Carrier plate for vacuum thin film deposition equipment

Abstract

The utility model relates to a carrier plate for vacuum thin film deposition equipment, which comprises a tray, the tray comprises a plurality of bearing areas for bearing substrates to be subjected to thin film deposition, and the bearing areas are arranged in an array; each bearing area is provided with a plurality of step parts and hollow structures, the step parts are used for placing substrates to be subjected to film deposition, and the contact mode of the step parts and the substrates to be subjected to film deposition is point contact, line contact or surface contact; and at least part of the hollow structure is positioned below the substrate to be subjected to film deposition. According to the carrier plate for the vacuum thin film deposition equipment, the multiple step parts and the multiple hollow structures are arranged, and in the machining process of the substrate to be subjected to thin film deposition, fragments of the substrate to be subjected to thin film deposition can be prevented from falling into a heating plate and a process cavity of the vacuum equipment; further, the heating performance of the substrate to be subjected to film deposition is influenced; and vacuum equipment is damaged.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of vacuum thin film deposition equipment, in particular to a carrier plate for vacuum thin film deposition equipment. BACKGROUND

[0002] In modern industrial manufacturing, vacuum processing technology plays a crucial role, especially in the fields of semiconductors, microelectronics, optoelectronics, etc. Common vacuum processing equipment includes vacuum thin film deposition, etching, plasma treatment, and oxidation equipment. Among them, the chemical vapor deposition (CVD) equipment is a material processing equipment used to deposit thin films on substrates through chemical reactions in a vacuum environment. This technology can achieve precise control of the composition of thin films and is suitable for the preparation of various high-performance materials and devices. During the operation of the CVD equipment, a carrier plate is usually used to dynamically transmit the substrate to be deposited with a thin film to the process chamber, and then the substrate to be deposited with a thin film carried on the carrier plate is processed.

[0003] In the prior art, the carrier plate used in the CVD process may encounter some technical challenges, for example, due to the limitations of heating capacity and fast-paced process requirements, the carrier plate usually uses a hollow structure to meet the temperature requirements during film plating, but the substrate to be deposited with a thin film may have hidden cracks or physical impact during the substrate placement, transmission, and process, which can cause the substrate to be damaged, and the size of the existing carrier plate hollow is too large, as shown in Figures 1 to 2 , Figure 1 For the full-hollow carrier plate in the prior art, Figure 2 For the partial enlarged view of the carrier area 11 of the carrier plate for placing the substrate to be deposited with a thin film, the carrier area 11 is a full-hollow structure, and the broken fragments of the substrate can fall onto the hot plate supporting the carrier plate, thereby affecting the contact between the carrier plate and the heating plate. In addition, when the radio frequency power source is working, arc discharge occurs, which can damage the carrier plate and the heating plate. More seriously, the fragments can fall into the cavity, block the exhaust duct, or fall into the carrier plate inlet and outlet valve, which can affect the closing of the valve and cause vacuum leakage and other problems. CONTENT OF THE UTILITY MODEL

[0004] Therefore, it is necessary to provide a carrier plate for vacuum thin film deposition equipment to solve the problem of the too large size of the hollow part of the carrier plate in the prior art vacuum equipment, which can cause the fragments of the substrate to be deposited with a thin film to fall, affect the heating of the substrate, and damage the equipment.

[0005] In order to achieve the above-mentioned purpose, the present application provides a carrier plate for vacuum thin film deposition equipment, comprising:

[0006] A tray, the tray comprises a plurality of carrier areas for carrying a substrate to be deposited with a thin film, and the plurality of carrier areas are arranged in an array;

[0007] Each of the loading areas is provided with a plurality of stepped portions for placing the substrate to be deposited with thin film and a hollow structure, the stepped portions being in point contact, line contact or surface contact with the substrate to be deposited with thin film;

[0008] The hollow structure is at least partially located below the substrate to be deposited with thin film.

[0009] In one of the embodiments, the thickness of the hollow structure is less than or equal to the thickness of the stepped portion in the direction perpendicular to the horizontal plane.

