Magnetron sputtering equipment
By employing a combination of substrate revolution and rotation in a magnetron sputtering apparatus, the problem of uneven film thickness was solved, thereby improving the uniformity and precision of the film and meeting the requirements for the preparation of high-precision ultrathin films.
Patent Information
- Application Number
- CN202423187170.3
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-12-23
- Publication Date
- 2025-12-09
- Estimated Expiration
- 2034-12-23
AI Technical Summary
In existing magnetron sputtering equipment, the unidirectional movement of the substrate results in uneven film thickness and poor overall consistency, making it difficult to meet the requirements for the preparation of high-precision ultrathin films.
An adjustment device including a first adjustment component and a second adjustment component is used to enable the substrate to achieve a motion mode that combines revolution and rotation. By revolution, the substrate passes through multiple cathode targets one by one, and by rotation, it uniformly receives sputtered particles, ensuring uniform coverage of a large area of coating.
It significantly improves the uniformity and precision of the film, meeting the high-precision preparation requirements of ultrathin film layers.
Smart Images
Figure CN223646619U_ABST
Abstract
Description
TECHNICAL FIELD
[0001] The utility model relates to thin film preparation technical field especially relates to a magnetron sputtering equipment. BACKGROUND
[0002] Magnetron sputtering is a commonly used thin film preparation technology, belongs to a kind of physical vapor deposition method, because magnetron sputtering has the advantages of simple equipment, easy to control, large plating film area and strong adhesion, it is widely used in the surface plating film of metal, semiconductor and insulator and other materials. Its principle is that in vacuum reaction cavity, argon ion produced by glow discharge bombards cathode target material, and then the atoms of cathode target material are sputtered out, and then deposited on the surface of substrate to form the required film layer.
[0003] Magnetron sputtering equipment is a thin film deposition equipment designed and manufactured by the above principle. In the current magnetron sputtering equipment, the substrate is usually moved in a single direction relative to the cathode target material to complete the plating film. This way is prone to problems such as uneven film thickness and poor overall consistency when preparing ultra-thin film layers (such as nanometer level thickness), and it is difficult to meet the requirements of high-precision film layer preparation.
[0004] Therefore, it is urgent to propose a magnetron sputtering equipment to solve the above technical problems. UTILITY MODEL CONTENT
[0005] The utility model aims at providing a kind of magnetron sputtering equipment, can significantly improve the uniformity and precision of film layer.
[0006] To achieve this purpose, the utility model adopts the following technical solutions:
[0007] The utility model provides a kind of magnetron sputtering equipment, including reaction chamber and adjusting device, the inner wall of the reaction chamber is spaced apart and is provided with multiple cathode target materials, the adjusting device is set in the reaction chamber interior, and the adjusting device is used to install the substrate to be plated and drives the substrate to pass through multiple cathode target materials one by one;The adjusting device includes:
[0008] First adjusting assembly, including first connecting piece and first gear, the first connecting piece is set to the inner bottom wall of the reaction chamber, and the central axis of the first connecting piece extends along the first direction, and the first gear is fixedly sleeved on the outer periphery of the end portion of the first connecting piece away from the inner bottom wall of the reaction chamber;
[0009] A second adjusting assembly includes a motor, a second connecting member, a second gear and a rotating disc, a central axis of the second connecting member extends along a second direction, the second connecting member is connected to an output shaft of the motor, the second gear is fixedly sleeved on an outer periphery of the second connecting member, the rotating disc is fixedly connected to an end of the second connecting member away from the motor, and the substrate is mounted on a surface of the rotating disc facing the cathode target material; the motor can drive the second connecting member to rotate around the central axis thereof, so that the rotating disc and the second gear rotate together with the second connecting member, and the second gear is in meshing transmission with the first gear to drive the second gear to rotate around the central axis of the first connecting member; wherein the first direction and the second direction are perpendicular to each other.
[0010] In some embodiments, the first adjusting assembly further includes a cylinder, the cylinder includes a cylinder body and a cylinder shaft, the cylinder body is mounted to an inner bottom wall of the reaction chamber, the cylinder shaft can be extended or retracted relative to the cylinder body, the first connecting member is connected to the cylinder shaft, and the cylinder shaft can drive the first connecting member to move along the first direction so that the first gear approaches or moves away from the second gear.
