Infrared receiving head

Abstract

The utility model discloses an infrared receiving head which comprises a substrate, a plurality of supporting pieces, a plurality of first bonding pads and a plurality of second bonding pads, and a circuit layer is arranged on the upper surface of the substrate; the supporting pieces are arranged on any side of the base plate in a protruding mode, and each supporting piece is provided with a binding face. A first bonding pad is arranged between every two adjacent supporting pieces, each first bonding pad is provided with a concave position, and each first bonding pad is electrically connected with the circuit layer. The plurality of second bonding pads are arranged on the lower surface of the substrate at intervals, and each second bonding pad is electrically connected with one first bonding pad. The substrate is laterally attached to the external PCB through the plurality of first bonding pads, and the substrate is positively attached to the external PCB through the plurality of second bonding pads, so that different use requirements are met. During welding, the silver colloid is filled in the concave position, so that the contact surface of the first bonding pad and the silver colloid is larger, the infrared receiving head and an external PCB are welded more firmly, each supporting piece is attached to the PCB, and the infrared receiving head and the PCB are attached more tightly while supporting is provided for the substrate.

Description

Technical Field

[0001] This utility model relates to the field of infrared receiving module technology, specifically to an infrared receiving head. Background Technology

[0002] An infrared receiver head is a device that can receive infrared signals and is used in various infrared remote control and infrared data transmission applications. It is generally divided into two main categories on the market: plug-in infrared receiver heads and surface-mount infrared receiver heads.

[0003] Traditional plug-in infrared receivers have a large ball head, allowing for long remote control distances and wide remote control angles. However, plug-in products are bulky and require manual or machine bending and insertion onto the PCB board during use. They also require manual soldering or wave soldering onto the PCB board, resulting in low efficiency, high cost, and significant quality risks, leading to complex processes and high processing costs.

[0004] Traditional surface-mount infrared receivers can only be mounted top-mounted or side-mounted, offering limited installation options and failing to meet diverse needs. To address this, existing technology employs a pin bending process. After electrically connecting the pins to the chip, a bending die is used to bend the pins, positioning them on the sidewalls and bottom of the mounting bracket, thus satisfying both side-mounting and top-mounting requirements. However, developing bending dies is expensive, and using a bending process can easily crush the wires, resulting in low production efficiency. Furthermore, after the pins are bent, full-coverage injection molding is performed, exposing some pins for soldering. However, since only a portion of the pins are exposed on the side, the contact area is small when the infrared receiver is mounted top-mounted onto an external PCB, making it prone to detachment. Utility Model Content

[0005] To address the shortcomings of existing technologies, an infrared receiver head is provided.

[0006] To achieve the above objectives, this utility model provides an infrared receiver head, including a substrate, multiple support members, multiple first pads, and multiple second pads. A circuit layer is provided on the upper surface of the substrate. Multiple support members protrude from any side of the substrate, and each support member has a bonding surface. A first pad is provided between two adjacent support members, and each first pad has a recessed position. Each first pad is electrically connected to the circuit layer. Multiple second pads are spaced apart on the lower surface of the substrate, and each second pad is electrically connected to a first pad.

[0007] According to one embodiment of the present invention, the circuit layer includes a first connection area, a second connection area, and a third connection area that are spaced apart; the first connection area, the second connection area, and the third connection area are respectively electrically connected to a first pad.

[0008] According to one embodiment of the present invention, a first chip and a second chip are provided; the first chip and the second chip are disposed in a first connection area, the second chip has an IN pin, an OUT pin, a VCC pin and a GND pin, the IN pins of the first chip and the second chip are connected, the GND pin of the second chip is electrically connected to the first connection area, the OUT pin of the second chip is electrically connected to the second connection area, and the VCC pin of the second chip is electrically connected to a third connection area.

[0009] According to one embodiment of the present invention, it further includes a shielding cover, which is supported on the side of the substrate where the circuit layer is provided. The shielding cover covers the first connection area and has a receiving window that corresponds to the first chip.

[0010] According to one embodiment of the present invention, it further includes a molding compound, which is disposed on the surface of the substrate and covers the first connection area, the second connection area and the third connection area.

[0011] According to one embodiment of the present invention, it further includes a lens, which is connected to the surface of the molding compound and is located directly above the first chip.

[0012] According to one embodiment of the present invention, the lens and the encapsulating body are made of black epoxy resin material.

[0013] According to one embodiment of the present invention, the first chip is a photodiode.

[0014] According to one embodiment of the present invention, the second chip is an IC chip.

