Semiconductor monocrystalline silicon wafer edge polishing device

Abstract

The utility model provides a semiconductor monocrystalline silicon wafer edge polishing device, and belongs to the technical field of semiconductor polishing equipment. Comprising a grinding machine table, a placing frame used for placing a plurality of silicon wafers in parallel is arranged on the grinding machine table, a fixing assembly used for fixing the silicon wafers at the same time and a driving assembly used for driving the silicon wafers to rotate at the same time are arranged on the placing frame, and a grinding assembly used for grinding the edges of the silicon wafers is arranged on the grinding machine table and located above the placing frame. The multiple silicon wafers are correspondingly placed in the containing cavities in the containing frame at the same time, after the multiple silicon wafers are fixed through the fixing assembly at the same time, the edges of the multiple silicon wafers are ground through the grinding assembly at the same time, then the multiple silicon wafers are driven to rotate through the driving assembly at the same time, and complete grinding of the edges of the silicon wafers is achieved. The effect of improving the silicon wafer polishing efficiency is achieved.

Description

TECHNICAL FIELD

[0001] The utility model relates to semiconductor polishing equipment technical field especially relates to a semiconductor monocrystalline silicon wafer edge polishing device. BACKGROUND

[0002] The silicon wafer is generally a thin piece cut from monocrystalline silicon, and has specifications such as 6 inches, 8 inches and 12 inches in diameter, and is mainly used to produce integrated circuits, is an important material for manufacturing integrated circuits, and various semiconductor devices can be manufactured through photolithography, ion implantation and other means on the silicon wafer. The edges of the semiconductor silicon wafer need to be polished during production.

[0003] The patent with publication number CN217572218U discloses an edge grinding machine for semiconductor silicon wafer production, which comprises an outer frame body, a moving clamping mechanism is slidably connected to the inner wall of the bottom end of the outer frame body, and the moving clamping mechanism is clamped and connected with a semiconductor silicon wafer, a sliding rod is slidably connected to one side of the bottom of the outer frame body, one end of the sliding rod penetrates through one side of the bottom of the outer frame body and is fixedly connected with the moving clamping mechanism, a fixed rod is fixedly installed at the top end of the outer frame body, and a grinding wheel is fixedly installed at one end of the fixed rod, a cleaning device is fixedly installed on the side away from the moving clamping mechanism of the fixed rod, and a waste chip cleaning structure is fixedly installed inside the sidewall of the outer frame body.

[0004] However, the current polishing equipment can only polish one monocrystalline silicon wafer at a time, and the polishing efficiency is low. UTILITY MODEL CONTENTS

[0005] In view of the above problems, the utility model provides a semiconductor monocrystalline silicon wafer edge polishing device.

[0006] In order to achieve the above utility model purposes, the utility model adopts the following technical solutions:

[0007] A semiconductor monocrystalline silicon wafer edge polishing device is provided, which comprises a polishing machine table, a placing frame for placing multiple silicon wafers side by side is arranged on the polishing machine table, a fixing assembly for fixing the multiple silicon wafers at the same time is arranged on the placing frame, a driving assembly for driving the multiple silicon wafers to rotate at the same time is arranged on the placing frame, a polishing assembly for polishing the edges of the silicon wafers is arranged above the placing frame on the polishing machine table;

[0008] The fixing assembly comprises sliding plates and a first driving member, the sliding plates are arranged at intervals along the silicon wafer arrangement direction in the placing frame, a placing cavity for placing a silicon wafer is formed between adjacent sliding plates, the first driving member is arranged on the placing frame, and the first driving member is used to push the sliding plate at the end side to move.

[0009] Further, guide rods are fixedly arranged on both sides of the placing frame along the silicon wafer arrangement direction, guide sleeves are fixedly connected to both ends of the sliding plate, the guide sleeves are slidably sleeved on the guide rods, the first driving member comprises a pneumatic cylinder, the pneumatic cylinder is fixedly arranged at both ends of the placing frame, and the output ends of the two pneumatic cylinders are fixedly connected with the sliding plates at both ends of the placing frame.

[0010] Further, the second driving member comprises a first driving motor, a driving rod with a polygonal cross section is coaxially fixedly connected to the rotating seat of the sliding plate at the end side of the placing frame, a driving gear is rotatably arranged on the end face of the placing frame, the driving rod is coaxially and slidably arranged in the driving gear, the first driving motor is fixedly arranged on the placing frame, and the output shaft of the first driving motor is in transmission connection with the driving gear.

[0011] Further, the rotating seat is rotatably connected to the sliding plate through a bearing, and rubber pads for frictionally contacting the silicon wafer are fixedly arranged on the end faces of both sides of the rotating seat.

