High-temperature-resistant circuit substrate

Abstract

The utility model, which relates to the technical field of the circuit substrate, discloses a high-temperature-resistant circuit substrate comprising a main body unit, a blocking unit arranged at the side part of the main body unit, and a cooling unit arranged at the top of the main body unit. Each blocking unit comprises a U-shaped plate installed on the side portion of the main body unit, a connecting groove formed in the top of the U-shaped plate, a connecting base installed at the bottom of the U-shaped plate and a connecting piece arranged in the connecting groove. According to the high-temperature-resistant circuit substrate provided by the utility model, the blocking unit and the cooling unit are arranged, so that the situation that circuit elements are touched and a circuit is connected due to overexertion in the installation process is avoided, and the installation applicability is improved.

Description

Technical Field

[0001] This utility model relates to the field of circuit board technology, and in particular to a high-temperature resistant circuit board. Background Technology

[0002] The substrate is the basic material for manufacturing PCBs. Generally, the substrate is a copper-clad laminate. In the manufacturing process of single-sided and double-sided PCBs, selective processing such as hole machining, chemical copper plating, electroplating, and etching are performed on the substrate material—the copper-clad laminate—to obtain the desired circuit pattern. Another type of PCB is the multilayer PCB, which also uses a thin copper-clad laminate as its base. Conductive pattern layers and prepregs are alternately laminated and bonded together in a single process to form interconnections between three or more conductive pattern layers. It has the functions of conductivity, insulation, and support.

[0003] A search revealed a high-temperature resistant flexible circuit board in Publication No. CN215871979U, comprising a substrate, a conductive layer disposed on top of the substrate, an adhesive layer disposed on top of the conductive layer, a high-temperature resistant protective layer disposed on top of the adhesive layer, and an insulating protective layer disposed on top of the high-temperature resistant protective layer; the upper surface of the adhesive layer is recessed with several horizontal grooves; this flexible circuit board can both adhere the high-temperature resistant layer to one side of the conductive layer through the adhesive layer, thereby improving the high-temperature resistance of the flexible circuit board, and create a sealed adhesive-free area on the adhesive layer by setting horizontal grooves, thereby improving the flexibility of the adhesive layer and reducing the adverse effect of the adhesive layer on the flexibility of the flexible circuit board.

[0004] While the above solutions improve the flexibility of the adhesive layer and reduce its adverse effects on the flexibility of the flexible circuit board, many circuit designs involve multi-layer mounting of the substrate circuit. However, the lack of separation between the upper and lower layers of the substrate means that even slight force during installation can damage the circuit components and connected circuits on the substrate. Therefore, we propose a high-temperature resistant circuit substrate. Utility Model Content

[0005] The main purpose of this utility model is to provide a high-temperature resistant circuit board. By setting up a barrier unit and a cooling unit, it solves the problem that in many circuit designs, the circuit board is installed in multiple layers, and there is no partition between the upper and lower layers of the board. During the installation process, even a little force will damage the circuit components and connected circuits on the board.

[0006] To achieve the above objectives, this utility model provides the following technical solution:

[0007] A high-temperature resistant circuit board includes a main body unit, a barrier unit disposed on the side of the main body unit, and a cooling unit disposed on the top of the main body unit.

[0008] The barrier unit includes an inverted plate installed on the side of the main unit, a connecting groove opened on the top of the inverted plate, a connecting seat installed on the bottom of the inverted plate, and a connector disposed in the connecting groove;

[0009] The cooling unit includes a first cooling plate and a second cooling plate installed on the top of the main unit, and a conductive plate installed on the top of the main unit for communication between the first cooling plate and the second cooling plate.

[0010] Preferably, the main body unit includes a copper foil conductive plate, a printed circuit board mounted on top of the copper foil conductive plate, and a base plate mounted on the bottom of the copper foil conductive plate.

[0011] Preferably, the main body unit further includes a heat dissipation cavity formed at the bottom of the base plate and a heat dissipation area formed at the bottom of the copper foil conductive plate.

