Pin SMT (Surface Mount Technology) processing jig

Abstract

The utility model relates to the technical field of welding auxiliary equipment, in particular to a pin SMT (Surface Mount Technology) process jig. Comprising a placing table, the placing table is provided with a placing bin used for placing a PCB, a plurality of sets of pin hole belt grooves used for welding are evenly distributed in the placing bin, a pressing strip used for limiting the PCB is arranged on the placing table in a lap joint mode, and pressing pieces used for limiting the pressing strip are arranged at the positions, located at the two ends of the length of the placing bin, of the placing table. Limiting is carried out through the containing bin and the pressing strip, shaking in the reflow soldering process is avoided, the containing stability is improved, the dislocation probability of the displacement welding position is reduced, the problems of piece collision, tin connection and the like caused by wave soldering are avoided, and production can be completed with higher quality and higher efficiency.

Description

TECHNICAL FIELD

[0001] The utility model relates to welding auxiliary equipment technical field especially relates to pin SMT process fixture. BACKGROUND

[0002] Traditional pin is crest soldering. When soldering, the PCB board needs to be soldered by SMT patch reflow soldering operation first, and then the plug-in part is soldered by crest soldering by jig, and the whole soldering process is completed. Because there is only one pin on the second surface of the PCB to pass through the crest, it needs to pass through the crest again. In the process, it is easy to cause size deviation, and the soldering quality and stability cannot be guaranteed.

[0003] Therefore, the utility model provides pin SMT process fixture, reduces the shake in reflow soldering process, improves stability and safety, and ensures quality. UTILITY MODEL CONTENTS

[0004] The utility model discloses a pin SMT process fixture to solve the problems in the prior art.

[0005] In order to realize the above-mentioned purpose, the utility model adopts the following technical scheme:

[0006] Pin SMT process fixture, including the placement platform, be equipped with the placement warehouse for placing the PCB board on the placement platform, the placement warehouse is evenly distributed with a plurality of groups of welding pin hole with slot, the press strip for limiting the PCB board is placed on the placement platform, and the press strip is located on the length both ends of the placement platform. The press piece for limiting the press strip is equipped.

[0007] Preferably, the placement platform is fixed with a rotating shaft, the press piece mounting end is sleeved on the rotating shaft, the rotating shaft upper end is equipped with a stud, the stud outer diameter is less than the rotating shaft outer diameter, and the stud is screwed with a nut.

[0008] Preferably, the positioning pressure buckle is symmetrically rotatably installed on both ends in the width direction on the placement platform.

[0009] Preferably, the positioning pressure buckle is sleeved with a rubber sleeve.

[0010] Preferably, the four corners of the placement warehouse are equipped with an avoidance arc groove.

[0011] Preferably, the L-shaped rubber plate is tightly installed on the four corners of the placement warehouse on the placement platform, and the inner wall of the rubber plate extends into the range of the placement warehouse with a size of not more than 1CM.

[0012] Preferably, the magnetic attraction piece is arranged on both ends in the length direction on the placement platform, and the metal sheet is arranged on both ends of the press strip.

[0013] Preferably, the grabbing groove for taking and placing the PCB board is arranged on the periphery of the placement warehouse on the placement platform.

[0014] Preferably, the periphery of the bottom surface of the placing table is fixedly provided with supporting blocks.

[0015] Compared with the prior art, the pin SMT process jig has the following beneficial effects:

[0016] The PCB with welding is placed in the accommodation bin, the pressing strip is pressed on the non-welding part of the PCB, then the pressing part is pressed on both ends of the pressing strip, the full adhesion of the pin and the PCB is ensured, and the pin is prevented from being not welded in place. Then, reflow soldering is directly performed to complete welding of all elements. The accommodation bin and the pressing strip are limited, the shaking in the reflow soldering process is avoided, the accommodation stability is improved, the displacement welding dislocation probability is reduced, the problems of collision and tin connection caused by wave soldering are avoided, and the production can be completed with higher quality and efficiency.

[0017] Other advantages, objects and features of the present application will be set forth in part in the following description, and in part will become apparent to those skilled in the art from the examination of the following specification, or can be learned by the practice of the present application. The benefits provided by the present application can be substantiated by studying the following specification. BRIEF DESCRIPTION OF DRAWINGS

[0018] Figure 1 The present application is a top view schematic diagram.

