High-frequency circuit ceramic substrate etching device

Abstract

The utility model discloses a high-frequency circuit ceramic substrate etching device which comprises a base, a moving roller is arranged on the outer surface of the upper end of the base, a ceramic substrate is arranged at the upper end of the moving roller, a fixing frame is arranged on the outer surface of one side of the base, an etching mechanism is arranged at the upper end of the ceramic substrate, and the ceramic substrate is arranged on the fixing frame. The etching mechanism comprises a frame, a folding pipe, a first guide pipe, a first fixing plate, a motor, a second fixing plate, a hole groove, an air cylinder, a coating roller, a first rotating shaft, a second rotating shaft, a first material guide roller, a third rotating shaft, a second material guide roller, a material groove and a second guide pipe. The second fixing plate is located at the front end in the fixing frame. The high-frequency circuit ceramic substrate etching device can conveniently etch the ceramic substrate, the height of the coating roller can be conveniently adjusted according to the thickness of the ceramic substrate, the adaptability is improved, the operation is simple, and a better use prospect is brought.

Description

TECHNICAL FIELD

[0001] The utility model relates to high frequency circuit ceramic substrate etching field, concretely is a kind of high frequency circuit ceramic substrate etching device. BACKGROUND

[0002] Ceramic substrate etching is a kind of equipment for carrying out etching operation on ceramic substrate, mainly used to evenly spread etching liquid on ceramic copper-clad substrate, to improve etching effect and quality, high frequency circuit ceramic substrate is mainly applied in the high-power, high-load component or power module of wireless communication, sensor network and other products, the existing high frequency circuit ceramic substrate is manually spread etching liquid when processing, and the operation is complicated, waste manpower, to the use process of people brings certain adverse effect, for this, we provide a kind of high frequency circuit ceramic substrate etching device. SUMMARY

[0003] (One) technical problem solved

[0004] In view of the deficiencies of prior art, the utility model provides a kind of high frequency circuit ceramic substrate etching device, with can be conveniently etched to ceramic substrate, it is convenient to adjust the height of coating roller according to the thickness of ceramic substrate, improve adaptability, easy operation and other advantages, can effectively solve the problems in background art.

[0005] (Two) technical scheme

[0006] To achieve the above object, the technical scheme adopted by the utility model is: a kind of high frequency circuit ceramic substrate etching device, including base, the upper end outer surface of the base is provided with moving roller, the upper end of the moving roller is provided with ceramic substrate, the outer surface of the one side of the base is provided with fixed frame, the upper end of the ceramic substrate is provided with etching mechanism, the etching mechanism includes frame, folding pipe, first conduit, first fixed plate, motor, second fixed plate, hole slot, pneumatic cylinder, coating roller, first pivot, second pivot, first material guide roller, third pivot, second material guide roller, material tank and second conduit, the second fixed plate is located at the front end in the interior of fixed frame, the hole slot is opened in the middle of second fixed plate, the frame is located in the interior of second fixed plate, two groups of first fixed plate are located at the lower end of the outer surface of frame two sides.

[0007] Preferably, two groups of pneumatic cylinder are located at the outer surface of second fixed plate two sides, the folding pipe is located at the upper end of the outer surface of frame upper end, the first conduit is located at the upper end of the outer surface of folding pipe, the material tank is located at the front end in the interior of frame, the second conduit is located at the lower end of the outer surface of folding pipe, the third pivot is located at the front end in the interior of frame, and the second material guide roller is located at the outer wall of third pivot.

[0008] Preferably, the first guide roller is located at the rear end of the second guide roller, the second rotating shaft is located in the middle of the first guide roller, the paint roller is located at the rear end of the first guide roller, the first rotating shaft is located in the middle of the paint roller, and the motor is located on one side of the first rotating shaft.

[0009] Preferably, the frame and the slot are slidably connected.

[0010] Preferably, the first fixing plate is fixedly connected to the frame.

