Multifunctional chip mounting device and wafer polishing production line

Abstract

The utility model relates to a multifunctional chip mounting device and a wafer polishing production line, the multifunctional chip mounting device comprises a ceramic disc module, a wafer module, a chip mounting module and a translation module, and the ceramic disc module comprises a ceramic disc feeding unit, at least one ceramic disc cleaning unit, a drying unit and at least one heating unit. The multifunctional chip mounting device has the advantages that the multifunctional chip mounting device integrates cleaning, drying and heating functions, the number of equipment required by a production line and the occupied area are greatly reduced, a ceramic disc cleaning device, a ceramic disc drying device and a ceramic disc heating device do not need to be independently arranged, and the equipment cost is greatly reduced; the ceramic plate cleaning unit can perform gradient cleaning, so that the cleanliness of the ceramic plates is improved; the heating unit can conduct gradient heating, the heating time is shortened, and the heating efficiency is improved.

Description

Technical Field

[0001] This utility model relates to the field of wafer polishing technology, and in particular to a multi-functional chip mounting device and a wafer polishing production line. Background Technology

[0002] Existing wafer polishing production lines generally include automatic wafer unloaders, ceramic disc washing machines, ceramic disc drying machines, waxing machines, mechanical polishing machines, wafer washing machines, disc storage, linear conveyor modules, rough polishers, and fine polishers. The production process is generally as follows: the automatic wafer unloader separates the wafer from the ceramic disc; the ceramic disc enters the subsequent ceramic disc washing machine for cleaning; the ceramic disc drying machine dries the ceramic disc; the ceramic disc enters the waxing machine to apply wax to the wafer; the mechanical polishing machine performs mechanical polishing on the wafer and ceramic disc; the wafer washing machine washes the mechanically polished wafer and ceramic disc; the wafer and ceramic disc are sequentially fed into the rough polisher and fine polisher via the linear conveyor module for rough polishing and fine polishing, respectively; after polishing, the automatic wafer unloader separates the wafer from the ceramic disc.

[0003] Existing wafer polishing production lines have the following drawbacks:

[0004] 1) It occupies a large area and has complex functional modules;

[0005] 2) Low production efficiency, poor cleaning cleanliness, and long heating time result in a long time to complete the waxing of a single ceramic plate, which affects subsequent processes.

[0006] Currently, no effective solutions have been proposed for the problems existing in related technologies, such as large footprint, low production efficiency, low cleaning cleanliness, and long process time. Utility Model Content

[0007] The purpose of this invention is to address the shortcomings of existing technologies by providing a multi-functional chip mounting device and wafer polishing production line, thereby solving problems such as large footprint, low production efficiency, low cleaning cleanliness, and long processing time in related technologies.

[0008] To achieve the above objectives, the technical solution adopted by this utility model is as follows:

[0009] In a first aspect, a multifunctional patch device is provided, comprising:

[0010] Ceramic plate module, used for the ceramic plate supply process;

[0011] Wafer modules are used for wafer supply processes.

[0012] A surface mount module is disposed downstream of the ceramic disk module and downstream of the wafer module, and is used to perform a bonding process to bond the wafer to the ceramic disk.

[0013] A translation module is disposed on the side of the ceramic disk module and the patch module, and is used to perform a translation process;

[0014] The ceramic disc module includes:

[0015] A ceramic disc feeding unit is disposed on the side of the translation module and is used to perform the ceramic disc feeding process.

[0016] At least one ceramic disc cleaning unit is provided, which is located downstream of the ceramic disc feeding unit and on the side of the translation module, and is used to perform the ceramic disc cleaning process.

[0017] A drying unit is located downstream of the ceramic disc cleaning unit and on the side of the translation module, and is used to perform the ceramic disc drying process.

[0018] At least one heating unit is provided, which is located downstream of the drying unit, upstream of the patch module, and on the side of the translation module, for performing a ceramic disc heating process;

[0019] The translation module moves the ceramic disc from the ceramic disc feeding unit to the ceramic disc cleaning unit, from the ceramic disc cleaning unit to the drying unit, from the drying unit to the heating unit, and from the heating unit to the patch module.

[0020] In some embodiments, there are multiple ceramic disc cleaning units, which are arranged sequentially to perform a gradient cleaning process for the ceramic discs.

[0021] In some embodiments, there are two ceramic disc cleaning units, wherein the two ceramic disc cleaning units are a first ceramic disc cleaning unit and a second ceramic disc cleaning unit, respectively.

[0022] The first ceramic disc cleaning unit is located downstream of the ceramic disc feeding unit and on the side of the translation module, and is used to perform a rough cleaning process for the ceramic disc.

[0023] The second ceramic disc cleaning unit is located downstream of the first ceramic disc cleaning unit, upstream of the drying unit, and on the side of the translation module, and is used to perform a fine cleaning process for the ceramic discs.

[0024] The translation module moves the ceramic disc from the ceramic disc feeding unit to the first ceramic disc cleaning unit, from the first ceramic disc cleaning unit to the second ceramic disc cleaning unit, and from the second ceramic disc cleaning unit to the drying unit.

