Distributed IO module damping device
By introducing a multi-layer buffer structure in the distributed I/O module, the problem of signal interruption caused by vibration was solved, and more stable signal transmission was achieved.
Patent Information
- Application Number
- CN202423253982.3
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-12-27
- Publication Date
- 2025-12-09
- Estimated Expiration
- 2034-12-27
AI Technical Summary
Existing distributed I/O modules are not tightly connected after long-term use, and are prone to signal transmission interruption due to vibration.
A distributed I/O module vibration damping device was designed. It uses a multi-layer buffer structure between the U-shaped bracket and the U-shaped mounting base, including components such as rubber pads, connecting rods, and springs, to buffer the vibration of the press and prevent signal interruption.
It effectively reduces signal interruption during the transmission process of the IO module and improves the stability of signal transmission.
Smart Images

Figure CN223644367U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to the field of press technology, specifically to a distributed I / O module vibration damping device. Background Technology
[0002] Existing presses are characterized by high reliability, affordable price, easy setup, and convenient network cabling, making them suitable for applications in distributed areas and saving time and costs associated with system integration. The presses utilize distributed I / O modules, connecting to the PLC via a single communication line, thus reducing cabling and the number of I / O points on the PLC itself. Therefore, distributed I / O is employed to read various data.
[0003] Existing distributed I / O modules employ numerous interconnected hardware components to form a substation. Over prolonged use, this can lead to reduced internal connection tension and loose connections. Furthermore, vibrations during operation can cause signal interruptions during I / O module signal transmission. Therefore, those skilled in the art have developed a vibration damping device for distributed I / O modules to address the problems described in the background. Utility Model Content
[0004] (a) Technical problems to be solved
[0005] To address the shortcomings of existing technologies, this utility model provides a distributed I / O module vibration damping device. This device solves the problem that existing distributed I / O modules, which use a large number of interconnected hardware units to form a substation, experience reduced internal connection tension and loose connections after prolonged use. Furthermore, vibrations during press operation can cause signal interruptions during I / O module signal transmission.
[0006] (II) Technical Solution
[0007] To achieve the above objectives, this utility model provides the following technical solution: a distributed I / O module vibration damping device, comprising a module body, a U-shaped bracket, and a U-shaped mounting base. The module body is slidably engaged with the U-shaped bracket. The U-shaped bracket is disposed within the U-shaped mounting base. A positioning seat is provided between the U-shaped bracket and the U-shaped mounting base. A support rod is installed within the positioning seat, and rubber pads are placed between the support rods. A top plate is provided above the positioning seat, and an upper compression rod is installed on the lower side of the top plate. A rotatable connection is made to the lower circumference of the top plate. The upper connecting rod is provided below the positioning seat, and a base plate is provided below the positioning seat. A lower pressing rod is installed on the upper side of the base plate. The lower connecting rod is rotatably connected to the upper circumference of the base plate. A movable cavity is opened on the bottom side of the base plate. An elastic pressure plate is installed on the inner wall of the movable cavity. A base is provided below the base plate. A limit plate is installed on the upper side of the base. The limit plate is movably engaged with the movable cavity. Movable grooves are opened on both sides of the positioning seat. A limit rod is installed horizontally in the movable groove. A slider is sleeved on the limit rod. A spring is installed on the side of the slider away from the rubber pad.
[0008] Preferably, the top plate is connected to the upper and lower inner walls of the U-shaped mounting base, and the base is connected to the upper and lower outer walls of the U-shaped bracket.
[0009] Preferably, the periphery of the limiting plate is in contact with the elastic pressure plate, and the limiting plate is buffered by the elastic pressure plate, which can effectively buffer the lateral vibration displacement between the U-shaped bracket and the U-shaped mounting base.
[0010] Preferably, the upper extrusion rod makes extrusion contact with the upper side of the rubber pad, and the lower extrusion rod makes extrusion contact with the lower side of the rubber pad, thereby providing initial buffering for the vibration generated by the press.
[0011] Preferably, the end where the upper connecting rod and the lower connecting rod meet is rotatably connected to the slider.
[0012] Preferably, the slider and the limiting rod are slidably sleeved together, one end of the spring is in contact with the slider by compression, and the other end of the spring is in contact with the inner wall of the end of the movable groove by compression. The slider is further buffered by the spring pressure under the limitation of the movable groove and the limiting rod.
[0013] (III) Beneficial Effects
[0014] Compared with the prior art, this utility model provides a distributed I / O module vibration damping device, which has the following beneficial effects:
[0015] Through design, the top plate above the positioning seat is installed to the inner walls of the upper and lower sides of the U-shaped mounting seat using bolts, while the base is installed to the outer walls of the upper and lower sides of the U-shaped bracket. At this time, the upper and lower extrusion rods on the top and bottom plates are compressed and buffered by the rubber pads inside the positioning seat, thereby initially buffering the vibration generated by the press. After the upper and lower connecting rods meet, they are rotatably connected to the slider. The slider is further buffered by the spring pressure under the limit of the movable groove and the limit rod. At the connection between the bottom plate and the base, the limit plate is buffered by the elastic extrusion plate, which can effectively buffer the lateral vibration displacement between the U-shaped bracket and the U-shaped mounting seat. Through multiple and multi-directional buffering structures, the phenomenon of signal interruption during the transmission of IO module signals can be effectively reduced. Attached Figure Description
[0016] Figure 1 This is a three-dimensional structural diagram of a distributed I / O module shock absorption device provided in an embodiment of this application.
