11 of the circuit board 1 is a grounding copper foil, the grounding spring 32 is an alloy spring, one end of the grounding spring 32 is fixed with the heat dissipation piece 31, and the other end of the grounding spring 32 is compressed and abuts against the grounding part 11 of the circuit board 1, and the chip assembly 2 includes but is not limited to a graphics processing unit (GPU) and a video memory particle (VRAM).

[0038] Compared with the grounding structure of the conductive foam and the conductive back glue, the grounding spring 32 can utilize the better metal conductivity of the grounding spring 32 than the conductive foam and the conductive back glue, so as to reduce the contact impedance of the grounding spring 32, improve the conductive characteristics of the heat dissipation assembly 3 and the circuit board 1, and enhance the grounding effect of the heat dissipation assembly 3 and the circuit board 1, thereby enhancing the electromagnetic shielding effect of the heat dissipation assembly 3 on the chip assembly 2.

[0039] For the above-mentioned grounding spring 32, please refer to Figures 3 to 5 , along the first direction, the diameter of the grounding spring 32 gradually increases, and the first direction is the direction of the heat dissipation piece 31 towards the circuit board 1.

[0040] Specifically, the grounding spring 32 is conically arranged, and the two ends of the grounding spring 32 are respectively provided with a narrow contact surface and a wide contact surface, the narrow contact surface is connected to the heat dissipation piece 31, and the wide contact surface is connected to the grounding part 11 of the circuit board 1.

[0041] In the above manner, the grounding spring 32 is conically arranged, which can improve the stability of the grounding spring 32 and reduce the skew deformation of the grounding spring 32; the wide contact surface of the grounding spring 32 is connected to the grounding part 11 of the circuit board 1, which can increase the contact area of the grounding spring 32 and the grounding part 11 of the circuit board 1, further reduce the contact impedance of the grounding spring 32, further improve the conductive characteristics of the heat dissipation assembly 3 and the circuit board 1, and further enhance the grounding effect of the heat dissipation assembly 3 and the circuit board 1, thereby further enhancing the electromagnetic shielding effect of the heat dissipation assembly 3 on the chip assembly 2.

[0042] For the above-mentioned grounding spring 32, please refer to Figures 3 to 5 , the heat dissipation piece 31 is provided with a threaded hole 311; the heat dissipation assembly 3 comprises a screw piece 33, the grounding spring 32 is sleeved on the screw piece 33, and the screw piece 33 is screwed in the threaded hole 311 after penetrating through one end of the grounding spring 32 away from the circuit board 1.

[0043] Specifically, the grounding spring 32 is conically arranged, one end of the screw piece 33 abuts against the conical section of the grounding spring 32, the other end of the screw piece 33 penetrates through one end of the grounding spring 32 away from the circuit board 1 and is screwed in the threaded hole 311, the screw piece 33 presses and fixes one end of the grounding spring 32 to the heat dissipation piece 31, when the heat dissipation piece 31 is fixed to the circuit board 1, the heat dissipation piece 31 presses and fixes the other end of the grounding spring 32 to the grounding part 11 of the circuit board 1, and the grounding spring 32 is compressed to make the grounding spring 32 grounded and conductive.

[0044] For the above-mentioned grounding spring 32, please refer to Figures 3 to 5The heat dissipation component 31 is provided with a groove 312, and the screw hole 311 is communicated with the groove bottom of the groove 312. The grounding spring 32 is at least partially inserted into the groove 312 at the end away from the circuit board 1, and the end of the grounding spring 32 away from the circuit board 1 abuts against the groove bottom of the groove 312.

[0045] Specifically, the cross-sectional shape of the groove 312 is the same as that of the grounding spring 32, for example, both are circular or square. The cross-section of the groove 312 is a plane of the groove 312 taken along the first direction, and the cross-section of the grounding spring 32 is a plane of the grounding spring 32 taken along the first direction.

[0046] In this way, the side wall of the groove 312 forms a barrier to the part of the grounding spring 32 inserted into the groove 312, which can reduce the probability of the grounding spring 32 being skewed and deformed due to collision.

[0047] In some embodiments, the depth of the groove 312 is less than or equal to two-thirds of the length of the grounding spring 32. In this way, not only can the part of the grounding spring 32 inserted into the groove 312 be blocked, reducing the skewing and deformation of the grounding spring 32, but also the extension and contraction of the grounding spring 32 can be reduced.