[0025] In some embodiments, there are multiple heating units arranged sequentially for performing a gradient heating process on a ceramic disc.

[0026] In some embodiments, there are three heating units, wherein the three heating units are a first heating unit, a second heating unit, and a third heating unit, respectively.

[0027] The first heating unit is located downstream of the drying unit and on the side of the translation module, and is used to perform the first preheating process of the ceramic disc;

[0028] The second heating unit is located downstream of the first heating unit and on the side of the translation module, and is used to perform the second preheating process of the ceramic disc;

[0029] The third heating unit is located downstream of the second heating unit, upstream of the patch module, and on the side of the translation module, and is used for the ceramic disc heating process;

[0030] The translation module moves the ceramic disc from the drying unit to the first heating unit, from the first heating unit to the second heating unit, from the second heating unit to the third heating unit, and from the third heating unit to the patch module.

[0031] In some embodiments, the wafer module includes:

[0032] The wafer loading unit is used to perform the wafer loading process.

[0033] A wax coating unit is located downstream of the wafer loading unit and is used to perform the wafer wax coating process.

[0034] A wafer transfer unit is located downstream of the wax coating unit and is used to perform a wafer transfer process to transfer the wafer to a ceramic disk.

[0035] In some embodiments, the patch module includes:

[0036] A lifting and rotating unit is disposed downstream of the heating unit of the ceramic disc module and on the side of the translation module, and is used to perform the lifting and rotating process of the ceramic disc;

[0037] A pressing unit is disposed on the upper part of the lifting and rotating unit and is used for performing a wafer pressing process;

[0038] A cooling and pressing unit is located downstream of the lifting and rotating unit and on the side of the translation module, and is used to perform the cooling and pressing process;

[0039] A cooling unit is located downstream of the lifting and rotating unit and on the side of the translation module, and is used to perform a cooling process.

[0040] Secondly, a wafer polishing production line is provided, comprising:

[0041] The multifunctional patch device as described in the first aspect.

[0042] In some of these embodiments, it also includes:

[0043] A first conveying device is located upstream of the multifunctional patching device and is used for conveying ceramic discs.

[0044] The second conveying device is located downstream of the multi-functional patch device and is used for conveying ceramic disks with wafers attached.

[0045] A polishing device, located downstream of the second conveying device, is used for performing a wafer polishing process;

[0046] The third conveying device is located downstream of the polishing device and is used for conveying the ceramic disk after wafer polishing.

[0047] A wafer scraping device is located downstream of the third conveying device and upstream of the first conveying device, and is used to perform a wafer scraping process to separate the wafer from the ceramic disk.

[0048] In some embodiments, the polishing apparatus includes:

[0049] At least one rough polishing unit is provided, which is located downstream of the second conveying device and is used to perform a wafer rough polishing process.

[0050] At least one fine polishing unit is provided, which is located downstream of the coarse polishing unit and is used to perform the wafer fine polishing process.

[0051] At least one ceramic disc transfer unit is provided, which is disposed on the side of the coarse polishing unit and the side of the fine polishing unit, and is used to perform the ceramic disc transfer process;

[0052] The ceramic disk transfer unit transfers the ceramic disk with the wafer attached from the second conveying device to the coarse polishing unit, from the coarse polishing unit to the fine polishing unit, and from the fine polishing unit to the third conveying device.

[0053] In some of these embodiments, it also includes:

[0054] A lifting device is provided, which is located downstream of the second conveying device and upstream of the polishing device, and / or, which is located downstream of the polishing device and upstream of the third conveying device, for performing a lifting process of a ceramic disk with a wafer attached.

[0055] In some of these embodiments, it also includes:

[0056] A receiving device is disposed between the polishing device and the third conveying device for performing a liquid receiving process.

[0057] The present invention adopts the above technical solution and has the following technical effects compared with the prior art:

[0058] This utility model discloses a multifunctional chip mounting device and a wafer polishing production line. The multifunctional chip mounting device integrates cleaning, drying, and heating functions, which greatly reduces the number of equipment and floor space required for the production line. It eliminates the need for separate ceramic disc cleaning devices, ceramic disc drying devices, and ceramic disc heating devices, thus significantly reducing equipment costs. The ceramic disc cleaning unit can perform gradient cleaning to improve the cleanliness of the ceramic discs. The heating unit can perform gradient heating to shorten the heating time and improve the heating efficiency. Attached Figure Description

[0059] Figure 1 This is a schematic diagram (a) of a multifunctional patch device according to an embodiment of the present utility model;

[0060] Figure 2 This is a schematic diagram (II) of a multifunctional patch device according to an embodiment of the present utility model.

[0061] Figure 3 This is a schematic diagram (a) of a wafer polishing production line according to an embodiment of the present utility model;

[0062] Figure 4 This is a schematic diagram (II) of a wafer polishing production line according to an embodiment of the present invention.

