Packaging and film pasting device and packaging and film pasting automation equipment

Abstract

The utility model relates to a packaging and film pasting device and packaging and film pasting automation equipment. The packaging film pasting device comprises a cover body which is provided with a first cavity; the base body can be covered with the cover body and is provided with a second cavity, a to-be-pasted assembly can be placed between the base body and the cover body, the to-be-pasted assembly is used for bearing a to-be-pasted film, and the first cavity and the second cavity are isolated through the to-be-pasted assembly; the laminating jig is arranged in the second cavity, and the side, facing the cover body, of the laminating jig is used for placing a part to be packaged; one end of the first lifting mechanism extends into the second cavity and is connected with the laminating jig; and the vacuumizing device is used for vacuumizing the first chamber and the second chamber. The to-be-packaged piece and the to-be-pasted film are arranged in the closed cavity, the to-be-pasted film is used for packaging the to-be-packaged piece in a vacuumizing mode, the situation that small bubbles exist after the to-be-pasted film and the to-be-packaged piece are pasted is reduced, and the film pasting effect is improved. In addition, the vacuum fitting mode is more stable, and the influence of external factors is also avoided.

Description

Technical Field

[0001] This application relates to the field of chip packaging technology, and in particular to packaging film application apparatus and automated packaging film application equipment. Background Technology

[0002] As is well known, the traditional film application process involves cutting a suitable film material and applying it to a cleaned film surface. This requires ensuring a dust-free environment, that the applied product is free of bubbles and impurities, and that a certain level of precision is maintained.

[0003] Currently, for MiniLED, MicroLED, or Printed Circuit Board (PCB) substrates, after the chip is bonded, the chip protrudes from the substrate plane. When encapsulating and applying a film to this substrate, if traditional rolling and pressing methods are used, small air bubbles are likely to exist between the film and the substrate, resulting in poor film application. Utility Model Content

[0004] Therefore, it is necessary to provide an encapsulation film application device and an automated encapsulation film application equipment to address the problem that small air bubbles can easily exist between the film and the substrate during the encapsulation film application process of MiniLED substrates, MicroLED substrates, or PCB substrates, resulting in poor film application effect.

[0005] One aspect of this application provides an encapsulation and film application device, comprising:

[0006] The cover has a first chamber;

[0007] The base can be closed with the cover and has a second chamber. The component to be applied can be placed between the base and the cover. The component to be applied is used to carry the film to be applied and the component to be applied isolates the first chamber and the second chamber.

[0008] A bonding fixture is located in the second chamber, and the side of the bonding fixture facing the cover is used to place the part to be packaged.

[0009] The first lifting mechanism extends one end into the second chamber and is connected to the fitting fixture; and

[0010] A vacuum pumping device is used to evacuate the first and second chambers.

[0011] In one embodiment, the bonding fixture includes a fixture body and a receiving component, and the encapsulation and film application device further includes a third lifting mechanism connected to the receiving component for driving the receiving component to move up and down relative to the fixture body.

[0012] In one embodiment, at least one side of the receiving member has a recessed receiving opening;

[0013] The receiving component includes a central connecting part and multiple legs. All the legs are arranged around the central connecting part at intervals, and one end of each leg is connected to the central connecting part; a receiving opening is formed between two adjacent legs.

[0014] In one embodiment, the bonding fixture is further provided with a second vacuum adsorption hole, which is used for vacuum adsorption of the component to be packaged.

[0015] In one embodiment, an adhesive layer is provided on the side of the fitting fixture where the part to be packaged is placed, and the adhesive layer is in contact with the part to be packaged.

[0016] In one embodiment, the encapsulation and film application device further includes a heating device disposed on the bonding fixture for heating the part to be encapsulated.

[0017] In one embodiment, the heating device includes multiple electric heating rods, some of which are disposed in the middle of the bonding fixture, and the remaining electric heating rods are arranged at intervals around the center line of the bonding fixture.

[0018] In one embodiment, the seat has a second opening on the side facing the cover, the second opening communicating with a second chamber, and the top of the seat has a positioning part, which is arranged around the second opening for positioning the component to be attached.