[0010] In one of the embodiments, the thickness of the hollow structure is 0.1mm-4mm.

[0011] In one of the embodiments, the tray is further provided with a blocking structure on the side surface of the tray for loading the substrate to be deposited with thin film, and the substrate to be deposited with thin film is located in the blocking area surrounded by the blocking structure.

[0012] In one of the embodiments, the blocking structure is integrally formed with the tray.

[0013] In one of the embodiments, the hollow area in the hollow structure accounts for 50%-99% of the area of the loading area.

[0014] In one of the embodiments, the carrier plate further comprises a frame structure for loading the tray.

[0015] In one of the embodiments, the frame structure comprises a frame and support structures arranged inside the frame and staggered.

[0016] In one of the embodiments, the shape of the hollow area in the hollow structure comprises at least one of a rhombus, a circle, a triangle, a quadrilateral, a pentagon and a hexagon.

[0017] The vacuum film deposition equipment carrier plate in the embodiment of the application is provided with a tray, the tray comprises a plurality of carrying areas for carrying the to-be-film-deposited substrates and arranged in an array, and each carrying area is provided with a plurality of stepped portions for placing the to-be-film-deposited substrates and a hollow structure. The contact mode of the stepped portion and the to-be-film-deposited substrate is point contact, line contact or surface contact. By flexibly designing the contact mode of the stepped portion and the to-be-film-deposited substrate, the problem that the to-be-film-deposited substrate is heated unevenly in the film deposition process and the surface of the to-be-film-deposited substrate is polluted due to too much contact between the stepped portion and the to-be-film-deposited substrate is avoided, and the structural design flexibility and applicability of the carrier plate are improved. The hollow structure is arranged at least partially below the to-be-film-deposited substrate, so that the to-be-film-deposited substrate can quickly reach the working temperature, the process efficiency is improved, and in the processing process of the to-be-film-deposited substrate, the fragments of the to-be-film-deposited substrate can be prevented from falling into the heating plate and the process cavity of the vacuum equipment, thereby affecting the heating performance of the to-be-film-deposited substrate and damaging the vacuum equipment, and the film deposition quality is improved. BRIEF DESCRIPTION OF DRAWINGS

[0018] In order to more clearly illustrate the technical solutions in the embodiments of the present application or the prior art, the accompanying drawings required to be used in the embodiments or the prior art description will be briefly introduced. Obviously, the accompanying drawings in the following description are only some embodiments of the present application, and other accompanying drawings can be obtained by those skilled in the art without creative labor.

[0019] Figure 1 It is a structural schematic view of a carrier plate for a vacuum film deposition equipment provided in the prior art;

[0020] Figure 2 It is a partial enlarged structural schematic view of a carrying area of a carrier plate for a vacuum film deposition equipment provided in the prior art;

[0021] Figure 3 It is a structural schematic view of a carrying area and a to-be-film-deposited substrate of a carrier plate for a vacuum film deposition equipment provided in an embodiment;

[0022] Figure 4 It is a structural schematic view of a carrying area provided in an embodiment;

[0023] Figure 5 It is a sectional structural schematic view along the AA' direction in Figure 4 ;

[0024] Figure 6 It is a sectional structural schematic view along the BB' direction in Figure 4 ;

[0025] Figure 7Fig. 2 shows a schematic view of another structure of a carrier area and substrates to be deposited with thin films provided in an embodiment.

[0026] Explanation of reference signs:

[0027] 10 - carrier plate, 1 - tray, 11 - carrier area, 111 - step portion, 112 - hollow structure, 2 - substrates to be deposited with thin films, 3 - barrier structure, 4 - frame structure, 41 - support structure, 411 - protrusion. DETAILED DESCRIPTION

[0028] In order to facilitate the understanding of the present application, a more complete understanding of the present application can be had by reference to the following description and the accompanying drawings. In the Figures, embodiments of the present application are illustrated by way of example. It is to be expressly understood that the drawings are for illustrative purposes only and therefore are not a limitation on the scope of the present application. It is to be further expressly understood that the description, given above, and the illustrative drawings are included to elucidate various embodiments of the present application and are not intended to be limiting.

