Fixed multilayer circuit board
By introducing a combined structure of mounting frame, cooler and heat spreader into a fixed multilayer circuit board, the problem of reduced heat conduction efficiency between copper foil and inner copper layer is solved, achieving a more efficient heat dissipation effect and improving the reliability and stability of the circuit board.
Patent Information
- Application Number
- CN202520551625.0
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-03-27
- Publication Date
- 2025-12-09
- Estimated Expiration
- 2035-03-27
AI Technical Summary
When existing fixed multilayer circuit boards operate under high loads, the thermal conductivity of the copper foil and inner copper layers decreases, resulting in insufficient heat dissipation. In particular, at high temperatures, the thermal conductivity of copper weakens, making it unable to effectively conduct a large amount of heat.
It adopts a combined structure of mounting frame, cooler body, connecting hose, cooling pipe body and heat spreader body. It removes heat through condensation circulation, improves heat dissipation efficiency, and makes the temperature distribution on the circuit board surface more uniform through heat spreader.
It achieves more efficient heat dissipation, avoids local overheating, improves the reliability and stability of the circuit board, and meets the heat dissipation requirements of high-power operation.
Smart Images

Figure CN223652538U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to the field of multilayer circuit boards, and more particularly to fixed multilayer circuit boards. Background Technology
[0002] Fixed multilayer circuit boards are a product of the development of electronic technology towards higher speed, more functions, larger capacity, and smaller size. As the functions of electronic products continue to increase and the integration of chips becomes higher, the design requirements for circuit boards are also increasing. Multilayer printed circuits have emerged to meet this need, as they can achieve more complex circuit layouts and higher circuit density within a limited space.
[0003] In existing technologies, the heat dissipation method of fixed multilayer circuit boards using copper foil to conduct heat between inner copper layers is a common heat dissipation method. However, this method does have some problems in practical applications. Although copper has good thermal conductivity, in the structure of multilayer circuit boards, the connection between copper foil and inner copper layers is not an ideal heat conduction channel. The thermal conductivity of copper itself will decrease to a certain extent at high temperatures. When electronic components on the circuit board are under high load for a long time and generate a lot of heat, the heat conduction efficiency between copper foil and inner copper layers will gradually decrease as the temperature rises. For example, in some high-power electronic devices, the operating temperature of the circuit board may reach 80-100℃. At this time, the thermal conductivity of copper will be weakened compared to room temperature. Factors such as the thickness and purity of copper foil will also affect heat conduction. Thinner copper foil may not be able to withstand the rapid conduction of a large amount of heat, while copper with insufficient purity contains impurities, which will interfere with the heat conduction path, causing heat to scatter during conduction and thus reducing heat dissipation efficiency. Therefore, it is necessary to improve the fixed multilayer circuit board to solve the above problems. Utility Model Content
[0004] To overcome the problem of copper materials in transmissions being unable to withstand the rapid conduction of large amounts of heat in certain situations, it is necessary to address the issue of heat dissipation.
[0005] The technical solution of this utility model is as follows: a fixed multilayer circuit board, including a fixed outer shell, a limiting frame and a limiting mechanism. A support rod for supporting the fixed outer shell is fixedly connected to the bottom of the fixed outer shell. A mounting base for supporting the support rod is fixedly connected to the bottom of the support rod. A limiting mechanism for limiting the mounting frame is provided inside the fixed outer shell. A limiting frame is fixedly connected to the inner side of the fixed outer shell. A mounting frame is slidably connected inside the limiting frame. A cooler body is provided inside the mounting base. A connecting hose is provided between the cooler body and the mounting frame. A cooling pipe body is provided inside the mounting frame. A temperature distribution plate body is provided inside the mounting frame. A circuit board body is provided inside the mounting frame.
[0006] Preferably, a push button is slidably connected inside the fixed housing, a fixed plate is fixedly connected to the inside of the push button, a first spring is fixedly connected between the fixed plate and the fixed housing, a connecting rod is fixedly connected to the inside of the fixed plate, a first fixed rod is fixedly connected inside the connecting rod, a sliding block is slidably connected inside the fixed housing, the first fixed rod is slidably connected inside the sliding block, a snap-fit block is fixedly connected to the inside of the sliding block, the snap-fit block is snap-fitted inside the support rod, and a second spring is fixedly connected between the sliding block and the fixed housing.
