Cleaning nozzle and cleaning device

Abstract

The utility model provides a cleaning spray head which comprises a spray head body, the first end of the spray head body is provided with a liquid inlet, the second end of the spray head body is provided with a liquid outlet, and the liquid inlet and the liquid outlet are communicated through a first channel arranged in the spray head body; the nozzle main body further comprises at least one air inlet formed in the first end of the nozzle main body; the at least one air outlet group is positioned between the first end and the second end of the spray head main body, and each air outlet group comprises a plurality of air outlets arranged around the spray head main body; and the air inlet is communicated with the air outlet through a second channel arranged in the spray head main body. The utility model further provides a cleaning device. According to the cleaning nozzle and the cleaning device provided by the invention, small particles outside the cleaning chamber can be prevented from entering the cleaning chamber in a wet etching process, so that the surface pollution of the wafer is reduced.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of semiconductor manufacturing, and in particular to a cleaning nozzle and a cleaning device. BACKGROUND

[0002] When a wafer is cleaned by using a wet single wafer cleaning machine, small particles are easily deposited on the surface of the wafer to form a center map. Referring to Figure 1 , this is because there is a gap between the cleaning nozzle 10 located at the back of the wafer and the sleeve shaft 21 inside the spindle 20, which connects the inside of the cleaning chamber 30 to the outside, and during the operation of the machine, the wafer rotates at a high speed, and the air pressure inside the cleaning chamber 30 is lower than that outside, due to the Bernoulli effect, small particles from the outside enter the inside of the cleaning chamber 30 through the gap and stay on the surface of the wafer.

[0003] It is necessary to develop a cleaning nozzle and a cleaning device to prevent small particles outside the cleaning chamber from entering the cleaning chamber during the wet etching process, thereby reducing the contamination of the wafer surface. CONTENT OF THE INVENTION

[0004] The purpose of the present application is to provide a cleaning nozzle and a cleaning device to prevent small particles outside the cleaning chamber from entering the cleaning chamber during the wet etching process, thereby reducing the contamination of the wafer surface.

[0005] In a first aspect, the present application provides a cleaning nozzle, comprising: a nozzle body, a liquid inlet is arranged at a first end of the nozzle body, a liquid outlet is arranged at a second end of the nozzle body, the liquid inlet and the liquid outlet are communicated through a first channel arranged inside the nozzle body; the nozzle body further comprises: at least one gas inlet arranged at the first end of the nozzle body; at least one gas outlet group located between the first end and the second end of the nozzle body, each gas outlet group comprises a plurality of gas outlets arranged around the nozzle body; the gas inlet and the gas outlet are communicated through a second channel arranged inside the nozzle body.

[0006] In some embodiments, the gas outlet is configured to spray the gas passing through it towards the first end of the nozzle body.

[0007] In some embodiments, the periphery of the nozzle body is sequentially provided with a first zone, a second zone and a third zone from the first end of the nozzle body to the second end of the nozzle body, the ratio of the lengths of the first zone, the second zone and the third zone along the axial direction of the nozzle body is (0.5-2):(0.5-2):(0.5-2); the sum of the cross-sectional areas of the gas outlets in the first zone is greater than the sum of the cross-sectional areas of the gas outlets in the second zone; and the third zone is not provided with the gas outlets.

[0008] In some embodiments, the number of the group of gas outlets in the first zone is greater than the number of the group of gas outlets in the second zone.

[0009] In some embodiments, the cross-sectional area of any one of the group of gas outlets in the first zone is the same as the cross-sectional area of any one of the group of gas outlets in the second zone.

[0010] In some embodiments, the nozzle body comprises a shell and a core body arranged inside the shell; the gap between the outer wall of the core body and the inner wall of the shell constitutes the second channel, and the gas outlets penetrate the side wall of the shell; and the first channel penetrates the core body along the axial direction of the core body.

[0011] In some embodiments, the cleaning nozzle further comprises a blocking part arranged at the second end of the nozzle body and connected with the shell, the cross-sectional area of the blocking part is greater than the cross-sectional area of the shell.

[0012] In some embodiments, the blocking part is detachably connected with the shell.

[0013] In some embodiments, the number of the gas inlets is two, and the two gas inlets are symmetrically distributed about the axial direction of the nozzle body.

