Clamp for testing bonding strength of electronic packaging

Abstract

The utility model relates to the technical field of electronic packaging testing, and discloses a clamp for testing the bonding strength of electronic packaging, which comprises a test board, a support frame fixedly connected to the bottom of the test board, a support plate fixedly connected to the inner side of the support frame, an adjusting assembly connected to the bottom of the support plate, and a pressing assembly connected to the top of the test board. Compared with the prior art, the fixture for testing the bonding strength of the electronic package has the advantages that the electronic package can be firmly fixed, so that the electronic package can be kept at a stable position on a test board, the electronic package is prevented from sliding when a shearing force is applied, and the testing stability of the fixture for testing the bonding strength of the electronic package is ensured; the fixture for testing the bonding strength of the electronic package can simulate pulling force, shearing force or composite force of different angles borne by the electronic package in an actual scene, so that the testing accuracy of the fixture for testing the bonding strength of the electronic package is improved.

Description

Technical Field

[0001] This utility model relates to the field of electronic packaging testing technology, and in particular to a fixture for testing the bonding strength of electronic packaging. Background Technology

[0002] Electronic packaging testing refers to a series of inspections and evaluations performed on packaged electronic components. Electronic packaging is the process of electrically connecting, physically protecting, and thermally managing semiconductor devices such as chips to the external world, while testing verifies whether the packaged components meet design requirements and performance standards. Existing fixtures for testing the bonding strength of electronic packages cannot securely fix the packaged components, causing them to slip when shear forces are applied, resulting in low test stability; furthermore, they cannot be adjusted according to the different angles of tensile, shear, or combined forces applied to the packaged components in real-world scenarios, leading to decreased test accuracy. Utility Model Content

[0003] The purpose of this invention is to address the shortcomings of existing technologies by proposing a fixture for testing the bonding strength of electronic packages.

[0004] To achieve the above objectives, the present invention adopts the following technical solution: a fixture for testing the bonding strength of electronic packaging, comprising a test platform, a support frame fixedly connected to the bottom of the test platform, a support plate fixedly connected to the inner side of the support frame, an adjustment component connected to the bottom of the support plate, and a clamping component connected to the top of the test platform;

[0005] The clamping assembly includes a mounting frame, one end of which is fixedly connected to the bottom of the test bench. A cylinder is fixedly connected inside the mounting frame, and the output end of the cylinder passes through the mounting frame and is fixedly connected to a drive plate. Drive rods are fixedly connected to the top of both ends of the drive plate. A limit groove is formed at the top of the test bench. One end of the drive rod passes through the limit groove and is fixedly connected to an active block. One end of the active block is rotatably connected to an active plate. A connecting plate is rotatably connected to the inner side of the active plate. A limit plate is rotatably connected to one end of the connecting plate. One end of the limit plate is fixedly connected to the top of the test bench. A pressure plate is fixedly connected to one end of the active plate, and a pressure block is fixedly connected to the inner side of the pressure plate.

[0006] As a further description of the above technical solution:

[0007] The adjustment assembly includes a base plate, a fixed frame and a fixed plate are fixedly connected to the top of the base plate, a worm gear is rotatably connected inside the fixed frame, one end of the worm gear passes through the fixed frame and is fixedly connected to a throttle handle, a worm wheel is meshed with the top of the worm gear, a connecting rod is fixedly connected to one end of the worm wheel, a fixed shaft is fixedly connected to one end of the connecting rod passing through the fixed plate, a fixed block is fixedly sleeved on the outside of the fixed shaft, and one end of the fixed block is fixedly connected to the bottom of the support plate.

[0008] As a further description of the above technical solution:

[0009] Two sets of base pads are fixedly connected to the bottom of the test bench.

[0010] As a further description of the above technical solution:

[0011] Both sets of base pads are made of rubber.

[0012] As a further description of the above technical solution:

[0013] The pressure block is made of silicone.

[0014] As a further description of the above technical solution:

[0015] The test bench and the base plate are parallel.