[0029] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs. The terminology used in the description of the application herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the application.

[0030] In the description of the present application, it is to be understood that, if there appear the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential", and the like, these terms indicate the orientation or positional relationship based on the orientation or positional relationship shown in the drawings, and are only for the purpose of facilitating the description of the present application and simplifying the description, and are not intended to indicate or imply that the device or element referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore cannot be understood as a limitation on the present application.

[0031] In addition, if the terms "first", "second" appear, these terms are only for the purpose of description, and cannot be understood as indicating or implying relative importance or implying the number of the technical features indicated. Therefore, the features limited by "first", "second" can explicitly or implicitly include at least one of the features. In the description of the present application, if the term "plurality" appears, the meaning of "plurality" is at least two, for example, two, three, etc., unless otherwise specifically limited.

[0032] In the present application, unless specifically defined otherwise, if there is an appearance of the terms "installation", "connection", "connection", "fixation" and the like, these terms should be interpreted in a broad sense. For example, it can be fixedly connected, or it can be detachably connected, or it can be integrated; it can be mechanically connected, or it can be electrically connected; it can be directly connected, or it can be indirectly connected through an intermediate medium; it can be the internal communication of two elements or the interaction relationship between two elements, unless otherwise specifically defined. For those skilled in the art, the specific meaning of the above terms in the present application can be understood according to the specific circumstances.

[0033] In the present application, unless specifically defined otherwise, if there is a description of the first feature "on" or "below" the second feature and the like, it means that the first and second features are in direct contact, or the first and second features are indirectly in contact through an intermediate medium. Moreover, the first feature "above", "above" and "above" the second feature can be directly above or obliquely above the second feature, or only indicates that the horizontal height of the first feature is higher than that of the second feature. The first feature "below", "below" and "below" the second feature can be directly below or obliquely below the second feature, or only indicates that the horizontal height of the first feature is less than that of the second feature.

[0034] It should be noted that if an element is referred to as "fixed to" or "provided on" another element, it can be directly on another element or there can be a middle element. If an element is considered to be "connected" to another element, it can be directly connected to another element or there can be a middle element. If present, the terms "vertical", "horizontal", "up", "down", "left", "right" and similar expressions used in the present application are for illustrative purposes only and are not the only embodiment.

[0035] See Figure 3 The embodiment of the present application provides a kind of vacuum thin film deposition equipment with carrier plate, vacuum thin film deposition equipment with carrier plate includes tray 1, tray 1 includes multiple for carrying the carrying area 11 of to-be-film-deposited substrate 2, multiple carrying area 11 is arranged in array;Each carrying area 11 is equipped with multiple step portion 111 and hollow structure 112, step portion 111 is used to place to-be-film-deposited substrate 2, and the contact mode of step portion 111 and to-be-film-deposited substrate 2 is point contact, line contact or surface contact;Hollow structure 112 is at least partially below to-be-film-deposited substrate 2.

[0036] The vacuum thin film deposition device carrier plate is provided with a tray 1, the tray 1 comprises a plurality of bearing areas 11 for bearing the to-be-deposited substrates 2 and is arranged in an array, and each bearing area 11 is provided with a plurality of step portions 111 for placing the to-be-deposited substrates 2 and a hollow structure 112; the contact mode between the step portion 111 and the to-be-deposited substrate 2 is point contact, line contact or surface contact; by flexibly designing the contact mode between the step portion 111 and the to-be-deposited substrate 2, the excessive contact between the step portion 111 and the to-be-deposited substrate 2 is avoided, and the pollution to the to-be-deposited substrate 2 is reduced; and by arranging the hollow structure 112 to be at least partially below the to-be-deposited substrate 2, the to-be-deposited substrate 2 can quickly reach the working temperature, the process efficiency is improved, and in the process of processing the to-be-deposited substrate 2, the fragments of the to-be-deposited substrate 2 can also be prevented from falling into the process cavity of the heating plate and the vacuum device, thereby affecting the heating performance of the to-be-deposited substrate 2 and causing damage to the vacuum device, and the thin film deposition quality is improved.

