Drilling device and PCB processing equipment

Abstract

The utility model relates to a drilling device and PCB processing equipment. The drilling device comprises a main shaft, an equal-height piece and a cutter detector, the main shaft is connected with a cutter and a presser foot module, and at least one of the main shaft and the cutter detector moves in the first direction, so that the drilling device is switched between a first detection position and a second detection position. The drilling device is located at the first detection position, so that the abutting face of the presser foot module abuts against the upper end face of the equal-height piece, and the position of the main shaft can be obtained; and the drilling device is located at the second detection position, so that the tool detector can detect the position of the tool. When the drilling device is located at the first detection position, the presser foot module does not need to make contact with the tool detector, so that the risk that the tool detector fails due to the fact that the presser foot module extrudes the tool detector is reduced, the tool detector is not prone to damage, and the service life of the tool detector is prolonged.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of mechanical processing, in particular to a drilling device and a PCB processing equipment. BACKGROUND

[0002] The drilling device is generally used for drilling processing of a PCB (Printed Circuit Board). The drilling device includes a tool for drilling operation, a main shaft for driving the tool to rotate, and a presser foot module pressed on the PCB to prevent displacement or vibration of the PCB. When drilling operation is performed, since the distance between the abutting surface of the tool and the presser foot module in the vertical direction is a known value, the depth control can be completed when the presser foot module contacts the surface of the PCB during drilling.

[0003] With long-time use of the drilling device, the presser foot module will be worn out. If regular inspection and adjustment are not performed, the depth control error will occur in the later period. In order to avoid the influence of the depth control precision of the drilling device due to abnormal tool or wear of the presser foot module during processing of the drilling device, the distance between the abutting surface of the tool and the presser foot module in the vertical direction needs to be detected before the main shaft drives the tool to perform drilling operation.

[0004] In the related art, the distance between the abutting surface of the tool and the presser foot module in the vertical direction is measured by a tool detector. During the measurement process, the presser foot module needs to be pressed on the tool detector all the time. However, the tool detector is a precision detection instrument, and will be damaged due to frequent pressing. Content of the utility model

[0005] Therefore, it is necessary to provide a drilling device for solving the problem that the tool detector is easily damaged in the existing drilling device for measuring the distance between the abutting surface of the tool and the presser foot module.

[0006] A drilling device applied to a PCB processing equipment, the PCB processing equipment including a workbench, the drilling device including:

[0007] a main shaft connected with a presser foot module below the main shaft; and

[0008] a leveling piece and a tool detector arranged on the workbench in a first direction respectively.

[0009] At least one of the main shaft and the tool detector is movable in the first direction, so that the drilling device is selectively in a first detection position or a second detection position. When the drilling device is in the first detection position, the abutting surface of the presser foot module abuts against the upper end surface of the leveling piece. When the drilling device is in the second detection position, the tool detector can measure the position of a tool connected with the main shaft.

[0010] In one of the embodiments, the equal-height member is at the same height as the upper end surface of the presser module in the vertical direction of the PCB processing device.

[0011] In one of the embodiments, the equal-height member is configured with a clearance hole for the drill to pass through.

[0012] In one of the embodiments, the presser module includes a first presser and a second presser arranged at intervals; the number of the clearance holes is two, and the two clearance holes are distributed along the first direction, and the two clearance holes have different diameters.

[0013] In one of the embodiments, the equal-height member is configured with a ventilation hole communicating with the clearance hole.

[0014] In one of the embodiments, the drill detector is configured with a groove, and the drill detector is provided with a detection part arranged in the groove.

[0015] In one of the embodiments, the groove is configured with an opening located at the side surface of the drill detector.

[0016] In one of the embodiments, when the drilling device is in the second detection position, the presser module is arranged at intervals with the drill detector in the vertical direction.

[0017] In one of the embodiments, the drilling device further includes a telescopic driving member arranged at intervals with the main shaft along the first direction; the telescopic driving member is used to drive the presser module to descend or ascend in the vertical direction of the PCB processing device.

[0018] In one of the embodiments, the drilling device further includes a chip suction cover connected to the telescopic driving member, and the side surface of the chip suction cover away from the telescopic driving member is provided with the presser module.

[0019] In one of the embodiments, the drilling device further includes a displacement measurement module arranged at the main shaft, and the displacement measurement module can detect the position of the main shaft when the drilling device is in the first detection position.

[0020] In one of the embodiments, the displacement measurement module includes a grating ruler and a reading head, one of the grating ruler and the reading head is connected to the chip suction cover, and the other of the grating ruler and the reading head is connected to the main shaft.

[0021] In one of the embodiments, the chip suction cover is slidingly connected with a presser plate, and the presser module includes a first presser and a second presser.