[0063] The reference numerals in the attached drawings are as follows: 100, multi-functional chip mounting device; 110, ceramic disc module; 111, ceramic disc loading unit; 112, ceramic disc cleaning unit; 113, drying unit; 114, heating unit; 120, wafer module; 121, wafer loading unit; 122, wax coating unit; 123, wafer transfer unit; 124, edge finding unit; 130, chip mounting module; 131, lifting and rotating unit; 132, pressing unit; 133, cooling and pressing unit; 134, cooling unit; 140, translation module;

[0064] 200. First conveying device; 300. Second conveying device;

[0065] 400. Polishing device; 410. Coarse polishing unit; 420. Fine polishing unit; 430. Ceramic disc transfer unit;

[0066] 500. Third conveying device;

[0067] 600. Shovel blade device;

[0068] 700. Lifting device;

[0069] 800. Receiving device. Detailed Implementation

[0070] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those skilled in the art without creative effort are within the protection scope of the present utility model.

[0071] It should be noted that, unless otherwise specified, the embodiments and features described in these embodiments can be combined with each other.

[0072] The present invention will be further described below with reference to the accompanying drawings and specific embodiments, but this is not intended to limit the present invention.

[0073] Example 1

[0074] This embodiment relates to the multifunctional patch device of this utility model.

[0075] An illustrative embodiment of this utility model, such as Figures 1-2 As shown, a multifunctional chip mounting device 100 includes a ceramic disk module 110, a wafer module 120, a chip mounting module 130, and a translation module 140. The ceramic disk module 110 is used for a ceramic disk supply process; the wafer module 120 is used for a wafer supply process; the chip mounting module 130 is located downstream of the ceramic disk module 110 and downstream of the wafer module 120, and is used for a bonding process to bond the wafer to the ceramic disk; the translation module 140 is located on the side of the ceramic disk module 110 and the chip mounting module 130, and is used for a translation process.

[0076] Generally, the wafer module 120 is located on the side of the ceramic disk module 110.

[0077] In some embodiments, the translation module 140 is a reciprocating translation mechanism, such as a linear reciprocating translation mechanism or a circular reciprocating translation mechanism, which is a conventional configuration in the art and will not be described in detail here.

[0078] The working principle of the multifunctional patch device 100 of this utility model is as follows:

[0079] The ceramic plate module 110 obtains the ceramic plate to be cleaned from the upstream process, and performs the feeding process, cleaning process, drying process and heating process on the ceramic plate in sequence to obtain a ceramic plate with a preset temperature, and supplies the ceramic plate with the preset temperature to the chip module 130.

[0080] The wafer module 120 obtains wafers from upstream processes, performs cleaning and waxing processes on the wafers to obtain wax-coated wafers, and transfers the wax-coated wafers to the upper surface of a ceramic disk with a preset temperature.

[0081] The chip mounting module 130 obtains a ceramic disk containing a wafer from the ceramic disk module 110, and sequentially performs a pressing process, a cooling pressing process, and a cooling process on the ceramic disk containing the wafer to obtain a ceramic disk with the wafer attached, and then transfers the ceramic disk with the wafer attached to the downstream process.

[0082] The translation module 140 performs a translation process on the ceramic disc, so that the ceramic disc can move between the feeding process, cleaning process, drying process, heating process, pressing process, cooling and pressing process, and cooling process.

[0083] like Figures 1-2 As shown, the ceramic disc module 110 includes a ceramic disc feeding unit 111, at least one ceramic disc cleaning unit 112, a drying unit 113, and at least one heating unit 114. The ceramic tray feeding unit 111 is located on the side of the translation module 140 and is used for the ceramic tray feeding process; the ceramic tray cleaning unit 112 is located downstream of the ceramic tray feeding unit 111 and on the side of the translation module 140 and is used for the ceramic tray cleaning process; the drying unit 113 is located downstream of the ceramic tray cleaning unit 112 and on the side of the translation module 140 and is used for the ceramic tray drying process; the heating unit 114 is located downstream of the drying unit 113, upstream of the patch module 130 and on the side of the translation module 140 and is used for the ceramic tray heating process; the translation module 140 moves the ceramic tray from the ceramic tray feeding unit 111 to the ceramic tray cleaning unit 112, from the ceramic tray cleaning unit 112 to the drying unit 113, from the drying unit 113 to the heating unit 114, and from the heating unit 114 to the patch module 130.

[0084] In some embodiments, the ceramic disc feeding unit 111 includes, but is not limited to, a feeding mechanism, which is a basic feature in the art and will not be described in detail here.

[0085] In some embodiments, there are multiple ceramic disc cleaning units 112, which are arranged sequentially to perform a gradient cleaning process for ceramic discs.

[0086] In this invention, the purpose of setting up multiple ceramic disc cleaning units 112 is to ensure the cleanliness of the ceramic discs without affecting the efficiency of the production line.

[0087] In some embodiments, there are two ceramic disc cleaning units 112. These two units are designated as a first ceramic disc cleaning unit and a second ceramic disc cleaning unit. The first ceramic disc cleaning unit is located downstream of the ceramic disc loading unit 111 and on the side of the translation module 140, and is used for a rough cleaning process. The second ceramic disc cleaning unit is located downstream of the first ceramic disc cleaning unit, upstream of the drying unit 113, and on the side of the translation module 140, and is used for a fine cleaning process. The translation module 140 moves the ceramic discs from the ceramic disc loading unit 111 to the first ceramic disc cleaning unit, from the first ceramic disc cleaning unit to the second ceramic disc cleaning unit, and from the second ceramic disc cleaning unit to the drying unit 113.

