Multi-nozzle ball mounting device for large-size warped substrate

Abstract

The utility model relates to a multi-nozzle ball mounting device for a large-size warped substrate. The multi-nozzle ball mounting device comprises a soldering flux material box, a solder ball box, a material conveying mechanism and a material blocking part, the bottoms of the soldering flux box and the solder ball box are connected with a material conveying mechanism; the material conveying mechanism comprises a connecting column and a material distributing plate. Each discharge hole of a material conveying mechanism connected with the soldering flux box is communicated with a soldering flux nozzle; each discharge hole of a material conveying mechanism connected with the solder ball box is communicated with a solder ball nozzle; the scaling powder nozzle and the solder ball nozzle which need to be closed are tightly buckled with blocking pieces through blocking bayonets. The multi-head spraying device has the advantages that the operation number and positions of the nozzles are flexibly selected according to the warping condition of a substrate, and scaling powder and spraying balls are sprayed at the same time by multiple heads, so that the online operation efficiency is improved; and a single nozzle can be temporarily closed when abnormal, so that the maintenance downtime is reduced.

Description

TECHNICAL FIELD

[0001] The utility model relates to the technical field of semiconductor packaging, especially a multi-nozzle ball placement device for large-size warped substrates. BACKGROUND

[0002] In today's rapidly changing semiconductor packaging technology field, 2.5D and 3D packaging technology are undoubtedly the two most promising development directions. They not only provide strong support for the performance improvement, power reduction and size reduction of integrated circuits, but also play a key role in promoting electronic products to higher integration, smaller size and lower cost.

[0003] 2.5D and 3D integrated forms are very suitable for scenarios with larger chip sizes and higher pin density requirements, so the overall thickness and size of the carrier substrate are relatively large. Large-size substrates have a high degree of warping area, and the number and position of ball placement in each area of the substrate are different. Therefore, the existing production line uses a single ball spraying device, but the single ball spraying device needs to spray soldering flux and then spray balls one by one, which is low in efficiency.

[0004] Therefore, it is necessary to improve the ball placement device to meet the online ball placement needs of large-size warped substrates. SUMMARY

[0005] The utility model aims at providing a multi-nozzle ball placement device for large-size warped substrates, which can realize simultaneous ball placement in the same row of substrates according to the warping degree of the substrates.

[0006] To achieve the above-mentioned utility model purposes, the utility model provides a multi-nozzle ball placement device for large-size warped substrates, which comprises a soldering flux box, a solder ball box, a material conveying mechanism, and a material blocking piece.

[0007] The bottom of the soldering flux box and the bottom of the solder ball box are connected with the material conveying mechanism, and the soldering flux box and the solder ball box are arranged side by side above the substrate.

[0008] The material conveying mechanism comprises a connecting column and a material distribution plate, the connecting column is located above the material distribution plate, the connecting column is provided with a first conveying pipeline, the material distribution plate is provided with an inlet, a plurality of outlets, and a second conveying pipeline, the inlet is in communication with the top of the second conveying pipeline, and the plurality of outlets are in communication with the bottom of the second conveying pipeline in sequence; the inlet is in communication with the first conveying pipeline.

[0009] The bottom of the soldering flux box is provided with a soldering flux outlet, the first conveying pipeline of the material conveying mechanism connected with the soldering flux box is in communication with the soldering flux outlet, and each outlet of the material conveying mechanism connected with the soldering flux box is in communication with a soldering flux nozzle.

[0010] The bottom of the tin ball box is provided with a tin ball discharge port, the first transmission pipeline of the material transmission mechanism connected with the tin ball box is communicated with the tin ball discharge port, and each of the discharge ports of the material transmission mechanism connected with the tin ball box is communicated with a tin ball nozzle.

[0011] The top of the plugging piece is provided with a plugging bayonet, and the solder nozzle and the tin ball nozzle to be closed are tightly buckled to the plugging piece through the plugging bayonet.

[0012] Preferably, the distribution plate is an arc-shaped plate with two downward sides, and the feeding port is located in the middle of the distribution plate.

[0013] As a further improvement of the utility model, the tin ball nozzle for ball spraying is provided with a ball planting nozzle sleeve, the two ends of the ball planting nozzle sleeve are respectively provided with a conical bayonet and a conical nozzle head, the conical bayonet and the conical nozzle head are communicated, and the conical bayonet is clamped at the bottom opening of the tin ball nozzle.

[0014] As a further improvement of the utility model, the tin ball box is provided with a plurality of storage sub-boxes.

[0015] Further, the top of the tin ball box is provided with an easily opened protective cover.