[0011] In some embodiments, the first adjusting assembly further includes a first coupling, the first coupling is connected between the first connecting member and the cylinder shaft, an anti-overload rotating connection is provided between the first connecting member and the first coupling, and the first coupling is fixedly connected to the cylinder shaft.
[0012] In some embodiments, the second adjusting assembly further includes a connecting shaft, the connecting shaft is coaxially arranged with the second connecting member, one end of the connecting shaft is fixedly connected to the second connecting member, and the other end of the connecting shaft is connected to the output shaft of the motor through a second coupling.
[0013] In some embodiments, the motor is a bidirectional motor.
[0014] In some embodiments, a surface of the substrate facing the cathode target material is parallel to a cathode surface of each cathode target material.
[0015] In some embodiments, each cathode target material has an open state and a closed state, and can be switched between the open state and the closed state.
[0016] In some embodiments, the rotating disc is provided with a recess, and the substrate is mounted in the recess through a clamping member.
[0017] In some embodiments, a plurality of clamping members are uniformly arranged along a circumferential direction of the recess.
[0018] In some embodiments, the motor housing is provided with a first protective cover;
[0019] And / or, the cylinder housing is provided with a second protective cover.
[0020] The utility model discloses beneficial effects:
[0021] The magnetron sputtering equipment provided by the utility model, through setting the adjusting device including the first adjusting component and the second adjusting component, the substrate to be plated can realize the motion mode of combination of revolution and rotation when plating, wherein the substrate passes the multiple cathode target materials one by one through revolution, and the uniform coverage of large-area plating is ensured, and the rotation makes the substrate surface be able to receive the sputtering particles uniformly when facing each cathode target material, thereby effectively solving the problems of uneven film layer thickness and poor overall consistency caused by the single direction motion of the substrate in the prior art magnetron sputtering equipment, the uniformity and precision of the film layer are improved significantly, and the requirements of ultrathin film layer high-precision preparation are met. BRIEF DESCRIPTION OF DRAWINGS
[0022] In order to more clearly illustrate the technical scheme in the embodiments of the utility model, the drawings needed to be used in the description of the embodiments of the utility model will be briefly introduced, and obviously, the drawings in the following description are only some embodiments of the utility model, and for those skilled in the art, other drawings can be obtained according to the contents of the embodiments of the utility model and these drawings without paying creative labor.
[0023] Figure 1 It is the three-dimensional structure schematic view of the adjusting device provided by the embodiments of the utility model;
[0024] Figure 2 It is the front view of the adjusting device provided by the embodiments of the utility model;
[0025] Figure 3 It is the structure schematic view of the reaction chamber provided by the embodiments of the utility model;
[0026] Figure 4 It is the structure schematic view of the turntable provided by the embodiments of the utility model;
[0027] Figure 5 It is the structure schematic view of the substrate installed on the turntable provided by the embodiments of the utility model;
[0028] Figure 6 It is the relative position schematic view of the adjusting device and the cathode target material provided by the embodiments of the utility model.
[0029] In the drawings:
[0030] 100, reaction chamber; 200, adjusting device; 300, cathode target material; 400, substrate;
[0031] 1, first adjusting assembly; 11, first connecting piece; 12, first gear; 13, cylinder; 131, cylinder body; 132, cylinder shaft; 14, first coupling;
[0032] 2, second adjusting assembly; 21, motor; 22, second connecting piece; 23, second gear; 24, rotary disc; 241, concave table; 242, clamping piece; 25, connecting shaft; 26, second coupling. DETAILED DESCRIPTION
[0033] In order to make the purpose, technical scheme and advantages of the embodiments of the present application clearer, the technical scheme in the embodiments of the present application will be described clearly and completely below in conjunction with the drawings in the embodiments of the present application. Obviously, the described embodiments are part of the embodiments of the present application, rather than all the embodiments. The components of the embodiments of the present application described and shown in the drawings can be arranged and designed in various different configurations.
