Graphene composite heat-conducting gasket and electronic equipment
By using a layered graphene composite structure and a corrugated structure design, the problem of poor heat uniformity in the planar direction of graphene thermal conductive pads is solved, achieving uniformity of thermal conductivity and improved strength in both the thickness and planar directions, making it suitable for heat dissipation in electronic devices.
Patent Information
- Application Number
- CN202520274610.4
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-02-19
- Publication Date
- 2025-12-12
- Estimated Expiration
- 2035-02-19
AI Technical Summary
Existing graphene thermal pads have high thermal conductivity in the thickness direction, but poor heat distribution in the planar direction, resulting in uneven heat distribution and affecting the thermal conductivity.
The graphene composite structure is stacked, including a first graphene film, an intermediate graphene layer, and a second graphene film. The intermediate graphene layer is provided with heat dissipation channels along the planar direction, and the contact between the graphene films is improved through a corrugated structure to form a composite corrugated structure to enhance the thermal conductivity.
The graphene composite thermal conductive pad exhibits excellent thermal conductivity in both the thickness and planar directions, improving the uniform distribution of heat and overall strength, making it suitable for heat dissipation applications in various electronic devices.
Smart Images
Figure CN223657756U_ABST
Abstract
Description
TECHNICAL FIELD
[0001] The present application relates to the technical field of graphene, in particular to a graphene composite heat-conducting gasket and an electronic device. BACKGROUND
[0002] Graphene is a single-layer two-dimensional honeycomb lattice structure material formed by carbon atoms in sp 2 hybrid orbitals, and its thermal conductivity can be as high as 5300 W / m·K, which is much higher than that of traditional heat-conducting materials (such as copper, aluminum, etc.). Therefore, graphene has a wide application prospect in realizing the heat dissipation requirements of high-power LEDs, CPUs and other electronic devices.
[0003] The current graphene heat-conducting gasket has high heat-conducting performance in the thickness direction, but poor heat-distribution performance in the plane direction, which will lead to uneven heat distribution on the gasket during use and affect the heat-conducting effect. Therefore, how to improve the heat-conducting performance of the graphene heat-conducting gasket in the thickness direction and the plane direction is a problem to be solved in the current field. CONTENT OF THE INVENTION
[0004] The purpose of the embodiments of the present application is to provide a graphene composite heat-conducting gasket and an electronic device, which has excellent heat-conducting performance in the thickness direction and the plane direction.
[0005] In a first aspect, the embodiments of the present application provide a graphene composite heat-conducting gasket, which comprises a first graphene film, an intermediate graphene layer and a second graphene film which are sequentially stacked along a first direction, the material of the first graphene film, the intermediate graphene layer and the second graphene film is graphene, the intermediate graphene layer is provided with a plurality of heat-distribution channels arranged along a second direction, and the first direction and the second direction are perpendicular to each other.
[0006] In the above implementation process, the graphene composite heat-conducting gasket is a composite structure stacked by layers, and the material of each layer is graphene, so as to improve the heat-conducting performance of the gasket in the thickness direction by using the excellent thermal conductivity of graphene material; the graphene composite heat-conducting gasket is provided with heat-distribution channels in the plane direction, so as to improve the heat-distribution performance of the gasket in the plane direction, and make the gasket have excellent heat-conducting performance in the thickness direction and the plane direction.
[0007] In a possible implementation manner, the thickness of the intermediate graphene layer along the first direction is 0.1-3 mm, and can be 0.3-2 mm.
[0008] In a possible implementation manner, the thickness of the first graphene film is 100-300 microns, and the thickness of the second graphene film is 100-300 microns.
[0009] In one possible implementation, the intermediate graphene layer includes a third graphene film having a plurality of curved lines arranged and spaced apart along the second direction, the third graphene film being bent sequentially in opposite directions along each of the curved lines to form a corrugated structure.
[0010] In the above process, a third graphene film is used to form a corrugated structure and serve as the intermediate graphene layer in the gasket, thereby improving the overall strength of the gasket.
[0011] In one possible implementation, the curved lines of the third graphene film are arranged in two layers, with the upper layer of curved lines abutting against the second graphene film and the lower layer of curved lines abutting against the first graphene film.
[0012] In one possible implementation, the upper curved lines are embedded in the second graphene film, and the lower curved lines are embedded in the first graphene film.
[0013] In the above implementation process, the corrugated structure is utilized to directly contact the corrugated structure with the adjacent first and second graphene films, reducing the obstruction caused by non-graphene materials such as adhesives and improving the thermal conductivity between adjacent graphene films.
[0014] In one possible implementation, the two sides of the upper curved line are bonded to the second graphene film, and the two sides of the lower curved line are bonded to the first graphene film.