[0022] Both the first presser foot and the second presser foot are mounted on the presser foot plate, which is capable of moving along the distribution direction of the first presser foot and the second presser foot, so that one of the first presser foot and the second presser foot is coaxial with the spindle.

[0023] A PCB processing device includes a base, a worktable, a crossbeam, and a drilling device as described above. The worktable is slidably connected to the base and is used to support a PCB. The crossbeam is disposed on the base, and at least one of the drilling devices is slidably connected to the crossbeam.

[0024] The aforementioned drilling device switches between a first detection position and a second detection position by moving at least one of the spindle and the tool detector along a first direction. When the drilling device is in the first detection position, the contact surface of the pressure foot module abuts against the upper end surface of the leveling piece; when the drilling device is in the second detection position, the tool detector can measure the position of the tool connected to the spindle. Thus, when the drilling device is in the first detection position, the pressure foot module does not need to contact the tool detector, thereby reducing the risk of the tool detector malfunctioning due to pressure from the pressure foot module, making the tool detector less prone to damage, and thus helping to extend the service life of the tool detector. Attached Figure Description

[0025] Figure 1 A schematic diagram of a drilling apparatus provided in an embodiment of this application from a first-view perspective.

[0026] Figure 2 for Figure 1 The drilling device shown is a schematic diagram from a second-view perspective.

[0027] Figure 3 for Figure 1 The diagram shows a drilling device from a third-person perspective.

[0028] Figure 4 for Figure 3 A partial cross-sectional view of the drilling apparatus shown.

[0029] Figure 5 for Figure 3 A simplified diagram showing the cutting tool in the drilling apparatus at a first horizontal height.

[0030] Figure 6 for Figure 5 A simplified diagram showing the cutting tool in the drilling apparatus at the second horizontal height.

[0031] Icon labels:

[0032] 100. Drilling equipment;

[0033] 110. Spindle; 111. Cutting tool;

[0034] 120, displacement measurement module; 121, grating ruler; 122, reading head; 123, connecting plate;

[0035] 130, equal-height piece; 131, avoiding hole; 133, air hole;

[0036] 140, cutter detector; 141, groove; 142, detection part; 143, opening;

[0037] 150, presser foot module; 151, first presser foot; 152, second presser foot; 153, open slot;

[0038] 160, telescopic driving piece; 161, guide shaft; 162, mounting bracket;

[0039] 170, chip suction cover; 171, presser foot plate;

[0040] 180, fixing frame;

[0041] X, first direction; Z, vertical direction. DETAILED DESCRIPTION

[0042] In order to make the above objectives, features and advantages of the present application more apparent, specific embodiments of the present application are described in detail below with reference to the accompanying drawings. In the following description, numerous specific details are set forth in order to provide a thorough understanding of the present application. However, the present application can be practiced in a variety of ways beyond the specific embodiments described herein without departing from the scope of the present application, and it is understood that similar modifications can be made by those skilled in the art in the light of the following disclosure, and therefore the present application is not limited to the following disclosed specific embodiments.

[0043] In the description of the present application, it should be understood that if these terms "center", "longitudinal", "transverse", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential" and the like appear, these terms indicate the orientation or positional relationship based on the orientation or positional relationship shown in the drawings, and are only for the convenience of describing the present application and simplifying the description, and therefore cannot be understood as indicating or implying that the device or element referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore cannot be understood as limiting the present application.

[0044] In addition, the terms "first", "second", and the like, if any, are used herein for descriptive purposes only and should not be construed as indicating or implying relative importance or implicating the number of indicated technical features. Thus, a feature defined with "first" or "second" can include at least one of the features explicitly or implicitly. In the description of the present application, the term "plurality" means at least two, for example, two, three, etc., unless otherwise explicitly specified and limited.

[0045] In the present application, unless otherwise explicitly specified and limited, if the terms "mounting", "connecting", "connecting", "fixing" and the like appear, these terms should be interpreted broadly. For example, it can be fixedly connected, or it can be detachably connected, or it can be integrated; it can be mechanically connected, or it can be electrically connected; it can be directly connected, or it can be indirectly connected through an intermediate medium; it can be the internal communication of two elements or the interaction relationship between two elements, unless otherwise explicitly limited. For those skilled in the art, the specific meaning of the above terms in the present application can be understood according to the specific circumstances.

[0046] In the present application, unless otherwise explicitly specified and limited, if the first feature is described as "on" or "under" the second feature, etc., it can mean that the first and second features are in direct contact, or the first and second features are indirectly in contact through an intermediate medium. Moreover, the first feature "above", "above" and "above" the second feature can be the first feature directly above or obliquely above the second feature, or it can only mean that the first feature is higher than the second feature in horizontal height. The first feature "below", "below" and "below" the second feature can be the first feature directly below or obliquely below the second feature, or it can only mean that the first feature is lower than the second feature in horizontal height.