[0019] In one embodiment, the positioning part includes a plurality of first vacuum adsorption holes, all of which are arranged spaced apart from each other around the second opening.

[0020] Another aspect of this application provides an automated packaging and film application device, including the packaging and film application device, the component to be applied feeding device, and the packaged component feeding device as described in any of the above embodiments. The component to be applied feeding device is used to provide the component to be applied and the film to be applied to the packaging and film application device, and the packaged component feeding device is used to provide the packaged component to be packaged to the packaging and film application device.

[0021] The aforementioned encapsulation and film-applying device and automated encapsulation and film-applying equipment, by placing the component to be encapsulated and the film to be applied in a closed chamber and using vacuum to complete the encapsulation of the component, reduce the occurrence of small air bubbles after the film and component are bonded together, thus improving the film-applying effect. In addition, the vacuum bonding method is more stable and avoids the influence of external factors (such as manual labor, dust, and film material). Attached Figure Description

[0022] Figure 1 This is a front view of the encapsulation and film application device in one or more embodiments of this application.

[0023] Figure 2 This is a bottom view of the component to be attached in one or more embodiments of this application.

[0024] Figure 3 for Figure 1 A three-dimensional structural diagram of a portion of the encapsulation and film application device is shown.

[0025] Figure 4 for Figure 3 A front view of a portion of the structure in the encapsulation and film application device shown.

[0026] Figure 5 for Figure 1 A three-dimensional structural diagram of another part of the encapsulation and film application device shown.

[0027] Figure 6 for Figure 5 A front view of another part of the structure in the encapsulation and film application device shown.

[0028] Figure 7 for Figure 6 A cross-sectional view (AA) of another part of the structure of the encapsulation and film application device shown.

[0029] Figure 8 for Figure 5 A side view of another part of the structure in the encapsulation and film application device shown.

[0030] Figure 9 for Figure 8 A BB cross-sectional view of another part of the structure of the encapsulation and film application device shown.

[0031] Figure 10 This is a flowchart illustrating the encapsulation and film application device in one embodiment of this application.

[0032] Explanation of reference numerals in the attached figures:

[0033] The package includes a film-applying device 100, a cover 10, a cover body 11, an annular seal 12, a seat 20, a second chamber 21, a second opening 22, a positioning part 23, a first vacuum adsorption hole 231, an applicator 30, a fixture body 31, a receiving part 32, an intermediate connecting part 321, a leg 322, a second vacuum adsorption hole 33, a first lifting mechanism 40, a drive motor 41, a lead screw 42, a nut 43, a second lifting mechanism 50, a guide mechanism 60, a guide column 61, a guide sleeve 62, a mounting base 65, a third lifting mechanism 70, a sub-lifting mechanism 71, an adhesive layer 75, a heating device 80, an electric heating rod 81, a guide rail 84, a slider 86, a connecting assembly 88, a frame 90, an assembly to be applied 200, a positioning ring 210, a process film 220, an image to be applied 300, and an assembly to be packaged 400. Detailed Implementation

[0034] To make the above-mentioned objectives, features, and advantages of this application more apparent and understandable, the specific embodiments of this application are described in detail below with reference to the accompanying drawings. Many specific details are set forth in the following description to provide a thorough understanding of this application. However, this application can be implemented in many other ways different from those described herein, and those skilled in the art can make similar modifications without departing from the spirit of this application. Therefore, this application is not limited to the specific embodiments disclosed below.

[0035] In the description of this application, it should be understood that if terms such as "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential" appear, these terms indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, and are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this application.

[0036] Furthermore, where the terms "first" and "second" appear, these terms are for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined with "first" or "second" may explicitly or implicitly include at least one of that feature. In the description of this application, where the term "multiple" appears, "multiple" means at least two, such as two, three, etc., unless otherwise explicitly specified.

[0037] In this application, unless otherwise expressly specified and limited, the terms "installation," "connection," "joining," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components, unless otherwise expressly limited. Those skilled in the art can understand the specific meaning of the above terms in this application based on the specific circumstances.