[0015] According to one embodiment of the present invention, it further includes at least one third pad, which is disposed on the lower surface of the substrate, and each third pad is electrically connected to the first connection area.

[0016] The beneficial effects of this invention are that by setting multiple first pads on one side of the substrate and multiple second pads on the bottom of the substrate, the infrared receiver head can be attached to an external PCB board either directly or sideways, meeting different usage requirements. Since each first pad has a recessed area, silver paste fills the recessed area during soldering. Compared to planar pads, the recessed area provides a larger contact surface between the first pad and the silver paste, resulting in a more secure soldering between the infrared receiver head and the external PCB board. Furthermore, when the infrared receiver head is sideways attached to the external PCB board, each support member adheres to the PCB board, providing support for the substrate while ensuring a tighter fit between the infrared receiver head and the PCB board. Attached Figure Description

[0017] The accompanying drawings, which are included to provide a further understanding of this application and form part of this application, illustrate exemplary embodiments and are used to explain this application, but do not constitute an undue limitation of this application. In the drawings:

[0018] Figure 1 This is a front view of the substrate in the embodiment;

[0019] Figure 2 This is a schematic diagram of the bottom of the substrate in the embodiment;

[0020] Figure 3 This is a schematic diagram showing the connection between the first chip and the second chip and the substrate in the embodiment.

[0021] Figure 4 This is a schematic diagram of the shielding cover in the embodiment;

[0022] Figure 5 This is a schematic diagram showing the connection between the shielding cover and the substrate in the embodiment;

[0023] Figure 6 This is a schematic diagram of the infrared receiver head in the embodiment.

[0024] Explanation of reference numerals in the attached figures

[0025] 1-Substrate; 11-Circuit layer; 111-First connection area; 112-Second connection area; 113-Third connection area; 2-Support member; 21-Mating surface; 3-First pad; 30-Recessed area; 4-Second pad; 5-First chip; 6-Second chip; 7-Shielding cover; 71-Receiving window; 8-Molded body; 9-Lens; 10-Third pad. Detailed Implementation

[0026] The following drawings will disclose several embodiments of this utility model. For clarity, many practical details will be described in the following description. However, it should be understood that these practical details should not be used to limit this utility model. That is, in some embodiments of this utility model, these practical details are not essential. In addition, for the sake of simplicity, some conventional structures and components will be shown in the drawings in a simple schematic manner.

[0027] Furthermore, in this utility model, the use of terms such as "first" and "second" is for descriptive purposes only and does not specifically refer to any order or sequence, nor is it intended to limit the utility model. They are merely used to distinguish components or operations described with the same technical terms and should not be construed as indicating or implying their relative importance or implicitly specifying the number of indicated technical features. Therefore, a feature defined with "first" or "second" may explicitly or implicitly include at least one of those features. Additionally, the technical solutions of various embodiments can be combined with each other, but only if they are feasible for those skilled in the art. If a combination of technical solutions is contradictory or impossible to implement, it should be considered that such a combination of technical solutions does not exist and is not within the scope of protection claimed by this utility model.

[0028] Please refer to Figure 1 , Figure 1 This is a front view of the substrate. Figure 2 This is a schematic diagram of the bottom of the substrate. This embodiment provides an infrared receiver head, which includes a substrate 1, multiple support members 2, multiple first pads 3, and multiple second pads 4. A circuit layer 11 is provided on the upper surface of the substrate 1. Multiple support members 2 protrude from either side of the substrate 1, each support member 2 having a bonding surface 21. A first pad 3 is provided between two adjacent support members 2, and each first pad 3 has a recessed position 30. Each first pad 3 is electrically connected to the circuit layer 11. The multiple first pads 3 are disposed on one side of the substrate 1 and are used for side-mounting the infrared receiver head onto an external PCB board. Multiple second pads 4 are spaced apart on the lower surface of the substrate 1, and each second pad 4 is electrically connected to a first pad 3.

[0029] When the infrared receiver head is side-mounted onto an external PCB board, one side of the substrate 1 with multiple support members 2 is connected to the PCB board. The contact surface 21 of each support member 2 abuts against the PCB board, and each first pad 3 is soldered to the PCB board. When the infrared receiver head is directly mounted onto the external PCB board, multiple second pads 4 are soldered to the external PCB board. Thus, by providing multiple first pads 3 on one side of the substrate 1 and multiple second pads 4 on the bottom of the substrate 1, the infrared receiver head can be directly mounted or side-mounted onto the external PCB board, meeting different usage requirements.

