Infrared receiving module and infrared receiver

Abstract

The utility model discloses an infrared receiving module which comprises a substrate and a shielding cover, a circuit layer is arranged on one side of the substrate, a bonding pad is arranged on the other side of the substrate, the shielding cover comprises a main shielding plate and at least two auxiliary shielding plates, the two auxiliary shielding plates are arranged on the two opposite sides of the main shielding plate respectively, and each auxiliary shielding plate comprises a main body and auxiliary feet. One end of the main body is connected with the main shielding plate, the auxiliary pin is arranged at one end of the main body far away from the main shielding plate, the auxiliary pin is convexly arranged outside the main body, and the main body and the auxiliary pin are attached to the circuit layer.

Description

Technical Field

[0001] This utility model relates to the field of infrared receiver technology, specifically to an infrared receiving module and an infrared receiver. Background Technology

[0002] Infrared receivers are the basic components for infrared remote control reception in the home appliance industry. They are very sensitive to surrounding electromagnetic interference, which requires that an electromagnetic shielding device be installed on the device.

[0003] Currently, there are two main shielding methods. One is to add a shielding metal shell to the outside of the infrared remote control receiver module, called external shielding. The disadvantages of external shielding are low production efficiency, high material consumption, and limited application scenarios. The other is to add a shielding metal cover to the photosensitive chip and signal amplification and processing chip inside the infrared remote control receiver module, called internal shielding. However, the existing internal shielding has the disadvantage that the contact area between the shielding cover and the substrate is small, resulting in an unstable structure of the infrared receiver module and poor shielding effect. Utility Model Content

[0004] To address the shortcomings of existing technologies, an infrared receiving module is provided.

[0005] To achieve the above objectives, this utility model provides an infrared receiving module, including a substrate and a shielding cover. One side of the substrate is provided with a circuit layer, and the other side of the substrate is provided with solder pads. The shielding cover includes a main shielding plate and at least two secondary shielding plates. The two secondary shielding plates are respectively disposed on opposite sides of the main shielding plate. Each secondary shielding plate includes a main body and an auxiliary foot. One end of the main body is connected to the main shielding plate, and the auxiliary foot is disposed at the end of the main body away from the main shielding plate and protrudes from the outside of the main body. The main body and the auxiliary foot are attached to the circuit layer.

[0006] According to one embodiment of the present invention, a first die-bonding region is formed in the circuit layer, and a receiving window is opened in the main shielding plate, the receiving window corresponding to the die-bonding region.

[0007] According to one embodiment of the present invention, the circuit layer further forms a second die-bonding region, a main shielding plate covers the front of the second die-bonding region, and at least two shielding plates shield at least two sides of the second die-bonding region.

[0008] According to one embodiment of the present invention, a recessed position is provided on the inner side of the auxiliary foot.

[0009] According to one embodiment of the present invention, the shielding cover is integrally stamped.

[0010] According to one embodiment of the present invention, the substrate and the shielding cover are connected by silver paste or solder paste.

[0011] According to one embodiment of the present invention, the substrate has copper-plated plug holes, and the copper-plated plug holes sequentially pass through the circuit layer, the substrate, and the pads along the surface of the circuit layer.

[0012] Another embodiment of this utility model provides an infrared receiver, including the infrared receiving module described above.

[0013] The beneficial effects of this invention are as follows: the shielding cover is placed on the substrate, and the main shielding cover blocks electromagnetic wave signals from the front of the substrate, while the secondary shielding plates on both sides block electromagnetic wave signals from the sides of the substrate, resulting in better shielding and effectively enhancing the receiving distance of the infrared receiver module. Furthermore, by providing auxiliary feet on the outer side of the main body, the contact area between the secondary shielding plate and the circuit layer of the substrate is increased, improving the stability of the connection between the secondary shielding plate and the substrate, and effectively enhancing the overall stability of the infrared receiver module. Attached Figure Description

[0014] The accompanying drawings, which are included to provide a further understanding of this application and form part of this application, illustrate exemplary embodiments and are used to explain this application, but do not constitute an undue limitation of this application. In the drawings:

[0015] Figure 1 This is a perspective view of the infrared receiving module in the embodiment;

[0016] Figure 2 This is a schematic diagram of the shielding cover in the embodiment;

[0017] Figure 3 This is a front view of the substrate in the embodiment;

[0018] Figure 4 This is a schematic diagram of the back side of the substrate in the embodiment.

[0019] Explanation of reference numerals in the attached figures

[0020] 1-Substrate; 10-Circuit layer; 100-First die-bonding region; 101-First connection region; 102-Second connection region; 103-Third connection region; 200-Second die-bonding region; 11-Pad; 12-Copper-plated plug hole; 2-Shielding cover; 21-Main shielding plate; 210-Receiving window; 22-Secondary shielding plate; 221-Main body; 222-Auxiliary foot; 2220-Recessed position. Detailed Implementation

[0021] The following drawings will disclose several embodiments of this utility model. For clarity, many practical details will be described in the following description. However, it should be understood that these practical details should not be used to limit this utility model. That is, in some embodiments of this utility model, these practical details are not essential. In addition, for the sake of simplicity, some conventional structures and components will be shown in the drawings in a simple schematic manner.

