Radiator of photoelectric communication module

Abstract

The utility model relates to a radiator of a photoelectric communication module, which comprises a communication module body, and a radiating structure is arranged outside the communication module body. According to the radiator of the photoelectric communication module, the communication module body is sleeved with the installation frame, cooling treatment on the communication module is achieved, the semiconductor chilling plate on the installation frame is tightly attached to the heating end of the communication module body, and low temperature is transmitted to the communication module body through work of the semiconductor chilling plate; meanwhile, the two installed side supporting plates support the top frame, a good heat dissipation condition is provided for the heating end of the outer side of the semiconductor chilling plate, the two motors drive the fan blades to rotate, generated airflow is blown to the hot end of the semiconductor chilling plate, the cooling process of the hot end is accelerated, and finally circulation of the whole cooling system is completed. The design not only effectively solves the heat dissipation problem of the communication module, but also improves the working efficiency and stability of the communication module.

Description

TECHNICAL FIELD

[0001] The utility model relates to communication module technical field, concretely is a heat sink of photoelectric communication module. BACKGROUND

[0002] With the rapid development of information technology, wireless communication module is increasingly widely used in the field of internet of things, smart home, industrial automation and the like.

[0003] At present, the common communication module heat dissipation mode on the market mainly includes natural heat dissipation and forced air cooling heat dissipation, and the natural heat dissipation mode relies on the natural convection of air to dissipate heat, and the forced air cooling heat dissipation relies on the airflow generated by the fan to dissipate heat, and the heat dissipation effect of the above two modes is limited, and the heat dissipation demand of high-power communication module cannot be met, therefore, a heat sink of photoelectric communication module is provided to solve the above problems. UTILITY MODEL CONTENTS

[0004] In view of the deficiencies of the prior art, the utility model provides a heat sink of photoelectric communication module to overcome the deficiencies in the prior art.

[0005] The utility model solves the technical problem that the technical scheme is as follows: a heat sink of photoelectric communication module, including communication module body, the outside of communication module body is provided with heat dissipation structure.

[0006] The heat dissipation structure includes the mounting frame that is movably installed at the outside of communication module body, the outside of mounting frame is "" shaped structure, the upper and lower ends of mounting frame are fixedly installed with the semiconductor refrigeration piece that penetrates to its inside, and the cold end of opposite sides of two semiconductor refrigeration pieces is combined with the outer wall of communication module body, the top and bottom of mounting frame are fixedly installed with the side support plate that is located at the front and back ends of semiconductor refrigeration piece, and the top frame that is close to the outside is fixedly installed between two side support plates, the outside of two top frames is fixedly installed with the installation frame that is mutually penetrated, the inside of two installation frames is fixedly installed with the cross support, and the inside of two cross supports is fixedly installed with the motor that penetrates to its inside, and the inside output end of two motors is fixedly installed with the fan blade, and the fan direction of two fan blades is respectively towards the outside heat generating end of two semiconductor refrigeration pieces.

[0007] The beneficial effects of this utility model are as follows: By placing the mounting bracket over the outside of the communication module body, cooling of the communication module is achieved. The thermoelectric cooler on the mounting bracket is in close contact with the heat-generating end of the communication module body. Through the operation of the thermoelectric cooler, the low temperature is transferred to the communication module body, thereby effectively reducing its temperature. At the same time, the two side support plates support the top bracket, providing good heat dissipation conditions for the outer heat-generating end of the thermoelectric cooler. In order to further improve the cooling capacity of the thermoelectric cooler, two motors drive the fan blades to rotate, generating airflow that blows towards the heat-generating end of the thermoelectric cooler, accelerating the cooling process of the heat-generating end. Finally, this airflow will be discharged to the right from the gap between the top bracket and the thermoelectric cooler, completing the circulation of the entire cooling system. This design not only effectively solves the heat dissipation problem of the communication module, but also improves its working efficiency and stability.

[0008] Based on the above technical solution, the present invention can be further improved as follows.

[0009] Furthermore, a side frame is fixedly installed on the left side of the mounting bracket, and a PC board is fixedly installed on the right side of the side frame. The PC board is electrically connected to the semiconductor cooling chip and the motor.

[0010] Furthermore, a power interface extending through to the front of the side frame is fixedly installed on the front of the PC board.

[0011] Furthermore, two side mesh plates are fixedly installed on the right side of the four side support plates by screws, and the side mesh plates are located on the right side of the top frame and the semiconductor cooling chip.

[0012] Furthermore, a top mesh plate is fixedly installed inside both of the mounting frames, and the top mesh plate is fitted onto the outside of the motor.