[0012] Preferably, the connector includes a receiving groove formed on the side of the connecting groove, a movable through hole formed on the side wall of the receiving groove, a movable column movably disposed in the movable through hole, a locking plate installed at one end of the movable column located inside the movable through hole, a stretching plate installed at the other end of the movable column, and a connecting spring disposed between the connecting groove and the locking plate.

[0013] Preferably, one end of the connecting spring is fixedly connected to the side wall of the connecting groove, and the other end is fixedly connected to the locking plate.

[0014] Preferably, the connector further includes an engagement groove formed on the side wall of the connector seat.

[0015] Preferably, the cooling unit further includes an electronic component mounting point mounted on top of the printed circuit board.

[0016] Compared with the prior art, the present invention has the following beneficial effects:

[0017] In this invention, by using the barrier unit and cooling unit, when multiple layers of the circuit board need to be installed, the tension plate can be pulled to compress the locking plate and the spring, until the locking plate is completely housed in the receiving groove. At this time, the connecting seat of the upper circuit board can be placed into the connecting groove of the lower circuit board. Then, the force applied to the tension plate is removed, and under the elastic force of the spring, the locking plate returns to its original position and engages with the locking groove, thus forming a stable connection between the upper and lower layers of the circuit board and forming a partition layer. This avoids the occurrence of contact with circuit components and the connection of circuits due to excessive force during installation, thus improving the applicability of the installation. When the circuit board needs to work, the first and second cooling plates will start to cool and dissipate heat to the surface of the printed circuit board through the conductive plate. The bottom plate and the cavity form a heat dissipation cavity, and a heat dissipation area is provided in the cavity, which can greatly improve the heat dissipation effect and has good heat dissipation stability. Attached Figure Description

[0018] Figure 1 This is a three-dimensional structural diagram of the present invention;

[0019] Figure 2 This is a schematic diagram of the left-side structure of this utility model;

[0020] Figure 3 This utility model Figure 2 Schematic diagram of the cross-sectional structure at point AA;

[0021] Figure 4 This utility model Figure 2 Schematic diagram of the cross-sectional structure at point BB;

[0022] Figure 5 This is a schematic diagram of the main structure of this utility model.

[0023] In the picture:

[0024] 1. Main unit; 101. Printed circuit board; 102. Copper foil conductive plate; 103. Base plate; 104. Heat dissipation area;

[0025] 2. Barrier unit; 201. C-shaped plate; 202. Connecting groove; 203. Connecting seat; 204. Connecting piece; 2041. Moving column; 2042. Locking plate; 2043. Tensioning plate; 2044. Connecting spring; 2045. Locking groove;

[0026] 3. Cooling unit; 301. First cooling element; 302. Second cooling element; 303. Conducting element; 304. Electronic component mounting point. Detailed Implementation

[0027] To make the technical means, creative features, objectives and effects of this utility model easier to understand, the present utility model will be further described below in conjunction with specific embodiments. Example 1

[0028] like Figure 1 , Figure 2 , Figure 4 as well as Figure 5 As shown, a high-temperature resistant circuit board includes a main body unit 1, a barrier unit 2 disposed on the side of the main body unit 1, and a cooling unit 3 disposed on the top of the main body unit 1.

[0029] like Figure 1 As shown, the barrier unit 2 includes an inverted plate 201 installed on the side of the main unit 1, a connecting groove 202 opened on the top of the inverted plate 201, a connecting seat 203 installed on the bottom of the inverted plate 201, and a connector 204 disposed in the connecting groove 202. The cooperation between the connecting seat 203 and the connecting groove 202 enables convenient installation between the upper and lower circuit boards.

[0030] like Figure 4 As shown, the cooling unit 3 includes a first cooling chip 301 and a second cooling chip 302 installed on the top of the main unit 1, and a conductive plate 303 installed on the top of the main unit 1 for communicating between the first cooling chip 301 and the second cooling chip 302. The conductive plate 303 can dissipate the cold air generated between the first cooling chip 301 and the second cooling chip 302.

[0031] like Figure 3 As shown, the main unit 1 includes a copper foil conductive plate 102, a printed circuit board 101 mounted on the top of the copper foil conductive plate 102, and a base plate 103 mounted on the bottom of the copper foil conductive plate 102. The base plate 103 forms a heat dissipation cavity with the cavity to facilitate heat dissipation.