[0022] Furthermore, in this utility model, the use of terms such as "first" and "second" is for descriptive purposes only and does not specifically refer to any order or sequence, nor is it intended to limit the utility model. They are merely used to distinguish components or operations described with the same technical terms and should not be construed as indicating or implying their relative importance or implicitly specifying the number of indicated technical features. Therefore, a feature defined with "first" or "second" may explicitly or implicitly include at least one of those features. Additionally, the technical solutions of various embodiments can be combined with each other, but only if they are feasible for those skilled in the art. If a combination of technical solutions is contradictory or impossible to implement, it should be considered that such a combination of technical solutions does not exist and is not within the scope of protection claimed by this utility model.

[0023] Please refer to Figure 1 and Figure 2 , Figure 1 This is a 3D view of the infrared receiving module. Figure 2 This is a schematic diagram of the shielding cover. This embodiment provides an infrared receiver module, which includes a substrate 1 and a shielding cover 2. A circuit layer 10 is provided on one side of the substrate 1, and the shielding cover 2 covers the circuit layer 10 to shield electromagnetic wave signals, preventing interference from the electromagnetic wave signals to the circuit layer 10. A solder pad 11 is provided on the other side of the substrate 1. In use, the solder pad 11 is used for connecting the infrared receiver module to the circuit board.

[0024] The shielding cover 2 includes a main shielding plate 21 and at least two secondary shielding plates 22. In this example, the shielding cover includes a main shielding plate and two secondary shielding plates 22, which are disposed on opposite sides of the main shielding plate 21 along the length direction. The main shielding plate 21 is used to shield electromagnetic wave signals on the front of the substrate 1, and the two secondary shielding plates 22 are used to block electromagnetic wave signals on both sides of the shielding substrate 1, effectively enhancing the anti-interference capability of the infrared receiver module. In other embodiments, three or four secondary shielding plates 22 can be provided to further enhance the anti-interference capability of the infrared receiver module.

[0025] The secondary shielding plate 22 includes a main body 221 and auxiliary feet 222. One end of the main body 221 is connected to the main shielding plate 21, and the other end is connected to the circuit layer 10. The auxiliary feet 222 are located at the end of the main body 221 away from the main shielding plate 21, and protrude from the outer side of the main body 221, and are in contact with the circuit layer 10. The auxiliary feet 222 are used to increase the contact area between the main body 221 and the circuit layer 10. By increasing the contact area between the shielding cover 2 and the substrate 1, the stability of the shielding cover 2 is improved, and the connection between the shielding cover 2 and the substrate 1 is effectively enhanced. When the shielding cover 2 is connected to the substrate 1, the two sets of secondary shielding plates 22 are respectively connected to the circuit layer 10, and the main shielding plate 21 is connected to the circuit layer 10 through the main body 221 and the auxiliary feet 222, so that the main shielding plate 21 is supported above the substrate 1. Preferably, the main body 221 and the auxiliary feet 222 are integrally formed.

[0026] The shielding cover 2 is connected to the substrate 1 by silver paste or solder paste. When the shielding cover 2 is connected to the substrate 1, silver paste or solder paste is applied to the end of the secondary shielding plate 22 away from the main shielding plate 21, and the secondary shielding plate 22 is bonded to the substrate 1. After high temperature baking, the silver paste or solder paste is cured, thereby completing the connection between the shielding cover 2 and the substrate 1.

[0027] Furthermore, a recess 2220 is provided on the inner side of the main body 221. The recess 2220 is used to increase the contact area between the sub-shielding plate 22 and the silver paste or solder paste. During bonding, the silver paste and solder paste are filled in the recess 2220. Compared with a flat surface, the recess 2220 on the inner side of the main body 221 increases the contact area between the silver paste and the solder paste, making the shielding cover 2 bonded to the substrate 1 more firmly, and further improving the stability of the shielding cover 2.

[0028] Furthermore, the shielding cover 2 is integrally formed by stamping. In this embodiment, the shielding cover 2 is integrally formed by stamping, which reduces processing steps and effectively improves processing efficiency compared to the traditional bending process.

[0029] Please refer to Figure 3 and Figure 4 , Figure 3 This is a front view of the substrate. Figure 4 This is a schematic diagram of the back side of the substrate. Further, the circuit layer 10 has a first die-bonding region 100 for fixing the PD chip, and the main shielding plate 21 has a receiving window 210, which corresponds to the first die-bonding region 100. In practical applications, the first die-bonding region 100 is used to place the PD chip, and the PD chip forms a circuit connection with the circuit layer 10. The shielding cover 2 covers the substrate 1, and the PD chip receives light from the front through the receiving window 210.