[0016] This utility model has the following beneficial effects:

[0017] 1. In this utility model, the clamping component can firmly fix the electronic package and keep it in a stable position on the test bench, preventing the electronic package from sliding when shear force is applied, thus ensuring the test stability of the fixture for testing the bonding strength of the electronic package.

[0018] 2. In this utility model, by adjusting the components, the tensile force, shear force or combined force at different angles that electronic packages are subjected to in actual scenarios can be simulated, thereby improving the testing accuracy of the fixture for testing the bonding strength of electronic packages. Attached Figure Description

[0019] Figure 1 This invention provides a schematic diagram of the overall structure of a fixture for testing the bonding strength of electronic packages. Figure 1 ;

[0020] Figure 2 This invention provides a schematic diagram of the overall structure of a fixture for testing the bonding strength of electronic packages. Figure 2 ;

[0021] Figure 3 This is a front view of a fixture for testing the bonding strength of electronic packages according to the present invention.

[0022] Figure 4 This is a side view of a fixture for testing the bonding strength of electronic packaging according to the present invention.

[0023] Legend:

[0024] 1. Test bench; 2. Clamping assembly; 3. Mounting bracket; 4. Cylinder; 5. Drive plate; 6. Drive rod; 7. Limiting groove; 8. Driving block; 9. Driving plate; 10. Connecting plate; 11. Limiting plate; 12. Pressure plate; 13. Pressure block; 14. Support frame; 15. Support plate; 16. Adjustment assembly; 17. Base plate; 18. Fixing frame; 19. Fixing plate; 20. Worm gear; 21. Throttle; 22. Worm wheel; 23. Connecting rod; 24. Fixing shaft; 25. Fixing block; 26. Base pad. Detailed Implementation

[0025] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0026] Reference Figures 1-4 An embodiment of this utility model is provided: a fixture for testing the bonding strength of electronic packaging, including a test platform 1, a support frame 14 fixedly connected to the bottom of the test platform 1, a support plate 15 fixedly connected to the inner side of the support frame 14, an adjustment component 16 connected to the bottom of the support plate 15, and a clamping component 2 connected to the top of the test platform 1.

[0027] The clamping assembly 2 includes a mounting frame 3. One end of the mounting frame 3 is fixedly connected to the bottom of the test bench 1. A cylinder 4 is fixedly connected inside the mounting frame 3. The output end of the cylinder 4 passes through the mounting frame 3 and is fixedly connected to a drive plate 5. Both ends of the drive plate 5 are fixedly connected to drive rods 6. A limit groove 7 is opened at the top of the test bench 1. One end of the drive rod 6 passes through the limit groove 7 and is fixedly connected to an active block 8. One end of the active block 8 is rotatably connected to an active plate 9. A connecting plate 10 is rotatably connected to the inside of the active plate 9. One end of the connecting plate 10 is rotatably connected to a limit plate 11. One end of the limit plate 11 is fixedly connected to the top of the test bench 1. One end of the active plate 9 is fixedly connected to a pressure plate 12. A pressure block 13 is fixedly connected to the inside of the pressure plate 12.

[0028] The adjustment assembly 16 includes a base plate 17. A fixed frame 18 and a fixed plate 19 are fixedly connected to the top of the base plate 17. A worm gear 20 is rotatably connected inside the fixed frame 18. One end of the worm gear 20 passes through the fixed frame 18 and is fixedly connected to a handle 21. A worm wheel 22 is meshed with the top of the worm gear 20. A connecting rod 23 is fixedly connected to one end of the worm wheel 22. A fixed shaft 24 is fixedly connected to one end of the connecting rod 23 through the fixed plate 19. A fixed block 25 is fixedly sleeved on the outside of the fixed shaft 24. One end of the fixed block 25 is fixedly connected to the bottom of the support plate 15. Two sets of bottom pads 26 are fixedly connected to the bottom of the test platform 1. Both sets of bottom pads 26 are made of rubber to prevent slippage and improve stability. The pressure block 13 is made of silicone to increase friction. The test platform 1 and the base plate 17 are parallel.