[0037] In some embodiments, referring to Figures 4 to 6 In the direction perpendicular to the horizontal plane, the thickness of the hollow structure 112 is less than or equal to the thickness of the step portion 111. By arranging the thickness of the hollow structure 112 to be less than the thickness of the step portion 111, the step portion 111 can bear the to-be-deposited substrate 2 while avoiding the direct contact between the hollow structure 112 and the to-be-deposited substrate 2, thereby causing the surface pollution and uneven heating of the to-be-deposited substrate 2, leading to uneven thin film deposition and affecting the deposition film quality. For example, the thickness of the hollow structure 112 is 0.1mm-4mm. In addition, the shape and structure of the step portion 111 can be selected according to actual conditions without limitation, as long as the step portion 111 can bear the to-be-deposited substrate 2 and does not affect the uniformity of the heating of the to-be-deposited substrate 2 and does not pollute the to-be-deposited substrate 2.

[0038] In some embodiments, referring to Figures 4 to 6 The side surface of the tray 1 on which the to-be-deposited substrate 2 is borne is also provided with a blocking structure 3, and the to-be-deposited substrate 2 is located in a blocking area surrounded by the blocking structure 3. For example, the blocking structure 3 is arranged on the upper surface of the step portion 111, the blocking structure 3 and the plane where the step portion 111 is located are arranged at a preset angle, and for example, the preset angle is greater than 0 degrees and less than or equal to 90 degrees, thereby fully avoiding the risk of the to-be-deposited substrate 2 slipping and falling during the process transportation, and the shape and size of the blocking structure 3 can be selected according to actual conditions without limitation, as long as the to-be-deposited substrate 2 does not slip and fall during the process transportation.

[0039] In some embodiments, referring to Figures 4 to 6The blocking structure 3 is integrally formed with the tray 1. By integrally forming the blocking structure 3 with the tray 1, the structural stability of the carrier plate is improved, and the process difficulty is reduced. It should be noted that, in the case of meeting the performance of the carrier plate, the blocking structure 3 can also be detachable on the tray 1, such as being clamped and mounted on the tray 1, and the angle between the blocking structure 3 and the plane where the stepped portion 111 is located is flexibly adjusted, which can improve the design flexibility and applicability of the carrier plate.

[0040] In some embodiments, referring to Figure 7 The hollow area in the hollow structure 112 accounts for 50% to 99% of the area of the bearing area. By setting the hollow area in the hollow structure 112 to account for 50% to 99% of the area of the bearing area, the fragments of the to-be-deposited-film substrate 2 can be prevented from falling, and at the same time, the heating plate pair can be fully heated, so that the to-be-deposited-film substrate 2 can be quickly heated to reach the working temperature. Exemplarily, the shape of the hollow area in the hollow structure 112 includes at least one of a rhombus, a circle, a triangle, a quadrilateral, a pentagon, and a hexagon, and can also be other suitable shapes, and is not limited to the above shapes. In addition, the number of hollow areas in the hollow structure 112 is multiple and is arranged in an array, which can avoid the broken fragments of the to-be-deposited-film substrate 2 from falling, and the material of the hollow structure 112 includes carbon fiber, which can meet the rigidity of receiving the broken fragments of the to-be-deposited-film substrate 2. In the case of meeting the performance of the carrier plate, the number of hollow areas in the hollow structure 112 can be selected according to actual conditions, which is not limited herein.