[0034] Therefore, the following detailed description of the embodiments of the present application provided in the drawings is not intended to limit the scope of the claimed present application, but only represents selected embodiments of the present application. All other embodiments obtained by those of ordinary skill in the art based on the embodiments in the present application without creative labor are within the scope of protection of the present application.
[0035] It should be noted that: similar reference numerals and letters represent similar items in the following drawings, therefore, once an item is defined in one drawing, it does not need to be further defined and explained in subsequent drawings.
[0036] In the description of the present application, it should be noted that the terms "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer" and the like indicate the orientation or positional relationship based on the orientation or positional relationship shown in the drawings, or the orientation or positional relationship commonly placed when the product of the present application is used, and are only for the convenience of describing the present application and simplifying the description, and therefore cannot be understood as indicating or implying that the indicated device or element must have a particular orientation, be constructed and operated in a particular orientation, and therefore cannot be understood as limiting the present application. In addition, the terms "first", "second", "third" and the like are only used for differentiation in description, and cannot be understood as indicating or implying relative importance. In the description of the present application, unless otherwise specified, the meaning of "multiple" is two or more.
[0037] In the description of this utility model, it should also be noted that, unless otherwise explicitly specified and limited, the terms "set" and "connection" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection. Those skilled in the art can understand the specific meaning of the above terms in this utility model based on the specific circumstances.
[0038] In this invention, unless otherwise explicitly specified and limited, "above" or "below" the second feature can include direct contact between the first and second features, or contact between the first and second features through another feature between them. Furthermore, "above," "over," and "on top" of the second feature includes the first feature directly above or diagonally above the second feature, or simply indicates that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature includes the first feature directly below or diagonally below the second feature, or simply indicates that the first feature is at a lower horizontal level than the second feature.
[0039] The embodiments of this utility model are described in detail below. Examples of these embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain this utility model, and should not be construed as limiting this utility model.
[0040] like Figures 1-6 As shown, this embodiment provides a magnetron sputtering apparatus, including a reaction chamber 100 and an adjustment device 200. Multiple cathode targets 300 are spaced apart on the inner wall of the reaction chamber 100. The adjustment device 200 is disposed inside the reaction chamber 100 and is used to mount the substrate 400 to be coated and to move the substrate 400 sequentially past each of the multiple cathode targets 300. The reaction chamber 100 provides a vacuum-sealed environment for the sputtering process. Within this vacuum-sealed environment, the substrate 400 is coated as it faces each cathode target 300.
[0041] like Figure 3 As shown, in this embodiment, the reaction chamber 100 is cylindrical, with its central axis extending along a first direction. The cathode target 300 is disposed on the inner peripheral wall of the reaction chamber 100 and is rectangular. However, this is not a limitation. In other embodiments, the shapes of the reaction chamber 100 and the cathode target 300 can also be other. For example, the reaction chamber 100 can be a square cylinder, and the cathode target 300 can be a square, a circle, etc., depending on the actual situation.
[0042] The adjusting device 200 comprises a first adjusting assembly 1 and a second adjusting assembly 2.
[0043] The first adjusting assembly 1 comprises a first connecting member 11 and a first gear 12, the first connecting member 11 is arranged on the inner bottom wall of the reaction chamber 100 and the central axis of the first connecting member 11 extends along a first direction, and the first gear 12 is fixedly sleeved on the outer periphery of the end of the first connecting member 11 away from the inner bottom wall of the reaction chamber 100.
[0044] The second adjusting assembly 2 comprises a motor 21, a second connecting member 22, a second gear 23 and a rotating disc 24, the central axis of the second connecting member 22 extends along a second direction, the second connecting member 22 is connected to the output shaft of the motor 21, the second gear 23 is fixedly sleeved on the outer periphery of the second connecting member 22, the rotating disc 24 is fixedly connected to one end of the second connecting member 22 away from the motor 21, and the substrate 400 is installed on the side of the rotating disc 24 facing the cathode target material 300. The motor 21 can drive the second connecting member 22 to rotate around the central axis thereof, so that the rotating disc 24 and the second gear 23 rotate together with the second connecting member 22, and the second gear 23 is in meshing transmission with the first gear 12, so that the second gear 23 rotates around the central axis of the first connecting member 11. Wherein, the first direction and the second direction are perpendicular to each other.