[0047] It should be noted that if an element is referred to as "fixed to" or "disposed on" another element, it can be directly on another element or there can be a middle element. If an element is considered to be "connected" to another element, it can be directly connected to another element or there can be a middle element. If present, the terms "vertical", "horizontal", "up", "down", "left", "right" and similar expressions used in the present application are only for illustrative purposes and do not represent the only implementation.

[0048] Reference Figures 3 to 6As shown, the drilling device 100 provided by an embodiment of the present application is applied to a PCB processing equipment, the PCB processing equipment comprises a workbench, the drilling device 100 comprises a spindle 110, an equal-height piece 130 and a tool detector 140; the spindle 110 is connected with a presser foot module 150 located below the spindle 110; it can be understood that the spindle 110 is also connected with a tool 111, and the spindle 110 is used to drive the tool 111 to perform a rotary motion; the presser foot module 150 firmly fixes the PCB on the workbench by applying appropriate pressure on the PCB, prevents the PCB from being displaced or vibrated due to the rotary or feeding motion of the tool 111, and ensures that the PCB remains stable and unmoved during the processing. The equal-height piece 130 and the tool detector 140 are respectively arranged on the workbench, and both are arranged along a first direction; at least one of the spindle 110 and the tool detector 140 can move along the first direction, so that the drilling device 100 can selectively be in a first detection position or a second detection position; when the drilling device 100 is in the first detection position, an abutting surface (i.e. the lower end surface of the presser foot module 150) of the presser foot module 150 abuts against the upper end surface of the equal-height piece 130; it can be understood that the abutting surface of the presser foot module 150 is the end surface of the presser foot module 150 used for abutting against the PCB during drilling; when the drilling device 100 is in the second detection position, the tool detector 140 can measure the position of the tool 111. As shown in Figure 3 As shown, the first direction X is indicated by an arrow X, and the vertical direction Z is indicated by an arrow Z. In Figure 3 In the perspective shown, the first direction X is the left-right direction, and the vertical direction Z is the up-down direction.

[0049] The drilling device 100 described above realizes the control of the drilling depth by the following steps:

[0050] Step 1: The presser foot module 150 is lowered along the vertical direction Z until the abutting surface of the presser foot module 150 abuts against the equal-height piece 130, so that the first position of the spindle 110, i.e. the first horizontal height value, can be obtained;

[0051] Step 2: At least one of the spindle 110 and the tool detector 140 is moved along the first direction X, so that the spindle 110 is moved above the tool detector 140;

[0052] Step 3: As the spindle 110 moves downward along the vertical direction Z, until the tool detector 140 detects the position of the tool 111, the second position of the spindle 110, i.e. the second horizontal height value, can be obtained again;

[0053] Step 4: The first distance D1 of the downward movement of the spindle 110 can be obtained by the difference between the second horizontal height value and the first horizontal height value;

[0054] Step 5: The position of the tool 111 detected by the tool detector 140 and the upper end face of the tool detector 140 have a second distance D2, and the second distance D2 is a known value;

[0055] Step 6: The third distance D3 between the contact surfaces of the tool 111 and the presser foot module 150 along the vertical direction Z can be calculated by the difference between the first distance D1 and the second distance D2.

[0056] Step 7: When it is necessary to drill a hole to the target drilling depth, the pressure foot module 150 contacts the PCB surface. Then, the fourth distance that the spindle 110 continues to move down is the sum of the third distance and the target drilling depth.

[0057] In this way, the drilling device 100 can calibrate the wear degree of the pressure foot module 150, improving the control accuracy of the drilling depth. At the same time, when the drilling device 100 is in the first detection position, the pressure foot module 150 does not need to contact the tool detector 140, thereby reducing the risk of the pressure foot module 150 squeezing the tool detector 140 and causing the tool detector 140 to fail, making the tool detector 140 less prone to damage and extending its service life.

[0058] In some embodiments, the tool detector 140 is used to detect the position of the tool tip 111. Over time, the tool 111 will experience some wear or slight deformation. The tool tip is the foremost working part of the tool 111, and it is the first part to contact the PCB surface. Therefore, by monitoring the position of the tool tip 111 in real time, the PCB processing equipment can automatically adjust the feed rate according to the actual situation, ensuring a consistent drilling depth for each hole.

[0059] In some embodiments, the drilling device 100 includes a displacement measurement module 120 disposed on the spindle 110. When the drilling device 100 is in a first detection position, the displacement measurement module 120 is triggered, thereby enabling the displacement measurement module 120 to detect the position of the spindle 110, i.e., to obtain the first horizontal height value of the spindle 110. By setting the displacement measurement module 120, the position of the spindle 110 can be monitored in real time, improving drilling accuracy.