[0015] In the above implementation process, not only is a fixed connection between adjacent graphene films achieved, but also the obstruction between graphene films is reduced, so that direct contact sites are formed between adjacent graphene films to improve thermal conductivity in the thickness direction.
[0016] In one possible implementation, the thickness of the third graphene film is 100 to 500 micrometers.
[0017] In the above process, it is easy to bend and process to form the intermediate graphene layer and maintain a stable structural state.
[0018] In one possible implementation, the cross-sectional shape of the heat dissipation channel is triangular or semi-circular.
[0019] Secondly, embodiments of this application provide an electronic device that includes the graphene composite thermal pad provided in the first aspect.
[0020] In the above process, the graphene composite thermal conductive pad has excellent thermal conductivity in both the thickness and planar directions, making it suitable for heat dissipation applications in various electronic devices. Attached Figure Description
[0021] To more clearly illustrate the technical solutions of the embodiments of this application, the accompanying drawings used in the embodiments of this application will be briefly introduced below. It should be understood that the following drawings only show some embodiments of this application and should not be regarded as a limitation of the scope. For those skilled in the art, other related drawings can be obtained based on these drawings without creative effort.
[0022] Figure 1 This is a schematic diagram of the structure of a graphene composite thermal conductive pad provided in an embodiment of this application;
[0023] Figure 2 for Figure 1 A schematic diagram of its decomposed structure.
[0024] Icons: 110 - First graphene film; 120 - Middle graphene layer; 130 - Second graphene film. Detailed Implementation
[0025] The technical solutions in the embodiments of this application will now be described with reference to the accompanying drawings.
[0026] To make the objectives, technical solutions, and advantages of the embodiments of this application clearer, the technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments. The components of the embodiments of this application described and shown in the accompanying drawings can generally be arranged and designed in various different configurations.
[0027] Therefore, the following detailed description of the embodiments of this application provided in the accompanying drawings is not intended to limit the scope of the claimed application, but merely to illustrate selected embodiments of the application. All other embodiments obtained by those skilled in the art based on the embodiments in this application without inventive effort are within the scope of protection of this application.
[0028] It should be noted that similar labels and letters in the following figures indicate similar items. Therefore, once an item is defined in one figure, it does not need to be further defined and explained in subsequent figures.
[0029] In the description of this application, it should be noted that the terms "upper," "lower," "inner," and "outer," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, or the orientation or positional relationship commonly used when the product is in use. They are used only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation on this application. In addition, the terms "first," "second," and "third," etc., are used only to distinguish descriptions and should not be construed as indicating or implying relative importance.
[0030] In the description of this application, it should also be noted that, unless otherwise expressly specified and limited, the terms "set up," "install," "connect," and "link" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in this application based on the specific circumstances.
[0031] First Embodiment
[0032] Please refer to Figure 1 and Figure 2 This embodiment provides a graphene composite thermal conductive pad, which includes a first graphene film 110, an intermediate graphene layer 120 and a second graphene film 130 stacked sequentially along a first direction. The first graphene film 110, the intermediate graphene layer 120 and the second graphene film 130 are all made of graphene. The intermediate graphene layer 120 is provided with a plurality of heat dissipation channels arranged along a second direction. The first direction and the second direction are perpendicular to each other.
[0033] In this application, the first direction and the second direction are used to indicate the relationship between directions. For a sheet-like graphene composite thermal pad, the first direction refers to its thickness direction, and the second direction refers to its planar direction (laid flat within a plane).
[0034] In one possible implementation, the thickness of the first graphene film 110 is 100–300 micrometers, and the thickness of the second graphene film 130 is 100–300 micrometers. In this embodiment, the thickness of both the first graphene film 110 and the second graphene film 130 is 200 micrometers.
[0035] In one possible implementation, the thickness of the intermediate graphene layer 120 along the first direction is 0.1–3 mm, optionally 0.3–2 mm. In this embodiment, the thickness of the intermediate graphene layer 120 along the first direction is 1 mm.
[0036] In one possible implementation, the heat spreader channel has a triangular or semi-circular cross-sectional shape. In this embodiment, the heat spreader channel has a triangular cross-sectional shape.
[0037] In one possible implementation, the intermediate graphene layer 120 includes a third graphene film. The third graphene film has several curved lines arranged at intervals along the second direction. The third graphene film is bent sequentially in opposite directions along each curved line to form a corrugated structure. The heat dissipation channel of the corrugated structure is a groove-shaped structure, and then covered by the corresponding first graphene film 110 and second graphene film 130 to form a closed heat dissipation channel.