[0041] In some embodiments, referring to Figures 4 to 6 The carrier plate further includes a frame structure 4, and the frame structure 4 is used to bear the tray 1. By setting the frame structure 4 below the tray 1 to bear the tray 1, the overall rigidity and stability of the tray 1 are enhanced, especially in the process transmission process, the process deviation caused by structural deformation is reduced, the stability and uniformity of the to-be-deposited-film substrate 2 in the process are ensured, and the quality and efficiency of film deposition are also improved. The frame structure 4 can be integrally formed with the tray 1, or can form a detachable structure with the tray 1. By designing the frame structure 4 and forming the detachable structure with the tray 1, the tray 1 can be more easily detached and cleaned, the process performance of the tray 1 can be maintained and the service life of the tray 1 can be prolonged, and the design flexibility and applicability of the carrier plate are further improved.

[0042] In some embodiments, the frame structure 4 includes a frame (not shown) and a support structure 41 arranged inside the frame and staggered, which further increases the stability of the frame structure 4.

[0043] In some embodiments, the support structure 41 is further provided with a protrusion 411 on the surface for supporting the tray 1, and the tray 1 is placed on the protrusion 411. Exemplarily, the protrusion 411 is located below the step portion 111. By providing the protrusion 411 on the support structure 41 to support the tray 1, and the protrusion 411 is located below the step portion 111, the contact area between the frame structure 4 and the tray 1 is reduced, and the influence on the working temperature of the film deposition substrate 2 is avoided.

[0044] In the description of the present specification, the description referring to the terms "some embodiments", "other embodiments", "ideal embodiments", and the like means that the specific features, structures, materials, or characteristics described in connection with the embodiments or examples are included in at least one embodiment or example of the present application. In the present specification, the illustrative description of the above terms does not necessarily refer to the same embodiment or example.

[0045] The technical features of the above-described embodiments can be combined in any manner. In order to make the description concise, all possible combinations of the technical features of the above-described embodiments are not described, however, as long as the combinations of the technical features do not contradict each other, they should be considered within the scope of the present application.

[0046] The above-described embodiments only express several implementation manners of the present application, and the description is relatively specific and detailed, but it should not be understood as a limitation on the patent scope of the present application. It should be noted that, for ordinary skilled persons in the art, several modifications and improvements can be made without departing from the concept of the present application, and these all belong to the protection scope of the present application. Therefore, the patent protection scope of the present application should be subject to the appended claims.

Claims

1. A carrier plate for a vacuum thin film deposition apparatus, characterized in that, include: The tray includes multiple support areas for supporting the substrate to be deposited with thin film, and the multiple support areas are arranged in an array; Each of the aforementioned bearing areas is provided with multiple stepped portions and hollow structures. The stepped portions are used to place the substrate to be deposited on the thin film. The contact between the stepped portions and the substrate to be deposited on the thin film is point contact, line contact, or surface contact. The hollow structure is located below the substrate to be deposited with thin film.

2. The carrier plate according to claim 1, characterized in that, In the direction perpendicular to the horizontal plane, the thickness of the hollow structure is less than or equal to the thickness of the step portion.

3. The carrier plate according to claim 1, characterized in that, The thickness of the hollow structure is 0.1mm to 4mm.

4. The carrier plate according to claim 1, characterized in that, The tray also has a blocking structure on one side surface that supports the substrate to be deposited, and the substrate to be deposited is located within the blocking area enclosed by the blocking structure.

5. The carrier plate according to claim 4, characterized in that, The blocking structure is integrally formed with the tray.

6. The carrier plate according to claim 1, characterized in that, In the hollow structure, the hollow area accounts for 50% to 99% of the area of ​​the bearing area.

7. The carrier plate according to claim 1, characterized in that, The carrier plate also includes a frame structure for supporting the tray.

8. The carrier plate according to claim 7, characterized in that, The frame structure includes a border and a support structure disposed inside the border and arranged in an alternating manner.

9. The carrier plate according to claim 8, characterized in that, The support structure has a protrusion on its surface for supporting the tray, and the tray is placed on the protrusion.

10. The carrier plate according to claim 1, characterized in that, The shape of the hollowed-out area in the hollowed-out structure includes at least one of the following: rhombus, circle, triangle, quadrilateral, pentagon, and hexagon.

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