Rigid circuit board laminated with covering protective film

Abstract

The utility model discloses a rigid circuit board laminated with a covering protective film, which belongs to the technical field of circuit boards, and comprises a rigid circuit board, the upper surface of the rigid circuit board is connected with a protective film in a bonding manner, the rigid circuit board is internally provided with heat dissipation holes, the rigid circuit board is internally provided with ventilation grooves, and the ventilation grooves are communicated with the protective film. The ventilation grooves are symmetrically distributed relative to the center of the rigid circuit board, preferably, the lower surface of the protection film is connected with a substrate in a bonding mode, the substrate is made of a copper-clad laminate material, preferably, the lower surface of the substrate is connected with a wire layer in a bonding mode, and the wire layer is made of an aluminum alloy material. According to the rigid circuit board pasted and pressed with the covering protective film, the ventilation grooves and the heat dissipation holes are formed in the rigid circuit board, so that heat on the circuit board can be dissipated more quickly, the working temperature of the circuit board is reduced, faults caused by overheating are prevented, mutual interference among electrical signals is avoided, and safe operation of a circuit is guaranteed.

Description

TECHNICAL FIELD

[0001] The utility model relates to the technical field of circuit board, concretely to a rigid circuit board with covering protective film. BACKGROUND

[0002] Circuit board, also known as printed circuit board (PCB for short) or circuit board, is an indispensable component in today's electronic equipment, and the circuit board is a component that miniaturizes and visualizes the circuit, plays an important role in batch production of fixed circuits and optimization of electrical appliance layout, and is mainly composed of pads, vias, mounting holes, wires, components, connectors, fillers and electrical boundaries, which cooperates together to realize the connection and function of the circuit.

[0003] The outer circuit of the rigid circuit board is protected by adopting a silk-screen ink solder resist method to make a protective layer, since the silk-screen ink solder resist method has many production procedures, a long process and high manufacturing cost, and is prone to uneven thickness of silk-screen ink, red circuit, poor density of solder resist bubbles and other adverse rework phenomena, and in the surface treatment processing of the subsequent process, the silk-screen ink is prone to discoloration, poor adhesion and falling off, and there is a great quality risk.

[0004] In order to overcome the above defects, the prior art 1 (Chinese patent with application number CN202122633985.X and application date of October 29, 2021) is a rigid circuit board with covering protective film, which avoids the problems of uneven thickness of silk-screen ink, red circuit and poor density of solder resist bubbles caused by the silk-screen ink solder resist method for making a protective layer of the existing circuit board, and further avoids the quality risks of discoloration, poor adhesion and falling off of the silk-screen ink in the subsequent process, and the method of making a protective layer by using a covering protective film can simplify the manufacturing process, save production cost and improve production efficiency.

[0005] The above device cannot effectively dissipate heat for the rigid circuit board in the use process, which increases energy loss and reduces the efficiency of the components, and the high temperature accelerates the aging process of the internal materials of the components, which shortens the service life of the components. UTILITY MODEL CONTENTS

[0006] The utility model aims at providing a rigid circuit board with covering protective film to solve the problem that the rigid circuit board cannot be effectively dissipated in the background art, which increases energy loss and reduces the efficiency of the components, and the high temperature accelerates the aging process of the internal materials of the components, which shortens the service life of the components.

[0007] In order to realize the above-mentioned purpose, the utility model provides the following technical scheme: a rigid circuit board with a covering protective film, comprising a rigid circuit board, the upper surface of the rigid circuit board is connected with a protective film through bonding, and the inside of the rigid circuit board is provided with a heat dissipation hole, the inside of the rigid circuit board is provided with a breathable groove, and the breathable groove is symmetrically divided about the center of the rigid circuit board.

