Chip test carrier and chip test equipment

Abstract

The utility model relates to a chip test carrier and chip test equipment. The chip test carrier comprises a base, an accommodating groove, a test needle and a ventilation groove, the containing groove is located in the base, a groove opening of the containing groove is located in the top face of the base, the testing needle is fixed in the containing groove, and the first end of the testing needle protrudes out of the bottom face of the containing groove. When the to-be-tested chip is placed in the accommodating groove, the first end of the test pin is electrically connected with a solder ball of the to-be-tested chip. The ventilation groove is located in the side, provided with the containing groove, of the base and comprises a first opening, a second opening and a third opening, the first opening is located in the top face of the base, the second opening is located in the side face of the base, the third opening is located in the groove wall of the containing groove, the second opening and the third opening are opposite in position, and the ventilation groove is communicated with the containing groove through the third opening. According to the technical scheme, the heat dissipation structure of the chip test carrier can be improved, the heat accumulation effect of the solder ball end during chip test can be avoided, and the ball melting phenomenon during chip test can be avoided.

Description

Technical Field

[0001] This utility model relates to the field of semiconductor technology, specifically to a chip testing carrier and a chip testing device. Background Technology

[0002] In related technologies, chips are typically placed in a chip test socket for testing. During HTOL (High Temperature Operating Life) testing, the chip test socket is a critical path for heat dissipation. If heat cannot be dissipated from the socket in time, it can easily lead to solder balls. A solder ball refers to the melting of solder balls on the chip.

[0003] In related technologies, heat dissipation in HTOL testing is mainly achieved through a pressure block located on the cover of the chip test carrier. However, this method is designed for heat dissipation on the mark side of the chip and does not significantly improve the heat accumulation effect on the side of the chip with solder balls. Utility Model Content

[0004] The purpose of this application is to provide a chip test carrier and a chip test equipment that can improve the heat dissipation structure of the chip test carrier, avoid the heat accumulation effect at the solder ball end during chip testing, and thus avoid the phenomenon of molten balls during chip testing.

[0005] According to a first aspect of the embodiments of this application, a chip test carrier is provided, including: a base, a receiving slot, test probes and a ventilation slot;

[0006] The receiving groove is located on the base, the opening of the receiving groove is located on the top surface of the base, the test probe is fixed in the receiving groove, and the first end of the test probe protrudes from the bottom surface of the receiving groove; when the chip under test is placed in the receiving groove, the first end of the test probe is electrically connected to the solder ball of the chip under test.

[0007] The ventilation slot is located on one side of the base where the receiving slot is provided. The ventilation slot includes a first opening, a second opening and a third opening. The first opening is located on the top surface of the base, the second opening is located on the side of the base, and the third opening is located on the wall of the receiving slot. The second opening and the third opening are opposite to each other. The ventilation slot communicates with the receiving slot through the third opening.

[0008] In one embodiment, the chip test carrier includes two ventilation slots, the receiving slot is located in the middle of the base, and the two ventilation slots are respectively located on opposite sides of the receiving slot.

[0009] In one embodiment, the two ventilation slots are aligned.

[0010] In one embodiment, the cross-section of the ventilation slot is trapezoidal, and the length of the upper base of the trapezoid is less than the length of the lower base.

[0011] In one embodiment, the chip test carrier further includes a cover, a first side of which is movably connected to a first side of the base, so that the cover can be opened and closed.

[0012] When the chip under test is placed in the receiving slot and the cover is closed on the base, the chip under test is fixed in the receiving slot.

[0013] In one embodiment, the chip test carrier further includes a chip holder and four screws. The chip holder is used to hold the chip under test. When the chip under test is placed in the receiving slot, the first end of the chip holder is located on the top surface of the second side of the base, and the second end of the chip holder is located on the top surface of the third side of the base. The second side and the third side of the base are respectively adjacent to the first side, and the second side and the third side of the base are opposite to each other.

[0014] The chip holder is provided with four first threaded holes, two of which are located at the first end of the chip holder and the other two are located at the second end of the chip holder.