[0048] For the grounding spring 32 described above, please refer to Figures 3 to 5 The grounding spring 32 includes a spring body and a first conductive layer covering the surface of the spring body, and / or the screw component 33 includes a screw body and a second conductive layer covering the surface of the screw body.

[0049] Specifically, the first and second conductive layers are formed by, but not limited to, electroplating or coating, and the materials of the first and second conductive layers include, but are not limited to, nickel, tin, platinum, etc. For example, the grounding spring 32 and the screw component 33 are both plated with nickel to form the first and second conductive layers.

[0050] In this way, the conductivity and corrosion resistance of the grounding spring 32 and the screw component 33 can be improved, the contact impedance of the grounding spring 32 and the screw component 33 is further reduced, the conductive properties of the heat dissipation assembly 3 and the circuit board 1 are further improved, and the grounding effect of the heat dissipation assembly 3 and the circuit board 1 is further enhanced, thereby further enhancing the electromagnetic shielding effect of the heat dissipation assembly 3 on the chip assembly 2.

[0051] For the electronic device 100 described above, please refer to Figures 3 to 5 The heat dissipation assembly 3 includes a heat conduction component 34 arranged between the chip assembly 2 and the heat dissipation component 31, one end of the heat conduction component 34 abutting against the surface of the chip assembly 2, and the other end of the heat conduction component 34 abutting against the surface of the heat dissipation component 31.

[0052] In the above manner, the heat transfer efficiency between the heat dissipation member 31 and the chip assembly 2 can be improved, thereby improving the heat dissipation efficiency of the heat dissipation member 31 on the chip assembly 2.

[0053] For the above electronic device 100, please refer to Figures 3 to 5 The electronic device 100 comprises a fastening assembly 5, one end of the fastening assembly 5 is connected to the circuit board 1, and the other end of the fastening assembly 5 is connected to the heat dissipation member 31, so that the heat dissipation member 31 is fixed to the circuit board 1.

[0054] Specifically, the heat dissipation member 31 is provided with a mounting groove 313; the fastening assembly 5 comprises a fastening spring 51, a stud 52, a nut 53 and a gasket 54, the fastening spring 51 is sleeved on the stud 52, one end of the stud 52 abuts against one end of the fastening spring 51 away from the groove bottom of the mounting groove 313, the other end of the stud 52 penetrates through the groove bottom of the mounting groove 313 and the circuit board 1 and is screwed to the nut 53, and the gasket 54 is arranged between the circuit board 1 and the heat dissipation member 31.

[0055] In the above manner, the fastening assembly 5 elastically presses and fixes the heat dissipation member 31 to the circuit board 1, and the elastic pressing and fixing of the fastening assembly 5 can absorb external vibration or external force impact and reduce the risk of poor contact of the grounding spring 32 caused by vibration.

[0056] For the above electronic device 100, please refer to Figure 2 , and refer to Figures 3 to 5 The number of grounding parts 11 is multiple, the multiple grounding parts 11 are arranged at intervals, and the multiple grounding parts 11 are arranged around the periphery of the chip assembly 2; the number of grounding springs 32 is multiple, one end of one grounding spring 32 is connected to the heat dissipation member 31, and the other end of the grounding spring 32 is connected to one grounding part 11.

[0057] Specifically, the circuit board 1, the heat dissipation member 31 and the multiple grounding springs 32 jointly enclose to form an electromagnetic shielding space 4, and the chip assembly 2 is located in the electromagnetic shielding space 4, so that the heat dissipation member 31 covers the chip assembly 2.

[0058] In the above manner, the electrical conductivity of the heat dissipation assembly 3 and the circuit board 1 can be further improved, the grounding effect of the heat dissipation assembly 3 and the circuit board 1 is further enhanced, and the electromagnetic shielding effect of the heat dissipation assembly 3 on the chip assembly 2 is further enhanced.