[0045] In specific implementation, the adjusting device 200 is first installed inside the reaction chamber 100, for example, the adjusting device 200 can be installed on the inner bottom wall of the reaction chamber 100 through a support. After the adjusting device 200 is installed, the substrate 400 is installed on the rotating disc 24. The motor 21 is started to drive the second connecting member 22 to rotate around the central axis thereof, so as to drive the rotating disc 24 and the second gear 23 to rotate synchronously, at this time, the substrate 400 on the rotating disc 24 rotates around the central axis of the second connecting member 22; at the same time, since the second gear 23 is in meshing transmission with the first gear 12, the rotation of the second gear 23 around the central axis of the second connecting member 22 will drive the first gear 12 to rotate and mesh, so that the second adjusting assembly 2 rotates around the central axis of the first connecting member 11, at this time, the substrate 400 on the rotating disc 24 rotates around the central axis of the first connecting member 11. That is, the substrate 400 can revolve around the central axis of the first connecting member 11 to pass through the plurality of cathode target materials 300 one by one, and can also revolve around the central axis of the second connecting member 22 while revolving.
[0046] The magnetron sputtering device provided by the embodiment can make the substrate 400 realize the combined movement of revolution and rotation during the film plating, the substrate 400 passes through the plurality of cathode target materials 300 one by one through the revolution, and the uniform coverage of the large-area film plating is ensured, and the rotation can make the surface of the substrate 400 uniformly receive the sputtering particles when facing each cathode target material 300, thereby effectively solving the problems of the film layer thickness unevenness and the poor overall consistency caused by the single direction movement of the substrate 400 in the existing magnetron sputtering device, significantly improving the uniformity and precision of the film layer, and being beneficial to meeting the requirements of the ultra-thin film layer high-precision preparation.
[0047] As shown in Figure 4 and Figure 5 , in some embodiments, the turntable 24 is provided with a recess 241, and the substrate 400 is installed in the recess 241 through a clamping piece 242. The recess 241 provides a stable installation position for the substrate 400, thereby improving the installation stability of the substrate 400.
[0048] Further, the clamping piece 242 is provided in plurality, and the plurality of clamping pieces 242 are uniformly arranged along the circumference of the recess 241. In this way, the plurality of clamping pieces 242 can exert uniform clamping force on the substrate 400.
[0049] Optionally, the clamping piece 242 can be a bolt clamping structure, a spring clamp, etc., which is not limited here.
[0050] As shown in Figure 1 and Figure 2 , in some embodiments, the first adjusting assembly 1 further includes a gas cylinder 13, the gas cylinder 13 includes a gas cylinder body 131 and a gas cylinder shaft 132, the gas cylinder body 131 is installed on the inner bottom wall of the reaction chamber 100, the gas cylinder shaft 132 can extend or retract relative to the gas cylinder body 131, the first connecting piece 11 is connected to the gas cylinder shaft 132, and the gas cylinder shaft 132 can drive the first connecting piece 11 to move in the first direction, so that the first gear 12 is close to or away from the second gear 23. When the gas cylinder shaft 132 extends relative to the gas cylinder body 131, the first gear 12 can be moved to a position engaged with the second gear 23, and when the gas cylinder shaft 132 retracts relative to the gas cylinder body 131, the first gear 12 can be reversely moved to disengage from the second gear 23.
[0051] By providing the gas cylinder 13, the position of the first gear 12 can be flexibly adjusted, the first gear 12 and the second gear 23 can be quickly engaged or disengaged, the start and stop control of the device is facilitated, and the operation flexibility and maintenance convenience of the device are improved.
[0052] As shown in Figure 1 and Figure 2As shown in the figure, in some embodiments, the first adjusting assembly 1 further comprises a first coupling 14 connected between the first connecting piece 11 and the cylinder shaft 132, the first connecting piece 11 is in anti-overload rotary connection with the first coupling 14, and the first coupling 14 is in fixed connection with the cylinder shaft 132.