[0007] Preferably, the support rod has a slot at the relative position of the locking block, and the locking block is locked into the inside of the slot.
[0008] Preferably, the fixed housing has a groove at the relative position of the sliding block, and the sliding block is slidably connected inside the groove.
[0009] Preferably, the sliding block has a groove at the relative position of the first fixed rod, and the first fixed rod is slidably connected inside the groove. The groove limits the sliding of the first fixed rod and prevents the first fixed rod from separating from the sliding block.
[0010] Preferably, the limiting mechanism includes a fixing buckle, which is fixedly connected to the front of the fixed housing. A second fixing rod is fixedly connected to the inner side of the fixing buckle. A rotating block is rotatably connected to the outer side of the second fixing rod. A threaded rod is threadedly connected to the inner side of the mounting frame. A limiting block is fixedly connected to the outer side of the threaded rod. A knob is fixedly connected to the outer side of the limiting block.
[0011] Preferably, the mounting frame has a matching threaded groove at the relative position of the threaded rod, and the threaded rod is threaded into the inside of the threaded groove.
[0012] The beneficial effects of this utility model are as follows: By adding an installation frame, a cooler body, a connecting hose, a cooler pipe body, and a heat spreader body, heat can be removed more effectively than the traditional copper wire heat conduction and condensation cycle, achieving higher heat dissipation efficiency and better meeting the heat dissipation requirements of the circuit board during high-power operation. The heat spreader can also make the surface temperature distribution of the circuit board more uniform, avoiding local overheating and improving the overall reliability and stability of the circuit board. This avoids the problem that copper materials used for heat dissipation may not be able to withstand the rapid conduction of large amounts of heat in some situations. Attached Figure Description
[0013] Figure 1 This is a three-dimensional structural diagram of the present invention;
[0014] Figure 2 This is a cross-sectional view of the fixed outer shell and mounting base of this utility model;
[0015] Figure 3This is an exploded structural diagram of the limiting frame and its connected components of this utility model;
[0016] Figure 4 This is a schematic diagram of the push button and its connected components of this utility model;
[0017] Figure 5 This is an exploded structural diagram of the sliding block and its connected components of this utility model;
[0018] Figure 6 This is a schematic diagram of the limiting mechanism of this utility model.
[0019] Explanation of reference numerals in the attached drawings: 1. Fixed outer casing; 4. Support rod; 5. Mounting base; 21. Limiting frame; 22. Mounting frame; 23. Refrigerator body; 24. Connecting hose; 25. Refrigeration pipe body; 26. Heat spreader plate body; 27. Circuit board body; 28. Press button; 29. Fixing plate; 210. First spring; 211. Connecting rod; 212. First fixing rod; 213. Sliding block; 214. Snap-fit block; 215. Second spring; 31. Fixing buckle; 32. Second fixing rod; 33. Rotating block; 34. Threaded rod; 35. Limiting block; 36. Button. Detailed Implementation
[0020] The present invention will be further described below with reference to the accompanying drawings and embodiments.