[0014] In a second aspect, the present application further provides a cleaning device, comprising: a tray for supporting a wafer; a rotating shaft for driving the tray to rotate, the center of the rotating shaft being provided with a through hole penetrating the rotating shaft; and a cleaning nozzle as described in the first aspect of the present application, the cleaning nozzle being configured to be inserted into the through hole, the liquid outlet being directed towards the wafer, the liquid inlet and the gas inlet being located outside the through hole, the outer surface of the cleaning nozzle in the circumferential direction having a gap with the surface of the through hole, and the gas outlet being located inside the through hole.

[0015] The cleaning nozzle and the cleaning device provided by the present application have the following beneficial effects, but are not limited to the following:

[0016] The cleaning nozzle of the present application comprises a nozzle body, the nozzle body comprises at least one gas inlet and at least one gas outlet group, the gas outlet group comprises a plurality of gas outlets, the gas outlets are in communication with the gas inlet and are arranged around the side surface of the nozzle body, during the cleaning process of the wafer, the gas is sprayed from the gas outlets to the gap between the nozzle body and the rotating shaft, so that the gas pressure in the gap is greater than or equal to the external gas pressure, avoiding the tiny particles in the external environment entering the cleaning chamber through the gap to contaminate the wafer. BRIEF DESCRIPTION OF DRAWINGS

[0017] The following drawings in detail describe the exemplary embodiments disclosed in the present application. The same reference signs in the several views of the drawings represent similar structures. A person of ordinary skill in the art will understand that these embodiments are non-limiting, exemplary embodiments, the drawings are only for the purpose of illustration and description, and are not intended to limit the scope of the present application, and other ways of embodiments can also achieve the same intention of the invention in the present application. It should be understood that the drawings are not drawn to scale.

[0018] Wherein:

[0019] Figure 1 It is a structural schematic diagram of a cleaning machine;

[0020] Figure 2 It is a structural schematic diagram of another cleaning machine;

[0021] Figure 3 It is a structural schematic diagram of a cleaning nozzle according to some embodiments of the present application;

[0022] Figure 4 It is a structural schematic diagram of a cleaning nozzle according to some embodiments of the present application; and

[0023] Figure 5 It is a structural schematic diagram of a cleaning device according to some embodiments of the present application. DETAILED DESCRIPTION

[0024] The following description provides specific application scenarios and requirements of the present application, which is to enable a person skilled in the art to manufacture and use the content in the present application. Various local modifications of the disclosed embodiments are obvious to those skilled in the art, and the general principles defined herein can be applied to other embodiments and applications without departing from the spirit and scope of the present application. Therefore, the present application is not limited to the shown embodiments, but is consistent with the widest scope of the claims.

[0025] REFERENCE Figure 1When a wet single wafer cleaning machine is used to clean a wafer, there is a gap between the cleaning nozzle 10 on the back of the wafer and the sleeve shaft 21 inside the rotating shaft 20 in the cleaning chamber 30. During the operation of the machine, the wafer rotates at a high speed, and the internal pressure of the cleaning chamber 30 is lower than the external pressure. Due to the Bernoulli effect, external fine particles enter the inside of the cleaning chamber 30 through the gap and stay on the surface of the wafer, causing contamination of the wafer. Although the amount of fine particles adhering to the back of the wafer can be reduced by spraying water or nitrogen gas from the cleaning nozzle 10 to the back of the wafer, it cannot fundamentally solve the problem of fine particles entering the cleaning chamber 30.

[0026] In some embodiments, the amount of external fine particles entering the inside of the cleaning chamber 30 can be reduced by reducing the gap between the cleaning nozzle 10 and the sleeve shaft 21, for example, the gap between the cleaning nozzle 10 and the sleeve shaft 21 is reduced to 2 mm, and the gap between the wide head 11 of the cleaning nozzle 10 close to the outside of the cleaning chamber 30 and the sleeve shaft 21 is reduced to 0.95 mm. However, this requires extremely high machining precision. If the gap is too large, it cannot effectively block fine particles from entering the cleaning chamber 30, and if the gap is too small, the vibration of the rotating shaft 20 during operation will cause the cleaning nozzle 10 to rub against the inner wall of the sleeve shaft 21, generating fine particles and contaminating the wafer.