[0053] Through such an arrangement, under normal circumstances, the first gear 12 and the second gear 23 are in smooth engagement, and the first gear 12 remains fixed during the revolution of the second gear 23 around the first gear 12; when the first gear 12 and the second gear 23 are not in smooth engagement, the rotation of the second gear 23 may cause the first gear 12 to be subjected to excessive force, at which time, due to the anti-overload rotary connection function of the first coupling 14, the first gear 12 can drive the first connecting piece 11 to rotate by a certain angle, thereby playing a certain overload protection role for the motor 21.
[0054] As shown in the figure, Figure 1 and Figure 2 As shown in the figure, in some embodiments, the second adjusting assembly 2 further comprises a connecting shaft 25 coaxially arranged with the second connecting piece 22, one end of the connecting shaft 25 is fixedly connected with the second connecting piece 22, and the other end of the connecting shaft 25 is connected to the output shaft of the motor 21 through a second coupling 26.
[0055] Through such an arrangement, reliable connection between the motor 21 and the second connecting piece 22 is achieved, facilitating efficient transmission of power, and at the same time, through the arrangement of the second coupling 26, axial or angular deviations that may exist between the motor output shaft and the second connecting piece 22 can also be absorbed and compensated, thereby reducing vibration and wear during equipment operation and improving the stability and service life of the equipment.
[0056] In some embodiments, the motor 21 is a bidirectional motor. That is, the motor 21 can be reversed, and such an arrangement allows the substrate 400 to revolve in two opposite directions.
[0057] As shown in the figure, Figure 3 Taking the three cathode targets 300 shown in the figure as an example, by setting the motor 21 as a bidirectional motor, the substrate 400 can be driven to revolve from left to right or from right to left, and the initial process position of the substrate 400 can also be controlled, that is, the substrate 400 can start the sputtering process at any cathode target 300, which is conducive to making the film coating process selection more flexible.
[0058] Optionally, the speed of the substrate 400 can be controlled by the motor 21.
[0059] As shown in the figure, Figure 6As shown, in some embodiments, the surface of the substrate 400 towards the cathode target 300 is parallel to the cathode surface of each cathode target 300. In this way, the distance between the surface of the substrate 400 and the cathode surface of the cathode target 300 is uniform, which is conducive to the uniform deposition of target atoms on the surface of the substrate 400 during sputtering.
[0060] In some embodiments, each cathode target 300 has an open state and a closed state, and can be switched between the open state and the closed state. Before the substrate 400 is about to enter the area of a cathode target 300, the cathode target 300 is opened, and when the substrate 400 leaves the area of the cathode target 300, the cathode target 300 is closed. In this way, the cathode target 300 is opened and closed in turn, which can avoid the risk of cross contamination and unevenness of the film layer caused by simultaneous deposition of different cathode materials during the process, and can also reduce the amount of film layer deposited on the components in the chamber per unit time, thereby prolonging the cleaning cycle of the components. In addition, the revolution of the substrate 400 combined with the switching of the cathode target 300 can meet the needs of various film deposition processes, such as single-layer or multi-layer film deposition, combination of different material film layers, etc.
[0061] In some embodiments, the motor 21 is provided with a first protective cover (not shown in the figure). The first protective cover can prevent sputtering material from being directly deposited on the motor 21 during the process. The first protective cover can be periodically removed and cleaned.
[0062] In some embodiments, the cylinder 13 is provided with a second protective cover (not shown in the figure). The second protective cover can prevent sputtering material from being directly deposited on the cylinder 13 during the process. The second protective cover can be periodically removed and cleaned.
[0063] Obviously, the above embodiments of the utility model are only examples for clear illustration of the utility model, and are not a limitation on the embodiments of the utility model. For ordinary skilled persons in the art, other different forms of changes or variations can be made on the basis of the above description. Here, it is not necessary and impossible to exhaust all the embodiments. Any modification, equivalent replacement and improvement, etc. made within the spirit and principle of the utility model should be included in the protection scope of the claims of the utility model.