[0038] In this application, unless otherwise expressly specified and limited, the use of descriptions such as "above" or "below" the second feature indicates that the first and second features are in direct contact or indirect contact via an intermediate medium. Furthermore, "above," "on top of," and "over" the second feature can mean that the first feature is directly above or diagonally above the second feature, or simply that the first feature is at a higher horizontal level than the second feature. Similarly, "below," "below," and "under" the second feature can mean that the first feature is directly below or diagonally below the second feature, or simply that the first feature is at a lower horizontal level than the second feature.

[0039] It should be noted that if an element is referred to as being "fixed to" or "set on" another element, it can be directly on the other element or there may be an intervening element. If an element is considered to be "connected to" another element, it can be directly connected to the other element or there may be an intervening element. If so, the terms "vertical," "horizontal," "upper," "lower," "left," "right," and similar expressions used in this application are for illustrative purposes only and do not represent the only possible implementation.

[0040] See Figure 1 , Figure 2 and Figure 5 An embodiment of this application provides a film-applying device 100, including a cover 10, a seat 20, an application fixture 30, a first lifting mechanism 40, and a vacuum device. The cover 10 has a first chamber. The seat 20 can be closed with the cover 10 and has a second chamber 21. A component to be applied 200 can be placed between the seat 20 and the cover 10. The component to be applied 200 is used to support the film 300 to be applied, and it isolates the first chamber from the second chamber 21. The application fixture 30 is disposed in the lower chamber 21, and the side of the application fixture 30 facing the cover 10 is used to place the component to be packaged 400. One end of the first lifting mechanism 40 extends into the second chamber 21 and is connected to the application fixture 30. The vacuum device is used to evacuate the first chamber and the second chamber 21.

[0041] It should be noted that the component to be applied 200 can not only be used to support the film to be applied 300, but can also be placed between the cover 10 and the base 20, thereby playing the role of isolating the first chamber and the second chamber 21.

[0042] like Figure 2As shown, in a specific embodiment of this application, the component to be bonded 200 includes a positioning ring 210 and a process film 220. The process film 220 is attached to one side of the positioning ring 210, sealing the opening on that side. The film to be bonded 300 is attached to the inner side of the process film 220 facing the positioning ring 210. Thus, through the attachment of the process film 220, the film to be bonded 300 can be positioned relative to the positioning ring 210. The positioning ring 210 can be an iron ring or other metal ring, and its shape can be square, circular, etc. When the component to be bonded 200 is disposed between the cover 10 and the seat 20, the process film 220, by sealing the opening of the positioning ring 210, can isolate the first chamber and the second chamber 21.

[0043] In the embodiments of this application, the component to be packaged 400 can be a MiniLED substrate, a MicroLED substrate, or a PCB substrate, and the film to be applied 300 can be an encapsulation film.

[0044] In practice, the cover 10 can be separated from the base 20 to expose the opening above the base 20 that communicates with the second chamber 21. The component to be packaged 400 is placed on the bonding fixture 30, and then the component to be bonded 200 is placed between the base 20 and the cover 10. The cover 10 is closed, and then the bonding fixture 30 is raised by the first lifting mechanism 40, so that the component to be packaged 400 approaches and contacts the film to be bonded on the component to be bonded 200. Then, a vacuum device is used to evacuate the first chamber and the second chamber 21. In this way, the film to be bonded 300 and the component to be packaged 400 are tightly connected, thus completing the packaging.

[0045] Therefore, the encapsulation and film-applying device 100 of this application embodiment, by placing the component to be encapsulated 400 and the film to be applied 300 in a closed chamber and using vacuum to complete the encapsulation of the component to be encapsulated 400 by the film to be applied 300, reduces the occurrence of small air bubbles after the film to be applied 300 and the component to be encapsulated 400 are bonded together, thus improving the film-applying effect. In addition, the vacuum bonding method is more stable and avoids the influence of external factors (such as manual labor, dust, and film material).

