Chip cleaning device for chip production

Abstract

The utility model relates to the technical field of chip cleaning devices, and discloses a chip cleaning device for chip production, which comprises a cleaning box for supporting the chip cleaning device; the ultrasonic generator body is fixedly connected and arranged at the bottom of the cleaning box and is used for generating vibration on water in the cleaning box to clean the chip; the valve is fixedly connected to one side of the lower end of the cleaning box and is used for discharging cleaned sewage in the cleaning box; according to the utility model, the lifting of the cover plate and the placing frame is controlled by the air cylinder, so that the placing and the taking-out of the chip are realized, a worker can easily place the chip to be cleaned between the first clamping plate and the second clamping plate, and the chip is fixed through a spring rebounding mechanism, the operation process is greatly simplified, the cleaning efficiency is improved, and meanwhile, the working efficiency is improved. As a plurality of groups of chips can be placed at the same time for cleaning, the efficiency of cleaning operation is remarkably improved, and the complexity and time consumption of manual operation are reduced.

Description

Technical Field

[0001] This utility model relates to the technical field of chip cleaning devices, and in particular to a chip cleaning device for chip production. Background Technology

[0002] During the chip manufacturing process, the chip's appearance needs to be cleaned to keep the chip clean and prevent pin contamination that could render it unusable.

[0003] However, in actual use, it can only clean the chip, resulting in incomplete chip cleaning and making it inconvenient to remove the cleaned chip. Utility Model Content

[0004] The purpose of this invention is to address the shortcomings of existing technologies by proposing a chip cleaning device for chip manufacturing.

[0005] To achieve the above objectives, the present invention adopts the following technical solution: a chip cleaning device for chip manufacturing, comprising:

[0006] Cleaning tank, used to support the chip cleaning device;

[0007] The ultrasonic generator body is fixedly arranged at the bottom of the cleaning tank to generate vibrations in the water inside the cleaning tank to clean the chip.

[0008] The valve is fixedly located on one side of the lower end of the cleaning tank and is used to discharge the wastewater after cleaning in the cleaning tank.

[0009] The placement mechanism includes a first clamp and a second clamp arranged inside the cleaning chamber for fixing the chip to be cleaned;

[0010] The drive structure includes a second sprocket arranged inside the cleaning chamber for driving the chip to rotate;

[0011] The lifting component is used to move the chip up and down.

[0012] As a further description of the above technical solution: the placement mechanism also includes:

[0013] A placement frame is arranged inside the cleaning tank to support the first clamping plate and the second clamping plate, and the second clamping plate is fixedly arranged on the placement frame.

[0014] A placement slot is provided on the placement frame to accommodate the chip, and the second clamping plate and the first clamping plate are located in the placement slot;

[0015] A limiting groove is provided on the placement frame to limit the first clamping plate, and the first clamping plate is slidably connected to the limiting groove.

[0016] A spring, with one end fixedly attached to the placement frame on the side away from the second clamping plate in the placement groove, is used to keep one end of the first clamping plate always in contact with the second clamping plate by the spring rebound.

[0017] A pull rod is slidably connected to the placement frame and is used to move the first clamping plate, which is fixedly arranged on the pull rod.

[0018] As a further description of the above technical solution: the limiting groove passes through the placement frame, and the pull rod passes through the placement frame.

[0019] As a further description of the above technical solution: the first clamping plate is L-shaped, the first clamping plate and the second clamping plate are provided with through holes, the placement frame is provided with through holes, and the limiting groove is connected to the placement groove.

[0020] As a further description of the above technical solution: the driving structure also includes:

[0021] The chain is meshed with the second sprocket and is used to drive the second sprocket to rotate;

[0022] The first sprocket is used to drive the chain to rotate, and the chain is meshed and mounted on the first sprocket;

[0023] The motor has its output end fixedly mounted on the first sprocket to drive the first sprocket to rotate.

[0024] A cover plate is arranged at the top of the cleaning tank for closing and opening the cleaning tank, and the bottom side of the motor is fixedly arranged on the upper surface of the cover plate.

[0025] The support rod is fixedly arranged on the lower surface of the cover plate to support the placement frame, and the placement frame is rotatably connected to the support rod.

[0026] As a further description of the above technical solution: the second sprocket is fixedly arranged at one end of the placement frame.

[0027] As a further description of the above technical solution: the lifting component includes:

[0028] A support frame is fixedly mounted on the cleaning tank to support the placement frame, and the cover plate is slidably connected to the support frame.