[0012] Further, the polishing assembly comprises a polishing belt, a plurality of rollers are rotatably arranged on the polishing machine table, the polishing belt is wound around the rollers, a synchronous wheel is coaxially and fixedly connected to one end of the roller, a synchronous belt is wound around and meshingly arranged on the synchronous wheels of the plurality of rollers, and a second driving motor is arranged on the polishing machine table and in transmission connection with the synchronous wheel on any one of the rollers.

[0013] Further, the placing frame comprises a support frame and a lifting frame, the lifting frame is vertically and liftably arranged above the support frame, a plurality of support rods for supporting the lower edge of the silicon wafer are fixedly arranged on the support frame in a circle, the axis of the support rod is parallel to the silicon wafer arrangement direction, the fixing assembly and the driving assembly are arranged on the lifting frame, a guide column is vertically and fixedly arranged on the support frame, a guide hole is formed through the lifting frame, the guide column penetrates into the guide hole, a lead screw is vertically and rotatably arranged on the support frame, a servo motor for driving the lead screw to rotate is arranged on the support frame, a lead screw sleeve is fixedly arranged on the lifting frame, and the lead screw is in screwing cooperation with the lead screw sleeve.

[0014] The utility model discloses a beneficial effect is: when the edge of the silicon wafer is polished, can be placed in the each placing cavity in the placing frame in multiple silicon wafers simultaneously corresponding, through the sliding plate is clamped and fixed simultaneously to multiple silicon wafers, again by polishing assembly simultaneously to the edge of the multiple silicon wafers in the placing frame is polished, by drive assembly simultaneously drives multiple silicon wafers to rotate, thereby realizes the all polishing operation to the edge of the silicon wafer, simultaneously polishes multiple silicon wafers, improves the polishing efficiency of silicon wafer. BRIEF DESCRIPTION OF DRAWINGS

[0015] Figure 1 It is whole structure schematic diagram of the silicon wafer edge polishing device of the embodiment of the application.

[0016] Figure 2 It is structure schematic diagram of the silicon wafer fixed and lifted state in the lifting frame of the embodiment of the application.

[0017] Figure 3 It is whole structure schematic diagram of the sliding plate of the embodiment of the application.

[0018] Wherein, 1, polishing machine platform;2, placing frame;21, guide rod;22, drive gear;23, support frame;231, support rod;232, guide column;233, screw;24, lifting frame;241, screw sleeve;31, sliding plate;311, guide sleeve;32, first drive part;41, rotating seat;411, drive rod;412, rubber pad;42, second drive part;5, polishing assembly;51, polishing belt;52, roller;53, second drive motor. DETAILED DESCRIPTION

[0019] In order to better understand the above technical solutions, the above technical solutions will be described in detail in the following with reference to the drawings and specific embodiments of the specification.

[0020] The embodiment of the application discloses a kind of semiconductor single crystal silicon wafer edge polishing device, refer to Figure 1 And Figure 2 , including polishing machine platform 1, polishing machine platform 1 is equipped with placing frame 2, and multiple silicon wafers can be placed in parallel in placing frame 2.In placing frame 2 is equipped with the fixed component for simultaneously fixing multiple silicon wafers, and drive component for simultaneously driving multiple silicon wafers to rotate.Polishing machine platform 1 is located above placing frame 2, and is provided with polishing assembly 5 for polishing the edge of silicon wafer.In polishing single crystal silicon wafer, multiple silicon wafers can be put into placing frame 2 simultaneously, after being fixed by fixed component simultaneously to multiple silicon wafers, multiple silicon wafers can be polished simultaneously by polishing assembly 5 to the edge, and the efficiency of polishing multiple silicon wafers is improved by drive component to drive multiple silicon wafers to rotate simultaneously.

[0021] In the embodiment of the present application, the fixing assembly is composed of sliding plates 31 and first driving members 32. The sliding plates 31 are arranged at intervals along the arrangement direction of the silicon wafers in the placing frame 2. The sliding plates 31 are slidingly installed on the placing frame 2 along the arrangement direction of the silicon wafers. The placing cavities for placing the silicon wafers are formed between the adjacent sliding plates 31. The first driving members 32 are arranged on the placing frame 2 and used to drive the sliding plates 31 at the end sides to move. By driving the sliding plates 31 at the end sides to move, the sliding plates 31 in the placing frame 2 move closely to the silicon wafers in the placing cavities. The sliding plates 31 continue to move, the widths of the placing cavities are sequentially reduced, until the sliding plates 31 and the silicon wafers closely contact with each other, and the silicon wafers are clamped and fixed. Specifically, guide rods 21 are fixedly installed on the two sides of the placing frame 2 along the arrangement direction of the silicon wafers. Guide sleeves 311 are fixedly installed on the sliding plates 31 and slidingly sleeved on the guide rods 21, so as to linearly guide the sliding direction of the sliding plates 31. The first driving members 32 can be air cylinders. The air cylinders are fixedly arranged on the end faces of the placing frame 2 by bolts. The output ends of the air cylinders are fixedly connected with the sliding plates 31. In order to improve the clamping effect of the silicon wafers, air cylinders can be fixed on the two ends of the placing frame 2. The output ends of the two air cylinders are fixedly connected with the sliding plates 31 at the two end sides of the sliding plates 31 in the placing frame 2. The two driving air cylinders are synchronously started, so that the sliding plates 31 at the two end sides are synchronously moved to close to each other, the clamping rate of the silicon wafers is improved, and the moving abrasion of the silicon wafers in the placing frame 2 is reduced.

