Production line of thick-film surface-mounted chip resistor

Abstract

The utility model discloses a production line of a thick-film surface-mounted chip resistor, and relates to the technical field of chip processing. The device comprises a conveying frame, a positioning mechanism and a configuration mechanism are arranged on the conveying frame, the positioning mechanism comprises a first motor fixedly connected to the right side of the conveying frame, and an output shaft of the first motor is fixedly connected with a first rotating shaft through a coupler. By arranging the positioning mechanism, during use, the ceramic substrate can be placed on the conveying belt, then the first motor is started, the first motor drives the conveying belt to drive the ceramic substrate to move forwards through the matching effect of the first rotating shaft and the second rotating shaft, and in the moving process, the rotating disc on the outer wall of the two-way screw rod can be rotated to drive the ceramic substrate to move forwards. When the two-way screw rotates, the two-way screw drives the two positioning clamps to be matched with the limiting rods to get close to each other, the left side and the right side of the ceramic substrate are limited, and therefore the situation that the ceramic substrate deviates in the machining process, and then the follow-up procedure is affected is prevented.

Description

TECHNICAL FIELD

[0001] The utility model belongs to wafer processing technical field, especially relate to a production line of thick film mount wafer resistor. BACKGROUND

[0002] A production line of thick film mount wafer resistor, cover from ceramic substrate is placed in the start of conveyer belt, through motor drive conveyer belt drive ceramic substrate moves, utilize carousel, bidirectional screw rod and positioning fixture to baseplate limit, again with hydraulic cylinder, solenoid valve, roller etc. Component completes the extraction, smearing and transfer of resistance paste on the screen printing plate to form resistance film pattern, then by conveyer belt the substrate after printing is moved to the bottom of drying box, rely on motor driven fan blade rotation and introduce external air and heat by heating module to enhance the adhesion of resistance film and substrate, finally by conveyer belt continue to drive substrate to complete wafer mounting, welding until the series of automatic production process and related equipment combination of packaging.

[0003] The existing production device has obvious defects in the ceramic substrate processing process, because the ceramic substrate is not effectively positioned, which causes deviation in the subsequent process, such as in the silk screen printing link, once the position of the ceramic substrate is inaccurate, the resistance paste printing pattern will be offset, which makes the resistance value distribution of the resistor difficult to be uniform, seriously affects the stability and consistency of its electrical performance, in this way, the production yield of the entire thick film mount wafer resistor will inevitably drop sharply, and the production cost will also rise significantly. UTILITY MODEL CONTENTS

[0004] The utility model discloses a production line of thick film mount wafer resistor, be provided with positioning mechanism, solved because the ceramic substrate is not effectively positioned, which causes deviation in the subsequent process, such as in the silk screen printing link, once the position of the ceramic substrate is inaccurate, the resistance paste printing pattern will be offset, which makes the resistance value distribution of the resistor difficult to be uniform, seriously affects the stability and consistency of its electrical performance, in this way, the production yield of the entire thick film mount wafer resistor will inevitably drop sharply, and the production cost will also rise significantly.

[0005] To solve the above technical problems, the utility model is realized through the following technical schemes:

[0006] The utility model discloses a production line of thick film mount wafer resistor, including conveyer frame, be provided with positioning mechanism and configuration mechanism on the conveyer frame;

[0007] The positioning mechanism comprises a motor one fixedly connected to the right side of the conveying frame, an output shaft of the motor one is fixedly connected to a rotating shaft one through a shaft coupling, the rotating shaft one penetrates through the conveying frame and is rotationally connected to the conveying frame, a rotating shaft two is rotationally connected to the inner wall of the conveying frame, a conveying belt is wound on the outer walls of the rotating shaft one and the rotating shaft two, a ceramic substrate is arranged on the top of the conveying belt, two U-shaped blocks one are fixedly connected to the top of the conveying frame, a bidirectional screw rod is rotationally connected to the inner wall of each U-shaped block one, the right end of the bidirectional screw rod extends out of the corresponding U-shaped block one, a rotating disc is fixedly sleeved on the outer wall of the bidirectional screw rod, and two positioning clamps are threadedly sleeved on the outer wall of the bidirectional screw rod.

[0008] Further, limit rods are fixedly connected to the sides of the two U-shaped blocks one, the limit rods penetrate through the two positioning clamps and are slidably connected to the two positioning clamps.

[0009] Further, the configuration mechanism comprises a plurality of slide rods fixedly connected to the top of the conveying frame, a screen is slidably sleeved on the outer wall of each slide rod, two hydraulic cylinders one are fixedly connected to the top of the conveying frame, and the output ends of the two hydraulic cylinders one are fixedly connected to the screen.