[0015] The base is provided with four second threaded holes; two of the second threaded holes are located on the second side of the base, and the other two second threaded holes are located on the third side of the base.

[0016] When the chip under test is placed in the receiving slot, the four first threaded holes on the chip holder are aligned one-to-one with the four second threaded holes on the base. The aligned first threaded holes and second threaded holes form a threaded hole group. The four screws respectively cooperate with the four groups of threaded holes to make the chip holder threadedly connected to the base, and fix the chip under test in the receiving slot, and the first end of the test probe is electrically connected to the solder ball of the chip under test.

[0017] In one embodiment, of the two ventilation slots, one ventilation slot is located on the second side of the base, and the other ventilation slot is located on the third side of the base;

[0018] For either the second or third side of the base, there are two second threaded holes, which are located on both sides of the ventilation slot.

[0019] In one embodiment, when the chip under test is fixed in the receiving groove and the first end of the test probe is electrically connected to the solder ball of the chip under test, the solder ball is opposite to the third opening of the ventilation groove, or the side of the solder ball that contacts the test probe is flush with the bottom surface of the ventilation groove, or the bottom surface of the ventilation groove is lower than the side of the solder ball that contacts the test probe.

[0020] In one embodiment, the chip test carrier further includes a circuit board located in the base, and the test probes are electrically connected to the circuit board.

[0021] According to a second aspect of the embodiments of this application, a chip testing device is provided, comprising: a tester and the chip testing carrier described above, wherein the tester is electrically connected to the test probe.

[0022] Compared with the prior art, the beneficial effects of this application are as follows: By creating a ventilation slot next to the receiving slot on the base of the chip test carrier, and the ventilation slot communicating with the receiving slot through a third opening, when the chip under test is being tested, the chip under test is located in the receiving slot, and the solder balls of the chip under test can dissipate heat through the ventilation slot during testing. This avoids the heat accumulation effect at the solder ball ends during chip testing, and thus avoids the phenomenon of molten balls during chip testing. Therefore, the technical solution provided by this application can improve the heat dissipation structure of the chip test carrier, thereby avoiding the heat accumulation effect at the solder ball ends during chip testing and preventing the phenomenon of molten balls during chip testing. Attached Figure Description

[0023] Figure 1 This is a schematic diagram of the structure of a chip testing carrier according to an exemplary embodiment.

[0024] Figure 2 This is a schematic diagram of the structure of a chip testing carrier according to another exemplary embodiment.

[0025] Figure 3 This is a schematic diagram illustrating the connection between a chip under test and a chip test carrier according to an exemplary embodiment.

[0026] Figure 4 This is a schematic diagram illustrating the positional relationship between a ventilation slot and a solder ball according to an exemplary embodiment.

[0027] Figure 5 This is a schematic diagram illustrating the positional relationship between a ventilation slot and a solder ball according to another exemplary embodiment. Detailed Implementation

[0028] Unless otherwise defined, the technical or scientific terms used in this specification and claims shall have the ordinary meaning understood by one of ordinary skill in the art to which this invention pertains. Specific embodiments of this invention will be described below with reference to the accompanying drawings. It should be noted that, in order to provide a concise description, this specification cannot provide a detailed description of all features of the actual embodiments. Without departing from the spirit and scope of this invention, those skilled in the art can make modifications and substitutions to the embodiments of this invention, and the resulting embodiments are also within the protection scope of this invention.

[0029] One embodiment of this application provides a chip test carrier. This chip test carrier can be used to test chips under test, for example, to perform HTOL testing on the chips under test. The HTOL test is briefly described below. During the test, the supply voltage of the chip under test is greater than or equal to VCCmax (maximum operating voltage), the junction temperature of the chip under test is 125°C, and the test duration is 1000 hours. This accelerated stress test can be used to evaluate the normal operating life of the chip under test.

[0030] like Figure 1 As shown, the chip test carrier may include: a base 11, a receiving slot 12, a test probe 13, and a ventilation slot 14.