[0032] like Figure 3 As shown, the main unit 1 also includes a heat dissipation cavity formed at the bottom of the base plate 103 and a heat dissipation area 104 formed at the bottom of the copper foil conductive plate 102. The heat dissipation area 104 is a heat dissipation groove formed by laser engraving. The heat dissipation groove is used for heat dissipation, which has good heat dissipation effect and high heat dissipation efficiency.

[0033] like Figure 4As shown, the connector 204 includes a storage groove formed on the side of the connecting groove 202, a movable through hole formed on the side wall of the storage groove, a movable column 2041 movably disposed in the movable through hole, a locking plate 2042 installed at one end of the movable column 2041 located inside the movable through hole, a tension plate 2043 installed at the other end of the movable column 2041, and a connecting spring 2044 disposed between the connecting groove 202 and the locking plate 2042. By pulling the tension plate 2043, the movable column 2041 drives the locking plate 2042 to move.

[0034] like Figure 4 As shown, one end of the connecting spring 2044 is fixedly connected to the side wall of the connecting groove 202, and the other end is fixedly connected to the locking plate 2042. The setting of the connecting spring 2044 facilitates the reset and movement of the locking plate 2042.

[0035] like Figure 2 As shown, the connector 204 also includes a locking groove 2045 formed on the side wall of the connector 203. The locking groove 2045 and the locking plate 2042 are configured to facilitate the connection between the connector 203 and the connecting groove 202.

[0036] When multiple layers of the circuit board need to be installed, the tension plate 2043 can be pulled to cause the moving column 2041 to drive the locking plate 2042 to be compressed by the spring 2044 until the locking plate 2042 is completely housed in the receiving groove. At this time, the connecting seat 203 of the upper circuit board can be placed into the connecting groove 202 of the lower circuit board. Then, the force applied to the tension plate 2043 is removed. Under the elastic force of the spring 2044, the locking plate 2042 returns to its original position and engages with the locking groove 2045, thereby forming a stable connection between the upper and lower layers of the circuit board and forming a partition layer. This avoids the occurrence of contact with circuit components and connection of circuits due to excessive force during installation, thus improving the applicability of the installation. Example 2

[0037] like Figure 1 , Figure 2 , Figure 3 , Figure 4 as well as Figure 5 As shown, a high-temperature resistant circuit board includes a main body unit 1, a barrier unit 2 disposed on the side of the main body unit 1, and a cooling unit 3 disposed on the top of the main body unit 1.

[0038] like Figure 1As shown, the barrier unit 2 includes an inverted plate 201 installed on the side of the main unit 1, a connecting groove 202 opened on the top of the inverted plate 201, a connecting seat 203 installed on the bottom of the inverted plate 201, and a connector 204 disposed in the connecting groove 202. The cooperation between the connecting seat 203 and the connecting groove 202 enables convenient installation between the upper and lower circuit boards.

[0039] like Figure 4 As shown, the cooling unit 3 includes a first cooling chip 301 and a second cooling chip 302 installed on the top of the main unit 1, and a conductive plate 303 installed on the top of the main unit 1 for communicating between the first cooling chip 301 and the second cooling chip 302. The conductive plate 303 can dissipate the cold air generated between the first cooling chip 301 and the second cooling chip 302.

[0040] like Figure 3 As shown, the main unit 1 includes a copper foil conductive plate 102, a printed circuit board 101 mounted on the top of the copper foil conductive plate 102, and a base plate 103 mounted on the bottom of the copper foil conductive plate 102. The base plate 103 forms a heat dissipation cavity with the cavity to facilitate heat dissipation.

[0041] like Figure 3 As shown, the main unit 1 also includes a heat dissipation cavity formed at the bottom of the base plate 103 and a heat dissipation area 104 formed at the bottom of the copper foil conductive plate 102. The heat dissipation area 104 is a heat dissipation groove formed by laser engraving. The heat dissipation groove is used for heat dissipation, which has good heat dissipation effect and high heat dissipation efficiency.