[0046] See Figure 3 and Figure 4 Specifically, in the embodiments of this application, the cover 10 includes a cover body 11 and an annular sealing member 12 disposed on one side of the cover body 11. The side of the cover body 11 where the annular sealing member 12 is disposed may have an inwardly recessed cavity, thereby forming a first chamber, or it may be a plane, which together with the annular sealing member 12 encloses and forms the first chamber. The side of the cover 10 facing the seat 20 has a first opening, which communicates with the first chamber.

[0047] In some embodiments, the packaging and film application device 100 further includes a second lifting mechanism 50, which is connected to the cover 10 and is used to drive the cover 10 to move up and down relative to the base 20. Specifically, it can move up and down in the vertical direction towards or away from the base 20, thereby enabling the cover 10 to close and separate from the base 20. The second lifting mechanism 50 can be a cylinder, hydraulic cylinder, etc.

[0048] To make the lifting and lowering movement of the cover 10 smoother, the sealing and film-applying device 100 further includes multiple guide mechanisms 60. These guide mechanisms 60 are connected between the mounting base 65 (where the second lifting mechanism 50 is mounted) and the cover 10, guiding the lifting and lowering movement of the cover 10. Specifically, each guide mechanism 60 includes a guide post 61 and a guide sleeve 62. The guide sleeve 62 is mounted on the mounting base 65. One end of the guide post 61 is connected to the cover 10, and the other end passes through the mounting base 65 and slides in cooperation with the guide sleeve 62. The number of guide mechanisms 60 can be two, three, or four; there is no specific limitation.

[0049] See Figures 5-9 In some embodiments, the seat 20 has a second opening 22 on the side facing the cover 10, and the second opening 22 communicates with the second chamber 21.

[0050] Furthermore, the top of the base 20 has a positioning part 23, which is arranged around the second opening 22 for positioning the component 200 to be attached.

[0051] By positioning the component to be applied 200, the film to be applied 300 on the component to be applied 200 can be positioned relative to the base 20 during the film application process, and then positioned relative to the packaged part 400 on the bonding fixture 30, thereby improving the accuracy of the packaging.

[0052] Specifically, the positioning part 23 includes a plurality of first vacuum adsorption holes 231, all of which are arranged at intervals around the second opening 22.

[0053] Vacuum adsorption is a simple method for positioning and fixing the component to be applied 200, which also occupies little space and provides reliable fixation.

[0054] In some embodiments, the bonding fixture 30 includes a fixture body 31 and a receiving component 32, and the encapsulation and film application device 100 further includes a third lifting mechanism 70, which is connected to the receiving component 32 and is used to drive the receiving component 32 to move up and down relative to the fixture body 31.

[0055] The fixture body 31 is the structure that plays a major role in supporting the component 400 to be packaged during the film application process.

[0056] The receiving part 32 is used to receive the material to be packaged 400 from outside the packaging and film application device 100.

[0057] Specifically, when the cover 10 is opened, the receiving component 32 can be driven to rise a certain height relative to the fixture body 31 by the third lifting mechanism 70, so that the receiving component 32 can receive the packaged component 400 at a position closer to the second opening 22 of the seat 20. After receiving the component, the third lifting mechanism 70 is controlled to drive the receiving component 32 to descend, so that the fixture body 31 and the receiving component 32 can jointly support the packaged component 400.

[0058] In the embodiments of this application, the third lifting mechanism 70 drives the receiving member 32 to rise to the outside of the seat 20, thereby making it easier to receive the packaged member 400 and without obstructing the transport of the loading device described below. Of course, in other embodiments, it can also rise to a position flush with the second opening 22.

[0059] Therefore, by setting a third lifting mechanism 70 to drive the receiving component 32 to move up and down relative to the fixture body 31, the packaging and film application device 100 can more easily receive the packaged component 400, reducing the damage to the packaging and film application device 100 during the material receiving process.

[0060] Furthermore, when the receiving component 32 descends to its lowest position, its upper surface is on the same surface as the upper surface of the fixture body 31, thus enabling them to jointly receive the packaged component 400. Specifically, the upper surface of the fixture body 31 is provided with a contour groove, the shape of which is adapted to the shape of the receiving component 32.

[0061] Furthermore, at least one side of the receiving component 32 has a recessed receiving opening.