[0031] like Figure 1 As shown, the receiving slot 12 is located on the base 11, and the opening of the receiving slot 12 is located on the top surface of the base 11. The top surface of the base 11 refers to the surface of the side where the receiving slot 12 is located. When testing the chip under test, the chip is located in the receiving slot 12.

[0032] like Figure 1 As shown, the test probe 13 is fixed in the receiving groove 12, and the first end of the test probe 13 protrudes from the bottom surface of the receiving groove 12. The first end of the test probe 13 can be the tip of the test probe 13. The test probe 13 can be a spring-loaded probe, but is not limited to this. When the chip under test is placed in the receiving groove 12, the first end of the test probe 13 is electrically connected to the solder ball of the chip under test.

[0033] like Figure 1 As shown, the ventilation slot 14 is located on one side of the base 11 where the receiving slot 12 is provided. The ventilation slot 14 includes a first opening 141, a second opening 142 and a third opening 143. The first opening 141 is located on the top surface of the base 11, the second opening 142 is located on the side of the base 11, and the third opening 143 is located on the wall of the receiving slot 12. The second opening 142 and the third opening 143 are opposite to each other. The ventilation slot 14 is connected to the receiving slot 12 through the third opening 143.

[0034] When testing the chip under test, the heat generated by the solder balls of the chip under test can be dissipated through the ventilation slot 14. Therefore, the technical solution provided in this application improves the heat dissipation structure of the chip test carrier, which can avoid the heat accumulation effect at the solder ball end during chip testing, and thus avoid the phenomenon of melting balls during chip testing.

[0035] In this embodiment, a ventilation slot 14 is formed next to the receiving slot 12 on the base 11 of the chip test carrier, and the ventilation slot 14 is connected to the receiving slot 12 through a third opening 143. When the chip under test is tested, the chip under test is located in the receiving slot 12, and the solder balls of the chip under test can dissipate heat through the ventilation slot 14 during testing. This avoids the heat accumulation effect at the solder ball end during chip testing, and thus avoids the phenomenon of molten balls during chip testing. Therefore, the technical solution provided by this application can improve the heat dissipation structure of the chip test carrier, thereby avoiding the heat accumulation effect at the solder ball end during chip testing and avoiding the phenomenon of molten balls during chip testing.

[0036] In one embodiment, the chip test carrier further includes a cover (not shown), a first side of which is movably connected to a first side S1 of the base 11 to enable the cover to be opened and closed.

[0037] In one embodiment, such as Figure 1 As shown, the base 11 and the cover can be hinged via a bearing 15. In other embodiments, the base 11 and the cover can also be hinged via a hinge, but are not limited thereto.

[0038] In one embodiment, when the chip under test is placed in the receiving slot 12 and the cover is closed on the base 11, the chip under test can be fixed in the receiving slot 12.

[0039] In one embodiment, the chip test carrier further includes a snap-fit ​​structure (not shown) that locks the second side of the cover to the fourth side S4 of the base 11 via the snap-fit ​​structure. The second side of the cover is opposite to the first side.

[0040] In one embodiment, such as Figure 1 As shown, the receiving slot 12 is located in the middle of the base 11. The chip testing carrier may include two ventilation slots 14, which are located on opposite sides of the receiving slot 12. For example, the two ventilation slots 14 may be located on the second side S2 and the third side S3 of the base 11, respectively. The second side S2 and the third side S3 of the base 11 are adjacent to the first side S1, and the second side S2 and the third side S3 of the base 11 are opposite each other. This can further improve the heat dissipation effect of the solder balls.

[0041] In one embodiment, such as Figure 1 As shown, the two ventilation slots 14 can be aligned, which allows for smooth airflow and improves the heat dissipation of the solder balls.

[0042] In one embodiment, such as Figure 1 and Figure 2 As shown, the chip test carrier also includes a chip holder (not shown) and four screws 16. The chip holder is used to hold the chip under test 30. When the chip under test 30 is placed in the receiving slot 12, the first end of the chip holder is located on the top surface of the second side S2 of the base 11, and the second end of the chip holder is located on the top surface of the third side S3 of the base 11.

[0043] In one embodiment, the chip holder is provided with four first threaded holes (not shown), two of which are located at the first end of the chip holder and the other two are located at the second end of the chip holder.