[0019] Figure 2 The present application is a bottom view schematic diagram.

[0020] Figure 3 The present application is a top view schematic diagram.

[0021] Figure 4 The present application is a bottom view schematic diagram.

[0022] Figure 5 The present application is a side view schematic diagram.

[0023] Figure 6 The present application is a Figure 1 partial schematic diagram of A.

[0024] Figure 7 The present application is a cross-sectional view of the connection between the pressing part, the rotating shaft and the supporting block and the placing table.

[0025] Figure 8 The present application is a cross-sectional view of the rotating shaft and the stud.

[0026] Figure 9 The present application is a Figure 1 partial schematic diagram of B.

[0027] Figure 10 The present application is aFigure 1 A local schematic view at C of Fig.

[0028] Figure 11 A schematic view of the avoiding arc groove structure of the utility model.

[0029] In the figure: 1, placing table; 2, placing bin; 3, pressing strip; 4, pressing part; 5, rotating shaft; 6, stud; 7, nut; 8, magnetic attraction part; 9, metal sheet; 10, supporting block; 11, avoiding arc groove; 12, grabbing groove; 13, positioning pressing buckle. DETAILED DESCRIPTION

[0030] The technical solutions in the embodiments of the utility model will be clearly and completely described below with reference to the drawings in the embodiments of the utility model. Figures 1-11 It is apparent that the described embodiments are only a part of the embodiments of the utility model, not all the embodiments.

[0031] In order to solve the problems in the prior art, the embodiment provides a pin SMT process jig, which comprises a placing table 1, the placing table 1 is provided with a placing bin 2 for placing a PCB board, the placing bin 2 and the PCB board are opened and engraved according to a one-to-one size mold. The placing bin 2 is uniformly provided with a plurality of groups of soldering pin hole bands with grooves, the placing table 1 is provided with a pressing strip 3 for limiting the PCB board, and the placing table 1 is provided with a pressing part 4 for limiting the pressing strip 3 at both ends of the placing bin 2. The pressing part 4 is a metal pressing buckle.

[0032] According to the above technical solution:

[0033] The PCB board with soldering is placed in the placing bin 2, after being placed, the pressing strip 3 is pressed on the non-soldering part of the PCB board, then the pressing part 4 is pressed at both ends of the pressing strip 3, so that the pin and the PCB board are fully attached, and the pin is prevented from being not welded in place. Then, reflow soldering is directly carried out to complete the welding of all elements.

[0034] The placing bin 2 and the pressing strip 3 are limited, the shaking in the reflow soldering process is avoided, the stability of placement is improved, the displacement welding dislocation probability is reduced, the problems of collision and tin connection caused by wave soldering are avoided, and the production can be completed more efficiently and with higher quality.

[0035] The pressing strip 3 is located in the butt joint area of the plurality of groups of pin hole bands with grooves, so that interference on the soldering process is avoided.

[0036] In a further embodiment of the present application, a rotating shaft 5 is fixed on the placing table 1, a mounting end of the pressing part 4 is sleeved on the rotating shaft 5, a stud 6 is arranged at the upper end of the rotating shaft 5, the outer diameter of the stud 6 is smaller than the outer diameter of the rotating shaft 5, and a nut 7 is screwed on the stud 6. The height of the rotating shaft 5 is the same as the thickness of the mounting part of the pressing part 4. The mounting part of the pressing part 4 is horizontally provided with a through hole, and the diameter of the through hole is the same as the diameter of the rotating shaft 5.

[0037] In use, the perforations are aligned with the rotating shaft 5 so that the pressing member 4 is sleeved on the rotating shaft 5, the nut 7 is screwed on the stud 6 until the nut 7 abuts against the mounting portion of the pressing member 4, so as to limit the pressing member 4 on the rotating shaft 5 and enable the pressing member 4 to rotate on the rotating shaft 5. The pressing member 4 can be adjusted and moved to facilitate the placement of the pressing strip 3.

[0038] In a further embodiment of the present application, the placing table 1 is symmetrically provided with positioning buckles 13 at both ends in the width direction. The PCB is further limited by the four groups of positioning buckles 13, thereby further improving the stability of the PCB.

[0039] In a further embodiment of the present application, the positioning buckle 13 is sleeved with a rubber sleeve. The deformation and extrusion of the rubber sleeve can avoid damage to the PCB and ensure sufficient limiting force.