[0060] In some embodiments, when the drilling device 100 is in the second detection position, the pressure foot module 150 is spaced apart from the tool detector 140 in the vertical direction Z. For example, during the process of the spindle 110 moving downward relative to the tool detector 140, the pressure foot module 150 can be controlled to move upward in the vertical direction Z and maintain a certain distance between it and the upper end face of the tool detector 140 facing the pressure foot module 150. In this way, during the process from the spindle 110 starting to move downward until the tool detector 140 detects the tool 111, the pressure foot module 150 will not come into contact with the tool detector 140, reducing the possibility of contact between the two, thereby reducing the risk of the pressure foot module 150 squeezing the tool detector 140 and causing the tool detector 140 to fail, making the tool detector 140 less prone to damage and extending the service life of the tool detector 140.

[0061] In some embodiments, the spindle 110 has a built-in motor that drives the tool 111 or other cutting tools to rotate. The end of the spindle 110 is typically equipped with a special collet or pull stud structure for securely fixing various types of tools 111 and other cutting tools, ensuring stability during machining.

[0062] In some embodiments, the displacement measurement module 120 can be connected to the pressure foot module 150 to obtain the actual movement distance of the spindle 110. In some embodiments, the displacement measurement module 120 may include a grating ruler 121 connected to the pressure foot module 150. When the contact surface of the pressure foot module 150 contacts and presses against the leveling piece 130 or the PCB, the grating ruler 121 is triggered, causing it to start reading and obtain the first horizontal height value of the spindle 110. The spindle 110 moves downward relative to the grating ruler 121, that is, the grating ruler 121 moves upward relative to the spindle 110. When the spindle 110 moves to the point where the tool detector 140 detects the position of the tool 111, such as the position of the tool tip, the grating ruler 121 stops counting, thereby obtaining the second horizontal height value of the spindle 110 and thus obtaining the downward movement distance of the spindle 110. Then, based on the difference between the first and second horizontal height values, the distance between the contact surface of the presser foot module 150 and the blade tip along the vertical direction Z can be obtained.

[0063] In some embodiments, the spindle 110 gradually moves from a height H above the PCB towards the PCB until the pressure foot module 150 contacts the surface of the PCB, at which point the grating ruler 121 generates a first signal. The first signal can be a pulse signal, and the height H is any height in the direction of spindle 110's movement. It can be the origin or starting position of the spindle 110, or any position during the process of the spindle 110 moving from the starting position to the point where the pressure foot module 150 contacts the PCB; no limitation is imposed here.

[0064] In other embodiments, the displacement measurement module 120 may also be a laser rangefinder or the like.

[0065] See Figures 3 to 6 As shown, in one embodiment, along the vertical direction Z, the upper surface of the leveling member 130 facing the pressure foot module 150 is at the same horizontal height as the upper surface of the tool detector 140 facing the pressure foot module 150. Thus, the upper surface of the leveling member 130 can be equivalent to the upper surface of the tool detector 140. This is achieved by subtracting the second distance along the vertical direction Z between the upper surface of the tool detector 140 and the tool 111 (e.g., the tip of the tool 111) detected by the tool detector 140 from the first distance the spindle 110 moves downward. The difference between these two values ​​represents the distance along the vertical direction Z between the contact surface of the pressure foot module 150 and the tool tip.

[0066] In other embodiments, the horizontal height of the upper surface of the leveling member 130 facing the pressure foot module 150 may also be higher than the horizontal height of the upper surface of the tool detector 140 facing the pressure foot module 150. For example, there may be a fifth distance along the vertical direction Z between the horizontal height of the upper surface of the leveling member 130 and the horizontal height of the upper surface of the tool detector 140. Thus, by subtracting the second distance along the vertical direction Z between the upper surface of the tool detector 140 and the tool 111 (e.g., the tip of the tool 111) detected by the tool detector 140 from the first distance the spindle 110 moves downward, and then subtracting the fifth distance between the upper surface of the leveling member 130 and the upper surface of the tool detector 140, the final second difference is the distance along the vertical direction Z between the contact surface of the pressure foot module 150 and the tool tip.

[0067] See Figures 3 to 4 As shown, in one embodiment, the contour leveling member 130 is provided with a clearance hole 131 for the tool 111 to pass through. By providing the clearance hole 131, the risk of contact wear between the tool 111 and the contour leveling member 130 is reduced when the contact surface of the pressure foot module 150 abuts against the upper surface of the contour leveling member 130, causing the tool 111 to be exposed relative to the pressure foot. At the same time, by providing the clearance hole 131 for the tool 111 to pass through, when the tool 111 is exposed relative to the pressure foot, the tool 111 can be located within the clearance hole 131, and the contact surface of the pressure foot module 150 can still abut against the upper surface of the contour leveling member 130, thus improving the reliability of depth control.