[0011] (III) Beneficial Effects

[0012] Compared with the prior art, the present invention provides a high-frequency circuit ceramic substrate etching device, which has the following advantages:

[0013] 1. This high-frequency circuit ceramic substrate etching device can conveniently perform etching processing on ceramic substrates.

[0014] 2. This high-frequency circuit ceramic substrate etching device allows for easy adjustment of the coating roller height according to the thickness of the ceramic substrate, improving adaptability and simplifying operation. Attached Figure Description

[0015] Figure 1 This is a schematic diagram of the overall structure of a high-frequency circuit ceramic substrate etching device according to the present invention.

[0016] Figure 2 This is a frontal sectional view of the high-frequency circuit ceramic substrate etching device of this utility model.

[0017] Figure 3 This is a partial structural diagram of a high-frequency circuit ceramic substrate etching device according to the present invention.

[0018] Figure 4 This is a side sectional view of the frame in a high-frequency circuit ceramic substrate etching device according to the present invention.

[0019] In the figure: 1. Base; 2. Moving roller; 3. Ceramic substrate; 4. Fixing frame; 5. Etching mechanism; 6. Frame; 7. Folded tube; 8. First guide tube; 9. First fixing plate; 10. Motor; 11. Second fixing plate; 12. Groove; 13. Cylinder; 14. Coating roller; 15. First rotating shaft; 16. Second rotating shaft; 17. First guide roller; 18. Third rotating shaft; 19. Second guide roller; 20. Material trough; 21. Second guide tube. Detailed Implementation

[0020] To make the technical means, creative features, objectives and effects of this utility model easier to understand, the present utility model will be further described below in conjunction with specific embodiments.

[0021] This embodiment is a high-frequency circuit ceramic substrate etching device.

[0022] like Figures 1-4 As shown, the system includes a base 1, a movable roller 2 on the upper outer surface of the base 1, a ceramic substrate 3 on the upper end of the movable roller 2, a fixing frame 4 on one side of the outer surface of the base 1, and an etching mechanism 5 on the upper end of the ceramic substrate 3. The etching mechanism 5 includes a frame 6, a folded tube 7, a first guide tube 8, a first fixing plate 9, a motor 10, a second fixing plate 11, a slot 12, a cylinder 13, a paint roller 14, a first rotating shaft 15, a second rotating shaft 16, a first guide roller 17, a third rotating shaft 18, a second guide roller 19, a material trough 20, and a second guide tube 21. The second fixing plate 11 is located at the front end inside the fixing frame 4, the slot 12 is opened in the middle of the second fixing plate 11, the frame 6 is located inside the second fixing plate 11, and two sets of first fixing plates 9 are located at the lower ends of the outer surfaces on both sides of the frame 6.

[0023] Two sets of cylinders 13 are located on the outer surfaces of the two sides of the second fixed plate 11, the folded tube 7 is located at the upper end of the outer surface of the frame 6, the first guide tube 8 is located on the outer surface of the upper end of the folded tube 7, the material trough 20 is located at the front end inside the frame 6, the second guide tube 21 is located on the outer surface of the lower end of the folded tube 7, the third rotating shaft 18 is located at the front end inside the frame 6, and the second guide roller 19 is located on the outer wall of the third rotating shaft 18; the first guide roller 17 is located at the rear end of the second guide roller 19, the second rotating shaft 16 is located in the middle of the first guide roller 17, the paint roller 14 is located at the rear end of the first guide roller 17, the first rotating shaft 15 is located in the middle of the paint roller 14, and the motor 10 is located on one side of the first rotating shaft 15; the frame 6 and the slot 12 are slidably connected; the first fixed plate 9 and the frame 6 are fixedly connected.