[0029] Working principle: The electronic package is placed on the test bench 1. The cylinder 4 is activated, which drives the drive plate 5 to move upward. The drive plate 5 drives the active block 8 to move via the drive rod 6. The active block 8 drives the active plate 9 to move. The active plate 9 tilts at one end under the limit of the connecting plate 10 and the limiting plate 11. The active plate 9 drives the pressure plate 12 to move. The pressure plate 12 drives the pressure block 13 to approach and press the electronic package, improving the stability of the test. Then, the throttle 21 can be rotated. The throttle 21 drives the worm gear 20 to rotate. The worm gear 20 drives the worm wheel 22 to rotate. The worm wheel 22 drives the fixed shaft 24 to rotate via the connecting rod 23. The fixed shaft 24 drives the fixed block 25 to rotate. The fixed block 25 drives the test bench 1 to rotate via the support plate 15 and the support frame 14, adjusting the tilt of the test bench 1 and improving the measurement accuracy.

[0030] All electrical components mentioned in this article are connected to an external main controller and 220V AC mains power. The main controller can be a conventional known device such as a computer for control. The detailed description of known functions and components is omitted in the specific implementation of this disclosure. To ensure the compatibility of the device, the operating methods used are consistent with the parameters of commercially available instruments.

[0031] Finally, it should be noted that the above description is only a preferred embodiment of the present utility model and is not intended to limit the present utility model. Although the present utility model has been described in detail with reference to the foregoing embodiments, those skilled in the art can still modify the technical solutions described in the foregoing embodiments or make equivalent substitutions for some of the technical features. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present utility model should be included within the protection scope of the present utility model.

Claims

1. A fixture for testing the bonding strength of electronic packages, comprising a test stage (1), characterized in that: The test bench (1) is fixedly connected to a support frame (14) at the bottom, and a support plate (15) is fixedly connected to the inner side of the support frame (14). An adjustment component (16) is connected to the bottom of the support plate (15), and a clamping component (2) is connected to the top of the test bench (1). The clamping assembly (2) includes a mounting bracket (3), one end of which is fixedly connected to the bottom of the test bench (1). A cylinder (4) is fixedly connected inside the mounting bracket (3). The output end of the cylinder (4) passes through the mounting bracket (3) and is fixedly connected to a drive plate (5). Both ends of the drive plate (5) are fixedly connected to drive rods (6). A limit groove (7) is opened at the top of the test bench (1). One end of the drive rod (6) passes through the limit groove (7) and is fixedly connected to an active block (8). One end of the active block (8) is rotatably connected to an active plate (9). A connecting plate (10) is rotatably connected to the inner side of the active plate (9). One end of the connecting plate (10) is rotatably connected to a limit plate (11). One end of the limit plate (11) is fixedly connected to the top of the test bench (1). One end of the active plate (9) is fixedly connected to a pressure plate (12). A pressure block (13) is fixedly connected to the inner side of the pressure plate (12).

2. The fixture for testing the bonding strength of electronic packaging according to claim 1, characterized in that: The adjustment assembly (16) includes a base plate (17), a fixed frame (18) and a fixed plate (19) are fixedly connected to the top of the base plate (17), a worm gear (20) is rotatably connected inside the fixed frame (18), a throttle (21) is fixedly connected to one end of the worm gear (20) through the fixed frame (18), a worm wheel (22) is meshed with the top of the worm gear (20), a connecting rod (23) is fixedly connected to one end of the worm wheel (22), a fixed shaft (24) is fixedly connected to one end of the connecting rod (23) through the fixed plate (19), a fixed block (25) is fixedly sleeved on the outside of the fixed shaft (24), and one end of the fixed block (25) is fixedly connected to the bottom of the support plate (15).

3. The fixture for testing the bonding strength of electronic packaging according to claim 1, characterized in that: The bottom of the test bench (1) is fixedly connected to two sets of base pads (26).

4. A fixture for testing the bonding strength of electronic packaging according to claim 3, characterized in that: Both sets of base pads (26) are made of rubber.

5. A fixture for testing the bonding strength of electronic packaging according to claim 1, characterized in that: The pressure block (13) is made of silicone.

6. A fixture for testing the bonding strength of electronic packaging according to claim 1, characterized in that: The test bench (1) and the base plate (17) are parallel.

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