[0013] Furthermore, the right side of the mounting bracket is hinged to a side cover near its top, and a plurality of latches near its bottom are fixedly installed on the outer side of the side cover. The mounting bracket is fixedly installed with locking pins corresponding to the plurality of latches. Attached Figure Description

[0014] Figure 1 This is a schematic diagram of the overall structure of the present utility model. Figure 1 ;

[0015] Figure 2 This is a schematic diagram of the overall heat dissipation structure of this utility model. Figure 2 ;

[0016] Figure 3 Explosion-proof diagram of the heat dissipation structure of this utility model Figure 3 ;

[0017] Figure 4 This utility model Figure 2 Enlarged structural diagram at point AFigure 4 .

[0018] In the drawings, the components represented by the respective reference numerals are listed as follows:

[0019] 1, the communication module body; 2, the mounting frame; 3, the semiconductor refrigeration piece; 4, the side support plate; 5, the top frame; 6, the mounting frame; 7, the cross support; 8, the motor; 9, the fan blade; 10, the side frame; 11, the PC board; 12, the power supply interface; 13, the side net plate; 14, the top net plate; 15, the side cover; 16, the lock catch; 17, the lock pin. DETAILED DESCRIPTION

[0020] The principles and characteristics of the present application are described below in conjunction with the drawings, and the examples are only used to explain the present application and are not used to limit the scope of the present application.

[0021] As shown in Embodiment 1, a heat sink of an optoelectronic communication module comprises a communication module body 1, and a heat dissipation structure is arranged outside the communication module body 1. Figures 1-3

[0022] The heat dissipation structure comprises a mounting frame 2 movably mounted outside the communication module body 1, the mounting frame 2 has a “” shape structure, and semiconductor refrigeration pieces 3 are fixedly mounted at the upper and lower ends of the mounting frame 2 and penetrate to the inside of the mounting frame 2, the cold ends of the two semiconductor refrigeration pieces 3 on the opposite sides are in contact with the outer wall of the communication module body 1, side support plates 4 are fixedly mounted at the front and rear ends of the semiconductor refrigeration pieces 3 on the top and bottom of the mounting frame 2, a top frame 5 is fixedly mounted between the two side support plates 4 and close to the outside of the two side support plates 4, mounting frames 6 are fixedly mounted at the outside of the two top frames 5 and penetrate each other, cross supports 7 are fixedly mounted in the inside of the two mounting frames 6, motors 8 are fixedly mounted at the outside of the two cross supports 7 and penetrate to the inside of the cross supports 7, fan blades 9 are fixedly mounted at the inside output ends of the two motors 8, and the fan blowing directions of the two fan blades 9 are respectively towards the outside heat generating ends of the two semiconductor refrigeration pieces 3.

[0023] In use, the mounting frame 2 is directly sleeved from front to back outside the communication module body 1, at this time, the heat generating end outside the communication module body 1 is in contact with the refrigeration end of the two semiconductor refrigeration pieces 3, then the two semiconductor refrigeration pieces 3 work to cool down, and then the low temperature is transmitted to the communication module body 1 to achieve the purpose of cooling the communication module body 1, then the two side support plates 4 installed support the top frame 5 outside the semiconductor refrigeration pieces 3, which is beneficial to the heat dissipation of the heat generating end outside the semiconductor refrigeration pieces 3, then the two motors 8 drive the two fan blades 9 to rotate to generate airflow to blow to the hot end of the two semiconductor refrigeration pieces 3, thereby accelerating the cooling of the hot end of the semiconductor refrigeration pieces 3 to improve the refrigeration capacity of the semiconductor refrigeration pieces 3, finally, the airflow blowing to the semiconductor refrigeration pieces 3 is discharged to the right from the gap between the top frame 5 and the semiconductor refrigeration pieces 3.​

[0024] As shown in Figures 1-3 embodiment 1, the specific implementation is as follows:

[0025] The left side of the mounting rack 2 is fixedly installed with a side frame 10, and the right side of the side frame 10 is fixedly installed with a PC board 11, which is electrically connected between the semiconductor refrigeration sheet 3 and the motor 8.

[0026] The PC board 11 is supported and installed on the back of the mounting rack 2 through the installed side frame 10, and the PC board 11 provides an electrical circuit connection between the semiconductor refrigeration sheet 3 and the motor 8, forming a complete circuit.

[0027] As shown in Figures 1-3 embodiment 1, the specific implementation is as follows:

[0028] The front surface of the PC board 11 is fixedly installed with a power supply interface 12 that penetrates to the front of the side frame 10.