[0008] The design of the above structure can increase the air circulation in the circuit board, help the heat on the circuit board to dissipate faster, thereby reducing the working temperature of the circuit board, especially in high-power or high-load application scenarios, the breathable hole can significantly improve the heat dissipation efficiency of the circuit board, prevent performance degradation or damage caused by overheating, the design of the heat dissipation groove can increase the heat dissipation area and improve the heat dissipation efficiency, the heat distribution of the circuit board can be optimized through the design of the heat dissipation groove, and the circuit instability phenomenon caused by temperature difference is reduced, which helps to improve the stability and reliability of the entire electronic equipment.

[0009] Preferably, the lower surface of the protective film is connected with a substrate through bonding, and the substrate is composed of a copper-clad laminate material.

[0010] The design of the above structure improves the protection of the circuit board by connecting the protective film and the substrate, and the protective film can prevent dust, moisture and other pollutants from entering the surface of the circuit board, providing a clean and dry working environment for the circuit board. The protective film has good insulation performance and can prevent short circuit between the wires on the circuit board, ensuring the normal operation of the circuit, and the isolation effect of the protective film can reduce the electrical performance degradation of the circuit board caused by environmental factors, thereby improving the durability and reliability of the circuit.

[0011] Preferably, the lower surface of the substrate is connected with a wire layer through bonding, and the wire layer is composed of an aluminum alloy material.

[0012] The design of the above structure can effectively block external electromagnetic interference and signal interference by connecting the substrate and the wire layer, ensuring the stability of the transmission quality. The wire with an insulating layer reduces the capacitive coupling between lines through the insulating layer, avoiding mutual interference in the signal transmission process. This helps to improve the clarity and accuracy of signal transmission, and the insulating layer can prevent direct contact between wires, reducing the risk of electric shock and short circuit, thereby ensuring the safety of users.

[0013] Preferably, the lower surface of the wire layer is connected with a copper-clad layer through bonding, and the copper-clad layer is composed of a copper foil material.

[0014] The design of the above structure can reduce signal attenuation and interference through the connection of the wire layer and the copper layer, the conductivity of copper is very high, and more current can be carried, thereby improving the overall signal transmission performance, when the signal is transmitted from one end point to another end point, the copper layer can ensure that the signal is stable and efficient, which is crucial for the performance and stability of the circuit board, and the copper layer can also reduce the propagation of noise inside the circuit.

[0015] Preferably, the lower surface of the copper layer is bonded to an insulating layer, and the insulating layer is composed of a silicone rubber insulating material.

[0016] The design of the above structure can prevent current from flowing between different parts of the wire or cable, thereby avoiding short circuit and electric shock danger, and the insulating layer can protect the internal conductor from physical damage such as tearing and stretching, which helps to prolong the service life of the wire and cable and reduce failures caused by mechanical damage, and the insulating layer can withstand a certain range of temperature changes to ensure that the wire and cable can still work normally in high or low temperature environment.

[0017] Preferably, the lower surface of the insulating layer is bonded to a solder resist layer, and the solder resist layer is composed of a resin material.

[0018] The design of the above structure can prevent short circuit caused by solder bridges during soldering, the solder resist layer can protect the copper layer on the PCB from oxidation and corrosion, prolonging the service life of the PCB, the copper layer is easily oxidized when exposed to air, and the solder resist layer can isolate air and moisture to reduce the possibility of oxidation, which helps to maintain the conductivity and stability of the circuit board, and can significantly improve the reliability, stability and service life of the circuit board.

[0019] Preferably, the protective film is composed of an ester polyester film material.

[0020] The design of the above structure, the protective film is composed of a polyester film material, the polyester film has high mechanical strength, including tensile strength and tear resistance, can withstand large tensile force and pressure, is not easy to break and deform, and this high strength characteristic makes the polyester film protective film can effectively resist external physical impact and wear and tear during use, thereby prolonging the service life of the circuit board.

[0021] Compared with the prior art, the rigid circuit board with a protective film has the following advantages:

[0022] (1) The rigid circuit board with a protective film covering the pressure, by setting the air slot and the heat dissipation hole in the rigid circuit board, helps to dissipate the heat on the circuit board faster, thereby reducing the working temperature of the circuit board, preventing overheating caused by failure, helping to avoid mutual interference between electrical signals, ensuring the safe operation of the circuit.