[0044] In one embodiment, such as Figure 1 As shown, the base 11 is provided with four second threaded holes 111, two of which are located on the second side of the base 11, and the other two are located on the third side of the base 11.

[0045] When the chip under test 30 is placed in the receiving slot 12, the four first threaded holes on the chip holder are aligned one-to-one with the four second threaded holes 111 on the base 11. A pair of aligned first and second threaded holes 111 forms a threaded hole group. Four screws 16 engage with each of the four threaded hole groups, thus threading the chip holder to the base 11. For example, for each pair of threaded hole groups, a corresponding screw 16 is sequentially screwed into the first and second threaded holes 111 to achieve the threaded connection between the chip holder and the base 11. After the chip holder is threadedly connected to the base 11, the chip under test 30 is fixed in the receiving slot 12, and the first end of the test probe 13 is electrically connected to the solder ball of the chip under test 30.

[0046] In one embodiment, such as Figure 3 As shown, the chip testing carrier also includes a circuit board 17. The circuit board 14 is located in the base 11, and the test probes 13 are electrically connected to the circuit board 17. The circuit board 17 is also used to connect to a testing machine, and the chip under test 30 is connected to the testing machine via the test probes 13 and the circuit board 17.

[0047] In one embodiment, such as Figure 3 As shown, after the chip under test 30 is fixed in the receiving groove 12, the solder balls of the chip under test 30 are electrically connected to the test probes 13 in a one-to-one correspondence.

[0048] In one embodiment, such as Figure 3As shown, the chip under test 30 may include solder balls 31, a substrate 32, bumps 33, an insulator 34, a die 35, and a package layer 36. The bumps 33 may be copper pillars or solder balls. The die 35 is an unpackaged chip containing circuitry and is the primary heat source during testing. The package layer 36 may be a molding compound, and markings may be set on its upper surface; therefore, the upper surface of the package layer 36 may also be called the marking surface.

[0049] When testing the chip under test 30, the heat dissipation path of the chip under test 30 includes two heat dissipation paths: the die 35 upward from the packaging layer 36 and the die 35 downward through the substrate 32 and solder balls 31.

[0050] In one embodiment, such as Figure 1 As shown, of the two ventilation slots 14, one ventilation slot 14 is located on the second side of the base 11, and the other ventilation slot 14 is located on the third side of the base 11. The two second threaded holes 111 on the second side of the base 11 are located on opposite sides of the ventilation slot 14. Similarly, the two second threaded holes 111 on the third side of the base 11 are located on opposite sides of the ventilation slot 14.

[0051] In one embodiment, such as Figure 4 As shown, the cross-section of the ventilation slot 14 is trapezoidal, with the length of the upper base B1 being shorter than the length of the lower base B2. This preserves the mechanical structure of the base 11. Without compromising the mechanical structure of the base 11, the larger the size of the ventilation slot 14, the better the heat dissipation effect.

[0052] In other embodiments, the cross-section of the ventilation slot 14 may also be rectangular or other shapes.

[0053] In one embodiment, such as Figure 4 As shown, when the chip under test 30 is fixed in the receiving groove 12 and the first end of the test probe 13 is electrically connected to the solder ball of the chip under test 30, the side of the solder ball that contacts the test probe 13 is flush with the bottom surface of the ventilation groove 14. In this way, it can be ensured that the ventilation groove 14 covers the heat source of the solder ball in the vertical Y direction, thereby improving the heat dissipation effect.

[0054] In another embodiment, such as Figure 5 As shown, when the chip under test 30 is fixed in the receiving groove 12 and the first end of the test probe 13 is electrically connected to the solder ball of the chip under test 30, the bottom surface of the ventilation groove 14 is lower than the side of the solder ball that contacts the test probe 13. In this way, the ventilation groove 14 can cover a larger heat dissipation range of the solder ball in the vertical Y direction, thereby improving the heat dissipation effect.

[0055] Another embodiment of this application provides a chip testing device. The chip testing device includes a tester and a chip testing carrier as described in any of the above embodiments, the tester being electrically connected to test probes 13.