Claims
1. A magnetron sputtering apparatus, characterized by, The magnetic control sputtering equipment comprises a reaction chamber (100) and an adjusting device (200), the inner wall of the reaction chamber (100) is provided with a plurality of cathode targets (300) at intervals, the adjusting device (200) is arranged in the reaction chamber (100), the adjusting device (200) is used for mounting a substrate (400) to be plated and driving the substrate (400) to pass through the cathode targets (300) one by one, and the adjusting device (200) comprises: A first adjusting assembly (1) comprises a first connecting piece (11) and a first gear (12), the first connecting piece (11) is arranged on the inner bottom wall of the reaction chamber (100), and the central axis of the first connecting piece (11) extends along a first direction, the first gear (12) is fixedly sleeved on the outer periphery of the end of the first connecting piece (11) away from the inner bottom wall of the reaction chamber (100); A second adjusting assembly (2) comprises a motor (21), a second connecting piece (22), a second gear (23) and a rotating disc (24), the central axis of the second connecting piece (22) extends along a second direction, the second connecting piece (22) is connected to the output shaft of the motor (21), the second gear (23) is fixedly sleeved on the outer periphery of the second connecting piece (22), the rotating disc (24) is fixedly connected to one end of the second connecting piece (22) away from the motor (21), and the substrate (400) is mounted on the side of the rotating disc (24) facing the cathode targets (300); the motor (21) can drive the second connecting piece (22) to rotate around the central axis thereof, so that the rotating disc (24) and the second gear (23) rotate together with the second connecting piece (22), the second gear (23) and the first gear (12) are in meshing transmission, so that the second gear (23) rotates around the central axis of the first connecting piece (11); wherein the first direction is perpendicular to the second direction.
2. The magnetic control sputtering equipment according to claim 1, wherein The first adjusting assembly (1) further comprises a pneumatic cylinder (13), the pneumatic cylinder (13) comprises a pneumatic cylinder body (131) and a pneumatic cylinder shaft (132), the pneumatic cylinder body (131) is mounted on the inner bottom wall of the reaction chamber (100), the pneumatic cylinder shaft (132) can be extended or retracted relative to the pneumatic cylinder body (131), the first connecting piece (11) is connected to the pneumatic cylinder shaft (132), and the pneumatic cylinder shaft (132) can drive the first connecting piece (11) to move along the first direction, so that the first gear (12) is close to or away from the second gear (23).
3. The magnetic control sputtering equipment according to claim 2, wherein The first adjusting assembly (1) further comprises a first coupling (14) connected between the first connecting piece (11) and the cylinder shaft (132), the first connecting piece (11) is in anti-overload rotation connection with the first coupling (14), and the first coupling (14) is in fixed connection with the cylinder shaft (132).
4. The magnetron sputtering device according to claim 1, wherein, The second adjusting assembly (2) further comprises a connecting shaft (25) coaxially arranged with the second connecting piece (22), one end of the connecting shaft (25) is fixedly connected with the second connecting piece (22), and the other end of the connecting shaft (25) is connected with the output shaft of the motor (21) through a second coupling (26).
5. The magnetron sputtering device according to any one of claims 1-4, wherein, The motor (21) is a bidirectional motor.
6. The magnetron sputtering device according to any one of claims 1-4, wherein, The surface of the substrate (400) facing the cathode target (300) is parallel to the cathode surface of each cathode target (300).
7. The magnetron sputtering device according to claim 6, wherein, Each cathode target (300) has an open state and a closed state and can be switched between the open state and the closed state.
8. The magnetron sputtering device according to any one of claims 1-4, wherein, The turntable (24) is provided with a recess (241), and the substrate (400) is installed in the recess (241) through a clamping piece (242).
9. The magnetron sputtering device according to claim 8, wherein, The clamping pieces (242) are arranged in multiple, and the multiple clamping pieces (242) are uniformly arranged along the circumference of the recess (241).
10. The magnetron sputtering device according to claim 2, wherein, The motor (21) is provided with a first protective cover; And / or, the cylinder (13) is provided with a second protective cover.