[0062] In some cases, due to the feeding method of the component to be packaged 400, such as MicroLED substrates or PCB substrates, to avoid damage, their upper and side surfaces cannot be fixed to the feeding device during transportation; they can only be transported by fixing them to their lower surfaces. Therefore, the design of the receiving opening allows the feeding device to extend into it and place the component to be packaged 400 on the receiving device 32 without obstruction.

[0063] Specifically, in the embodiments of this application, the receiving component 32 includes an intermediate connecting portion 321 and a plurality of legs 322. All legs 322 are arranged around the intermediate connecting portion 321 at intervals, and one end of each leg is connected to the intermediate connecting portion 321. A receiving opening is formed between two adjacent legs 322.

[0064] The distribution of the multiple legs 322 can take many forms. Optionally, the multiple legs 322 can be arranged symmetrically around the intermediate connecting part 321. For example, there may be four legs 322 arranged symmetrically around the intermediate connecting part 321.

[0065] By setting multiple legs 322, not only can the needs of material inflow from multiple directions be met, but the coverage area of ​​multiple legs 322 is also larger, making the support of the packaged component 400 more stable.

[0066] In cases where the receiving member 32 has multiple legs 322, to make the lifting movement of the receiving member 32 more stable, in some embodiments, the third lifting mechanism 70 includes multiple sub-lifting mechanisms 71, each sub-lifting mechanism 71 being connected to a corresponding leg 322. Furthermore, since each sub-lifting mechanism 71 is connected to a corresponding leg 322, each sub-lifting mechanism 71 can also be distributed around the outer periphery of the intermediate connecting portion 321 of the receiving member 32, thereby separating it from the first lifting mechanism 40 and avoiding positional interference between the two.

[0067] Specifically, the sub-lifting mechanism 71 can be a pneumatic cylinder or a hydraulic cylinder, etc.

[0068] In some embodiments, the fitting fixture 30 is further provided with a second vacuum adsorption hole 33, which is used for vacuum adsorption of the component 400 to be packaged.

[0069] The method of adsorbing and fixing the part to be packaged 400 by vacuum adsorption is simple and reliable.

[0070] Specifically, the second vacuum adsorption pore 33 is strip-shaped. The strip-shaped vacuum adsorption pore has a relatively long length, which not only occupies less space, but also has a wider vacuum adsorption range and more stable adsorption.

[0071] For example, the second vacuum adsorption hole 33 includes a plurality of holes, and the plurality of second vacuum adsorption holes 33 are spaced apart from each other along the length or width direction of the fitting fixture 30.

[0072] It should be noted that the lengths of the second vacuum adsorption holes 33 may be different in order to avoid interfering with other components, such as the receiving part 32 mentioned above.

[0073] In the embodiments of this application, the second vacuum adsorption hole 33 is disposed on the fixture body 31. The fixture body 31 has a larger disposed area relative to the receiving part 32.

[0074] In some embodiments, the side of the fitting fixture 30 where the component to be packaged 400 is placed is further provided with an adhesive layer 75, and the adhesive layer 75 is in contact with the component to be packaged 400.

[0075] Specifically, both the fixture body 31 and the receiving component 32 are provided with an adhesive layer 75. The adhesive layer 75 can be bonded to or covered on the fixture body 31 and the receiving component 32.

[0076] By setting the encapsulation layer 75, the anti-static, anti-wear, high temperature resistance and anti-stick functions can be achieved. Therefore, the encapsulated part 400 is better protected and wear is reduced. It also prevents particles generated by wear between the encapsulated part 400 and the bonding fixture 30, and further improves the encapsulation effect.

[0077] In some embodiments, the encapsulation and film application device 100 further includes a heating device 80, which is disposed on the bonding fixture 30 and is used to heat the package 400 to be packaged.

[0078] By heating the part to be packaged at 400°C, the film adhesion can be improved during the film application process, which is more conducive to packaging.

[0079] Specifically, the heating device 80 may include an electric heating rod 81, which is disposed within the fitting fixture 30.

[0080] The electric heating rod 81 has a long, cylindrical structure. Because the electric heating rod 81 has a certain length and its outer periphery is equipped with heating function, it has a wider heating area and a better heating effect.