[0010] Further, a roller is slidably sleeved on the inner wall of the screen, a U-shaped block two is fixedly connected to the top of the screen, a hydraulic cylinder two is fixedly sleeved on the inner wall of the U-shaped block two, and the output end of the hydraulic cylinder two is fixedly connected to the roller.

[0011] Further, two hoops are fixedly connected to the top of the screen, a resistance paste tank is fixedly sleeved on the inner wall of each hoop, an electromagnetic valve is arranged on the inner wall of the resistance paste tank, and the electromagnetic valve is matched with the screen.

[0012] Further, a drying box is fixedly connected to the top of the conveying frame, a filter screen is fixedly connected to the inner wall of the drying box, a supporting rod is fixedly connected to the inner wall of the drying box, a motor two is fixedly connected to the inner wall of the supporting rod, an output shaft of the motor two is fixedly connected to a rotating shaft three through a shaft coupling, a fan blade is fixedly sleeved on the outer wall of the rotating shaft three, and a heating module is arranged on the inner wall of the drying box.

[0013] Further, a die bonding and welding machine is arranged on the top of the conveying frame, and a packaging machine is arranged on the top of the conveying frame, and the die bonding and welding machine and the packaging machine are matched with the ceramic substrate.

[0014] The utility model has the following beneficial effects:

[0015] (1) By setting a positioning mechanism, the ceramic substrate can be placed on the conveyor belt during use. Then, start motor one. Motor one will cause the conveyor belt to move the ceramic substrate forward through the cooperation of rotating shaft one and rotating shaft two. During the movement, the turntable on the outer wall of the bidirectional screw can be rotated so that the turntable can drive the bidirectional screw to rotate. When the bidirectional screw rotates, it will drive the two positioning clamps and the limiting rod to move closer to each other, limiting the left and right sides of the ceramic substrate to prevent the ceramic substrate from deviating during the processing, which would affect the subsequent processes.

[0016] (2) By setting up a configuration mechanism, after the ceramic substrate is adjusted, two hydraulic cylinders are started. These two hydraulic cylinders and several slide bars work together to push the screen closer to the top of the ceramic substrate. After it is close, the solenoid valve is started to draw the resistive paste from the resistive paste tank and inject it into the screen. Then, with the help of the second hydraulic cylinder, the roller evenly spreads the resistive paste on the screen, filling the pattern part of the screen, and then transferring it to the ceramic substrate to successfully form a resistive film pattern. Then, the conveyor belt will move the printed ceramic substrate to the bottom of the drying chamber. At this time, the second motor is started. The second motor drives the fan blade to rotate by the third rotating shaft. After the filter screen filters the air, the outside air can enter the drying chamber. When the air flows through the heating module, it is heated. The hot air blows towards the resistive film and the ceramic substrate, which effectively enhances the adhesion between the resistive film and the ceramic substrate. This effectively ensures that the resistive film will not easily fall off during subsequent use, thus ensuring the long-term stability of the resistor. Then, the conveyor belt continues to drive the ceramic substrate for the subsequent chip mounting and welding process until the final packaging operation is completed.

[0017] Of course, any product implementing this utility model does not necessarily need to achieve all of the advantages described above at the same time. Attached Figure Description

[0018] To more clearly illustrate the technical solutions of the embodiments of this utility model, the accompanying drawings used in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0019] Figure 1 This is a schematic diagram of the overall structure of this utility model;

[0020] Figure 2 This is a schematic diagram of the positioning mechanism of this utility model;

[0021] Figure 3 This is a schematic diagram of the configuration mechanism of this utility model;

[0022] Figure 4for Figure 2 A magnified view of part A in the diagram;

[0023] Figure 5 for Figure 3 A magnified view of part B in the diagram.

[0024] The attached diagram lists the components represented by each number as follows:

[0025] 1. Conveyor frame; 2. Positioning mechanism; 3. Configuration mechanism; 21. Motor 1; 22. Rotating shaft 1; 23. Rotating shaft 2; 24. Conveyor belt; 25. Ceramic substrate; 26. U-shaped block 1; 27. Bidirectional screw; 28. Turntable; 29. ​​Positioning fixture; 291. Limiting rod; 31. Sliding rod; 32. Screen; 33. Hydraulic cylinder 1; 34. Roller; 35. U-shaped block 2; 36. Hydraulic cylinder 2; 37. Hoop; 38. Resistance paste tank; 39. Solenoid valve; 391. Drying oven; 392. Filter screen; 393. Support rod; 394. Motor 2; 395. Rotating shaft 3; 396. Fan blade; 397. Heating module; 398. Wafer bonding and welding machine; 399. Packaging machine. Detailed Implementation

[0026] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those skilled in the art without creative effort are within the protection scope of the present utility model.