[0029] The cylinder is fixedly mounted on the support frame, and its output end is fixedly mounted on the upper surface of the cover plate, used to drive the cover plate to rise and fall.

[0030] As a further description of the above technical solution: the output end of the cylinder passes through the support frame.

[0031] This utility model has the following beneficial effects:

[0032] 1. In this utility model, the chip is placed and removed by controlling the lifting and lowering of the cover plate and the placement frame by the cylinder. This allows the staff to easily place the chip to be cleaned between the first clamping plate and the second clamping plate, and fix the chip by the spring rebound mechanism. This greatly simplifies the operation process and improves the cleaning efficiency. At the same time, since multiple sets of chips can be placed for cleaning at the same time, the efficiency of the cleaning operation is significantly improved and the complexity and time consumption of manual operation are reduced.

[0033] 2. In this utility model, the chip on the placement frame is rotated by a motor, which further enhances the cleaning effect of the cleaning fluid and ultrasound on the chip. After cleaning, the wastewater is discharged by opening the valve and the water droplets on the chip are thrown off by the rotation of the placement frame driven by the motor, which can speed up the drying process of the chip and improve the efficiency of the entire cleaning and drying process. Attached Figure Description

[0034] Figure 1 This is a partial structural schematic diagram of a chip cleaning device for chip production proposed in this utility model.

[0035] Figure 2 This is an exploded view of a chip cleaning device for chip manufacturing proposed in this utility model;

[0036] Figure 3 This is a schematic diagram of the structure of a chip cleaning device for chip production proposed in this utility model.

[0037] Figure 4 This is a cross-sectional view of a chip cleaning device for chip production proposed in this utility model.

[0038] Legend:

[0039] 1. Cleaning box; 2. Ultrasonic generator body; 301. Placement frame; 302. Placement slot; 303. Limiting slot; 304. Pull rod; 305. First clamping plate; 306. Second clamping plate; 307. Spring; 401. Motor; 402. First sprocket; 403. Chain; 404. Second sprocket; 405. Cover plate; 406. Support rod; 501. Support frame; 502. Cylinder; 6. Valve. Detailed Implementation

[0040] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0041] Example 1:

[0042] For reference Figures 1 to 4 The present invention provides a chip cleaning device for chip production, including a cleaning tank 1 for supporting the chip cleaning device, an ultrasonic generator body 2 fixedly arranged at the bottom of the cleaning tank 1 for vibrating the water in the cleaning tank 1 to clean the chip, and a valve 6 fixedly arranged on one side of the lower end of the cleaning tank 1 for discharging the wastewater after cleaning in the cleaning tank 1. The cleaning tank 1 includes a placement mechanism, including a first clamping plate 305 and a second clamping plate 306 arranged in the cleaning tank 1 for fixing the chip to be cleaned.

[0043] It should be noted that the chip is cleaned by vibrating the cleaning fluid through the ultrasonic generator body 2.

[0044] In a preferred embodiment, the placement mechanism further includes: a placement frame 301, arranged inside the cleaning tank 1, for supporting the first clamping plate 305 and the second clamping plate 306, wherein the second clamping plate 306 is fixedly arranged on the placement frame 301; a placement groove 302, formed on the placement frame 301, for accommodating the chip, wherein the second clamping plate 306 and the first clamping plate 305 are disposed within the placement groove 302; and a limiting groove 303, formed on the placement frame 301, for limiting the first clamping plate 305. 5. A limit is set, and the first clamping plate 305 is slidably connected to the limit groove 303; a spring 307, one end of which is fixedly arranged on the placement frame 301 in the placement groove 302 away from the second clamping plate 306, is used to keep one end of the first clamping plate 305 always in contact with the second clamping plate 306 by the rebound of the spring 307; a pull rod 304 is slidably connected to the placement frame 301, is used to drive the first clamping plate 305 to move, and the first clamping plate 305 is fixedly arranged on the pull rod 304;

[0045] It should be noted that the placement slot 302 is provided with several sets, and the second clamping plate 306 is provided with a rubber layer on the side close to the first clamping plate 305, and the first clamping plate 305 is provided with a rubber layer on the side close to the second clamping plate 306, in order to prevent damage during cleaning when fixing the chip.