[0040] In a further embodiment of the present application, the placing table 1 is symmetrically provided with positioning buckles 13 at both ends in the width direction. The PCB is further limited by the four groups of positioning buckles 13, thereby further improving the stability of the PCB.

[0041] In a further embodiment of the present application, the placing table 1 is symmetrically provided with positioning buckles 13 at both ends in the width direction. The PCB is further limited by the four groups of positioning buckles 13, thereby further improving the stability of the PCB.

[0042] In a further embodiment of the present application, the placing table 1 is symmetrically provided with positioning buckles 13 at both ends in the width direction. The PCB is further limited by the four groups of positioning buckles 13, thereby further improving the stability of the PCB.

[0043] In a further embodiment of the present application, the placing table 1 is symmetrically provided with positioning buckles 13 at both ends in the width direction. The PCB is further limited by the four groups of positioning buckles 13, thereby further improving the stability of the PCB.

[0044] In a further embodiment of the present application, the placing table 1 is symmetrically provided with positioning buckles 13 at both ends in the width direction. The PCB is further limited by the four groups of positioning buckles 13, thereby further improving the stability of the PCB.

[0045] The above merely describes a preferred embodiment of the present application, but the protection scope of the present application is not limited thereto, and any person skilled in the art can make equivalent replacements or changes to the technical scheme and the inventive concept of the present application within the technical scope disclosed by the present application, and all of them should be covered within the protection scope of the present application.

[0046] In the description of the present application, the description of the terms "one embodiment", "some embodiments", "an example", "a specific example", or "some examples" means that the specific features, structures, materials or characteristics described in connection with the embodiment or example are included in at least one embodiment or example of the present application. In the present application, the illustrative description of the above terms is not necessarily directed to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described can be combined in any one or more embodiments or examples in a suitable manner. In addition, the person skilled in the art can combine and combine the different embodiments or examples described in the present application and the features of the different embodiments or examples without contradiction.

[0047] Although the embodiments of the present application have been shown and described above, it can be understood that the above embodiments are exemplary and cannot be understood as limiting the present application, and the person skilled in the art can make changes, modifications, replacements and modifications to the above embodiments within the scope of the present application.

Claims

1. A pin SMT process jig, characterized in that, Including the placement platform (1), the placement platform (1) is equipped with the installation warehouse (2) for placing the PCB board, the installation warehouse (2) is evenly distributed with multiple groups of welding pin hole with slot, the placement platform (1) is placed with the pressing strip (3) for limiting the PCB board, the placement platform (1) is located at the length both ends of installation warehouse (2) and is equipped with the compression member (4) for limiting the pressing strip (3).

2. The pin SMT process jig of claim 1, wherein, The placement platform (1) is fixed with the rotating shaft (5), the compression member (4) installation end is sleeved on the rotating shaft (5), the rotating shaft (5) upper end is equipped with the stud (6), the stud (6) outer diameter is less than the rotating shaft (5) outer diameter, the stud (6) is screwed with the nut (7).

3. The pin SMT process fixture of claim 1, wherein, The placement platform (1) is located at the width direction both ends and is symmetrically rotatably installed with the positioning pressure buckle (13).

4. The pin SMT process fixture of claim 3, wherein, The positioning pressure buckle (13) is sleeved with a rubber sleeve.

5. The pin SMT process fixture of claim 1, wherein, The installation warehouse (2) four corners are equipped with the avoidance arc groove (11).

6. The pin SMT process fixture of claim 5, wherein, The placement platform (1) is located at the four corners of installation warehouse (2) and is tightly installed with the L-shaped rubber plate, the rubber plate inner wall extends into the installation warehouse (2) range, and the size is not more than 1CM.

7. The pin SMT process fixture of claim 1, wherein, The placement platform (1) is located at the length direction both ends and is equipped with the magnetic attraction member (8), and the pressing strip (3) both ends are equipped with the metal sheet (9).

8. The pin SMT process fixture of claim 1, wherein, The placement platform (1) is located at the periphery of installation warehouse (2) and is equipped with the PCB board taking and placing grabbing groove (12).

9. The pin SMT process fixture of claim 1, wherein, The placement platform (1) bottom periphery is tightly installed with the support block (10).

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