[0030] In this example, four support members 2 are provided, spaced apart on one side of the substrate 1. A first solder pad 3 is provided between two adjacent support members 2, meaning there are three first solder pads 3 in this example. When the infrared receiver head is attached to an external PCB board, the side of the substrate 1 with the four first support members 2 is connected to the external PCB board. The contact surface 21 of each support member 2 abuts against the PCB board, and each first solder pad 3 is soldered to the external PCB board using silver paste. Since each first solder pad 3 has a recess 30, the silver paste fills the recess 30 during soldering. Compared to planar solder pads, the recess 30 provides a larger contact area between the first solder pad 3 and the silver paste, resulting in a stronger solder joint between the infrared receiver head and the external PCB board. Furthermore, when the infrared receiver head is attached to the external PCB board, each support member 2 adheres to the PCB board, providing support for the substrate 1 while ensuring a tighter fit between the infrared receiver head and the PCB board.

[0031] In this embodiment, both the first pad 3 and the second pad 4 are conductive metal layers. The first pad 3 and the second pad 4 are formed by coating the substrate 1 with a conductive metal coating, and the first pad 3 and the second pad 4 are connected, thus achieving electrical connection between them. This method eliminates the need for pin bending to achieve compatible front-mount and side-mount connections for the infrared receiver, avoiding the collapse of the internal wiring during pin bending and eliminating the need for additional bending dies, effectively reducing the manufacturing cost of the infrared receiver.

[0032] Furthermore, the first circuit layer 11 includes a first connection area 111, a second connection area 112, and a third connection area 113, which are electrically connected to a first pad 3 respectively.

[0033] Please refer to Figure 3 , Figure 3This is a schematic diagram showing the connection between the first chip and the second chip and the substrate. The infrared receiver head also includes a first chip 5 and a second chip 6. The first chip 5 is used to sense infrared light, and the second chip 6 is electrically connected to the first chip 5. The second chip 6 is used to receive the signal from the first chip 5 and process the signal. Both the first chip 5 and the second chip 6 are disposed within the first connection area 111. Specifically, the second chip 6 has an IN pin, an OUT pin, a VCC pin, and a GND pin. The IN pin of the second chip 6 is electrically connected to the first connection area 111, the GND pin of the second chip 6 is electrically connected to the first connection area 111, the OUT pin of the second chip 6 is electrically connected to the second connection area 112, and the VCC pin of the second chip 6 is electrically connected to the third connection area 113. Since the first connection area 111, the second connection area 112, and the third connection area 113 are each connected to a first pad 3, the OUT pin, VCC pin, and GND pin of the second chip 6 are each electrically connected to a first pad 3. Furthermore, each first pad 3 is electrically connected to a second pad 4, so that the OUT pin, VCC pin, and GND pin of the second chip 6 are each electrically connected to a second pad 4. Therefore, in the actual application of the infrared receiver, the OUT pin, VCC pin, and GND pin of the second chip 6 can be electrically connected to an external PCB board through the first pad 3 or the second pad 4.

[0034] In this embodiment, the first chip 5 is a photodiode, and the second chip 6 is an IC chip. The IN pin of the second chip 6 is connected to the first chip 5 via a wire, and the OUT pin, VCC pin, and GND pin of the second chip 6 are respectively electrically connected to a first pad 3 via wires.

[0035] Please refer to Figure 1 Furthermore, the infrared receiver head also includes at least one third pad 10, which is disposed on the lower surface of the substrate 1, and each third pad 10 is electrically connected to the first connection area 111. In this embodiment, two third pads 10 are disposed at the bottom of the substrate 1, the two third pads 10 are spaced apart, and the third pads 10 are formed by coating the surface of the substrate 1 with a metal conductive coating. The third pads 10 are connected to the first connection area 111, so that each third pad 10 is electrically connected to the first connection area 111.

[0036] When the infrared receiver head is attached to the external PCB board, multiple second pads 4 are soldered to the PCB board respectively, and the third pad 10 is soldered to the PCB board at the same time. This increases the number of soldering points between the infrared receiver head and the PCB board, effectively improving the tightness of the connection between the infrared receiver head and the PCB board.

[0037] Please refer to Figure 4 and Figure 5 , Figure 4 This is a schematic diagram of the shielding cover. Figure 5This is a schematic diagram showing the connection between the shielding cover and the substrate. Furthermore, the infrared receiver head also includes a shielding cover 7, which is supported on the side of the substrate where the circuit layer is located, and is positioned above the first connection area 111. The shielding cover 7 is used to shield electromagnetic waves, preventing them from interfering with the second chip 6. The shielding cover 7 has a receiving window 71, which corresponds to the first chip 5, facilitating the first chip 5 to receive infrared light signals.