[0042] like Figure 4 As shown, the connector 204 includes a storage groove formed on the side of the connecting groove 202, a movable through hole formed on the side wall of the storage groove, a movable column 2041 movably disposed in the movable through hole, a locking plate 2042 installed at one end of the movable column 2041 located inside the movable through hole, a tension plate 2043 installed at the other end of the movable column 2041, and a connecting spring 2044 disposed between the connecting groove 202 and the locking plate 2042. By pulling the tension plate 2043, the movable column 2041 drives the locking plate 2042 to move.

[0043] like Figure 4 As shown, one end of the connecting spring 2044 is fixedly connected to the side wall of the connecting groove 202, and the other end is fixedly connected to the locking plate 2042. The setting of the connecting spring 2044 facilitates the reset and movement of the locking plate 2042.

[0044] like Figure 2 As shown, the connector 204 also includes a locking groove 2045 formed on the side wall of the connector 203. The locking groove 2045 and the locking plate 2042 are configured to facilitate the connection between the connector 203 and the connecting groove 202.

[0045] like Figure 4 and Figure 5 As shown, the cooling unit 3 also includes an electronic component mounting point 304 mounted on the top of the printed circuit board 101. The electronic component mounting point 304 is configured to mount external electronic components.

[0046] When the circuit board needs to work, the first cooling chip 301 and the second cooling chip 302 will start to cool, and dissipate heat to the surface of the printed circuit board 101 through the conductive piece 303; the base plate 103 forms a heat dissipation cavity with the cavity, and a heat dissipation area 104 is provided in the cavity, which can greatly improve the heat dissipation effect and have good heat dissipation stability.

[0047] The foregoing has shown and described the basic principles, main features, and advantages of this utility model. Those skilled in the art should understand that this utility model is not limited to the above embodiments. The embodiments and descriptions in the specification are merely illustrative of the principles of this utility model. Various changes and modifications can be made to this utility model without departing from its spirit and scope, and all such changes and modifications fall within the scope of the claims. The scope of protection of this utility model is defined by the appended claims and their equivalents.

Claims

1. A high-temperature resistant circuit board, comprising a main unit (1), characterized in that, It also includes a barrier unit (2) disposed on the side of the main body unit (1) and a cooling unit (3) disposed on the top of the main body unit (1). The barrier unit (2) includes an inverted plate (201) installed on the side of the main unit (1), a connecting groove (202) opened on the top of the inverted plate (201), a connecting seat (203) installed on the bottom of the inverted plate (201), and a connector (204) disposed in the connecting groove (202). The cooling unit (3) includes a first cooling chip (301) and a second cooling chip (302) installed on the top of the main unit (1), and a conductive piece (303) installed on the top of the main unit (1) for communication between the first cooling chip (301) and the second cooling chip (302).

2. The high-temperature resistant circuit board according to claim 1, characterized in that: The main unit (1) includes a copper foil conductive plate (102), a printed circuit board (101) mounted on top of the copper foil conductive plate (102), and a base plate (103) mounted on the bottom of the copper foil conductive plate (102).

3. The high-temperature resistant circuit board according to claim 2, characterized in that: The main unit (1) also includes a heat dissipation cavity formed at the bottom of the base plate (103) and a heat dissipation area (104) formed at the bottom of the copper foil conductive plate (102).

4. The high-temperature resistant circuit board according to claim 3, characterized in that: The connector (204) includes a storage groove opened on the side of the connecting groove (202), a movable through hole opened on the side wall of the storage groove, a movable column (2041) movably disposed in the movable through hole, a locking plate (2042) installed at one end of the movable column (2041) located inside the movable through hole, a tension plate (2043) installed at the other end of the movable column (2041), and a connecting spring (2044) disposed between the connecting groove (202) and the locking plate (2042).

5. A high-temperature resistant circuit board according to claim 4, characterized in that: One end of the connecting spring (2044) is fixedly connected to the side wall of the connecting groove (202), and the other end is fixedly connected to the locking plate (2042).

6. A high-temperature resistant circuit board according to claim 4, characterized in that: The connector (204) also includes a locking groove (2045) formed on the side wall of the connector (203).

7. A high-temperature resistant circuit board according to claim 2, characterized in that: The cooling unit (3) also includes an electronic component mounting point (304) mounted on top of the printed circuit board (101).

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