[0021] Please see Figure 1 - Figure 6This utility model provides an embodiment of a fixed multilayer circuit board, including a fixed outer shell 1, a limiting frame 21, and a limiting mechanism. A support rod 4 is fixedly connected to the bottom of the fixed outer shell 1 to support the fixed outer shell 1. A mounting base 5 is fixedly connected to the bottom of the support rod 4 to support the support rod 4. A limiting mechanism is provided inside the fixed outer shell 1 to limit the mounting frame 22. The limiting frame 21 is fixedly connected to the inner side of the fixed outer shell 1. The mounting frame 22 is slidably connected inside the limiting frame 21. A cooler body 23 is provided inside the mounting base 5. A connecting hose 24 is provided between the cooler body 23 and the mounting frame 22. A cooling pipe body 25 is provided inside the mounting frame 22. A heat spreader plate body 26 is provided inside the mounting frame 22. The mounting frame 22 houses the circuit board body 27. During use, the heat exchange plate body 26 and the circuit board body 27 are installed inside the mounting frame 22, and the connecting hose 24 connects the cooler body 23 to the mounting frame 22. The mounting frame 22 is then slid to the inside of the limiting frame 21 for initial limiting, and then fully limited by the limiting mechanism. When the circuit board body 27 operates, the cooler body 23 and the cooling pipe body 25 work together to perform a condensation cycle, cooling the circuit board body 27. A push button 28 is slidably connected inside the fixed outer shell 1. A fixing plate 29 is fixedly connected to the inside of the push button 28. A first spring 210 is fixedly connected between the fixing plate 29 and the fixed outer shell 1. The inner side of the fixing plate 29 is fixed... A connecting rod 211 is connected, and a first fixing rod 212 is fixedly connected inside the connecting rod 211. A sliding block 213 is slidably connected inside the fixed housing 1. The first fixing rod 212 is slidably connected inside the sliding block 213. A locking block 214 is fixedly connected to the inner side of the sliding block 213. The locking block 214 is locked inside the support rod 4. A second spring 215 is fixedly connected between the sliding block 213 and the fixed housing 1. The second spring 215 provides a pushing force to the sliding block 213, making the locking block 214 more securely locked inside the support rod 4, thus restricting the position of the fixed housing 1. A slot is opened on the support rod 4 at the relative position of the locking block 214. The locking block 214 is locked inside the slot, thus locking the support rod 4. The installation and fixing of the multi-layer fixed housing 1 can be improved by increasing the number of circuit board bodies 27 according to actual needs, thereby increasing the overall applicability. The fixed housing 1 has a groove at the relative position of the sliding block 213. The sliding block 213 is slidably connected inside the groove. The groove restricts the sliding of the sliding block 213, ensuring that the sliding block 213 is linearly connected inside the fixed housing 1, preventing tilting of the sliding block 213 and affecting the engagement between the locking block 214 and the support rod 4. The sliding block 213 also has a groove at the relative position of the first fixed rod 212. The first fixed rod 212 is slidably connected inside the groove. The groove restricts the sliding of the first fixed rod 212, preventing it from disengaging from the sliding block 213, while simultaneously engaging with the first fixed rod 212 through the groove.The sliding block 213 is controlled to slide, thereby engaging or disengaging the locking block 214 from the support rod 4.
[0022] Please see Figure 1 , Figure 6 In this embodiment, the limiting mechanism includes a fixing buckle 31, which is fixedly connected to the front of the fixed housing 1. A second fixing rod 32 is fixedly connected to the inner side of the fixing buckle 31. A rotating block 33 is rotatably connected to the outer side of the second fixing rod 32. A threaded rod 34 is threadedly connected to the inner side of the mounting frame 22. A limiting block 35 is fixedly connected to the outer side of the threaded rod 34. A knob 36 is fixedly connected to the outer side of the limiting block 35. The position of the mounting frame 22 is limited by the rotating block 33, thereby preventing the mounting frame 22 from sliding out when the circuit board body 27 is working, which would affect the normal operation of the circuit board. The mounting frame 22 has a matching threaded groove at the relative position of the threaded rod 34. The threaded rod 34 is threadedly connected to the inside of the threaded groove. By rotating the threaded rod 34, the limiting block 35 is driven to rotate, thereby limiting the position of the rotating block 33 to prevent it from opening and causing the mounting frame 22 to slide.