[0038] Please refer to Figure 6 , Figure 6 This is a schematic diagram of an infrared receiver head. Furthermore, the infrared receiver head also includes a molding compound 8. The molding compound 8 is disposed on the surface of the substrate 1, and the molding compound 8 covers the first connection area 111, the second connection area 112, and the third connection area 113.

[0039] In this embodiment, the encapsulated body 8 is formed by injection molding. After the first chip 5 and the second chip 6 are connected to the circuit layer 11 of the substrate 1, the shielding cover 7 is placed over the first connection area 111. Then, the connected substrate 1, the first chip 5, the second chip 6 and the shielding cover 7 are placed into the mold, and plastic is injected into the mold. After high-temperature baking and curing, the encapsulated body 8 is formed, so that the first chip 5, the second chip 6 and the shielding cover 7 are all encapsulated in the encapsulated body 8.

[0040] In addition, the infrared receiver head also includes a lens 9, which is disposed on the surface of the molding compound 8 and positioned above the first chip 5. The lens 9 is used to increase light transmittance. In use, externally emitted infrared light passes through the lens 9 and illuminates the first chip 5. The infrared light's refraction angle is increased by the lens 9, thereby widening the receiving range of the infrared receiver head. In this embodiment, the lens 9 and the molding compound 8 are integrally formed using an injection molding process.

[0041] Furthermore, the lens 9 and the molding compound 8 are made of black epoxy resin. When the infrared receiver head receives infrared light, the black epoxy resin can filter out other light rays, preventing other wavelengths of light from affecting the infrared receiver head.

[0042] The above description is merely an embodiment of this utility model and is not intended to limit the scope of this utility model. Various modifications and variations can be made to this utility model by those skilled in the art. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principle of this utility model should be included within the scope of the claims of this utility model.

Claims

1. An infrared receiver head, characterized in that, include: The substrate (1) comprises a plurality of support members (2), a plurality of first pads (3) and a plurality of second pads (4). A circuit layer (11) is provided on the upper surface of the substrate (1). The plurality of support members (2) protrude from any side of the substrate (1), and each support member (2) has a bonding surface (21). A first pad (3) is provided between two adjacent support members (2), and each first pad (3) has a recess (30). Each first pad (3) is electrically connected to the circuit layer (11). A plurality of second pads (4) are spaced apart on the lower surface of the substrate (1), and each second pad (4) is electrically connected to a first pad (3).

2. The infrared receiver head according to claim 1, characterized in that, The circuit layer (11) includes a first connection area (111), a second connection area (112) and a third connection area (113) spaced apart; the first connection area (111), the second connection area (112) and the third connection area (113) are electrically connected to a first pad (3) respectively.

3. The infrared receiver head according to claim 2, characterized in that, It also includes a first chip (5) and a second chip (6); the first chip (5) and the second chip (6) are located in the first connection area (111), the second chip (6) has an IN pin, an OUT pin, a VCC pin and a GND pin, the IN pin of the first chip (5) and the second chip (6) are connected, the GND pin of the second chip (6) is electrically connected to the first connection area (111); the OUT pin of the second chip (6) is electrically connected to the second connection area (112); the VCC pin of the second chip (6) is electrically connected to the third connection area (113).

4. The infrared receiver head according to claim 3, characterized in that, It also includes a shielding cover (7), which is supported on the side of the substrate (1) where the circuit layer (11) is provided. The shielding cover (7) covers the first connection area (111). The shielding cover (7) has a receiving window (71) which corresponds to the first chip (5).

5. The infrared receiver head according to claim 3, characterized in that, It also includes a molding compound (8), which is disposed on the surface of the substrate (1) and covers the first connection area (111), the second connection area (112) and the third connection area (113).

6. The infrared receiver head according to claim 5, characterized in that, It also includes a lens (9) which is attached to the surface of the encapsulation (8) and is located directly above the first chip (5).

7. The infrared receiver head according to claim 6, characterized in that, The lens (9) and the encapsulation body (8) are made of black epoxy resin material.

8. The infrared receiver head according to claim 3, characterized in that, The first chip (5) is a photodiode.

9. The infrared receiver head according to claim 3, characterized in that, The second chip (6) is an IC chip.

10. The infrared receiver head according to claim 2 further includes at least one third pad (10), the third pad (10) being disposed on the lower surface of the substrate (1), and each of the third pads (10) being electrically connected to the first connection area (111).

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