[0081] For example, the electric heating rod 81 is disposed within the fixture body 31. Specifically, the fixture body 31 may have a channel for mounting the electric heating rod 81, so that the electric heating rod 81 can be disposed therein.

[0082] In some embodiments, the electric heating rods 81 include multiple rods, with some of the electric heating rods 81 disposed in the middle of the bonding fixture 30, and the remaining electric heating rods 81 arranged at intervals around the center line of the bonding fixture 30. This arrangement allows for a wider heating area and better heating effect.

[0083] In some embodiments, the encapsulation and film application device 100 further includes a thermocouple for detecting the temperature of the bonding fixture 30, and the heating device 80 heats the fixture in response to the temperature detected by the thermocouple. Thus, the temperature of the bonding fixture 30 can be detected by the thermocouple, and the heating temperature of the heating device 80 can be controlled based on the detected temperature. For example, when the temperature of the bonding fixture 30 detected by the thermocouple is higher than a preset temperature, such as 80°C, the heating device 80 is controlled to lower the heating temperature; when the temperature of the bonding fixture 30 detected by the thermocouple is lower than the preset temperature, the heating device 80 is controlled to raise the heating temperature.

[0084] In the embodiments of this application, the first lifting mechanism 40 includes a drive motor 41, a lead screw 42, and a nut 43. The output shaft of the drive motor 41 is connected to the lead screw 42, and the nut 43 cooperates with the lead screw 42 and is connected to the fitting fixture 30.

[0085] Thus, when the drive motor 41 is working, its output shaft can drive the lead screw 42 to rotate, thereby causing the nut 43 that is in tandem with it to move up and down in the vertical direction, thereby driving the fitting fixture 30 to perform lifting and lowering movements.

[0086] Furthermore, the encapsulation and film application device 100 also includes a guide rail 84, a slider 86, and a connecting component 88. The nut 43 is connected to the slider 86 through the connecting component 88, and the guide rail 84 and the slider 86 are in sliding engagement.

[0087] Thus, with the sliding guidance of slider 86 and guide rail 84, the up and down movement of nut 43 can be made more stable.

[0088] The number of guide rails 84, sliders 86 and connecting components 88 may be multiple. Multiple guide rails 84 are arranged around the nut 43 at intervals. Each guide rail 84 is slidably engaged with a corresponding slider 86, and each connecting component 88 is connected between a corresponding slider 86 and the nut 43.

[0089] In addition, in order to provide installation space for the guide rail 84, slider 86 and connecting component 88, and to avoid damage to them, in the embodiments of this application, a frame 90 is provided at the bottom of the base 20, and the lead screw 42, nut 43, guide rail 84, slider 86 and connecting component 88 are all located in the frame 90.

[0090] See Figure 10 To better understand the working process of the encapsulation and film application device 100 according to the embodiments of this application, a specific embodiment is described below:

[0091] 1. Open the cover 10, the receiving part 32 rises to receive the packaged part 400, the receiving part 32 falls down, the packaged part 400 is placed on the upper surface of the bonding fixture 30 and is fixed by adsorption through the second vacuum adsorption hole 33; place the component 200 to be bonded with the film 300 attached to the lower surface on the top of the base 20 and is fixed by adsorption through the first vacuum adsorption hole 231, the film 300 to be bonded faces the packaged part 300 through the second opening 22 of the base 20;

[0092] 2. Cover the cover 10 onto the seat 20. At this time, under the action of the component to be attached 200, the first chamber and the second chamber 21 are isolated; evacuate the first chamber and the second chamber 21.

[0093] 3. The bonding fixture 30 rises, so that the film to be bonded 300 comes into contact with the packaged part 300, and the heating device 80 is turned on at the same time to control the heating temperature at about 80°C.

[0094] 4. The first chamber is devastated, the second chamber 21 is kept under vacuum, and a certain pressure difference is maintained between the first chamber and the second chamber 12.

[0095] 5. The first chamber and the second chamber 21 are connected to the atmosphere;

[0096] 6. Lid 10 rises to remove the product.