[0068] See Figures 3 to 4As shown, in one embodiment, the pressure foot module 150 includes a first pressure foot 151 and a second pressure foot 152 spaced apart. Both the first pressure foot 151 and the second pressure foot 152 have through holes for the cutting tool 111 to pass through. The two through holes have different diameters to accommodate cutting tools 111 of different sizes and meet the usage requirements under different working conditions. In some embodiments, the clearance holes 131 include two holes, which are distributed along a first direction X. The diameters of the two clearance holes 131 are such that one clearance hole 131 is used for the cutting tool corresponding to the first pressure foot 151 to pass through, and the other clearance hole 131 is used for the cutting tool corresponding to the second pressure foot 152 to pass through. For example, in one embodiment, the first pressure foot 151 is a large pressure foot with a larger corresponding hole diameter, which can be used for larger-sized cutting tools 111; the second pressure foot 152 is a small pressure foot with a smaller corresponding hole diameter, which can be used for smaller-sized cutting tools 111. In some embodiments, the diameter of the second clearance hole 131 may be smaller than the diameter of the first clearance hole 131. The first clearance hole 131 is used for a larger size cutting tool 111 to pass through, while the second clearance hole 131 is used for a smaller size cutting tool 111 to pass through.

[0069] In some embodiments, the first pressure foot 151 is a large pressure foot, and the second pressure foot 152 is a small pressure foot. The diameter of the first clearance hole 131 is smaller than the dimension of the first pressure foot 151 along the first direction X, and the diameter of the second clearance hole 131 is smaller than the diameter of the first clearance hole 131 and smaller than the dimension of the second pressure foot 152 along the first direction X. Thus, when measuring the distance between the contact surface of the second pressure foot 152 and the tool 111 (e.g., the tip of the tool 111), the contact surface of the second pressure foot 152 will only contact the upper surface of the leveling member 130 and will not sink into the corresponding clearance hole 131, ensuring measurement accuracy. In other words, this device can control the depth of the tool 111 corresponding to the first pressure foot 151, and it can also control the depth of the tool 111 corresponding to the second pressure foot 152. This solves the risk that the small pressure foot may fall into the groove 141 of the tool detector 140 when the existing tool detector 140 controls the depth of the tool 111 corresponding to the small pressure foot. It can also measure the distance between the contact surface of the small pressure foot and the tip of the tool.

[0070] See Figures 3 to 4 As shown, in some embodiments, the leveling member 130 is configured with a vent 133 communicating with the clearance hole 131. In some embodiments, the vent 133 is used to connect a dust collection mechanism, such as a vacuum cleaner. When the dust collection mechanism is working, a negative pressure is formed in the vent 133, thereby removing the chips adhering to the tool 111, reducing the risk of chips adhering to the tool 111 and affecting the drilling quality, and improving drilling accuracy. In other embodiments, the vent 133 is used to connect an air blower. By blowing air into the vent 133, the chips adhering to the tool 111 can be blown away, for example, by blowing the chips into the absorption chamber of the chip suction hood 170 (mentioned below).

[0071] See Figures 3 to 4 As shown, in one embodiment, the knife detector 140 has a groove 141 and a detection unit 142 disposed within the groove 141. In some embodiments, the detection unit 142 is a photoelectric sensor, including a transmitter and a receiver. When the knife 111, for example, the tip of the knife 111, moves down to the same horizontal plane as the photoelectric sensor, that is, when the tip is located between the transmitter and receiver, it will block the light emitted by the transmitter, thus indicating that the tip has been detected. In other embodiments, the detection unit 142 can be a probe. When the tip moves down to the same horizontal plane as the probe, it will contact the probe, causing the probe to displace, thus indicating that the tip has been detected.

[0072] See Figure 1 As shown, in some embodiments, the groove 141 is configured with an opening 143 located on the side of the knife detector 140. Thus, the knife 111, for example, the tip of the knife 111, can enter the groove 141 not only from above the knife detector 140, but also from the opening 143 on the side of the knife detector 140, making it more convenient to use.