[0088] In this invention, the purpose of setting up two ceramic disc cleaning units 112 is to achieve a balance between quantity and efficiency, and to improve the cleanliness of the ceramic discs without increasing the size of the equipment.

[0089] In some embodiments, the ceramic disc cleaning unit 112 includes, but is not limited to, a cleaning mechanism, which is a basic feature in the art and will not be described in detail here.

[0090] In some embodiments, there are multiple heating units 114 arranged sequentially for performing a gradient heating process for the ceramic disc.

[0091] In this invention, the purpose of providing multiple heating units 114 is to improve heating efficiency without affecting production line efficiency. For example, if only one heating unit 114 is used for heating, its heating time is the first heating time; if multiple heating units 114 are used for segmented heating, its heating time is the second heating time, where the second heating time is the sum of the individual heating times of the multiple heating units 114, and the second heating time is less than the first heating time. Furthermore, the second heating time is negatively correlated with the number of heating units 114, that is, the more heating units 114 there are, the shorter the second heating time. For example, if only one heating unit 114 is used, its heating time is 30 minutes; if three heating units 114 are used, the total heating time is 10 minutes.

[0092] In some embodiments, there are three heating units 114, namely a first heating unit, a second heating unit, and a third heating unit. The first heating unit is located downstream of the drying unit 113 and on the side of the translation module 140, and is used for a first preheating process of the ceramic disc. The second heating unit is located downstream of the first heating unit and on the side of the translation module 140, and is used for a second preheating process of the ceramic disc. The third heating unit is located downstream of the second heating unit, upstream of the patch module 130, and on the side of the translation module 140, and is used for a heating process of the ceramic disc. The translation module 140 moves the ceramic disc from the drying unit 113 to the first heating unit, from the first heating unit to the second heating unit, from the second heating unit to the third heating unit, and from the third heating unit to the patch module 130.

[0093] In this invention, the purpose of setting three heating units 114 is to achieve a balance between quantity and efficiency, and to improve heating efficiency without increasing the size of the equipment.

[0094] In some embodiments, the heating unit 114 includes, but is not limited to, a heating structure, which is a basic feature in the art and will not be described in detail here.

[0095] In some of these embodiments, the ceramic disc feeding unit 111, at least one ceramic disc cleaning unit 112, drying unit 113, and at least one heating unit 114 are arranged sequentially along a straight line, and the translation module 140 is disposed on the side of the above units to facilitate linear reciprocating motion.

[0096] like Figures 1-2 As shown, the wafer module 120 includes a wafer loading unit 121, a wax coating unit 122, and a wafer transfer unit 123. The wafer loading unit 121 performs the wafer loading process; the wax coating unit 122 is located downstream of the wafer loading unit 121 and performs the wafer wax coating process; the wafer transfer unit 123 is located downstream of the wax coating unit 122 and performs the wafer transfer process to transfer the wafer to a ceramic disk.

[0097] Generally, the wafer module 120 is located on the side of the heating unit 114.

[0098] In this invention, the working principle of the wafer module 120 is as follows:

[0099] The wafer loading unit 121 carries the wafer to the wax coating unit 122 for the wafer wax coating process;

[0100] The wafer transfer unit 123 acquires a wafer from the wafer loading unit 121 and transfers the wafer to the ceramic disk.

[0101] In some embodiments, the wafer loading unit 121 is a wafer moving mechanism, which is a basic feature in the art and will not be described in detail here.

[0102] In some embodiments, the wax coating unit 122 sequentially performs a wafer wax coating process and a wafer heating process on the wafer. The wafer wax coating process is a spin-coating process.

[0103] In some embodiments, the waxing unit 122 is a waxing mechanism, which is a basic feature in the art and will not be described in detail here.

[0104] In some embodiments, the wafer transfer unit 123 includes, but is not limited to, a multi-axis robot, such as a 4-axis flipping manipulator.

[0105] Furthermore, the wafer module 120 also includes an edge-finding unit 124. The edge-finding unit 124 is located downstream of the wax coating unit 122 and on the side of the wafer transfer unit 123, and is used to perform the wafer edge-finding process.

[0106] Specifically, the wafer transfer unit 123 places the wax-coated wafer in the edge-finding unit 124 for edge finding. After edge finding is completed, the wafer transfer unit 123 transfers the wax-coated wafer to the ceramic disk.

[0107] In some embodiments, the edge finding unit 124 is an edge finder, which is a basic feature in the art and will not be described in detail here.

[0108] like Figures 1-2 As shown, the chip mounting module 130 includes a lifting and rotating unit 131, a pressing unit 132, a cooling and pressing unit 133, and a cooling unit 134. The lifting and rotating unit 131 is located downstream of the heating unit 114 of the ceramic disk module 110 and to the side of the translation module 140, and is used for the ceramic disk lifting and rotating process. The pressing unit 132 is located above the lifting and rotating unit 131 and is used for the wafer pressing process. The cooling and pressing unit 133 is located downstream of the lifting and rotating unit 131 and to the side of the translation module 140, and is used for the cooling and pressing process. The cooling unit 134 is located downstream of the lifting and rotating unit 131 and to the side of the translation module 140, and is used for the cooling process.