[0027] In other embodiments, referring to Figure 2 A blocking device 40 is added outside the cleaning chamber 30 to prevent air flow from the outside of the cleaning chamber 30 into the gap between the cleaning nozzle 10 and the sleeve shaft 21, and a blocking block 60 is added between the top end of the cleaning nozzle 10 and the wafer pedestal 50 to reduce the gap between the top end of the cleaning nozzle 10 and the wafer pedestal 50, thereby reducing the entry of fine particles into the cleaning chamber 30. However, the vibration of the rotating shaft 20 during operation may still cause the blocking device 40 and the blocking block 60 to rub against, for example, the chamber wall or the wafer pedestal 50, thereby generating fine particles.

[0028] The technical solutions in the above embodiments require extremely high machining precision and stability of the rotating shaft operation, which are not easy to implement.

[0029] The present application provides a cleaning nozzle, comprising: a nozzle body, a liquid inlet is arranged at a first end of the nozzle body, a liquid outlet is arranged at a second end of the nozzle body, and the liquid inlet and the liquid outlet are communicated through a first channel arranged inside the nozzle body; the nozzle body further comprises: at least one gas inlet arranged at the first end of the nozzle body; at least one gas outlet group located between the first end and the second end of the nozzle body, each gas outlet group comprising a plurality of gas outlets arranged around the nozzle body; and the gas inlet and the gas outlets are communicated through a second channel arranged inside the nozzle body.

[0030] The present application provides a cleaning nozzle, which is provided with an inlet and an outlet. When the cleaning nozzle is in operation, gas is sprayed to the side of the cleaning nozzle to adjust the gas pressure in the gap between the cleaning nozzle and the inner sleeve of the rotating shaft, so that the gas pressure in the gap is greater than or equal to the gas pressure outside the cleaning chamber, thereby avoiding that the fine particles outside the cleaning chamber enter the cleaning chamber under the action of the gas flow.

[0031] The cleaning nozzle provided by the present application will be described in detail below in combination with specific embodiments.

[0032] Reference Figure 3 and 4 The present application provides a cleaning nozzle 100, which comprises a nozzle body 110.

[0033] In some embodiments, the nozzle body 110 comprises a shell 111 and a core 112 arranged inside the shell 111. The core 112 is provided with a first channel 112a penetrating the core 112 along the axial direction of the core 112. There is a gap between the outer wall of the core 112 and the inner wall of the shell 111, which constitutes a second channel 111a.

[0034] In some embodiments, the shell 111 and the core 112 are integrally connected.

[0035] In some embodiments, the shell 111 is in the shape of an inverted T.

[0036] The first end of the shell 111 is provided with a liquid inlet 111b, and the second end of the shell 111 is provided with a liquid outlet 111c. The liquid inlet 111b and the liquid outlet 111c are connected through the first channel 112a.

[0037] In some embodiments, the liquid inlet 111b is arranged at the center of the bottom of the first end of the shell 111.

[0038] The liquid inlet 111b is used to connect with a liquid source. When it is necessary to clean an object such as a wafer, the liquid source delivers cleaning liquid to the liquid inlet 111b, which is transmitted to the liquid outlet 111c through the first channel 112a. The cleaning liquid is sprayed from the liquid outlet 111c to the back of the wafer to clean the back of the wafer.

[0039] In some embodiments, the liquid provided by the liquid source comprises deionized water.

[0040] The shower head body 110 further comprises at least one gas inlet 121 arranged at the first end of the shower head body 110, at least one gas outlet group 122 arranged between the first end and the second end of the shower head body 110, each gas outlet group 122 comprising a plurality of gas outlets 122a arranged around the shower head body 110, and the gas inlet 121 and the gas outlets 122a are in communication through the second channel 111a.

[0041] In some cleaning scenarios, for example, the cleaning shower head 100 is arranged in a wet single wafer cleaning machine for cleaning the back side of a wafer, due to the gap between the circumferential side of the cleaning shower head 100 and the rotation shaft of the cleaning machine, the gap communicates the inside of the cleaning chamber with the outside, during the operation of the machine, the wafer rotates at a high speed, the pressure inside the cleaning chamber is lower than the outside, due to Bernoulli effect, the tiny particles from the outside enter the inside of the cleaning chamber through the gap.

[0042] The cleaning shower head 100 provided in the present application can spray gas from the gas outlets 122a to the gap between the shower head body 110 and the rotation shaft during the cleaning process, so that the pressure in the gap is greater than or equal to the outside, avoiding the tiny particles from the outside entering the cleaning chamber through the gap and contaminating the wafer.

[0043] The gas inlet 121 is used to communicate with a gas source, during the cleaning process, the gas source supplies gas to the gas inlet 121, the gas enters the second channel 111a through the gas inlet 121 and then flows out from the gas outlets 122a.