[0016] The utility model relates to a multi-nozzle ball planting device for large-size warped substrates, which transmits the substrate from the lower side of two material transmission mechanisms, transmits the solder of the solder box to each solder nozzle through the material transmission mechanism connected with the solder box, sprays the solder on the corresponding position of the substrate through the solder nozzle, and then transmits the solder coating area to the lower side of the tin ball box, transmits the tin ball in the tin ball box to each tin ball nozzle through the material transmission mechanism connected with the tin ball box, plants the tin ball on the solder coating area of the substrate through the tin ball nozzle, and realizes the coating of the solder and the ball spraying operation of the substrate single row at the same time. According to the warping degree of the substrate, the substrate can be divided into several different areas, the number of nozzles for operation is selected, and the solder nozzle and the tin ball nozzle which do not need to be operated are closed through the plugging piece.

[0017] Compared with the prior art, the utility model relates to a multi-nozzle ball planting device for large-size warped substrates, which transmits the substrate from the lower side of two material transmission mechanisms, transmits the solder of the solder box to each solder nozzle through the material transmission mechanism connected with the solder box, sprays the solder on the corresponding position of the substrate through the solder nozzle, and then transmits the solder coating area to the lower side of the tin ball box, transmits the tin ball in the tin ball box to each tin ball nozzle through the material transmission mechanism connected with the tin ball box, plants the tin ball on the solder coating area of the substrate through the tin ball nozzle, and realizes the coating of the solder and the ball spraying operation of the substrate single row at the same time. According to the warping degree of the substrate, the substrate can be divided into several different areas, the number of nozzles for operation is selected, and the solder nozzle and the tin ball nozzle which do not need to be operated are closed through the plugging piece.

[0018] (1) according to the warping condition of the substrate, the number and position of the nozzles are selected flexibly, the solder and the ball are sprayed by multiple heads at the same time, and the online operation efficiency is improved;

[0019] (2) a single nozzle can be temporarily closed for operation, and the maintenance downtime is reduced. DRAWINGS

[0020] Figure 1A kind of multi-nozzle ball mounting device structure schematic diagram for large size warping substrate of the utility model;

[0021] Figure 2 It is a distribution plate structure schematic diagram;

[0022] Figure 3 It is flux cartridge connecting structure schematic diagram;

[0023] Figure 4 It is tin ball box connecting structure schematic diagram;

[0024] Figure 5 It is blocking piece connecting structure schematic diagram;

[0025] Figure 6 It is ball mounting nozzle cover connecting structure schematic diagram. DETAILED DESCRIPTION

[0026] The specific implementation of the utility model is further explained in detail in combination with the drawings.

[0027] As Figure 1 shown, a kind of multi-nozzle ball mounting device structure schematic diagram for large size warping substrate of the utility model, including flux cartridge 1, tin ball box 2, material transmission mechanism 3, and blocking piece 6;

[0028] The bottom of flux cartridge 1 and tin ball box 2 is connected with material transmission mechanism 3, and flux cartridge 1 and tin ball box 2 are arranged side by side above substrate 8;

[0029] As Figures 2-4 shown, material transmission mechanism 3 includes connecting column 31 and distribution plate 32, connecting column 31 is located above distribution plate 32, connecting column 31 is equipped with first transmission pipeline 311, distribution plate 32 is equipped with inlet 323, several discharge ports 322 and second transmission pipeline 321, inlet 323 is communicated with the top of second transmission pipeline 321, and several discharge ports 322 are sequentially communicated with the bottom of second transmission pipeline 321;Inlet 323 is communicated with first transmission pipeline 311.

[0030] The bottom of flux cartridge 1 is equipped with flux discharge port 11, and the first transmission pipeline 311 of material transmission mechanism 3 connected with flux cartridge 1 is communicated with flux discharge port 11, and each discharge port 322 of material transmission mechanism 3 connected with flux cartridge 1 is communicated with flux nozzle 4;

[0031] The bottom of tin ball box 2 is equipped with tin ball discharge port 22, and the first transmission pipeline 311 of material transmission mechanism 3 connected with tin ball box 2 is communicated with tin ball discharge port 22, and each discharge port 322 of material transmission mechanism 3 connected with tin ball box 2 is communicated with tin ball nozzle 5;

[0032] AsFigure 5 As shown, the top of the blocking piece 6 is provided with a blocking bayonet 61, and the flux nozzle 4 and the solder ball nozzle 5 to be closed are tightly buckled to the blocking piece 6 through the blocking bayonet 61.

[0033] The utility model discloses a multi -nozzle ball placement device for large -size warping base plate, and the base plate 8 is transmitted from the below of two material transmission mechanisms 3, and the flux of flux box 1 is transmitted to each flux nozzle 4 through the material transmission mechanism 3 connected with it, and the flux is sprayed on the corresponding position of base plate 8 through flux nozzle 4, and the flux coating area is then transmitted to the below of solder ball box 2, and the solder ball in solder ball box 2 is transmitted to each solder ball nozzle 5 through the material transmission mechanism 3 connected with it, and the solder ball is planted in the flux coating area of base plate 8 through solder ball nozzle 5, realizes the coating of flux and the ball operation of spraying of base plate 8 single row simultaneously.