[0109] Generally, the ceramic disk lifting and rotating process includes a ceramic disk lifting process and a ceramic disk rotating process. Specifically, the translation module 140 translates the ceramic disk from the heating unit 114 to the lifting and rotating unit 131; the wafer transfer unit 123 transfers the wafer to the ceramic disk; the lifting and rotating unit 131 performs a ceramic disk lifting process; when the ceramic disk is raised to a preset position, the lifting and rotating unit 131 performs a ceramic disk rotating process; when the ceramic disk is rotated to a preset position, the lifting and rotating unit 131 performs a ceramic disk lowering process; when the ceramic disk is lowered to a preset position, the wafer transfer unit 123 transfers another wafer to the ceramic disk; the above steps are repeated until a preset number of wafers are placed on the ceramic disk.

[0110] In this invention, the ceramic disk can hold one wafer or multiple wafers. When holding one wafer, the lifting and rotating unit 131 can perform only the lifting and lowering process of the ceramic disk.

[0111] In some embodiments, the lifting and rotating unit 131 includes, but is not limited to, a lifting and rotating mechanism, which is a basic feature in the art and will not be described in detail here.

[0112] In some embodiments, the pressing unit 132 is a pressing mechanism, such as an airbag pressurization mechanism, which is a basic feature in the art and will not be described in detail here.

[0113] In some embodiments, the cooling pressing process includes a pressing process and a cooling process. The cooling process cools the ceramic disc. The cooling process within the cooling pressing process and the cooling process of the cooling unit 134 are two separate cooling processes.

[0114] In some embodiments, the cooling and pressing unit 133 is a cooling and pressing mechanism, which is a basic feature in the art and will not be described in detail here.

[0115] In some embodiments, the cooling unit 134 is a cooling mechanism, which is a basic feature in the art and will not be described in detail here.

[0116] In some embodiments, the lifting and rotating unit 131 (pressing unit 132), the cooling and pressing unit 133 and the cooling unit 134 are arranged in sequence along a straight line, and the translation module 140 is arranged on the side of the above units to facilitate linear reciprocating motion.

[0117] The method of using this utility model is as follows (taking two ceramic disc cleaning units 112 and three heating units 114 as an example):

[0118] (a) Ceramic Plate Process

[0119] The ceramic tray feeding unit 111 receives ceramic trays transported from the upstream process;

[0120] The translation module 140 translates the ceramic disc located in the ceramic disc feeding unit 111 to the first ceramic disc cleaning unit 112 for the ceramic disc rough cleaning process;

[0121] The translation module 140 translates the ceramic plate that has undergone the rough washing process to the second ceramic plate cleaning unit 112 for the fine washing process.

[0122] The translation module 140 translates the ceramic disc that has undergone the ceramic disc fine washing process to the drying unit 113 for the ceramic disc drying process;

[0123] The translation module 140 translates the ceramic disc that has undergone the ceramic disc drying process to the first heating unit 114 for the first preheating process of the ceramic disc;

[0124] The translation module 140 translates the ceramic disc, which has undergone the first preheating process, to the second heating unit 114 for the second preheating process.

[0125] The translation module 140 translates the ceramic disc, which has undergone the second preheating process, to the third heating unit 114 for the ceramic disc heating process;

[0126] The translation module 140 translates the ceramic disc, which has undergone the ceramic disc heating process, to the lifting and rotating unit 131;

[0127] (ii) Wafer Process

[0128] The wafer loading unit 121 receives wafers transported from the upstream process;

[0129] The wafer loading unit 121 moves the wafer to the wax coating unit 122 for the wax coating process;

[0130] The wafer transfer unit 123 transfers the wafer that has undergone the wax coating process to the edge finding unit 124 for the edge finding process;

[0131] The wafer transfer unit 123 places the wafer that has undergone the edge-finding process onto the ceramic disk located in the lifting and rotating unit 131;

[0132] (III) Surface Mount Process

[0133] The clamping unit 132 descends to perform a wafer pressing process on the wafer located on the ceramic disk;

[0134] The lifting and rotating unit 131 sequentially performs the ceramic disc lifting process, the ceramic disc rotating process, and the ceramic disc lowering process;

[0135] Repeat the above steps until the ceramic disk is fully covered with the wafer;

[0136] The translation module 140 translates the ceramic disk covered with the wafer to the cooling and pressing unit 133 for cooling and pressing.

[0137] The translation module 140 translates the ceramic disc that has undergone the cooling and pressing process to the cooling unit 134 for the cooling process;

[0138] The translation module 140 translates the ceramic disc that has undergone the cooling process to the next process;

[0139] After completing the above procedures, the translation module 140 returns to the starting point and repeats steps (1) to (3).