[0027] Please see Figures 1-5 As shown, this utility model is a production line for thick film mounted chip resistors, including a conveyor frame 1, on which a positioning mechanism 2 and a configuration mechanism 3 are provided;

[0028] The positioning mechanism 2 includes a motor 21 fixedly connected to the right side of the conveyor frame 1. The output shaft of the motor 21 is fixedly connected to a rotating shaft 22 via a coupling. The rotating shaft 22 passes through the conveyor frame 1 and is rotatably connected to the conveyor frame 1. A rotating shaft 23 is rotatably connected to the inner wall of the conveyor frame 1. A conveyor belt 24 is wound around the outer wall of the rotating shaft 22 and the rotating shaft 23. A ceramic substrate 25 is provided on the top of the conveyor belt 24. Two U-shaped blocks 26 are fixedly connected to the top of the conveyor frame 1. A bidirectional screw 27 is rotatably connected to the inner wall of the two U-shaped blocks 26. The right end of the bidirectional screw 27 extends to the outside of the corresponding U-shaped block 26. A turntable 28 is fixedly sleeved on the outer wall of the bidirectional screw 27. Two positioning clamps 29 are threaded on the outer wall of the bidirectional screw 27. Both positioning clamps 29 are adapted to the ceramic substrate 25. A limit rod 291 is fixedly connected to one side of the two U-shaped blocks 26 that is close to each other. The limit rod 291 passes through the two positioning clamps 29 and is slidably connected to the two positioning clamps 29.

[0029] By setting a positioning mechanism, the ceramic substrate 25 can be placed on the conveyor belt 24 during use. Then, the motor 21 is started. The motor 21 will cause the conveyor belt 24 to move the ceramic substrate 25 forward through the cooperation of the rotating shaft 22 and the rotating shaft 23. During the movement, the turntable 28 on the outer wall of the bidirectional screw 27 can be rotated, so that the turntable 28 can drive the bidirectional screw 27 to rotate. When the bidirectional screw 27 rotates, it will drive the two positioning clamps 29 to move closer to each other with the limiting rod 291, limiting the left and right sides of the ceramic substrate 25 to prevent the ceramic substrate 25 from deviating during the processing, which would affect the subsequent processes.

[0030] The configuration mechanism 3 includes several sliding rods 31 fixedly connected to the top of the conveyor frame 1. A screen 32 is slidably fitted onto the outer wall of each sliding rod 31. Two hydraulic cylinders 33 are fixedly connected to the top of the conveyor frame 1, and the output ends of both hydraulic cylinders 33 are fixedly connected to the screen 32. A roller 34 is slidably fitted onto the inner wall of the screen 32. A U-shaped block 35 is fixedly connected to the top of the screen 32. A hydraulic cylinder 36 is fixedly fitted onto the inner wall of the U-shaped block 35, and the output end of the hydraulic cylinder 36 is fixedly connected to the roller 34. Two hoops 37 are fixedly connected to the top of the screen 32. A resistance slurry tank 38 is fixedly fitted onto the inner wall of the two hoops 37, and a solenoid valve 39 is installed on the inner wall of the resistance slurry tank 38. Solenoid valve 39 is compatible with screen 32. A drying chamber 391 is fixedly connected to the top of conveyor frame 1. A filter screen 392 is fixedly connected to the inner wall of the drying chamber 391. A support rod 393 is fixedly connected to the inner wall of the drying chamber 391. A second motor 394 is fixedly connected to the inner wall of the support rod 393. The output shaft of the second motor 394 is fixedly connected to a third rotating shaft 395 through a coupling. A fan blade 396 is fixedly sleeved on the outer wall of the third rotating shaft 395. A heating module 397 is provided on the inner wall of the drying chamber 391. A wafer bonding and welding machine 398 is provided on the top of conveyor frame 1. A packaging machine 399 is provided on the top of conveyor frame 1. Both the wafer bonding and welding machine 398 and the packaging machine 399 are compatible with ceramic substrate 25.