[0056] The tester can be used to provide specified voltage and current signals to test the chip 30 under test.

[0057] In this invention, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance. The term "multiple" refers to two or more unless otherwise expressly defined.

[0058] The above description of the embodiments is intended to enable those skilled in the art to understand and apply this application. It will be apparent to those skilled in the art that various modifications can be easily made to these embodiments, and the general principles described herein can be applied to other embodiments without creative effort. Therefore, this application is not limited to the embodiments described herein, and any improvements and modifications made by those skilled in the art based on the disclosure of this application without departing from the scope and spirit of this application are within the scope of this application.

Claims

1. A chip test carrier, characterized by, include: Base, receiving slot, test probe and ventilation slot; The receiving groove is located on the base, the opening of the receiving groove is located on the top surface of the base, the test needle is fixed in the receiving groove, and the first end of the test needle protrudes from the bottom surface of the receiving groove; When the chip under test is placed in the receiving slot, the first end of the test probe is electrically connected to the solder ball of the chip under test; The ventilation slot is located on one side of the base where the receiving slot is provided. The ventilation slot includes a first opening, a second opening and a third opening. The first opening is located on the top surface of the base, the second opening is located on the side of the base, and the third opening is located on the wall of the receiving slot. The second opening and the third opening are opposite to each other. The ventilation slot communicates with the receiving slot through the third opening.

2. The chip test carrier of claim 1, wherein, It includes two ventilation slots, the receiving slot is located in the middle of the base, and the two ventilation slots are respectively located on opposite sides of the receiving slot.

3. The chip test carrier of claim 2, wherein, The two ventilation slots are aligned.

4. The chip test carrier of claim 3, wherein, The cross-section of the ventilation slot is trapezoidal, and the length of the upper base of the trapezoid is less than the length of the lower base.

5. The chip test carrier of claim 4, wherein, It also includes a lid, the first side of which is movably connected to the first side of the base so that the lid can be opened and closed; When the chip under test is placed in the receiving slot and the cover is closed on the base, the chip under test is fixed in the receiving slot.

6. The chip test carrier of claim 5, wherein, It also includes a chip holder and four screws. The chip holder is used to hold the chip under test. When the chip under test is placed in the receiving slot, the first end of the chip holder is located on the top surface of the second side of the base, and the second end of the chip holder is located on the top surface of the third side of the base. The second side and the third side of the base are adjacent to the first side, and the second side and the third side of the base are opposite to each other. The chip holder is provided with four first threaded holes, two of which are located at the first end of the chip holder and the other two are located at the second end of the chip holder. The base is provided with four second threaded holes; two of the second threaded holes are located on the second side of the base, and the other two second threaded holes are located on the third side of the base. When the chip under test is placed in the receiving slot, the four first threaded holes on the chip holder are aligned one-to-one with the four second threaded holes on the base. The aligned first threaded holes and second threaded holes form a threaded hole group. The four screws respectively cooperate with the four groups of threaded holes to make the chip holder threadedly connected to the base, and fix the chip under test in the receiving slot, and the first end of the test probe is electrically connected to the solder ball of the chip under test.

7. The chip test carrier of claim 6, wherein, Of the two ventilation slots, one ventilation slot is located on the second side of the base, and the other ventilation slot is located on the third side of the base; For either the second or third side of the base, there are two second threaded holes, which are located on both sides of the ventilation slot.

8. The chip test carrier of claim 6, wherein, When the chip under test is fixed in the receiving groove and the first end of the test probe is electrically connected to the solder ball of the chip under test, the side of the solder ball that contacts the test probe is flush with the bottom surface of the ventilation groove, or the bottom surface of the ventilation groove is lower than the side of the solder ball that contacts the test probe.

9. The chip test carrier of claim 1, wherein, It also includes a circuit board located in the base, and the test probe is electrically connected to the circuit board.

10. A chip testing apparatus characterized by comprising: include: The tester is connected to the chip test carrier as described in any one of claims 1 to 9, wherein the tester is electrically connected to the test probe.

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