[0140] The technical effects of this utility model are as follows:

[0141] 1) The multi-functional chip mounting device integrates cleaning, drying and heating functions, which greatly reduces the number of equipment and floor space required for the production line. There is no need to set up separate ceramic plate cleaning devices, ceramic plate drying devices and ceramic plate heating devices, which greatly reduces equipment costs.

[0142] 2) The ceramic plate cleaning unit can perform gradient cleaning to improve the cleanliness of the ceramic plate;

[0143] 3) The heating unit can perform gradient heating, which shortens the heating time and improves heating efficiency.

[0144] Example 2

[0145] This embodiment relates to the wafer polishing production line of this utility model.

[0146] An illustrative embodiment of this utility model, such as Figures 3-4 As shown, a wafer polishing production line includes a multifunctional chip mounting device 100 as described in Example 1.

[0147] Furthermore, such as Figures 3-4 As shown, the wafer polishing production line also includes a first conveying device 200, a second conveying device 300, a polishing device 400, a third conveying device 500, and a wafer scraping device 600. The first conveying device 200 is located upstream of the multi-functional chip mounting device 100 and is used for conveying ceramic disks; the second conveying device 300 is located downstream of the multi-functional chip mounting device 100 and is used for conveying ceramic disks with wafers attached; the polishing device 400 is located downstream of the second conveying device 300 and is used for wafer polishing; the third conveying device 500 is located downstream of the polishing device 400 and is used for conveying ceramic disks after wafer polishing; the wafer scraping device 600 is located downstream of the third conveying device 500 and upstream of the first conveying device 200 and is used for scraping to separate the wafer from the ceramic disk.

[0148] In this invention, the multi-functional chip mounting device 100, the first conveying device 200, the second conveying device 300, the polishing device 400, the third conveying device 500, and the wafer scraping device 600 form a circular production line, namely a wafer polishing production loop. This design aims to reduce the floor space required for the production line, and the end-to-end connection of the various devices improves production line efficiency.

[0149] In some embodiments, the first conveying device 200 is a right-angle transport module, which is a basic feature in the art and will not be described in detail here.

[0150] In some embodiments, the first conveying device 200 further includes a storage tray and a conveying trolley. The conveying trolley is located at the output end of the first conveying device 200; the storage tray is located downstream of the conveying trolley and upstream of the ceramic disc loading unit 111 of the multi-functional patch device 100.

[0151] In some embodiments, the second conveying device 300 is a right-angle transport module, which is a basic feature in the art and will not be described in detail here.

[0152] In some embodiments, the second conveying device 300 further includes a storage tray and a conveying trolley. The storage tray is located downstream of the cooling unit 134 of the multi-functional patch device 100; the conveying trolley is located at the input end of the second conveying device 300 and downstream of the storage tray.

[0153] like Figure 4 As shown, the polishing apparatus 400 includes at least one coarse polishing unit 410, at least one fine polishing unit 420, and at least one ceramic disk transfer unit 430. The coarse polishing unit 410 is located downstream of the second conveying device 300 and is used for the wafer coarse polishing process; the fine polishing unit 420 is located downstream of the coarse polishing unit 410 and is used for the wafer fine polishing process; the ceramic disk transfer unit 430 is located on the side of the coarse polishing unit 410 and the side of the fine polishing unit 420 and is used for the ceramic disk transfer process; the ceramic disk transfer unit 430 transfers the ceramic disk with the wafer attached from the second conveying device 300 to the coarse polishing unit 410, from the coarse polishing unit 410 to the fine polishing unit 420, and from the fine polishing unit 420 to the third conveying device 500.

[0154] In some embodiments, there are multiple rough polishing units 410. The multiple rough polishing units 410 are arranged sequentially for performing wafer gradient rough polishing processes.

[0155] In some embodiments, the coarse polishing unit 410 includes, but is not limited to, a coarse polishing machine, which is a basic feature in the art and will not be described in detail here.

[0156] In some embodiments, there are multiple fine polishing units 420. These multiple fine polishing units 420 are arranged sequentially for performing wafer gradient fine polishing processes.

[0157] In some embodiments, the fine polishing unit 420 includes, but is not limited to, a fine polishing machine, which is a basic feature in the art and will not be described in detail here.

[0158] In some embodiments, there are multiple ceramic disc transfer units 430. These multiple ceramic disc transfer units 430 are spaced apart. For example, at least one ceramic disc transfer unit 430 is disposed between the coarse polishing unit 410 and the second conveying device 300, at least one ceramic disc transfer unit 430 is disposed between the coarse polishing unit 410 and the fine polishing unit 420, and at least one ceramic disc transfer unit 430 is disposed between the fine polishing unit 420 and the third conveying device 500.

[0159] The number of ceramic disc transfer units 430 is matched with the number of coarse polishing units 410 and fine polishing units 420. Generally, the number of ceramic disc transfer units 430 is greater than the sum of the number of coarse polishing units 410 and the number of fine polishing units 420.

[0160] Preferably, the number of ceramic disc transfer units 430 = the number of coarse polishing units 410 + the number of fine polishing units 420 + 1.

[0161] In some embodiments, the ceramic disk transfer unit 430 includes, but is not limited to, a multi-axis manipulator, which is a basic feature in the art and will not be described in detail here.