[0097] Another embodiment of this application provides an automated packaging and film application device, including the packaging and film application device 100, the component to be applied feeding device, and the packaged component feeding device as described in any of the above embodiments. The component to be applied feeding device is used to provide the component to be applied 200 and the film to be applied 300 to the packaging and film application device 100, and the packaged component feeding device is used to provide the packaged component 400 to the packaging and film application device 100.

[0098] The component loading device and the packaged part loading device can be a robotic arm loading device, a belt loading device, etc., and there are no specific restrictions.

[0099] The automated encapsulation and film-applying equipment of this application embodiment places the component to be encapsulated 400 and the film to be applied 300 in a closed chamber, and uses vacuum to complete the encapsulation of the component to be encapsulated 400 by the film to be applied 300. This reduces the occurrence of small air bubbles after the film to be applied 300 and the component to be encapsulated 400 are bonded together, thus improving the film-applying effect. In addition, the vacuum bonding method is more stable and avoids the influence of external factors (such as manual labor, dust, and film material).

[0100] The technical features of the above embodiments can be combined in any way. For the sake of brevity, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0101] The embodiments described above are merely illustrative of several implementation methods of this application, and while the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the patent application. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of this application, and these all fall within the protection scope of this application. Therefore, the protection scope of this patent application should be determined by the appended claims.

Claims

1. A packaging film applicator, characterized in that, include: The cover has a first chamber; The base can be closed with the cover and has a second chamber. The component to be applied can be placed between the base and the cover. The component to be applied is used to carry the film to be applied and the component to be applied isolates the first chamber and the second chamber. A bonding fixture is disposed in the second cavity, and the side of the bonding fixture facing the cover is used to place the part to be packaged. A first lifting mechanism, one end of which extends into the second cavity and is connected to the fitting fixture; and A vacuum pumping device is used to evacuate the first chamber and the second chamber.

2. The encapsulation and film application device according to claim 1, characterized in that, The bonding fixture includes a fixture body and a receiving component. The encapsulation and film application device further includes a third lifting mechanism, which is connected to the receiving component and is used to drive the receiving component to move up and down relative to the fixture body.

3. The encapsulation and film application device according to claim 2, characterized in that, At least one side of the receiving component has a recessed receiving opening; The receiving component includes a central connecting part and multiple legs, all of which are arranged around the central connecting part at intervals, and one end of each leg is connected to the central connecting part; wherein the receiving opening is formed between two adjacent legs.

4. The encapsulation and film application device according to any one of claims 1 to 3, characterized in that, The bonding fixture is also provided with a second vacuum adsorption hole, which is used to vacuum adsorb the part to be packaged.

5. The encapsulation and film application device according to any one of claims 1 to 3, characterized in that, The bonding fixture has an adhesive layer on one side where the part to be packaged is placed, and the adhesive layer is in contact with the part to be packaged.

6. The encapsulation and film application device according to any one of claims 1 to 3, characterized in that, The encapsulation and film application device also includes a heating device, which is disposed on the bonding fixture and is used to heat the part to be encapsulated.

7. The encapsulation and film application device according to claim 6, characterized in that, The heating device includes multiple electric heating rods, some of which are located in the middle of the bonding fixture, while the remaining electric heating rods are arranged at intervals around the center line of the bonding fixture.

8. The encapsulation and film application device according to any one of claims 1 to 3, characterized in that, The seat has a second opening on the side facing the cover, and the second opening communicates with the second chamber. The top of the seat has a positioning part, which is arranged around the second opening for positioning the component to be attached.

9. The encapsulation and film application device according to claim 8, characterized in that, The positioning part includes a plurality of first vacuum adsorption holes, all of which are arranged at intervals around the second opening.

10. An automated packaging and film application device, characterized in that, The device includes a packaging and film application apparatus, a component loading apparatus, and a package loading apparatus as described in any one of claims 1 to 9, wherein the component loading apparatus is used to provide the component to be applied and the film to be applied to the packaging and film application apparatus, and the package loading apparatus is used to provide the package to be packaged to the packaging and film application apparatus.

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