[0023] Further, reduce the instability of the circuit caused by temperature difference, which helps to improve the stability and reliability of the entire electronic equipment.

[0024] (2) The rigid circuit board with a protective film covering the pressure, by setting the connection between the protective film and the substrate, improves the protection of the circuit board, and the protective film can prevent dust, moisture and other pollutants from entering the surface of the circuit board, providing a clean and dry working environment for the circuit board.

[0025] Further, the protective film has good insulation performance and can prevent short circuit between the wires on the circuit board.

[0026] (3) The rigid circuit board with a protective film covering the pressure, by setting the connection between the copper layer and the insulating layer, prevents the flow of current between different parts of the wire or cable, thereby avoiding short circuit and electric shock danger, and the insulating layer can protect the internal conductor from physical damage. BRIEF DESCRIPTION OF DRAWINGS

[0027] Fig. 1 It is a schematic diagram of the connection structure of the rigid circuit board and the heat dissipation hole of the utility model;

[0028] Fig. 2 It is a schematic diagram of the connection structure of the protective film and the substrate of the utility model;

[0029] Fig. 3 It is a schematic diagram of the connection structure of the heat dissipation hole and the protective film of the utility model;

[0030] Fig. 4 It is a schematic diagram of the connection structure of the substrate and the wire layer of the utility model;

[0031] Fig. 5 It is a schematic diagram of the connection structure of the copper layer and the insulating layer of the utility model;

[0032] Fig. 6 It is a schematic diagram of the connection structure of the air slot and the solder mask layer of the utility model.

[0033] In the figure: 1, rigid circuit board; 2, air slot; 3, heat dissipation hole; 4, protective film; 5, substrate; 6, wire layer; 7, copper layer; 8, insulating layer; 9, solder mask layer. DETAILED DESCRIPTION

[0034] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0035] Example 1: By connecting the rigid circuit board 1, heat dissipation holes 3, and ventilation grooves 2, the service life of the circuit board is extended, such as... Figs. 1-2 As shown:

[0036] The device includes a rigid circuit board 1, on which a protective film 4 is bonded and connected. The rigid circuit board 1 has heat dissipation holes 3 and ventilation grooves 2, which are symmetrically distributed about the center of the rigid circuit board 1.

[0037] Ventilation holes increase airflow within the circuit board, helping to dissipate heat more quickly and reduce its operating temperature. This is especially important in high-power or high-load applications, where ventilation holes significantly improve heat dissipation efficiency and prevent performance degradation or damage caused by overheating. Heat sinks increase the heat dissipation area, further enhancing heat dissipation efficiency. By optimizing heat distribution on the circuit board, they reduce circuit instability caused by temperature differences, contributing to the overall stability and reliability of the electronic device. Furthermore, heat sinks near high-power components on the circuit board can more effectively reduce their operating temperature, preventing overheating-related malfunctions. Heat sinks also create physical isolation on the circuit board, helping to prevent interference between electrical signals and ensuring safe circuit operation.

[0038] In Example 2, unlike Example 1, the protection of the circuit board is improved by connecting the substrate 5, the conductive layer 6, and the copper cladding layer 7. Figs. 3-4 As shown:

[0039] A substrate 5 is bonded to the lower surface of the protective film 4. The substrate 5 is made of copper-clad laminate material. A conductor layer 6 is bonded to the lower surface of the substrate 5. The conductor layer 6 is made of aluminum alloy material. A copper-clad layer 7 is bonded to the lower surface of the conductor layer 6. The copper-clad layer 7 is made of copper foil material.