[0029] Connecting the external power supply to the power supply interface 12 can power the PC board 11, and then the PC board 11 reasonably distributes power to the motor 8 and the semiconductor refrigeration sheet 3.

[0030] As shown in Figures 1-3 embodiment 1, the specific implementation is as follows:

[0031] The right side of the four side support plates 4 is fixedly installed with two side net plates 13 through screws, and the side net plates 13 are located on the right side of the top frame 5 and the semiconductor refrigeration sheet 3.

[0032] The right side opening between the top frame 5 and the semiconductor refrigeration sheet 3 is shielded by the side net plate 13, preventing foreign matter from entering from the outside.

[0033] As shown in Figures 1-3 embodiment 1, the specific implementation is as follows:

[0034] The inside of the two mounting frames 6 is fixedly installed with a top net plate 14, which is sleeved on the outside of the motor 8.

[0035] The outside of the mounting frame 6 is blocked by the installed top net plate 14, preventing foreign matter from entering the inside of the mounting frame 6 and damaging the fan blade 9.

[0036] As shown in Figures 1-4 embodiment 1, the specific implementation is as follows:

[0037] The right side of the mounting frame 2 is hingedly connected with a side cover 15 close to the top of the mounting frame 2, and the outer side of the side cover 15 is fixedly connected with a plurality of buckles 16 close to the bottom of the side cover 15, and the mounting frame 2 is fixedly connected with a plurality of locking pins 17 corresponding to the plurality of buckles 16.

[0038] The plurality of buckles 16 and the plurality of locking pins 17 are clamped after the side cover 15 is turned over and attached to the right side wall of the communication module body 1, and the plurality of buckles 16 and the plurality of locking pins 17 can firmly limit the heat dissipation structure of the communication module body 1 outside the communication module body 1.

[0039] Although the embodiments of the utility model have been shown and described above, it can be understood that the above-mentioned embodiments are exemplary and cannot be understood as limiting the utility model, and the ordinary skilled in the art can change, modify, replace and transform the above-mentioned embodiments within the scope of the utility model.

Claims

1. A heat sink for an optoelectronic telecommunications module comprising a telecommunications module body (1), characterised in that: The external of the communication module body (1) is provided with a heat dissipation structure; The heat dissipation structure comprises a mounting frame (2) movably mounted on the external of the communication module body (1), the external of the mounting frame (2) is a " " shape structure, the upper and lower ends of the mounting frame (2) are fixedly provided with semiconductor refrigerating fins (3) penetrating to the inside thereof, the cold ends of the opposite sides of the two semiconductor refrigerating fins (3) are attached to the external wall of the communication module body (1), the top and bottom of the mounting frame (2) are fixedly provided with side support plates (4) located at the front and rear ends of the semiconductor refrigerating fins (3), the top frame (5) close to the outside of the two side support plates (4) is fixedly installed, the external of the two top frames (5) is fixedly provided with mounting frames (6) penetrating to each other, the internal of the two mounting frames (6) is fixedly provided with cross supports (7), the external of the two cross supports (7) is fixedly provided with motors (8) penetrating to the inside thereof, the internal output end of the two motors (8) is fixedly provided with fan blades (9), the fan blowing directions of the two fan blades (9) are respectively towards the external heat emitting ends of the two semiconductor refrigerating fins (3).

2. A heat sink for an optoelectronic telecommunications module according to claim 1, wherein: The left side of the mounting frame (2) is fixedly provided with a side frame (10), the right side of the side frame (10) is fixedly provided with a PC board (11), the PC board (11) is electrically connected with the semiconductor refrigerating fins (3) and the motors (8).

3. A heat sink for an optoelectronic telecommunications module according to claim 2, wherein: The front of the PC board (11) is fixedly provided with a power interface (12) penetrating to the front of the side frame (10).

4. A heat sink for an optoelectronic telecommunications module according to claim 1, wherein: The right side of the four side support plates (4) is fixedly provided with two side net plates (13) through screws, the side net plates (13) are located at the right side of the top frame (5) and the semiconductor refrigerating fins (3).

5. A heat sink for an optoelectronic telecommunications module according to claim 1, wherein: The internal of the two mounting frames (6) is fixedly provided with top net plates (14), the top net plates (14) are sleeved on the external of the motors (8).

6. A heat sink for an optoelectronic telecommunications module according to claim 1, wherein: The right side of the mounting frame (2) is hingedly provided with a side cover (15) close to the top thereof, the external of the side cover (15) is fixedly provided with a plurality of lock buckles (16) close to the bottom thereof, the mounting frame (2) is fixedly provided with lock pins (17) corresponding to the plurality of lock buckles (16).

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