[0023] During operation, a certain number of fixed housings 1 are installed as needed. The support rod 4 at the bottom of the upper fixed housing 1 is pressed into the slot of the lower fixed housing 1. After entering the slot, the support rod 4 contacts the chamfer of the engaging block 214, pushing the engaging block 214 and the sliding block 213 to slide to both sides. When the support rod 4 contacts the bottom of the slot, the slot of the support rod 4 corresponds to the position of the engaging block 214. The second spring 215 provides a pushing force to the sliding block 213, pushing the sliding block 213 and the engaging block 214 to slide inwards, thereby engaging the engaging block 214 with the support rod 4, completing the installation of multiple fixed housings 1. Assemble the components, then insert multiple mounting frames 22, along with the heat spreader body 26 and the circuit board body 27, into the limiting frame 21. Connect the connecting hoses 24 between the multiple mounting frames 22. Subsequently, the cooling cycle is achieved through the cooler body 23, connecting hoses 24, and cooling pipe body 25. The heat spreader body 26 cools the circuit board body 27. After inserting the mounting frame 22 into the limiting frame 21, rotate the rotating block 33 to contact the mounting frame 22. When the knob 36 is rotated, the threaded rod 34 rotates inside the mounting frame 22. The limiting block 35 then restricts the rotating block 33, thus completing the installation.
[0024] By adding the mounting frame 22, the cooler body 23, the connecting hose 24, the cooler pipe body 25, and the heat spreader plate body 26, the problem of the copper material in the transmission being unable to withstand the rapid conduction of a large amount of heat in some situations can be solved.
Claims
1. A fixed multilayer circuit board, comprising a fixed housing (1), characterized in that: It also includes a limiting frame (21) and a limiting mechanism. The bottom of the fixed shell (1) is fixedly connected to a support rod (4) that supports the fixed shell (1). The bottom of the support rod (4) is fixedly connected to a mounting base (5) that supports the support rod (4). The inside of the fixed shell (1) is provided with a limiting mechanism that limits the mounting frame (22). The inside of the fixed shell (1) is fixedly connected to the limiting frame (21). The inside of the limiting frame (21) is slidably connected to the mounting frame (22). The inside of the mounting base (5) is provided with a cooler body (23). A connecting hose (24) is provided between the cooler body (23) and the mounting frame (22). The inside of the mounting frame (22) is provided with a cooling pipe body (25). The inside of the mounting frame (22) is provided with a heat spreader plate body (26). The inside of the mounting frame (22) is provided with a circuit board body (27).
2. The fixed multilayer circuit board according to claim 1, characterized in that: A push button (28) is slidably connected inside the fixed housing (1). A fixed plate (29) is fixedly connected to the inside of the push button (28). A first spring (210) is fixedly connected between the fixed plate (29) and the fixed housing (1). A connecting rod (211) is fixedly connected to the inside of the fixed plate (29). A first fixed rod (212) is fixedly connected inside the connecting rod (211). A sliding block (213) is slidably connected inside the fixed housing (1). The first fixed rod (212) is slidably connected inside the sliding block (213). A snap-fit block (214) is fixedly connected to the inside of the sliding block (213). The snap-fit block (214) is snap-fit connected inside the support rod (4). A second spring (215) is fixedly connected between the sliding block (213) and the fixed housing (1).
3. The fixed multilayer circuit board according to claim 2, characterized in that: The support rod (4) has a slot at the relative position of the snap-fit block (214), and the snap-fit block (214) is snapped into the inside of the slot.
4. The fixed multilayer circuit board according to claim 2, characterized in that: The fixed outer shell (1) has a groove at the relative position of the sliding block (213), and the sliding block (213) is slidably connected inside the groove.
5. The fixed multilayer circuit board according to claim 2, characterized in that: The sliding block (213) has a groove at a position relative to the first fixed rod (212), and the first fixed rod (212) is slidably connected inside the groove.
6. The fixed multilayer circuit board according to claim 1, characterized in that: The limiting mechanism includes a fixing buckle (31), which is fixedly connected to the front of the fixed housing (1). A second fixing rod (32) is fixedly connected to the inner side of the fixing buckle (31). A rotating block (33) is rotatably connected to the outer side of the second fixing rod (32). A threaded rod (34) is threadedly connected to the inner side of the mounting frame (22). A limiting block (35) is fixedly connected to the outer side of the threaded rod (34). A knob (36) is fixedly connected to the outer side of the limiting block (35).
7. The fixed multilayer circuit board according to claim 6, characterized in that: The mounting frame (22) has a matching threaded groove at the relative position of the threaded rod (34), and the threaded rod (34) is threadedly connected inside the threaded groove.