[0073] See Figures 3 to 4 As shown, in one embodiment, the drilling device 100 further includes a telescopic drive member 160 spaced apart from the spindle 110 along a first direction X. The telescopic drive member 160 drives the pressure foot module 150 to descend or rise in the vertical direction Z. When measuring the distance between the contact surface of the pressure foot module 150 and the tool 111, such as the tip of the tool 111, the telescopic drive member 160 can be used to drive the contact surface of the pressure foot module 150 to abut against the leveling member 130. When it is necessary to replace the tool 111, the telescopic drive member 160 can be used to drive the pressure foot module 150 upward, so that the tool 111 is exposed relative to the pressure foot module 150, thereby facilitating the replacement of the tool 111. In one embodiment, the telescopic drive member 160 is a cylinder. By venting air to the upper end of the cylinder, the cylinder piston rod moves downward, thereby driving the pressure foot module 150 downward and causing the contact surface of the pressure foot module 150 to abut against the leveling member 130 or against the PCB.

[0074] like Figure 3 As shown, in one embodiment, the telescopic drive member 160 includes two sets, which are disposed on both sides of the spindle 110 along the first direction X. When it is necessary to raise or lower the pressure foot, the two sets of telescopic drive members 160 will move simultaneously, so that the two ends of the pressure foot along the X direction are at the same horizontal height. Therefore, it can fit against the surface of the PCB, increase the contact area between the PCB and the pressure foot, thereby ensuring the clamping effect of the pressure foot and thus ensuring the drilling accuracy.

[0075] See Figures 3 to 4As shown, in one embodiment, the drilling apparatus 100 further includes a chip suction cover 170 connected to the telescopic drive member 160. A pressure foot module 150 is provided on the side surface of the chip suction cover 170 facing away from the telescopic drive member 160. The chip suction cover 170 has an absorption cavity, which can collect the chips generated during the drilling process and reduce the risk of chips adhering to the cutting tool 111 and affecting the drilling accuracy.

[0076] To ensure timely removal of chips generated during drilling, the chip extraction hood 170 is equipped with a dust discharge port, which is connected to a dust extraction mechanism, such as a vacuum cleaner. When the dust extraction mechanism is operating, a negative pressure is created within the extraction chamber, thereby expelling the chips generated during drilling through the dust discharge port, reducing pollution to the processing environment, and minimizing the risk of chips adhering to the cutting tool 111 or the PCB, thus affecting drilling quality.

[0077] In some embodiments, the pressure foot module 150 has multiple opening slots 153, each of which communicates with the absorption cavity of the chip suction hood 170. This allows chips generated during drilling to enter the absorption cavity through the opening slots 153, and then be collected by the dust discharge port and the dust suction mechanism. By removing chips adhering to the cutting tool 111, the drilling quality of the PCB is improved, and damage to the cutting tool 111 from chips and other foreign objects is reduced, thereby increasing the service life of the cutting tool 111 and reducing replacement costs.

[0078] See Figures 3 to 4 As shown, in one embodiment, a guide shaft 161 is also provided between the telescopic drive member 160 and the chip suction cover 170 to guide the movement of the presser foot module 150 in the vertical direction Z.

[0079] See Figures 3 to 4 As shown, in some embodiments, the drilling apparatus 100 includes a mounting frame 180, on which the spindle 110 is fixedly connected. The telescopic drive 160 is fixedly connected to the mounting frame 180 via a mounting bracket 162.

[0080] See Figures 3 to 4 As shown, in one embodiment, the displacement measurement module 120 includes a grating ruler 121 and a reading head 122. One of the reading head 122 and the grating ruler 121 is connected to the spindle 110 (or the mounting bracket 180), and the other is connected to the dust collection hood 170. When the contact surface of the pressure foot module 150 contacts the leveling piece 130 or the PCB, the spindle 110 continues to move downward, resulting in relative movement between the spindle 110 and the contact surface of the pressure foot module 150, thereby enabling the measurement of the downward distance of the spindle 110. For example, in... Figure 3In the illustrated embodiment, the grating ruler 121 is connected to the main shaft 110, and the reading head 122 is connected to the chip suction hood 170 via a connecting plate 123. The connecting plate 123 is approximately L-shaped, allowing the reading head 122 and the chip suction hood 170 to be positioned vertically. In other embodiments, the positions of the reading head 122 and the grating ruler 121 can be interchanged; that is, the reading head 122 is connected to the main shaft 110, and the grating ruler 121 is connected to the chip suction hood 170. Using the grating ruler 121 and the reading head 122 as the displacement measurement module 120 allows for extremely high resolution, typically reaching 0.1 micrometers or even smaller, ensuring highly accurate position detection. The reading head 122 can quickly respond to position changes and output measurement results at a high frequency, making it suitable for dynamic control applications. Furthermore, since the grating ruler 121 and the reading head 122 are non-contact measurement devices, they require less routine maintenance, reducing long-term operating costs.