[0046] In a preferred embodiment, the limiting groove 303 passes through the placement frame 301, and the pull rod 304 passes through the placement frame 301;

[0047] In a preferred embodiment, the first clamping plate 305 is L-shaped, and the first clamping plate 305 and the second clamping plate 306 are provided with through holes. The placement frame 301 is provided with through holes, and the limiting groove 303 and the placement groove 302 are interconnected.

[0048] Example 2:

[0049] Based on Example 1, in order to further improve the chip cleaning efficiency, a drive structure is provided on the cleaning box 1;

[0050] In a preferred embodiment, the drive structure includes a second sprocket 404 arranged inside the cleaning tank 1 for driving the chip to rotate;

[0051] In a preferred embodiment, the drive structure further includes: a chain 403, meshed on a second sprocket 404, for driving the second sprocket 404 to rotate; a first sprocket 402, for driving the chain 403 to rotate, and the chain 403 meshing on the first sprocket 402; a motor 401, with its output end fixedly disposed on the first sprocket 402, for driving the first sprocket 402 to rotate; a cover plate 405, disposed at the upper end of the cleaning tank 1, for closing and opening the cleaning tank 1, and the bottom side of the motor 401 fixedly disposed on the upper surface of the cover plate 405; and a support rod 406, fixedly disposed on the lower surface of the cover plate 405, for supporting the placement frame 301, and the placement frame 301 rotatably connected to the support rod 406.

[0052] It should be noted that the chain 403 is located in the through groove opened on the cover plate 405;

[0053] In a preferred embodiment, the second sprocket 404 is fixedly arranged at one end of the placement frame 301.

[0054] Example 3:

[0055] Based on Example 2, in order to further improve the chip cleaning efficiency, the cleaning box 1 is equipped with a lifting component;

[0056] As a preferred implementation, a lifting component is used to drive the chip to move up and down;

[0057] In a preferred embodiment, the lifting component includes: a support frame 501, which is fixedly arranged on the cleaning tank 1 to support the placement frame 301, and a cover plate 405 is slidably connected to the support frame 501; and a cylinder 502, which is fixedly arranged on the support frame 501, and whose output end is fixedly arranged on the upper surface of the cover plate 405 to drive the cover plate 405 to lift.

[0058] It should be noted that the support frame 501 is U-shaped;

[0059] In a preferred embodiment, the output end of cylinder 502 passes through support frame 501.

[0060] Working principle: In use, first turn on cylinder 502. Cylinder 502 moves cover plate 405 upward, which in turn moves the placement frame 301 on support rod 406 upward. When the placement frame 301 rises above the cleaning tank 1, turn off cylinder 502. Then, put cleaning fluid into the cleaning tank 1. Next, pull rod 304 to one side to slide on the placement frame 301. Pull rod 304 moves several sets of first clamping plates 305 to slide on the limiting groove 303 and compress spring 307. After plate 305 separates from the second clamping plate 306, the chip to be cleaned is placed between the first clamping plate 305 and the second clamping plate 306. Then, the pull rod 304 is released. The spring 307 rebounds, causing the first clamping plate 305 to adhere to the chip, and the second clamping plate 306 secures the chip. This not only allows multiple sets of chips to be placed for cleaning simultaneously, improving cleaning efficiency, but also facilitates chip insertion and removal by the operator. The operation is simple; after cleaning, simply pull the pull rod 304 to remove the chip, and then reverse the direction. The cylinder 502 pushes the cover plate 405 to slide on the support frame 501. The cover plate 405 causes the placement frame 301 on the support rod 406 to descend. When the cover plate 405 is attached to the upper end of the cleaning tank 1, the cleaning tank 1 is sealed. Then, the ultrasonic generator body 2 is turned on to make the cleaning fluid in the cleaning tank 1 vibrate and clean the chip on the placement frame 301. Then, the motor 401 is turned on, which drives the first sprocket 402 to rotate. The first sprocket 402 drives the chain 403 to rotate. The chain 403 drives the second sprocket 404 to rotate. The second sprocket 404 drives the placement frame 301 to rotate on the support rod 406. The placement frame 301 drives the chip to rotate for cleaning. By driving the chip to rotate, it can be ensured that the cleaning fluid and ultrasonic energy can be evenly applied to all surfaces of the chip, thereby achieving all-round cleaning. If it is necessary to accelerate the drying of the cleaned chip, first open the valve 6 to drain the wastewater in the cleaning tank 1, and then turn on the motor 401 to drive the placement frame 301 to rotate and shake off the water droplets adhering to the chip.