[0034] As shown in the figure, Figure 6 The solder ball nozzle 5 to be sprayed is provided with a ball placement nozzle sleeve 7, both ends of the ball placement nozzle sleeve 7 are respectively provided with a conical bayonet 71 and a conical nozzle 72, the conical bayonet 71 and the conical nozzle 72 are communicated, and the conical bayonet 71 is clamped at the bottom opening of the solder ball nozzle 5.

[0035] The solder ball in the solder ball nozzle 5 falls from the bottom opening of the solder ball nozzle 5 along the conical nozzle 72, and the ball placement nozzle sleeve 7 with the conical nozzle 72 can be selected according to different specifications of the solder ball. The conical structure of the conical nozzle 72 has a guiding effect on the transmission of the solder ball, and guides the solder ball to fall to the target position.

[0036] As shown in the figure, Figure 2 The distribution plate 32 is an arc-shaped plate with two downward sides, the feeding port 323 is located in the middle of the distribution plate 32, the material enters from the middle feeding port 323 and is transmitted from the middle to both ends along the second transmission pipeline 321. Compared with the conventional flat straight plate, the arc-shaped distribution plate 32 is more conducive to the transmission of the material and ensures that the material flows uniformly to each discharge port 322.

[0037] The solder ball box 2 is provided with a plurality of storage sub-boxes 21. The independent storage sub-box 21 is placed in the solder ball box 2, different specifications and sizes of solder balls can be placed in each storage sub-box 21, the target storage sub-box 21 is placed above the solder ball discharge port 22 according to the ball placement requirements of different products, and the solder ball in the target storage sub-box 21 is input into the connecting column 31 from the solder ball discharge port 22.

[0038] The tin ball box 2 is provided with an easily-opened protective cover 23 on the top, which is convenient for feeding and dustproof for the tin balls in the tin ball box 2, so as to avoid the tin balls from being polluted by dust.

[0039] The preferred embodiments of the utility model have been specifically described above, but the utility model is not limited to the described embodiments, and those skilled in the art can make various equivalent modifications or replacements without departing from the spirit of the utility model, and these equivalent modifications or replacements are all included in the range defined by the claims of the present application.

Claims

1. A multi-nozzle ball placement apparatus for large size warped substrates, characterized by, Including flux cartridge, tin ball box, material transmission mechanism, and blocking piece; The bottom of the flux cartridge and the tin ball box is connected with the material transmission mechanism, and the flux cartridge and the tin ball box are arranged side by side above the substrate; The material transmission mechanism comprises a connecting column and a distribution plate, the connecting column is located above the distribution plate, the connecting column is provided with a first transmission pipeline, the distribution plate is provided with an inlet, a plurality of outlets and a second transmission pipeline, the inlet is communicated with the top of the second transmission pipeline, and a plurality of outlets are communicated with the bottom of the second transmission pipeline in sequence; the inlet is communicated with the first transmission pipeline; The bottom of the flux cartridge is provided with a flux outlet, the first transmission pipeline of the material transmission mechanism connected with the flux cartridge is communicated with the flux outlet, and each outlet of the material transmission mechanism connected with the flux cartridge is communicated with a flux nozzle; The bottom of the tin ball box is provided with a tin ball outlet, the first transmission pipeline of the material transmission mechanism connected with the tin ball box is communicated with the tin ball outlet, and each outlet of the material transmission mechanism connected with the tin ball box is communicated with a tin ball nozzle; The top of the blocking piece is provided with a blocking bayonet, and the flux nozzle and the tin ball nozzle to be closed are tightly buckled with the blocking piece through the blocking bayonet.

2. A multi-nozzle ball placement apparatus for large size warped substrates as recited in claim 1, wherein, The distribution plate is an arc-shaped plate with two downward edges, and the inlet is located in the middle of the distribution plate.

3. A multi-nozzle ball placement apparatus for large size warped substrates as recited in claim 1, wherein, The tin ball nozzle to be sprayed is provided with a ball planting nozzle sleeve, both ends of the ball planting nozzle sleeve are respectively provided with a conical bayonet and a conical nozzle head, the conical bayonet and the conical nozzle head are communicated, and the conical bayonet is clamped at the bottom opening of the tin ball nozzle.

4. The apparatus of claim 1, wherein the apparatus is configured to handle a large size warped substrate. The tin ball box is provided with a plurality of storage sub-boxes.

5. A multi-nozzle ball placement apparatus for large size warped substrates as defined in claim 4, wherein The top of the tin ball box is provided with an easily opened protective cover.

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