[0044] In some embodiments, the gas provided by the gas source comprises nitrogen.

[0045] In some embodiments, the number of gas inlets 121 is two, and the two gas inlets 121 are symmetrically distributed about the axial direction of the shower head body 110. Symmetrically arranging the gas inlets 121 can make the distribution of the gas entering the second channel 111a more uniform, which is beneficial to control the uniformity of the flow rate of the gas discharged from different gas outlets 122a.

[0046] In some embodiments, the gas outlets 122a are configured to spray the gas passing therethrough towards the first end of the shower head body 110. For example, the gas outlets 122a are arranged outwardly and downwardly. It should be noted that the outwardly refers to the outside of the shower head body 110, and the downwardly refers to the first end of the shower head body 110.

[0047] Spraying the gas towards the first end of the shower head body 110 can make the gas flow in the gap between the shower head body 110 and the rotation shaft flow to the outside of the cleaning chamber, thereby avoiding the tiny particles from the outside entering the cleaning chamber.

[0048] In some embodiments, the gas outlets 122a are disposed through the housing 111.

[0049] In some embodiments, the perimeter of the showerhead body 110 is provided with a first zone I, a second zone II and a third zone III in sequence from the first end of the showerhead body 110 to the second end of the showerhead body 110, and the ratio of the lengths of the first zone I, the second zone II and the third zone III along the axial direction of the showerhead body 110 is (0.5-2):(0.5-2):(0.5-2), for example, 1:2:0.5, 0.5:2:1, 1:1:1 or 1:2:1.

[0050] The sum of the cross-sectional areas of the gas outlets 122a in the first zone I is greater than the sum of the cross-sectional areas of the gas outlets 122a in the second zone II, and the third zone III is not provided with the gas outlets 122a. It should be noted that the sum of the cross-sectional areas of the gas outlets 122a refers to the sum of the cross-sectional areas of all the gas outlets 122a in the first zone I or the second zone II.

[0051] The first zone I is close to the outside of the cleaning chamber during use, and by providing the gas outlets 122a, the gas pressure in the gap between the cleaning showerhead 100 and the rotating shaft is increased, which can prevent small particles from the outside from entering the cleaning chamber through the gap between the cleaning showerhead 100 and the rotating shaft. By providing the gas outlets 122a in the second zone II, small particles that may exist between the cleaning showerhead 100 and the rotating shaft can be further prevented from entering the cleaning chamber.

[0052] Since the first zone I is close to the outside of the cleaning chamber, a larger gas flow is usually required to prevent small particles from entering the gap between the cleaning showerhead 100 and the rotating shaft.

[0053] Since the cross-sectional area of the gas outlet 122a is small, in order to facilitate processing, the total cross-sectional area of the gas outlets 122a in the first zone I and the second zone II is preferably adjusted by increasing the number of gas outlets 122a. In some embodiments, the number of the gas outlet groups 122 in the first zone I is greater than the number of the gas outlet groups 122 in the second zone II. Specifically, in some embodiments, the first zone I includes two gas outlet groups 122, and the second zone II includes one gas outlet group 122.

[0054] In some embodiments, the cross-sectional area of any one of the gas outlets 122a in the gas outlet group 122 of the first zone I is the same as the cross-sectional area of any one of the gas outlets 122a in the gas outlet group 122 of the second zone II.

[0055] The shape of the cross section of the gas outlet 122a can be circular, oval, square, or irregular, and preferably, the shape of the cross section of the gas outlet 122a is circular.

[0056] In some embodiments, the cleaning nozzle 100 further comprises a blocking portion 130 for further blocking the tiny particles from entering the cleaning chamber. The blocking portion 130 is arranged at the second end of the nozzle body 110 and connected to the shell 111. The cross-sectional area of the blocking portion 130 is greater than that of the shell 111. It should be noted that the cross-sectional area of the blocking portion 130 and the cross-sectional area of the shell 111 refer to the area of the cross section perpendicular to the axial direction of the blocking portion 130 and the shell 111, respectively. The blocking portion 130 can hinder the movement of the tiny particles along the gap between the cleaning nozzle 100 and the rotating shaft into the cleaning chamber. The center of the blocking portion 130 is provided with a third passage 131 extending through the blocking portion 130 and communicating with the liquid outlet 111c. Liquid can enter the third passage 131 from the liquid outlet 111c and be sprayed from the top of the blocking portion 130.