[0040] By setting the connection of the protective film 4 and the substrate 5, the protection of the circuit board is improved, and at the same time the protective film 4 can prevent dust, moisture and other pollutants from entering the surface of the circuit board, providing a clean and dry working environment for the circuit board, and the protective film 4 has good insulation performance, which can prevent short circuit between the wires on the circuit board and ensure the normal operation of the circuit, and at the same time the isolation effect of the protective film 4 can reduce the electrical performance decline of the circuit board caused by environmental factors, thereby improving the durability and reliability of the circuit, and the connection of the substrate 5 and the wire layer 6 can effectively block external electromagnetic interference and signal interference, ensuring the stability of the transmission quality, and the wire with the insulating layer 8 reduces the capacitive coupling between the lines through the insulating layer 8, avoiding mutual interference in the signal transmission process, which helps to improve the clarity and accuracy of signal transmission, and the insulating layer 8 can prevent direct contact between the wires, reducing the risk of electric shock and short circuit, thereby ensuring the safety of the user.

[0041] In this embodiment, unlike in embodiment two, by setting the connection of the copper clad layer 7, the insulating layer 8 and the solder mask layer 9, short circuit and electric shock danger are avoided, as shown in Figs. 5-6 .

[0042] The lower surface of the copper clad layer 7 is bonded and connected with the insulating layer 8, and the insulating layer 8 is composed of silicone rubber insulating material, the lower surface of the insulating layer 8 is bonded and connected with the solder mask layer 9, and the solder mask layer 9 is composed of resin material, and the protective film 4 is composed of polyester film material.

[0043] By setting the connection of the copper clad layer 7 and the insulating layer 8, the flow of current between different parts of the wire or cable is prevented, thereby avoiding short circuit and electric shock danger, and the insulating layer 8 can protect the internal conductor from physical damage such as tearing and stretching, which helps to prolong the service life of the wire and cable and reduce the failure caused by mechanical damage, and at the same time the insulating layer 8 can withstand a certain range of temperature changes, ensuring that the wire and cable can still work normally in high temperature or low temperature environment, and at the same time the protective film 4 is composed of polyester film material, which has high mechanical strength, including tensile strength and tear resistance, and can withstand a large tensile force and pressure, and is not easy to break and deform, and this high strength feature makes the polyester film protective film 4 can effectively resist external physical impact and wear and tear during use, thereby prolonging the service life of the circuit board.

[0044] The above is the working process of the entire device, and the contents not described in detail in the specification all belong to the existing technology known to those skilled in the art.

[0045] Although the embodiments of the present application have been shown and described, it is to be understood that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the present application, the scope of which is defined by the appended claims and their equivalents.

Claims

1. A rigid circuit board with a protective film attached, comprising a rigid circuit board (1), a protective film (4) attached to the upper surface of the rigid circuit board (1), and a heat dissipation hole (3) formed in the rigid circuit board (1); Characterized in that: The rigid circuit board (1) is provided with a ventilation groove (2) formed therein, and the ventilation grooves (2) are symmetrically distributed about the center of the rigid circuit board (1).

2. The rigid circuit board according to claim 1, wherein: The lower surface of the protective film (4) is attached to a substrate (5), and the substrate (5) is composed of a copper-clad laminate material.

3. The rigid circuit board of claim 2, wherein: The lower surface of the substrate (5) is attached to a wire layer (6), and the wire layer (6) is composed of an aluminum alloy material.

4. The rigid circuit board of claim 3, wherein: The lower surface of the wire layer (6) is attached to a copper-clad layer (7), and the copper-clad layer (7) is composed of a copper foil material.

5. The rigid circuit board of claim 4, wherein: The lower surface of the copper-clad layer (7) is attached to an insulating layer (8), and the insulating layer (8) is composed of a silicone rubber insulating material.

6. The rigid circuit board of claim 5, wherein: The lower surface of the insulating layer (8) is attached to a solder resist layer (9), and the solder resist layer (9) is composed of a resin material.

7. The rigid circuit board of claim 1, wherein: the protective film is attached to the rigid circuit board by an adhesive. The protective film (4) is composed of a polyester film material.

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