[0081] See Figures 3 to 4 As shown, in one embodiment, a chip suction hood 170 is slidably connected to a pressure foot plate 171, and a pressure foot module 150 includes a first pressure foot 151 and a second pressure foot 152. Both the first pressure foot 151 and the second pressure foot 152 are mounted on the pressure foot plate 171, which is capable of moving along the distribution direction of the first pressure foot 151 and the second pressure foot 152, so that one of the first pressure foot 151 and the second pressure foot 152 is coaxial with the spindle 110. In some embodiments, the pressure foot plate 171 is an arc-shaped plate. When the first pressure foot 151 is on the central axis of the spindle 110, its horizontal height is lower than that of the second pressure foot 152. Therefore, when the pressure foot module 150 descends, the first pressure foot 151 contacts the height equalizer 130, allowing measurement of the distance between the contact surface of the first pressure foot 151 and the corresponding tool 111, such as the tip of the tool 111.

[0082] In other embodiments, when the second pressure foot 152 is on the central axis of the spindle 110, its horizontal height is lower than that of the first pressure foot 151. Therefore, when the pressure foot module 150 descends, the second pressure foot 152 contacts the leveling member 130, allowing measurement of the distance between the contact surface of the second pressure foot 152 and the corresponding tool 111, such as the tip of the tool 111. Thus, by moving the pressure foot plate 171, either the first pressure foot 151 or the second pressure foot 152 can be positioned on the central axis of the spindle 110, and the contact surface of either the first or second pressure foot 151 can contact the leveling member 130, thereby controlling the depth of the tool 111 corresponding to the first or second pressure foot 151 or the second pressure foot 152.

[0083] See Figure 4As shown, in some embodiments, taking the first presser foot 151 as the large presser foot and the second presser foot 152 as the small presser foot as an example, when measuring the distance between the contact surface of the small presser foot and the tool 111, such as the tip of the tool 111, the contact surface of the small presser foot can normally contact the leveling piece 130 and trigger the displacement measurement module 120 to obtain the first horizontal height value of the spindle 110; when the spindle 110 or the tool detector 140 moves along the first direction X so that the spindle 110 is located at the tool detector 14... During the process above 0, the pressure foot plate 171 slides along the distribution direction of the first pressure foot 151 and the second pressure foot 152, so that the first pressure foot 151 is located on the central axis of the spindle 110. As the spindle 110 moves down, the contact surface of the first pressure foot 151 is in contact with the upper end surface of the tool detector 140, and the tool 111 extends into the tool detector 140 until the detection part 142 of the tool detector 140 detects the position of the tool tip and obtains the second horizontal height value of the spindle 110. During calculation, the difference between the second and first horizontal height values ​​yields the first downward distance of the spindle 110. Subtracting the second distance between the detection section 142 of the tool detector 140 and its upper surface from this first distance gives the first difference. Subtracting the distance along the vertical Z-direction between the contact surfaces of the first and second pressure feet 151 and 152 from this first difference gives the second difference, which is the third distance along the vertical Z-direction between the tool tip and the contact surface of the second pressure foot 152. When drilling to the target depth, the contact surface of the second pressure foot 152 contacts the PCB surface, triggering the displacement measurement module 120. The fourth downward distance of the spindle 110 is then the sum of the third distance and the target drilling depth. This allows for depth control of the tool 111 corresponding to the first and second pressure feet 151 and 152, meeting actual usage requirements.

[0084] Furthermore, one embodiment of this application also provides a PCB processing device (not shown), including a base, a worktable slidably connected to the base, a crossbeam, and a drilling device 100 as described in any of the above embodiments. The worktable is used to support the PCB; the crossbeam is disposed on the worktable, and at least one drilling device 100 is slidably connected to the crossbeam. It is understood that any two of the first direction, the second direction, and the vertical direction are perpendicular to each other.

[0085] In some embodiments, the drilling device 100 can move relative to the crossbeam along a first direction X, and the worktable can move relative to the base along a second direction. When measuring the distance between the cutting tool 111, for example, the tip of the cutting tool 111, and the contact surface of the pressure foot module 150, the drilling device 100 moves along the first direction X, allowing the spindle 110 to move above the tool checker 140. During drilling operations, the drilling position can be changed or drilling operations can be performed on PCBs at different locations by moving the drilling device 100 or the worktable.

[0086] In other embodiments, the drilling device 100 may be able to move relative to the crossbeam in a second direction, and the worktable may move relative to the base in a first direction X.

[0087] When the aforementioned PCB processing equipment performs depth control operations, it is not necessary to squeeze the tool 111 through the pressure foot module 150, which reduces the risk of the tool detector 140 failing due to the pressure foot module 150 squeezing the tool detector 140, increases the service life of the tool detector 140, and reduces the replacement cost of the tool detector 140.