[0057] In some embodiments, the blocking portion 130 is detachably connected to the shell 111.

[0058] In some embodiments, the end of the blocking portion 130 away from the shell 111 is disc-shaped.

[0059] Reference Figure 5 The second aspect of the present application further provides a cleaning device, which comprises a tray 400, a rotating shaft 200, and a cleaning nozzle 100 arranged at the center of the rotating shaft 200.

[0060] In some embodiments, the tray 400 is used to support a wafer, and the tray 400 is connected to the rotating shaft 200 and can rotate the wafer under the driving of the rotating shaft 200. The tray 400 is hollow and annular to allow the blocking portion 130 of the cleaning nozzle 100 to pass through the tray 400 and be close to the back surface of the wafer.

[0061] In some embodiments, the side of the tray 400 away from the rotating shaft 200 is provided with a protrusion 410 matching the wafer for clamping the wafer.

[0062] In some embodiments, the rotating shaft 200 can rotate under the driving of a driving motor. The center of the rotating shaft 200 is provided with a through hole 210 extending through the rotating shaft 200 for accommodating the cleaning nozzle 100.

[0063] In some embodiments, the rotating shaft 200 further comprises a sleeve shaft 220 arranged at the center of the rotating shaft 200, the sleeve shaft 220 does not rotate with the rotating shaft 200 to minimize the impact of the rotating of the rotating shaft 200 on the cleaning nozzle 100, for example, to minimize the friction with the surface of the cleaning nozzle 100.

[0064] The cleaning nozzle 100 is the cleaning nozzle 100 of the first aspect of the application, which will not be described here in detail for the sake of brevity. The cleaning nozzle 100 is configured to be inserted into the through hole 210, the circumferential outer surface of the cleaning nozzle 100 has a gap with the surface of the through hole 210, and the gas outlet 122a is located in the through hole 210. The liquid outlet 111c faces the wafer, and the liquid inlet 111b and the gas inlet 121 are located outside the through hole 210.

[0065] In some embodiments, the cleaning device further comprises a cleaning chamber 300 for accommodating the tray 400 and the wafer, and the rotating shaft 200 and the cleaning nozzle 100 are inserted into the interior of the cleaning chamber 300 from the bottom plate portion of the cleaning chamber 300.

[0066] The working process of the cleaning nozzle 100 and the cleaning device provided by the embodiments of the application is as follows:

[0067] When the wafer needs to be cleaned, the rotating shaft 200 drives the tray 400 to rotate and thus drives the wafer to rotate, the liquid source and the gas source in communication with the cleaning nozzle 100 deliver liquid and gas to the cleaning nozzle 100, the liquid is sprayed from the top surface of the blocking portion 130 at the second end of the cleaning nozzle 100 to clean the back surface of the wafer, at the same time, the gas is sprayed from the gas outlet 122a at the side of the cleaning nozzle 100 to make the gas pressure in the gap between the cleaning nozzle 100 and the rotating shaft 200 greater than or equal to the pressure outside the cleaning chamber 300, thereby avoiding that the tiny particles outside the cleaning chamber 300 enter the cleaning chamber 300 through the gap between the cleaning nozzle 100 and the rotating shaft 200 to contaminate the wafer.

[0068] The cleaning nozzle and the cleaning device provided by the application have the following beneficial effects, but are not limited to the following:

[0069] The cleaning nozzle of the present application comprises a nozzle body, the nozzle body comprising at least one gas inlet and at least one gas outlet group, the gas outlet group comprising a plurality of gas outlets, the gas outlets being in communication with the gas inlet and being arranged around the side surface of the nozzle body, during the cleaning of the wafer, the gas outlets spraying gas to the gap between the nozzle body and the rotating shaft, so that the gas pressure in the gap is greater than or equal to the external gas pressure, avoiding the tiny particles in the external environment from entering the cleaning chamber through the gap and contaminating the wafer.

[0070] It should be noted that different embodiments can produce different beneficial effects, and in different embodiments, the beneficial effects that can be produced can be any one or a combination of the above, or any other beneficial effects that can be obtained.

[0071] The above has described the basic concept, and it is obvious that the above detailed disclosure is only as an example, and does not constitute a limitation on the present application. Although it is not explicitly stated here, those skilled in the art can make various modifications, improvements and corrections to the present application. Such modifications, improvements and corrections are suggested in the present application, so such modifications, improvements and corrections still belong to the spirit and scope of the exemplary embodiments of the present application.