[0030] The circuit layer 10 also includes a second die-bonding region 200 for fixing an IC chip. The IC chip is disposed in the second die-bonding region and is electrically connected to both the PD chip and the circuit layer 10. When the shielding cover 2 is connected to the substrate 1, the main shielding plate 21 covers the front of the second die-bonding region 200, and at least two shielding plates 22 block any two sides of the second die-bonding region 200. In this example, the shielding cover 2 includes a main shielding plate 21 and two shielding plates 22. The two shielding plates 22 are disposed on opposite sides of the main shielding plate 21 along the length direction, and the two shielding plates 22 block electromagnetic wave signals from both sides of the second die-bonding region 200. This configuration effectively blocks electromagnetic wave signals from the front and sides of the IC chip, thereby avoiding electromagnetic interference to the IC chip and effectively increasing the receiving distance of the infrared receiver module.

[0031] The substrate 1 has copper-plated plug holes 12. The copper-plated plug holes 12 pass through the circuit layer 10, the substrate 1, and the pads 11 sequentially along the surface of the circuit layer 10. The circuit layer 10 is electrically connected to the pads 11 through the copper-plated plug holes 12. The circuit layer 10 includes a first connection region 101, a second connection region 102, and a third connection region 103 spaced apart. A first die-bonding region 100 and a second die-bonding region 200 are located within the first connection region 101. The first connection region 101 has two copper-plated plug holes 12, and the second connection region 102 and the third connection region 103 each have one copper-plated plug hole 12. The IC chip located in the second die-bonding region 200 has an IN pin, a GND pin, an OUT pin, and a VCC pin. The IN pin is electrically connected to the PD chip located in the first die-bonding region 100. The OUT pin is connected to the copper-plated plug hole 12 in the second connection region 102, and the VCC pin is electrically connected to the copper-plated plug hole 12 in the third connection region 103. Two copper-plated vias 12 located in the first connection area 101 are electrically connected to the GND pin. Four pads 11 are correspondingly provided on the side of the substrate 1 facing away from the die-bonding area 100. Each copper-plated via 12 is connected to one pad 11, so that the circuit layer 10 on one side of the substrate 1 is connected to the pads 11 on the other side of the substrate 1 through the four copper-plated vias 12. This avoids the need for wire connections to connect the circuit layer 10 to the pads 11 on the bottom of the substrate 1, effectively simplifying the structure of the infrared receiving module and reducing its size.

[0032] This utility model also provides an infrared receiver, including the infrared receiving module described above. The infrared receiver has the beneficial effects of the infrared receiver module described above, which will not be elaborated here.

[0033] In summary, the shielding cover 2 is placed on the substrate 1. The main shielding plate 2 blocks electromagnetic wave signals from the front of the substrate 1, while the secondary shielding plates 2 on both sides block electromagnetic wave signals from the sides of the substrate 1. This results in better shielding performance of the shielding cover 2, effectively enhancing the receiving distance of the infrared receiver module. Furthermore, by providing auxiliary feet 222 on the outer side of the main body 221, the contact area between the secondary shielding plate 2 and the circuit layer 10 of the substrate 1 is increased, improving the stability of the connection between the secondary shielding plate 2 and the substrate 1, and effectively enhancing the overall stability of the infrared receiver module.

[0034] The above description is merely an embodiment of this utility model and is not intended to limit the scope of this utility model. Various modifications and variations can be made to this utility model by those skilled in the art. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principle of this utility model should be included within the scope of the claims of this utility model.

Claims

1. An infrared receiving module, characterized in that, include: The substrate (1) and shielding cover (2) are provided. One side of the substrate (1) is provided with a circuit layer (10) and the other side of the substrate (1) is provided with a pad (11). The shielding cover (2) includes a main shielding plate (21) and at least two secondary shielding plates (22). The at least two secondary shielding plates (22) are respectively disposed on any two sides of the main shielding plate (21). The secondary shielding plate (22) includes a main body (221) and an auxiliary foot (222). One end of the main body (221) is connected to the main shielding plate (21). The auxiliary foot (222) is disposed at the end of the main body (221) away from the main shielding plate (21) and the auxiliary foot (222) protrudes from the outside of the main body (221). The main body (221) and the auxiliary foot (222) are attached to the circuit layer (10).

2. The infrared receiving module according to claim 1, characterized in that, The circuit layer (10) has a first die-bonding region (100), and the main shielding plate (21) has a receiving window (210) that corresponds to the first die-bonding region (100).

3. The infrared receiving module according to claim 1, characterized in that, The circuit layer (10) also forms a second die-bonding region (200), the main shielding plate (21) covers the front of the second die-bonding region (200), and at least two of the secondary shielding plates (22) shield at least two sides of the second die-bonding region (200).

4. The infrared receiving module according to claim 1, characterized in that, The auxiliary foot (222) has a recess (2220) on its inner side.

5. The infrared receiving module according to claim 1, characterized in that, The shielding cover (2) is integrally stamped.

6. The infrared receiving module according to claim 1, characterized in that, The substrate (1) and the shielding cover (2) are connected by silver paste or solder paste.

7. The infrared receiving module according to claim 1, characterized in that, The substrate (1) has a copper-plated plug hole (12), and the copper-plated plug hole (12) passes through the circuit layer (10), the substrate (1) and the pad (11) in sequence along the surface of the circuit layer (10).

8. An infrared receiver, characterized in that, Includes the infrared receiving module as described in any one of claims 1-7.

Images