[0022] With reference to Figure 3 In the embodiment of the present application, the driving assembly is composed of rotating seats 41 and second driving members 42. The rotating seat 41 is rotatingly installed on each sliding plate 31. The rotating seat 41 penetrates through the sliding plate 31 and protrudes from the two sides of the sliding plate 31. When the adjacent sliding plates 31 move close to each other, the rotating seat 41 contacts the silicon wafer. The second driving member 42 is arranged on the placing frame 2 and used to drive the rotating seat 41 on the sliding plate 31 at the end side to rotate. When the sliding plates 31 move and clamp the silicon wafers, the second driving member 42 drives the rotating seat 41 at the end side to rotate, so that the rotating seat 41 and the silicon wafer rotate, the angle of the silicon wafer is adjusted, and the polishing assembly 5 can polish the edge of the silicon wafer comprehensively.

[0023] Specifically, the driving rod 411 with a polygonal cross section is coaxially and fixedly connected to the rotating seat 41 of the sliding plate 31 at the end side in the placing frame 2. The driving gear 22 is rotatingly connected to the end face of the placing frame 2. The through hole with a shape matched with the cross section of the driving rod 411 is coaxially formed in the driving gear 22. The driving rod 411 is coaxially and slidingly arranged in the driving gear 22. The second driving member 42 can be a first driving motor. The first driving motor is fixedly arranged on the placing frame 2. The output shaft of the first driving motor is coaxially connected with the transmission gear. The transmission gear is in meshing transmission connection with the driving gear 22.

[0024] In the embodiment of the present application, the rotating seat 41 is rotatably connected to the sliding plate 31 through a bearing, so that the rotating seat 41 and the silicon wafer rotate smoothly. In order to protect the end face of the silicon wafer, in the embodiment of the present application, the two side end faces of the rotating seat 41 are fixedly provided with rubber pads 412 for frictionally contacting the silicon wafer. When the rotating seat 41 contacts the silicon wafer, the rubber pads 412 protect the silicon wafer. When there is no silicon wafer in the placing cavity, the adjacent rotating seats 41 contact each other through the rubber pads 412, so that the rotating seats 41 can rotate synchronously.

[0025] In the embodiment of the present application, the polishing assembly 5 comprises a polishing belt 51, and a plurality of rollers 52 are rotatably arranged on the polishing machine table 1. The polishing belt 51 is arranged around the rollers 52. One end of each roller 52 is coaxially fixedly connected with a synchronous wheel. A synchronous belt is arranged around and engaged with the synchronous wheels of the plurality of rollers 52. A second driving motor 53 is arranged on the polishing machine table 1 and is in transmission connection with the synchronous wheel of any one of the rollers 52. In order to keep the polishing belt 51 taut, a tensioning roller can also be arranged on the polishing machine table 1, and the polishing belt 51 is arranged around the tensioning roller. The two ends of the tensioning roller are rotatably connected to sliding blocks, and the sliding blocks are slidingly installed on the polishing machine table 1. The polishing machine table 1 is provided with a spring, which pushes the sliding blocks to move, so that the tensioning roller supports and tenses the polishing belt 51.

[0026] In the embodiment of the present application, the placing frame 2 is composed of a support frame 23 and a lifting frame 24. The lifting frame 24 is vertically arranged above the support frame 23. The fixing assembly and the driving assembly are arranged on the lifting frame 24. The support frame 23 is fixedly provided with support rods 231. The support rods 231 are at least two in number and are circumferentially and interval ly distributed. When the silicon wafer is placed in the placing frame 2, the lower edge of the silicon wafer is supported by the support rods 231. After the silicon wafer is clamped and fixed by the fixing assembly, the lifting frame 24 is lifted, so that the silicon wafer is lifted to the upper edge and contacts the polishing belt 51.

[0027] Specifically, a guide column 232 is vertically and fixedly arranged on the support frame, a guide hole is formed through the lifting frame 24, the guide column 232 penetrates the guide hole, a lead screw 233 is vertically and rotatably arranged on the support frame 23, a servo motor (not shown in the figure) for driving the lead screw 233 to rotate is arranged on the support frame 23, a lead screw sleeve 241 is fixedly arranged on the lifting frame 24, and the lead screw 233 threadedly cooperates with the lead screw sleeve 241.