[0017] Figure 2 This is a schematic diagram of the U-shaped bracket in a distributed IO module shock absorption device provided in an embodiment of this application.
[0018] Figure 3 This is a schematic diagram of the positioning seat in a distributed IO module shock absorption device provided in an embodiment of this application.
[0019] Figure 4 This is a schematic diagram of the slider in a distributed I / O module shock absorption device provided in an embodiment of this application.
[0020] Figure 5 This is a partial structural cross-sectional view of the base plate in a distributed I / O module shock absorption device provided in an embodiment of this application.
[0021] In the diagram: 1. Module body; 2. U-shaped bracket; 3. U-shaped mounting base; 4. Positioning base; 5. Support rod; 6. Rubber pad; 7. Movable groove; 8. Limiting rod; 9. Slider; 10. Top plate; 11. Upper extrusion rod; 12. Upper connecting rod; 13. Base plate; 14. Lower extrusion rod; 15. Movable cavity; 16. Elastic pressure plate; 17. Base; 18. Limiting plate; 19. Lower connecting rod; 20. Spring. Detailed Implementation
[0022] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.
[0023] This utility model provides a technical solution: a distributed I / O module vibration damping device. Please refer to [link / reference]. Figure 1 , Figure 3 , Figure 4 , Figure 5 The system includes a module body 1, a U-shaped bracket 2, and a U-shaped mounting base 3. The module body 1 is slidably engaged with the U-shaped bracket 2. The U-shaped bracket 2 is housed within the U-shaped mounting base 3. A positioning seat 4 is provided between the U-shaped bracket 2 and the U-shaped mounting base 3. A support rod 5 is installed within the positioning seat 4, and rubber pads 6 are placed between the support rods 5. A top plate 10 is positioned above the positioning seat 4. An upper compression rod 11 is installed on the lower side of the top plate 10. An upper connecting rod 12 is rotatably connected to the lower circumference of the top plate 10. A bottom plate 13 is positioned below the positioning seat 4. A lower pressing rod 14 is installed on the upper side of the base plate 13, and a lower connecting rod 19 is rotatably connected to the upper circumference of the base plate 13. A movable cavity 15 is opened on the bottom side of the base plate 13, and an elastic pressing plate 16 is installed on the inner wall of the movable cavity 15. A base 17 is provided below the base plate 13, and a limiting plate 18 is installed on the upper side of the base 17. The limiting plate 18 is movably engaged with the movable cavity 15. Movable grooves 7 are opened on both sides of the positioning seat 4. A limiting rod 8 is installed horizontally in the movable groove 7. A slider 9 is sleeved on the limiting rod 8, and a spring 20 is installed on the side of the slider 9 away from the rubber pad 6.
[0024] Please see Figure 2 , Figure 3 , Figure 4 , Figure 5 The top plate 10 is connected to the upper and lower inner walls of the U-shaped mounting base 3, the base 17 is connected to the upper and lower outer walls of the U-shaped bracket 2, the periphery of the limiting plate 18 is in contact with the elastic pressing plate 16, and the limiting plate 18 is buffered by the elastic pressing plate, which can effectively buffer the lateral vibration displacement between the U-shaped bracket 2 and the U-shaped mounting base 3. The upper pressing rod 11 is in contact with the upper side of the rubber pad 6, and the lower pressing rod 14 is in contact with the lower side of the rubber pad 6, thereby initially buffering the vibration generated by the press. The end of the upper connecting rod 12 and the lower connecting rod 19 is rotatably connected to the slider 9. The slider 9 is slidably sleeved with the limiting rod 8. One end of the spring 20 is in contact with the slider 9, and the other end of the spring 20 is in contact with the inner wall of the end of the movable groove 7. The slider 9 is further buffered by the spring 20 under the limitation of the movable groove 7 and the limiting rod 8.
[0025] In this utility model, a module body 1 is mounted on the front side of the U-shaped bracket 2 via a slide rail. A U-shaped mounting seat 3 is provided at the rear of the U-shaped bracket 2. A positioning seat 4 is provided between the U-shaped bracket 2 and the U-shaped mounting seat 3. Four support rods 5 are provided in the positioning seat 4. Rubber pads 6 are filled between the four support rods 5. A top plate 10 with an upper extrusion rod 11 is provided above the positioning seat 4. An upper connecting rod 12 is rotatably connected to the bottom side of the top plate 10. A bottom plate 13 with a lower extrusion rod 14 is provided below the positioning seat 4. A lower connecting rod 19 is rotatably connected to the upper side of the bottom plate 13. Movable grooves 7 are provided on both sides of the positioning. A limit rod 8 is installed horizontally in the movable groove 7. A slider 9 is slidably sleeved on the limit rod 8. The end where the upper connecting rod 12 and the lower connecting rod 19 meet is rotatably connected to the outside of the slider 9. A spring 20 is provided on the side of the slider 9 away from the rubber pad 6. The spring 20 is sleeved with the limit rod 8.