[0038] In one possible implementation, the thickness of the third graphene film is 100–500 micrometers. In this embodiment, the thickness of the third graphene film is 200 micrometers.
[0039] In one possible implementation, the curved lines of the third graphene film are arranged in two layers, with the upper layer of curved lines abutting against the second graphene film 130 and the lower layer of curved lines abutting against the first graphene film 110.
[0040] In one possible implementation, the upper curved line is embedded in the second graphene film 130, and the lower curved line is embedded in the first graphene film 110. The two sides of the upper curved line are bonded to the second graphene film 130, and the two sides of the lower curved line are bonded to the first graphene film 110. In this embodiment, the curved lines of the corrugated structure directly abut against the corresponding first and second graphene films 110 and 130, and are bonded together by adhesive on both sides of the curved lines.
[0041] As one embodiment, this embodiment also provides a method for preparing the above-mentioned graphene composite thermal conductive pad, which includes the following steps:
[0042] Step 1: Place the third graphene film on the mold of the corrugating machine, and press the third graphene film into a wavy corrugated structure by adjusting the pressure of the corrugating machine to 10MPa and the temperature to 200℃.
[0043] Step 2: Apply a layer of adhesive evenly to the upper and lower surfaces of the corrugated structure, attach a first graphene film 110 to the lower surface, and attach a second graphene film 130 to the upper surface to form a composite structure.
[0044] Step 3: Pass the composite structure through a pressure roller and adjust the pressure of the pressure roller to 5MPa to ensure that the corrugated structure, the first graphene film 110, and the second graphene film 130 are tightly bonded together.
[0045] Step 4: Place the composite structure into the oven and set the oven temperature to 150℃ for 2 hours to remove excess moisture and ensure the adhesive cures.
[0046] Step 5: Place the cured composite structure into a high-temperature furnace. Adjust the temperature of the high-temperature furnace to 1000℃ and the time to 2 hours to allow the adhesive to undergo a carbonization or graphitization reaction, forming a stable composite structure.
[0047] Through the above steps, a composite corrugated structure based on graphene film can be obtained. This structure has good thermal conductivity in the thickness direction and planar heat dissipation performance, while also having high overall strength and carbonization or grapheneization efficiency, making it suitable for heat dissipation applications in various electronic devices.
[0048] Secondly, embodiments of this application provide an electronic device that includes the graphene composite thermal pad provided in the first aspect.
[0049] In summary, the graphene composite thermal conductive pads and pads in electronic devices of the present application embodiments have excellent thermal conductivity in both the thickness direction and the planar direction.
[0050] The above description is merely an embodiment of this application and is not intended to limit the scope of protection of this application. Various modifications and variations can be made to this application by those skilled in the art. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of this application should be included within the scope of protection of this application.
Claims
1. A graphene composite thermal conductive pad, characterized in that, It includes a first graphene film, an intermediate graphene layer and a second graphene film stacked sequentially along a first direction. The first graphene film, the intermediate graphene layer and the second graphene film are all made of graphene. The intermediate graphene layer is provided with a plurality of heat dissipation channels arranged along a second direction. The first direction and the second direction are perpendicular to each other.
2. The graphene composite thermal pad according to claim 1, characterized in that, The thickness of the intermediate graphene layer along the first direction is 0.1 to 3 mm, and can be selected as 0.3 to 2 mm.
3. The graphene composite thermal conductive pad according to claim 1, characterized in that, The thickness of the first graphene film is 100-300 micrometers, and the thickness of the second graphene film is 100-300 micrometers.
4. The graphene composite thermal conductive pad according to claim 1, characterized in that, The intermediate graphene layer includes a third graphene film, which has a plurality of curved lines arranged along the second direction and spaced apart. The third graphene film is bent in opposite directions along each of the curved lines to form a corrugated structure.
5. The graphene composite thermal pad according to claim 4, characterized in that, The curved lines of the third graphene film are arranged in two layers, with the upper layer of curved lines abutting against the second graphene film and the lower layer of curved lines abutting against the first graphene film.
6. The graphene composite thermal conductive pad according to claim 5, characterized in that, The upper curved line is embedded in the second graphene film, and the lower curved line is embedded in the first graphene film.
7. The graphene composite thermal conductive pad according to claim 5, characterized in that, The two sides of the upper curved line are bonded to the second graphene film, and the two sides of the lower curved line are bonded to the first graphene film.
8. The graphene composite thermal pad according to claim 4, characterized in that, The thickness of the third graphene film is 100–500 micrometers.
9. The graphene composite thermal pad according to claim 1, characterized in that, The heat dissipation channel has a triangular or semi-circular cross-sectional shape.
10. An electronic device, characterized in that, It includes the graphene composite thermal pad as described in any one of claims 1 to 9.