[0061] It should be noted that all electrical components mentioned in this article are connected to an external main controller and 220V AC mains power. The main controller can be a conventional known device that can be controlled by a computer or other means. The detailed description of known functions and known components is omitted in the specific embodiments disclosed herein. In order to ensure the compatibility of the device, the operating methods used are consistent with the parameters of commercially available instruments.

[0062] Finally, it should be noted that the above description is only a preferred embodiment of the present utility model and is not intended to limit the present utility model. Although the present utility model has been described in detail with reference to the foregoing embodiments, those skilled in the art can still modify the technical solutions described in the foregoing embodiments or make equivalent substitutions for some of the technical features. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present utility model should be included within the protection scope of the present utility model.

Claims

1. A chip cleaning apparatus for chip manufacturing, characterized in that: include: Cleaning tank (1), used to support chip cleaning device; The ultrasonic generator body (2) is fixedly arranged at the bottom of the cleaning tank (1) to generate vibration of the water in the cleaning tank (1) to clean the chip. The valve (6) is fixedly arranged on one side of the lower end of the cleaning tank (1) and is used to discharge the wastewater after cleaning in the cleaning tank (1); The placement mechanism includes a first clamping plate (305) and a second clamping plate (306) arranged in the cleaning chamber (1) for fixing the chip to be cleaned; The drive structure includes a second sprocket (404) arranged inside the cleaning tank (1) for driving the chip to rotate; The lifting component is used to move the chip up and down.

2. The chip cleaning apparatus for chip manufacturing according to claim 1, characterized in that: The placement mechanism also includes: A placement frame (301) is arranged inside the cleaning box (1) to support the first clamping plate (305) and the second clamping plate (306), and the second clamping plate (306) is fixedly arranged on the placement frame (301); A placement slot (302) is provided on the placement frame (301) to accommodate the chip, and a second clamping plate (306) and a first clamping plate (305) are provided in the placement slot (302); A limiting groove (303) is provided on the placement frame (301) to limit the first clamping plate (305), and the first clamping plate (305) is slidably connected to the limiting groove (303); A spring (307) is fixed at one end to a placement frame (301) on the side away from the second clamping plate (306) in the placement groove (302), and is used to keep one end of the first clamping plate (305) always in contact with the second clamping plate (306) by the rebound of the spring (307). A pull rod (304) is slidably connected to a placement frame (301) for moving a first clamping plate (305), and the first clamping plate (305) is fixedly arranged on the pull rod (304).

3. The chip cleaning apparatus for chip manufacturing according to claim 2, characterized in that: The limiting groove (303) passes through the placement frame (301), and the pull rod (304) passes through the placement frame (301).

4. The chip cleaning apparatus for chip manufacturing according to claim 3, characterized in that: The first clamping plate (305) is L-shaped, and the first clamping plate (305) and the second clamping plate (306) are provided with through holes. The placement frame (301) is provided with through holes, and the limiting groove (303) is connected to the placement groove (302).

5. A chip cleaning apparatus for chip manufacturing according to claim 4, characterized in that: The driving structure also includes: The chain (403) is meshed on the second sprocket (404) and is used to drive the second sprocket (404) to rotate; The first sprocket (402) is used to drive the chain (403) to rotate, and the chain (403) is meshed on the first sprocket (402); The motor (401) has its output end fixedly mounted on the first sprocket (402) and is used to drive the first sprocket (402) to rotate. A cover plate (405) is arranged at the upper end of the cleaning box (1) for closing and opening the cleaning box (1), and the bottom side of the motor (401) is fixedly arranged on the upper surface of the cover plate (405). A support rod (406) is fixedly arranged on the lower surface of the cover plate (405) to support the placement frame (301), and the placement frame (301) is rotatably connected to the support rod (406).

6. The chip cleaning apparatus for chip manufacturing according to claim 5, characterized in that: The second sprocket (404) is fixedly disposed at one end of the placement frame (301).

7. A chip cleaning apparatus for chip manufacturing according to claim 6, characterized in that: The lifting component includes: A support frame (501) is fixedly arranged on the cleaning box (1) to support the placement frame (301), and a cover plate (405) is slidably connected to the support frame (501). The cylinder (502) is fixedly arranged on the support frame (501), and its output end is fixedly arranged on the upper surface of the cover plate (405) for driving the cover plate (405) to rise and fall.

8. A chip cleaning apparatus for chip manufacturing according to claim 7, characterized in that: The output end of the cylinder (502) passes through the support frame (501).

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