[0024] It should be noted that this utility model is a high-frequency circuit ceramic substrate etching device. The ceramic substrate 3 is moved by placing it on the moving roller 2 set on the base 1. The cylinder 13 is started to drive the first fixed plate 9 to rise and fall, while the frame 6 slides along the slot 12 to stretch the folded tube 7. The position of the first rotating shaft 15 set inside the frame 6 is adjusted. After the first rotating shaft 15 is attached to the ceramic substrate 3, the motor 10 is started to drive the first rotating shaft 15 to rotate, while driving the coating roller 14 to rotate. Under the action of the coating roller 14 and the first guide roller 17, the second rotating shaft 16, the second guide roller 19 and the third rotating shaft 18 are driven to rotate. The second guide roller 19 comes into contact with the etching liquid inside the material tank 20 and is conveyed to the coating roller 14 under the action of the first guide roller 17. While the coating roller 14 is in contact with the ceramic substrate 3 and rolling, the etching liquid is evenly adhered to the ceramic substrate 3 for processing. It can easily perform etching processing on the ceramic substrate 3, and the height of the coating roller 14 can be easily adjusted according to the thickness of the ceramic substrate 3, improving adaptability and making the operation simple.

[0025] It should be noted that, in this document, relational terms such as first and second (number one, number two), etc., are used only to distinguish one entity or operation from another, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Furthermore, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or apparatus. Without further limitations, an element defined by the phrase "comprising one..." does not exclude the presence of other identical elements in the process, method, article, or apparatus that includes said element.

[0026] The foregoing has shown and described the basic principles, main features, and advantages of this utility model. Those skilled in the art should understand that this utility model is not limited to the above embodiments. The embodiments and descriptions in the specification are merely illustrative of the principles of this utility model. Various changes and modifications can be made to this utility model without departing from its spirit and scope, and all such changes and modifications fall within the scope of the claims. The scope of protection of this utility model is defined by the appended claims and their equivalents.

Claims

1. A high-frequency circuit ceramic substrate etching apparatus, comprising a base (1), characterized in that: A movable roller (2) is provided on the upper outer surface of the base (1), and a ceramic substrate (3) is provided on the upper end of the movable roller (2). A fixing frame (4) is provided on one side outer surface of the base (1), and an etching mechanism (5) is provided on the upper end of the ceramic substrate (3). The etching mechanism (5) includes a frame (6), a folded tube (7), a first guide tube (8), a first fixing plate (9), a motor (10), a second fixing plate (11), a slot (12), a cylinder (13), and a coating roller (6). 14) First rotating shaft (15), second rotating shaft (16), first guide roller (17), third rotating shaft (18), second guide roller (19), material trough (20) and second guide tube (21), the second fixing plate (11) is located at the front end inside the fixing frame (4), the hole slot (12) is opened in the middle of the second fixing plate (11), the frame (6) is located inside the second fixing plate (11), and the two sets of first fixing plates (9) are respectively located at the lower end of the outer surface on both sides of the frame (6).

2. The high-frequency circuit ceramic substrate etching apparatus according to claim 1, characterized in that: The two sets of cylinders (13) are located on the outer surfaces of the two sides of the second fixed plate (11), the folded tube (7) is located at the upper end of the upper outer surface of the frame (6), the first guide tube (8) is located at the upper outer surface of the folded tube (7), the material trough (20) is located at the front end inside the frame (6), the second guide tube (21) is located at the lower outer surface of the folded tube (7), the third rotating shaft (18) is located at the front end inside the frame (6), and the second guide roller (19) is located on the outer wall of the third rotating shaft (18).

3. The high-frequency circuit ceramic substrate etching apparatus according to claim 2, characterized in that: The first guide roller (17) is located at the rear end of the second guide roller (19), the second rotating shaft (16) is located in the middle of the first guide roller (17), the paint roller (14) is located at the rear end of the first guide roller (17), the first rotating shaft (15) is located in the middle of the paint roller (14), and the motor (10) is located on one side of the first rotating shaft (15).

4. The high-frequency circuit ceramic substrate etching apparatus according to claim 3, characterized in that: The frame (6) and the slot (12) are slidably connected.

5. The high-frequency circuit ceramic substrate etching apparatus according to claim 4, characterized in that: The first fixing plate (9) is fixedly connected to the frame (6).

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