[0059] The utility model discloses an electronic equipment 100, including casing (not shown in the drawing), circuit board 1, chip subassembly 2 and heat dissipation subassembly 3, circuit board 1 sets up in casing, and circuit board 1 is provided with ground part 11, chip subassembly 2 sets up in circuit board 1, and chip subassembly 2 is spaced apart with ground part 11, heat dissipation subassembly 3 includes heat dissipation piece 31 and ground spring 32, heat dissipation piece 31 sets up in circuit board 1, and ground spring 32 sets up between circuit board 1 and heat dissipation piece 31, and one end of ground spring 32 is connected heat dissipation piece 31, and the other end of ground spring 32 is connected ground part 11, and circuit board 1, heat dissipation piece 31 and ground spring 32 jointly enclose and form electromagnetic shield space 4, and chip subassembly 2 is located at least partially in electromagnetic shield space 4.Relative to the grounding structure of conductive bubble cotton and conductive back glue, by above -mentioned mode, the grounding spring 32 of the utility model embodiment can reduce contact impedance, improve the conductive characteristic of heat dissipation subassembly 3 and circuit board 1, enhance the grounding effect of heat dissipation subassembly 3 and circuit board 1, to strengthen the electromagnetic shield effect of heat dissipation subassembly 3 to chip subassembly 2.

[0060] The above is only the embodiment of the utility model, and does not limit the patent range of the utility model, and any equivalent structure or equivalent flow conversion using the contents of the utility model specification and drawings, or direct or indirect application in other related technical fields, are all included in the patent protection range of the utility model.

Claims

1. An electronic device, comprising: The electronic device comprises: a housing; a circuit board arranged in the housing, the circuit board being provided with a grounding portion; a chip assembly arranged on the circuit board, the chip assembly being spaced apart from the grounding portion; a heat dissipation assembly comprising a heat dissipation member and a grounding spring, the heat dissipation member being arranged on the circuit board, the grounding spring being arranged between the circuit board and the heat dissipation member, one end of the grounding spring being connected to the heat dissipation member, the other end of the grounding spring being connected to the grounding portion, the circuit board, the heat dissipation member and the grounding spring collectively forming an electromagnetic shielding space, the chip assembly being at least partially located in the electromagnetic shielding space.

2. The electronic device according to claim 1, wherein in a first direction, a diameter of the grounding spring gradually increases, the first direction being a direction in which the heat dissipation member faces the circuit board.

3. The electronic device according to claim 2, wherein the heat dissipation member is provided with a threaded hole; the heat dissipation assembly comprises a threaded member, the grounding spring being sleeved on the threaded member, the threaded member being screwed into the threaded hole after penetrating through the other end of the grounding spring away from the circuit board.

4. The electronic device according to claim 3, wherein the heat dissipation member is provided with a groove, the threaded hole being communicated with a groove bottom of the groove; the other end of the grounding spring away from the circuit board at least partially extends into the groove, the other end of the grounding spring away from the circuit board abutting against the groove bottom.

5. The electronic device according to claim 4, wherein a depth of the groove is less than or equal to two-thirds of a length of the grounding spring.

6. The electronic device according to claim 3, wherein the grounding spring comprises a spring body and a first conductive layer, the first conductive layer being covered on a surface of the spring body; and / or the threaded member comprises a threaded body and a second conductive layer, the second conductive layer being covered on a surface of the threaded body.

7. The electronic device according to claim 1, wherein the heat dissipation assembly comprises a heat conduction member, the heat conduction member being arranged between the chip assembly and the heat dissipation member, one end of the heat conduction member abutting against a surface of the chip assembly, the other end of the heat conduction member abutting against a surface of the heat dissipation member.

8. The electronic device according to claim 1, wherein the electronic device comprises a fastening assembly, one end of the fastening assembly being connected to the circuit board, the other end of the fastening assembly being connected to the heat dissipation member, so that the heat dissipation member is fixed to the circuit board.

9. The electronic device according to claim 8, wherein the heat dissipation member is provided with a mounting groove; the fastening assembly comprises a fastening spring, a stud, a nut and a gasket, one end of the fastening spring being connected to a groove bottom of the mounting groove, the fastening spring being sleeved on the stud, one end of the stud abutting against one end of the fastening spring away from the groove bottom of the mounting groove, the other end of the stud being screwed to the nut after penetrating through the groove bottom of the mounting groove and the circuit board, the gasket being arranged between the circuit board and the heat dissipation member.

10. The electronic device according to any one of claims 1-9, wherein The number of the grounding parts is multiple, the multiple grounding parts are arranged at intervals, and the multiple grounding parts are arranged around the periphery of the chip assembly. The number of the grounding springs is multiple, one end of one grounding spring is connected to the heat dissipation member, and the other end of the grounding spring is connected to one grounding part.

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