[0162] In some embodiments, the third conveying device 500 is a right-angle transport module, which is a basic feature in the art and will not be described in detail here.

[0163] In some embodiments, the shovel device 600 includes, but is not limited to, a shovel machine, which is a basic feature in the art and will not be described in detail here.

[0164] Furthermore, such as Figures 3-4 As shown, the wafer polishing production line also includes a lifting device 700. The lifting device 700 is located downstream of the second conveying device 300 and upstream of the polishing device 400, and / or, the lifting device 700 is located downstream of the polishing device 400 and upstream of the third conveying device 500, for performing a lifting process on ceramic disks with wafers attached.

[0165] Specifically, the lifting device 700 is located downstream of the second conveying device 300 and upstream of the coarse polishing unit 410, and / or the lifting device 700 is located downstream of the fine polishing unit 420 and upstream of the third conveying device 500.

[0166] In this invention, the ceramic disk transfer unit 430 transfers the ceramic disk with the wafer attached from the lifting device 700 to the coarse polishing unit 410, and / or, the ceramic disk transfer unit 430 transfers the ceramic disk with the wafer attached from the fine polishing unit 420 to the lifting device 700.

[0167] In some embodiments, there are two lifting devices 700. The first lifting device 700 is located downstream of the second conveying device 300 and upstream of the coarse polishing unit 410, and the second lifting device 700 is located downstream of the fine polishing unit 420 and upstream of the third conveying device 500.

[0168] In some of these embodiments, the lifting device 700 includes, but is not limited to, an elevator.

[0169] Furthermore, such as Figures 3-4 As shown, the wafer polishing production line also includes a receiving device 800. The receiving device 800 is located between the polishing device 400 and the third conveying device 500, and is used for the liquid receiving process.

[0170] Specifically, the receiving device 800 is located downstream of the fine polishing unit 420 and upstream of the third conveying device 500.

[0171] In this invention, when the ceramic disk transfer unit 430 transfers the ceramic disk with the wafer attached after the polishing process to the third conveying device 500, the ceramic disk may carry some polishing liquid. This polishing liquid may drip during the transfer process. The receiving device 800 can receive the dripping polishing liquid to reduce environmental pollution.

[0172] In some embodiments, the receiving device 800 includes, but is not limited to, a liquid receiving cart.

[0173] The method of using this utility model is as follows:

[0174] The first conveying device 200 conveys the ceramic disc to be cleaned to the multi-functional patch device 100;

[0175] The multi-functional chip mounting device 100 performs a cleaning process on the ceramic disk and a chip mounting process on the wafer and the ceramic disk (see Example 1 for details, which will not be repeated here).

[0176] The multi-functional chip mounting device 100 transports the ceramic disk with the wafer attached to it to the second conveying device 300;

[0177] The second conveying device 300 conveys the ceramic disk with the wafer attached to it to the first lifting device 700;

[0178] The first lifting device 700 performs the lifting process on ceramic disks with wafers attached.

[0179] The ceramic disk transfer unit 430 transfers the ceramic disk with the wafer attached from the lifting device 700 to the coarse polishing unit 410;

[0180] The rough polishing unit 410 performs a rough polishing process on the wafer;

[0181] After the rough polishing process is completed, the ceramic disk transfer unit 430 transfers the ceramic disk with the wafer attached from the rough polishing unit 410 to the fine polishing unit 420.

[0182] The fine polishing unit 420 performs a fine polishing process on the wafer;

[0183] After the fine polishing process is completed, the ceramic disk transfer unit 430 transfers the ceramic disk with the wafer attached from the fine polishing unit 420 to the third conveying device 500. During the transfer process, the receiving device 800 catches the dripping polishing liquid.

[0184] The third conveying device 500 conveys the ceramic disk with the wafer attached, which has completed the polishing process, to the second lifting device 700.

[0185] The second lifting device 700 lowers the ceramic disk with the wafer attached and conveys it to the shovel device 600.

[0186] The wafer scraping device 600 performs a wafer scraping process on the ceramic disk to which the wafer is attached, so as to separate the wafer from the ceramic disk and transport the ceramic disk to the first conveying device 200.

[0187] Repeat the above steps until all wafer polishing processes are completed.

[0188] The technical effects of this utility model are basically the same as those of Embodiment 1, and will not be repeated here.

[0189] The above description is only a preferred embodiment of the present utility model and does not limit the implementation method and protection scope of the present utility model. Those skilled in the art should realize that all solutions obtained by equivalent substitutions and obvious changes made based on the description and illustrations of the present utility model should be included within the protection scope of the present utility model.