[0031] After the ceramic substrate 25 is adjusted by setting up the configuration mechanism, two hydraulic cylinders 33 are activated. These two hydraulic cylinders 33, together with several slide bars 31, work together to push the screen 32 closer to the top of the ceramic substrate 25. Once the screen is close enough, the solenoid valve 39 is activated to draw resistance paste from the resistance paste tank 38 and inject it into the screen 32. Then, with the help of the hydraulic cylinder 36, the roller 34 evenly spreads the resistance paste onto the screen, filling the pattern area of ​​the screen, and then transferring it to the ceramic substrate to successfully form the resistance film pattern. Next, the conveyor belt 24 will move the printed ceramic substrate 25 to the drying area. At the bottom of chamber 391, motor 2 394 is started. Motor 2 394 drives fan blade 396 to rotate via shaft 395. After being filtered by filter screen 392, external air enters the drying chamber 391. When the air flows through heating module 397, it is heated. The hot air blows onto the resistive film and ceramic substrate, effectively enhancing the adhesion between the resistive film and ceramic substrate. This ensures that the resistive film will not easily fall off during subsequent use, thus guaranteeing the long-term stability of the resistor. Next, conveyor belt 24 continues to drive ceramic substrate 25 for subsequent chip mounting and soldering processes until the final packaging operation is completed.

[0032] One specific application of this embodiment is: Solenoid valve: A solenoid valve is an automated basic component that uses electromagnetic force to control the opening or closing of fluid passages. It is usually composed of components such as an electromagnetic coil, a valve core, and a valve body. When the electromagnetic coil is energized, it generates a magnetic field force, which drives the valve core to move, thereby changing the connection state of the internal passage of the valve body and realizing precise control of liquid or gas media. It is widely used in many fields such as industrial automation control systems, water supply and drainage systems, HVAC systems, and automobile manufacturing. Because it can quickly respond to electrical signal commands and accurately adjust fluid flow, pressure, and direction, it greatly improves the operating efficiency, reliability, and automation level of various equipment and systems.

[0033] Chip mounting and soldering machines are key equipment on thick-film chip resistor production lines. They feature precise mechanical structures and advanced control systems. During production, they accurately mount chips onto specific positions on ceramic substrates where the resistive film has been fabricated. High-precision positioning devices ensure the accuracy and stability of chip bonding. Subsequently, specialized soldering techniques and processes, such as thermoforming or ultrasonic soldering, reliably weld the connection points between the chip and the substrate, effectively guaranteeing the stability of the electrical connection and good conductivity. This allows the entire resistor to meet the corresponding electrical parameter requirements and quality standards, playing a crucial role in improving product quality and production efficiency in the electronics manufacturing industry.

[0034] Packaging machines are indispensable equipment on thick-film mount chip resistor production lines. Their main function is to encapsulate ceramic substrates that have undergone chip mounting and soldering. Through specific packaging processes and mechanical structures, using encapsulation materials such as epoxy resin, they tightly wrap the core components of the resistor. On the one hand, this provides physical protection for the internal components, shielding them from external dust, moisture, mechanical impact, and other adverse factors, ensuring their long-term stable operation. On the other hand, packaging machines can shape and size the resistors according to design requirements, facilitating automated installation and use in subsequent circuit board assembly and other applications. This greatly improves the applicability, reliability, and standardization of thick-film mount chip resistor production, powerfully promoting the efficient operation and development of the electronic component manufacturing industry.

[0035] In use, the ceramic substrate 25 can be placed on the conveyor belt 24. Then, the motor 21 is started. The motor 21, through the cooperation of the rotating shaft 22 and the rotating shaft 23, causes the conveyor belt 24 to move the ceramic substrate 25 forward. During the movement, the turntable 28 on the outer wall of the bidirectional screw 27 can be rotated, so that the turntable 28 can drive the bidirectional screw 27 to rotate. When the bidirectional screw 27 rotates, it will drive the two positioning clamps 29 and the limiting rods 291 to move closer to each other, limiting the left and right sides of the ceramic substrate 25 to prevent the ceramic substrate 25 from deviating during processing, which would affect subsequent processes. After the ceramic substrate 25 is adjusted, the two hydraulic cylinders 33 are started. The two hydraulic cylinders 33 and several sliding rods 31 work together to push the screen 32 closer to the top of the ceramic substrate 25. After it is close, the solenoid valve 39 is started to draw resistance paste from the resistance paste tank 38 and inject it into the screen. Inside 32, driven by hydraulic cylinder 26, roller 34 evenly applies the resistive paste onto the screen, filling the pattern area and transferring it to the ceramic substrate to successfully form the resistive film pattern. Next, conveyor belt 24 moves the printed ceramic substrate 25 to the bottom of drying chamber 391. At this time, motor 294 is started, and motor 294 drives fan blade 396 to rotate via shaft 395. After being filtered by filter screen 392, external air enters drying chamber 391. When the air flows through heating module 397, it is heated. The hot air blows onto the resistive film and ceramic substrate, effectively enhancing the adhesion between the resistive film and ceramic substrate. This ensures that the resistive film will not easily fall off during subsequent use, thus guaranteeing the long-term stability of the resistor. Then, conveyor belt 24 continues to move ceramic substrate 25 for subsequent chip mounting and soldering processes until the final packaging operation is completed.