[0072] It should be noted that in the description of the present application, unless otherwise explicitly specified and limited, the terms "mounting", "connection", "connecting", "fixing" should be understood broadly, for example, it can be fixedly connected, or it can be detachably connected, or it can be integrated; it can be mechanically connected, or it can be electrically connected; it can be rotationally connected, or it can be slidingly connected; it can be directly connected, or it can be indirectly connected through an intermediate medium; it can be the internal communication of two elements or the interaction relationship between two elements. For those skilled in the art, the specific meaning of the above terms in the present application can be understood in combination with the specific circumstances.

[0073] In addition, when the terms "first", "second", "third" and the like are used in the description of the present application to describe various features, these terms are only used to distinguish these features, and cannot be understood as indicating or implying the relevance between the features, the relative importance of the features, or implicitly indicating the number of the indicated features.

[0074] In addition, the description herein makes reference to idealized illustrative cross-sectional and / or plan and / or elevational views. Accordingly, variations from the shapes of the illustrations as a result, for example, of manufacturing techniques and / or tolerances, are to be expected. Thus, examples of the embodiments should not be construed as limited to the precise shapes illustrated herein but are to include deviations in shapes that result from such

[0075] Also, the use of "an" or "the" to refer to an element or class of elements, along with the

[0076] Similarly, it is to be noted that, as used in the preceding description, the

[0077] Finally, the language used in the specification should not be construed as limiting but rather as a representation given to the claims. In this application, the use of "may" when referring to certain embodiments of the present application indicates that such embodiments are among the alternatives used to fulfill the herein disclosure.

Claims

1. A cleaning showerhead, characterized by, The nozzle body is provided with a liquid inlet at a first end thereof and a liquid outlet at a second end thereof, and the liquid inlet and the liquid outlet are communicated through a first channel arranged inside the nozzle body. The nozzle body further comprises at least one air inlet arranged at the first end of the nozzle body, and at least one air outlet group arranged between the first end and the second end of the nozzle body, each air outlet group comprising a plurality of air outlets arranged around the nozzle body, and the air inlet and the air outlets are communicated through a second channel arranged inside the nozzle body. The air outlets are configured to spray the gas passing therethrough towards the first end of the nozzle body. The nozzle body is provided with a first zone, a second zone and a third zone arranged in sequence from the first end to the second end of the nozzle body, and the ratio of the lengths of the first zone, the second zone and the third zone along the axial direction of the nozzle body is (0.5-2):(0.5-2):(0.5-2); the sum of the cross-sectional areas of the air outlets in the first zone is greater than the sum of the cross-sectional areas of the air outlets in the second zone; and the third zone is not provided with the air outlets.

2. The cleaning showerhead of claim 1, wherein The number of air outlet groups in the first zone is greater than the number of air outlet groups in the second zone.

3. The cleaning showerhead of claim 1, wherein, The cross-sectional area of any one of the air outlets in the air outlet groups of the first zone is the same as the cross-sectional area of any one of the air outlets in the air outlet groups of the second zone.

4. The cleaning showerhead of claim 3, wherein, The nozzle body comprises a shell and a core arranged inside the shell; the gap between the outer wall of the core and the inner wall of the shell forms the second channel, and the air outlets penetrate the side wall of the shell; and 5. The cleaning showerhead of claim 4, wherein, The first channel penetrates the core along the axial direction of the core.

6. The cleaning showerhead of claim 1, wherein, A blocking part is arranged at the second end of the nozzle body and connected to the shell, and the cross-sectional area of the blocking part is greater than the cross-sectional area of the shell. The blocking part is detachably connected to the shell.

7. The cleaning showerhead of claim 6, wherein, The number of air inlets is two, and the two air inlets are symmetrically distributed about the axial direction of the nozzle body.

8. The cleaning showerhead of claim 7, wherein, The tray is used for supporting a wafer; 9. The cleaning showerhead of claim 1, wherein, The shaft is used for driving the tray to rotate, and the center of the shaft is provided with a through hole penetrating the shaft; 10. A cleaning device characterized by The cleaning nozzle as claimed in any one of claims 1-9 is configured to be inserted into the through hole, the liquid outlet faces the wafer, the liquid inlet and the air inlet are located outside the through hole, the circumferential outer surface of the cleaning nozzle has a gap with the surface of the through hole, and the air outlets are located inside the through hole. ​ ​ ​ ​

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