[0026] An active cavity 15 is provided on the bottom side of the base plate 13. An elastic pressure plate 16 is installed on the inner wall of the active cavity 15. A base 17 is provided below the base plate 13. A limiting plate 18 is installed on the upper side of the base 17. The limiting plate 18 is rotatably engaged with the active cavity 15. The diameter of the limiting plate 18 is smaller than the inner diameter of the active cavity 15. When the limiting plate 18 is inside the active cavity 15, it is in contact with the elastic pressure plate 16.
[0027] The top plate 10 in the structure is installed to the inner walls of the upper and lower sides of the U-shaped mounting base 3 by bolts, and the base 17 is installed to the outer walls of the upper and lower sides of the U-shaped bracket 2. At this time, the upper extrusion rod 11 and the lower extrusion rod 14 on the top plate 10 and the base plate 13 are squeezed and buffered by the rubber pad 6, thereby initially buffering the vibration generated by the press. After the upper connecting rod 12 and the lower connecting rod 19 meet, they are rotatably connected to the slider 9. The slider 9 is further buffered by the spring 20 under the limit of the movable groove 7 and the limit rod 8. At the connection between the base plate 13 and the base 17, the limit plate 18 is buffered by the elastic extrusion plate, which can effectively buffer the lateral vibration displacement between the U-shaped bracket 2 and the U-shaped mounting base 3.
[0028] It should be noted that, in this document, relational terms such as "first" and "second" are used only to distinguish one entity or operation from another, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Furthermore, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such process, method, article, or apparatus.
[0029] In this document, unless otherwise expressly specified and limited, the terms "installation," "setting," "connection," "fixing," "screw connection," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal connection of two components or the interaction between two components. Unless otherwise expressly limited, those skilled in the art can understand the specific meaning of the above terms in this utility model according to the specific circumstances.
[0030] Although embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the present invention, the scope of which is defined by the appended claims and their equivalents.
Claims
1. A distributed I / O module vibration damping device, comprising a module body (1), a U-shaped bracket (2), and a U-shaped mounting base (3), characterized in that: The module body (1) is slidably engaged with the U-shaped bracket (2), and the U-shaped bracket (2) is disposed inside the U-shaped mounting base (3); A positioning seat (4) is provided between the U-shaped bracket (2) and the U-shaped mounting base (3). A support rod (5) is installed inside the positioning seat (4). A rubber pad (6) is provided between the support rods (5). A top plate (10) is provided above the positioning seat (4). An upper compression rod (11) is installed on the lower side of the top plate (10). An upper connecting rod (12) is rotatably connected to the lower periphery of the top plate (10). A bottom plate (13) is provided below the positioning seat (4). A lower compression rod (14) is installed on the upper side of the bottom plate (13). A lower compression rod (14) is rotatably connected to the upper periphery of the bottom plate (13). The connecting rod (19) has a movable cavity (15) on the bottom side of the base plate (13). An elastic pressure plate (16) is installed on the inner wall of the movable cavity (15). A base (17) is provided below the base plate (13). A limiting plate (18) is installed on the upper side of the base (17). The limiting plate (18) is movably engaged with the movable cavity (15). Movable grooves (7) are provided on both sides of the positioning seat (4). A limiting rod (8) is installed horizontally in the movable groove (7). A slider (9) is sleeved on the limiting rod (8). A spring (20) is installed on the side of the slider (9) away from the rubber pad (6).
2. The distributed I / O module vibration damping device according to claim 1, characterized in that: The top plate (10) is connected to the upper and lower inner walls of the U-shaped mounting base (3), and the base (17) is connected to the upper and lower outer walls of the U-shaped bracket (2).
3. The distributed I / O module vibration damping device according to claim 1, characterized in that: The periphery of the limiting plate (18) is in contact with the elastic pressure plate (16).
4. The distributed I / O module vibration damping device according to claim 1, characterized in that: The upper extrusion rod (11) is in extrusion contact with the upper side of the rubber pad (6), and the lower extrusion rod (14) is in extrusion contact with the lower side of the rubber pad (6).
5. A distributed I / O module vibration damping device according to claim 1, characterized in that: The end where the upper connecting rod (12) and the lower connecting rod (19) meet is rotatably connected to the slider (9).
6. The distributed I / O module vibration damping device according to claim 1, characterized in that: The slider (9) is slidably sleeved with the limiting rod (8), one end of the spring (20) is in contact with the slider (9) by compression, and the other end of the spring (20) is in contact with the inner wall of the end of the movable groove (7) by compression.