[0036] In the description of this specification, references to terms such as "an embodiment," "example," "specific example," etc., indicate that a specific feature, structure, material, or characteristic described in connection with that embodiment or example is included in at least one embodiment or example of the present invention. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples.

[0037] The preferred embodiments of this utility model disclosed above are merely illustrative of the present utility model. These preferred embodiments do not exhaustively describe all details, nor do they limit the utility model to the specific implementations described. Clearly, many modifications and variations can be made based on the content of this specification. This specification selects and specifically describes these embodiments to better explain the principles and practical applications of this utility model, thereby enabling those skilled in the art to better understand and utilize it. This utility model is limited only by the claims and their full scope and equivalents.

Claims

1. A production line for thick-film mounted chip resistors, comprising a conveyor (1), wherein the conveyor (1) is provided with a positioning mechanism (2) and a placement mechanism (3), characterized in that... ； The positioning mechanism (2) includes a motor (21) fixedly connected to the right side of the conveyor frame (1). The output shaft of the motor (21) is fixedly connected to a rotating shaft (22) via a coupling. The rotating shaft (22) passes through the conveyor frame (1) and is rotatably connected to the conveyor frame (1). A rotating shaft (23) is rotatably connected to the inner wall of the conveyor frame (1). A conveyor belt (24) is wound around the outer walls of the rotating shaft (22) and the rotating shaft (23). A ceramic substrate is provided on the top of the conveyor belt (24). 25), the top of the conveyor frame (1) is fixedly connected to two U-shaped blocks (26), and the inner walls of the two U-shaped blocks (26) are rotatably connected to a bidirectional screw (27). The right end of the bidirectional screw (27) extends to the outside of the corresponding U-shaped block (26). The outer wall of the bidirectional screw (27) is fixedly fitted with a turntable (28), and the outer wall of the bidirectional screw (27) is threaded with two positioning clamps (29). Both positioning clamps (29) are adapted to the ceramic substrate (25).

2. The production line for a thick-film mounted chip resistor according to claim 1, characterized in that, A limiting rod (291) is fixedly connected to one side of the two U-shaped blocks (26) that are close to each other. The limiting rod (291) passes through the two positioning clamps (29) and is slidably connected to the two positioning clamps (29).

3. The production line for a thick-film mounted chip resistor according to claim 2, characterized in that, The configuration mechanism (3) includes several slide rods (31) fixedly connected to the top of the conveyor frame (1). The outer wall of the slide rods (31) is slidably fitted with a screen (32). The top of the conveyor frame (1) is fixedly connected to two hydraulic cylinders (33), and the output ends of the two hydraulic cylinders (33) are fixedly connected to the screen (32).

4. The production line for a thick-film mounted chip resistor according to claim 3, characterized in that, The inner wall of the screen (32) is slidably fitted with a roller (34), and the top of the screen (32) is fixedly connected with a U-shaped block (35). The inner wall of the U-shaped block (35) is fixedly fitted with a hydraulic cylinder (36), and the output end of the hydraulic cylinder (36) is fixedly connected to the roller (34).

5. The production line for a thick-film mounted chip resistor according to claim 4, characterized in that, The top of the screen (32) is fixedly connected to two hoop rings (37), and the inner wall of the two hoop rings (37) is fixedly fitted with a resistance slurry tank (38). The inner wall of the resistance slurry tank (38) is provided with a solenoid valve (39), which is compatible with the screen (32).

6. The production line for a thick-film mounted chip resistor according to claim 5, characterized in that, A drying box (391) is fixedly connected to the top of the conveyor frame (1). A filter screen (392) is fixedly connected to the inner wall of the drying box (391). A support rod (393) is fixedly connected to the inner wall of the drying box (391). A second motor (394) is fixedly connected to the inner wall of the support rod (393). The output shaft of the second motor (394) is fixedly connected to a third rotating shaft (395) via a coupling. A fan blade (396) is fixedly sleeved on the outer wall of the third rotating shaft (395). A heating module (397) is provided on the inner wall of the drying box (391).

7. The production line for a thick-film mounted chip resistor according to claim 6, characterized in that, The top of the conveyor (1) is provided with a wafer bonding and welding machine (398) and a packaging machine (399). Both the wafer bonding and welding machine (398) and the packaging machine (399) are adapted to the ceramic substrate (25).

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