[0088] In some embodiments, a linear drive is provided on the crossbeam, and the fixing frame 180 of the drilling device 100 is connected to the output end of the linear drive. When measuring the distance in the vertical direction Z between the cutting tool 111 (e.g., the tip of the cutting tool 111) and the contact surface of the pressure foot module 150, the linear drive can drive the spindle 110 to move downwards, so that the cutting tool 111 can move downwards synchronously, allowing the cutting tip to extend into the groove 141 of the tool detector 140 and be detected by the detection unit 142. During the drilling operation, the linear drive drives the spindle 110 to move in the vertical direction Z, and simultaneously the spindle 110 drives the cutting tool 111 to rotate, thereby completing the drilling operation.

[0089] In some embodiments, the PCB processing equipment may be drilling equipment, forming equipment, router equipment, or integrated drilling and router equipment, etc., without limitation.

[0090] The technical features of the above embodiments can be combined in any way. For the sake of brevity, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0091] The above embodiments merely illustrate several implementation methods of this application, and while the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the patent application. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of this application, and these all fall within the protection scope of this application. Therefore, the protection scope of this patent application should be determined by the appended claims.

Claims

1. A drilling device, characterized in that, Applied to PCB processing equipment, the PCB processing equipment includes a worktable, and the drilling device includes: A spindle (110), wherein a pressure foot module (150) is connected below the spindle (110); and The leveling piece (130) and the tool detector (140) are respectively disposed on the worktable, and both are disposed along the first direction (X); At least one of the spindle (110) and the tool detector (140) can move along a first direction (X) so that the drilling device can be selectively in a first detection position or a second detection position; when the drilling device is in the first detection position, the contact surface of the pressure foot module (150) presses against the upper end surface of the leveling member (130); when the drilling device is in the second detection position, the tool detector (140) can measure the position of the tool (111) connected to the spindle (110).

2. The drilling apparatus according to claim 1, characterized in that, Along the vertical direction (Z) of the PCB processing equipment, the upper surface of the leveling piece (130) facing the presser foot module (150) is at the same horizontal height as the upper surface of the tool inspector (140) facing the presser foot module (150).

3. The drilling apparatus according to claim 1, characterized in that, The contour piece (130) is constructed with a clearance hole (131) for the cutting tool (111) to pass through.

4. The drilling apparatus according to claim 3, characterized in that, The presser foot module (150) includes a first presser foot (151) and a second presser foot (152) spaced apart; there are two clearance holes (131), which are distributed along the first direction (X) and have different diameters.

5. The drilling apparatus according to claim 3, characterized in that, The leveling member (130) is constructed with a vent (133) that communicates with the clearance hole (131).

6. The drilling apparatus according to any one of claims 1 to 5, characterized in that, The knife detector (140) has a groove (141) and a detection part (142) is provided in the groove (141).

7. The drilling apparatus according to claim 6, characterized in that, The groove (141) is configured with an opening (143) located on the side of the knife detector (140).

8. The drilling apparatus according to any one of claims 1 to 5, characterized in that, When the drilling device is in the second detection position, the presser foot module (150) is arranged vertically at a distance from the tool detector (140).

9. The drilling apparatus according to claim 8, characterized in that, The drilling device further includes a telescopic drive member (160) spaced apart from the spindle (110) along a first direction (X); the telescopic drive member (160) is used to drive the presser foot module (150) to descend or rise along the vertical direction (Z) of the PCB processing equipment.

10. The drilling apparatus according to claim 9, characterized in that, The drilling device also includes a chip suction cover (170) connected to the telescopic drive (160), and the pressure foot module (150) is provided on the side surface of the chip suction cover (170) facing away from the telescopic drive (160).

11. The drilling apparatus according to claim 10, characterized in that, The drilling device also includes a displacement measurement module (120), which is disposed on the spindle (110). When the drilling device is in the first detection position, the displacement measurement module (120) can detect the position of the spindle (110).

12. The drilling apparatus according to claim 11, characterized in that, The displacement measurement module (120) includes a grating ruler (121) and a reading head (122), one of which is connected to the chip suction hood (170), and the other of which is connected to the main shaft (110).

13. The drilling apparatus according to claim 10, characterized in that, The dust collection cover (170) is slidably connected to a pressure foot plate (171), and the pressure foot module (150) includes a first pressure foot (151) and a second pressure foot (152). The first presser foot (151) and the second presser foot (152) are both mounted on the presser foot plate (171). The presser foot plate (171) can move along the distribution direction of the first presser foot (151) and the second presser foot (152) so that one of the first presser foot (151) and the second presser foot (152) is coaxial with the main shaft (110).

14. A PCB processing equipment, characterized in that, include: Base; A worktable is slidably connected to the base, and the worktable is used to support the PCB. A crossbeam is disposed on the base; at least one drilling device (100) as described in any one of claims 1 to 13 is slidably connected to the crossbeam.

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