[0028] Those skilled in the art will appreciate that although a preferred embodiment of the present application has been described, those skilled in the art will be able to devise alterations and modifications of the preferred embodiment without departing from the spirit and scope of the present application. Accordingly, it is intended that the appended claims be interpreted as including all such alterations and modifications as fall within the true spirit and scope of the present application. It is apparent that those skilled in the art can, without departing from the spirit and scope of the present application, make various changes and modifications of the present application. Thus, it is intended that the present application cover all such changes and modifications that fall within the scope of the present application, together with all such changes and modifications as are within the scope of the claims below and their equivalents.

Claims

1. A device for grinding the edge of a semiconductor single-crystal silicon wafer, characterized in that: The equipment includes a grinding machine table (1), on which a placement frame (2) is provided for placing multiple silicon wafers side by side, a fixing component for simultaneously fixing multiple silicon wafers is provided on the placement frame (2), a driving component for simultaneously driving multiple silicon wafers to rotate is provided on the placement frame (2), and a grinding component (5) for grinding the edges of silicon wafers is provided on the grinding machine table (1) above the placement frame (2). The fixing assembly includes a sliding plate (31) and a first driving member (32). Multiple sliding plates (31) are spaced apart in the placement frame (2) along the silicon wafer arrangement direction. A placement cavity for placing silicon wafers is formed between adjacent sliding plates (31). The first driving member (32) is disposed on the placement frame (2) and is used to push the sliding plate (31) located on the end side to move. The driving assembly includes a rotating seat (41) and a second driving member (42). A rotating seat (41) is rotatably disposed on each sliding plate (31). The rotating seat (41) protrudes from both sides of the sliding plate (31). The second driving member (42) is disposed on the placement frame (2) and is used to drive the rotating seat (41) on the sliding plate (31) located on the end side to rotate.

2. The semiconductor single-crystal silicon wafer edge polishing device according to claim 1, characterized in that, Guide rods (21) are fixedly provided on both sides of the placement frame (2) along the silicon wafer arrangement direction. Guide sleeves (311) are fixedly connected to both ends of the sliding plate (31). The guide sleeves (311) are slidably sleeved on the guide rods (21). The first driving component (32) includes a cylinder. A cylinder is fixedly provided at both ends of the placement frame (2). The output ends of the two cylinders are fixedly connected to the sliding plates (31) on both ends of the placement frame (2).

3. The semiconductor single-crystal silicon wafer edge polishing device according to claim 2, characterized in that, The second driving component (42) includes a first driving motor. A driving rod (411) with a polygonal cross section is coaxially fixedly connected to the rotating seat (41) of the sliding plate (31) on the inner end side of the placement frame (2). A driving gear (22) is rotatably provided on the end face of the placement frame (2). The driving rod (411) is coaxially slidably inserted into the driving gear (22). The first driving motor is fixedly installed on the placement frame (2). The output shaft of the first driving motor is connected to the driving gear (22) in a transmission manner.

4. The semiconductor single-crystal silicon wafer edge polishing device according to claim 3, characterized in that, The rotating seat (41) is rotatably connected to the sliding plate (31) via a bearing, and rubber pads (412) for frictional contact with the silicon wafer are fixedly provided on both end faces of the rotating seat (41).

5. The edge polishing device for semiconductor single-crystal silicon wafers according to claim 1, characterized in that, The grinding assembly (5) includes a grinding belt (51). Several rollers (52) are rotatably arranged on the grinding machine base (1). The grinding belt (51) is wound around the rollers (52). A synchronous pulley is coaxially fixedly connected to one end of each roller (52). A synchronous belt is wound around and meshed on the synchronous pulleys of the multiple rollers (52). A second drive motor (53) is provided on the grinding machine base (1). The second drive motor (53) is connected to the synchronous pulley on any one of the rollers (52) for transmission.

6. The semiconductor single-crystal silicon wafer edge polishing device according to claim 1, characterized in that, The placement frame (2) includes a support frame (23) and a lifting frame (24). The lifting frame (24) is vertically and vertically positioned above the support frame (23). The support frame (23) has multiple support rods (231) fixedly arranged in a circular pattern to support the lower edge of the silicon wafer. The axis of the support rods (231) is parallel to the silicon wafer arrangement direction. The fixing component and the driving component are both arranged on the lifting frame (24). The support frame (23) has a guide post (232) fixedly arranged vertically. The lifting frame (24) has a through guide hole, and the guide post (232) passes through the guide hole. The support frame (23) has a lead screw (233) vertically and rotatably arranged. The support frame (23) has a servo motor for driving the lead screw (233) to rotate. The lifting frame (24) has a lead screw sleeve (241) fixedly arranged. The lead screw (233) and the lead screw sleeve (241) are threadedly engaged.

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