Claims

1. A multi-functional patch device characterized by, The application relates to a ceramic disc manufacturing system. The ceramic disc manufacturing system comprises: a ceramic disc module for performing a ceramic disc supplying process; a wafer module for performing a wafer supplying process; a patch module arranged downstream of the ceramic disc module and downstream of the wafer module, for performing a wafer patching process to patch a wafer to a ceramic disc; a translation module arranged at the side of the ceramic disc module and the patch module, for performing a translation process; The ceramic disc module comprises: a ceramic disc loading unit arranged at the side of the translation module, for performing a ceramic disc loading process; at least one ceramic disc cleaning unit arranged downstream of the ceramic disc loading unit and at the side of the translation module, for performing a ceramic disc cleaning process; a drying unit arranged downstream of the ceramic disc cleaning unit and at the side of the translation module, for performing a ceramic disc drying process; at least one heating unit arranged downstream of the drying unit, upstream of the patch module and at the side of the translation module, for performing a ceramic disc heating process; 2. The multi-functional patch device of claim 1, wherein, The translation module translates the ceramic disc from the ceramic disc loading unit to the ceramic disc cleaning unit, from the ceramic disc cleaning unit to the drying unit, from the drying unit to the heating unit and from the heating unit to the patch module.

3. The multi-functional patch device of claim 2, wherein, The ceramic disc cleaning unit is a plurality of ceramic disc cleaning units arranged in sequence, for performing a ceramic disc gradient cleaning process. The ceramic disc cleaning unit is two ceramic disc cleaning units, namely a first ceramic disc cleaning unit and a second ceramic disc cleaning unit; The first ceramic disc cleaning unit is arranged downstream of the ceramic disc loading unit and at the side of the translation module, for performing a ceramic disc rough cleaning process; The second ceramic disc cleaning unit is arranged downstream of the first ceramic disc cleaning unit, upstream of the drying unit and at the side of the translation module, for performing a ceramic disc fine cleaning process; 4. The multi-functional patch device of claim 1, wherein, The translation module translates the ceramic disc from the ceramic disc loading unit to the first ceramic disc cleaning unit, from the first ceramic disc cleaning unit to the second ceramic disc cleaning unit and from the second ceramic disc cleaning unit to the drying unit.

5. The multi-functional patch device of claim 4, wherein, The heating unit is a plurality of heating units arranged in sequence, for performing a ceramic disc gradient heating process. The heating unit is three heating units, namely a first heating unit, a second heating unit and a third heating unit; The first heating unit is arranged downstream of the drying unit and at the side of the translation module, for performing a first ceramic disc preheating process; The second heating unit is arranged downstream of the first heating unit and at the side of the translation module, for performing a second ceramic disc preheating process; The third heating unit is arranged downstream of the second heating unit, upstream of the patch module and at the side of the translation module, for performing a ceramic disc heating process; The translation module translates the ceramic disc from the drying unit to the first heating unit, from the first heating unit to the second heating unit, from the second heating unit to the third heating unit, and from the third heating unit to the patch module.

6. The multi-functional patch device of claim 1, wherein, The wafer module comprises: a wafer loading unit for performing a wafer loading process; a wax coating unit arranged downstream of the wafer loading unit for performing a wafer wax coating process; a wafer transfer unit arranged downstream of the wax coating unit for performing a wafer transfer process to transfer the wafer to the ceramic disc; and / or The patch module comprises: a lifting and rotating unit arranged on the side of the heating unit of the ceramic disc module and on the side of the translation module downstream of the lifting and rotating unit for performing a lifting and rotating process of the ceramic disc; a pressing unit arranged on the upper part of the lifting and rotating unit for performing a wafer pressing process; a cooling and pressing unit arranged on the side of the lifting and rotating unit downstream of the cooling and pressing unit and on the side of the translation module for performing a cooling and pressing process; a cooling unit arranged on the side of the lifting and rotating unit downstream of the cooling unit and on the side of the translation module for performing a cooling process.

7. A wafer polishing production line characterized by comprising: It comprises: The multifunctional patch device according to any one of claims 1-6.

8. The wafer polishing production line according to claim 7, wherein It further comprises: a first conveying device arranged upstream of the multifunctional patch device for performing a ceramic disc conveying process; a second conveying device arranged downstream of the multifunctional patch device for performing a ceramic disc conveying process with a wafer; a polishing device arranged downstream of the second conveying device for performing a wafer polishing process; a third conveying device arranged downstream of the polishing device for performing a ceramic disc conveying process after wafer polishing; a spatula device arranged downstream of the third conveying device and upstream of the first conveying device for performing a wafer separation process from the ceramic disc.

9. The wafer polishing production line according to claim 8, wherein The polishing device comprises: at least one rough polishing unit arranged downstream of the second conveying device for performing a wafer rough polishing process; at least one fine polishing unit arranged downstream of the rough polishing unit for performing a wafer fine polishing process; at least one ceramic disc transfer unit arranged on the side of the rough polishing unit and on the side of the fine polishing unit for performing a ceramic disc transfer process; The ceramic disc transfer unit transfers the ceramic disc with a wafer from the second conveying device to the rough polishing unit, from the rough polishing unit to the fine polishing unit, and from the fine polishing unit to the third conveying device.

10. The wafer polishing production line according to claim 8 or 9, characterized in that, It further comprises: a lifting device arranged downstream of the second conveying device and upstream of the polishing device, and / or arranged downstream of the polishing device and upstream of the third conveying device for performing a ceramic disc lifting process with a wafer; and / or ​ A receiving device is provided between the polishing device and the third conveyance device for performing a liquid receiving process.

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