Protective high-frequency circuit ceramic substrate

Abstract

The utility model belongs to the technical field of circuit boards, particularly relates to a protective high-frequency circuit ceramic substrate, and provides the following scheme aiming at the protection problem: the protective high-frequency circuit ceramic substrate comprises a support column; the upper surface of the supporting column is fixedly connected with a protector. The protector comprises a protective shell fixedly connected to the upper surface of the supporting column. The upper surface of the protective shell is fixedly connected with a first supporting plate. The inner surface of the protective shell is fixedly connected with a second supporting plate. An assist device is fixedly connected to the inner surface of the protective shell; the upper surface of the first supporting plate is fixedly connected with a circuit substrate body. And through the arrangement of the protector, heat dissipation and protection can be performed on the circuit substrate body, the circuit substrate body is also convenient to take, and the efficiency is improved.

Description

Technical Field

[0001] This utility model relates to the field of circuit board technology, and in particular to a protective high-frequency circuit ceramic substrate. Background Technology

[0002] High-frequency circuit ceramic substrates are mainly used in high-power, high-load components or power modules of wireless communication, sensor network and other products. Therefore, the insulating medium of high-frequency circuit ceramic substrates is required to have higher heat resistance. Thus, the heat resistance thermal stress index should reach 288℃ for 120s.

[0003] However, existing technologies still have shortcomings. The small size of existing circuit boards leads to a crowded environment, causing them to generate a lot of heat during use. This heat cannot be dissipated in time, which can damage some electronic components with low heat resistance, or even burn them out, reducing the lifespan of the circuit board. At the same time, circuit boards are easily damaged by external impacts during transportation and use.

[0004] Therefore, we propose a protective high-frequency circuit ceramic substrate to solve this problem. Utility Model Content

[0005] The purpose of this invention is to solve the problems mentioned in the background art and to provide a protective high-frequency circuit ceramic substrate.

[0006] To achieve the above objectives, the present invention adopts the following technical solution:

[0007] A protective high-frequency circuit ceramic substrate includes a support pillar; a protector is fixedly connected to the upper surface of the support pillar; the protector includes a protective shell fixedly connected to the upper surface of the support pillar; a first support plate is fixedly connected to the upper surface of the protective shell; a second support plate is fixedly connected to the inner surface of the protective shell; an auxiliary device is fixedly connected to the inner surface of the protective shell; and a circuit board body is fixedly connected to the upper surface of the first support plate.

[0008] Preferably, the circuit board body includes a circuit board fixed to the upper surface of a first support plate; a buffer layer is fixed to the lower surface of the circuit board; a protective layer is fixed to the upper surface of the circuit board; a ceramic coating is fixed to the upper surface of the protective layer; and a waterproof layer is fixed to the upper surface of the ceramic coating.

[0009] Preferably, the auxiliary device includes a threaded rod rotatably mounted on the inner surface of the protective shell; a threaded shell is sleeved on the outer circular surface of the threaded rod; a push plate is fixedly connected to the upper surface of the threaded shell; a third support plate is fixedly connected to the upper surface of the push plate; a heat dissipation groove is provided on the upper surface of the push plate; a first connecting rod is fixedly connected to the lower surface of the push plate; a second connecting rod is slidably mounted on the outer circular surface of the first connecting rod; and a rotating block is fixedly connected to the lower surface of the threaded rod.

[0010] Preferably, the lower surface of the first connecting rod is fixed to the inner bottom surface of the protective shell; the upper surface of the rotating block is rotatably mounted on the lower surface of the protective shell.

[0011] Preferably, the circuit board body cooperates with the second support plate; the circuit board body cooperates with the third support plate.

[0012] In this utility model, a protective high-frequency circuit ceramic substrate is provided by a support column, a protective shell, a first support plate, a second support plate, a threaded rod, a threaded shell, a push plate, a third support plate, a heat dissipation groove, a first connecting rod, a second connecting rod, a rotating block, and a circuit substrate body. The first and second support plates support and protect the circuit substrate body. When the circuit substrate body is removed, the rotating block is rotated, which drives the threaded rod to rotate. The rotation of the threaded rod drives the threaded shell to move, which drives the push plate to move. The movement of the push plate drives the circuit substrate body to move, causing the circuit substrate body to leave the protective shell. This achieves heat dissipation and protection for the circuit substrate body, and also facilitates the removal of the circuit substrate body, improving efficiency.

[0013] In this utility model, the protective high-frequency circuit ceramic substrate improves the heat dissipation effect of the circuit substrate body by setting up a push plate, a third support plate and a heat dissipation groove, thus preventing the circuit substrate body from overheating.

[0014] This utility model has a reasonable structural design, is simple to operate, and has high reliability. Attached Figure Description

[0015] Figure 1 This is a three-dimensional structural diagram of a protective high-frequency circuit ceramic substrate proposed in this utility model;

[0016] Figure 2 This is a three-dimensional structural diagram of the protector in this utility model;

[0017] Figure 3 This is a cross-sectional view of the auxiliary device in this utility model;

[0018] Figure 4 This is a cross-sectional view of the circuit board body in this utility model.

[0019] In the diagram: 1. Support column; 2. Protector; 21. Protective shell; 22. Support plate 1; 23. Support plate 2; 24. Auxiliary device; 241. Threaded rod; 242. Threaded shell; 243. Push plate; 244. Support plate 3; 245. Heat dissipation groove; 246. Connecting rod 1; 247. Connecting rod 2; 248. Rotating block; 3. Circuit board body; 31. Circuit board; 32. Buffer layer; 33. Protective layer; 34. Ceramic coating; 35. Waterproof layer. Detailed Implementation

[0020] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments of the present utility model. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments.

[0021] Reference Figures 1-4 A protective high-frequency circuit ceramic substrate includes a support pillar 1; a protector 2 is fixedly connected to the upper surface of the support pillar 1; the protector 2 includes a protective shell 21 fixedly connected to the upper surface of the support pillar 1; a first support plate 22 is fixedly connected to the upper surface of the protective shell 21; a second support plate 23 is fixedly connected to the inner surface of the protective shell 21; an auxiliary device 24 is fixedly connected to the inner surface of the protective shell 21; and a circuit board body 3 is fixedly connected to the upper surface of the first support plate 22.

[0022] Furthermore, the circuit board body 3 includes a circuit board 31 fixed to the upper surface of the first support plate 22; a buffer layer 32 is fixed to the lower surface of the circuit board 31; a protective layer 33 is fixed to the upper surface of the circuit board 31; a ceramic coating 34 is fixed to the upper surface of the protective layer 33; and a waterproof layer 35 is fixed to the upper surface of the ceramic coating 34.

[0023] Furthermore, the auxiliary device 24 includes a threaded rod 241 rotatably mounted on the inner surface of the protective shell 21; a threaded shell 242 is sleeved on the outer circular surface of the threaded rod 241; a push plate 243 is fixedly connected to the upper surface of the threaded shell 242; a third support plate 244 is fixedly connected to the upper surface of the push plate 243; a heat dissipation groove 245 is provided on the upper surface of the push plate 243; a first connecting rod 246 is fixedly connected to the lower surface of the push plate 243; a second connecting rod 247 is slidably mounted on the outer circular surface of the first connecting rod 246; and a rotating block 248 is fixedly connected to the lower surface of the threaded rod 241.

[0024] Furthermore, the lower surface of the first connecting rod 246 is fixed to the inner bottom surface of the protective shell 21; the upper surface of the rotating block 248 is rotatably mounted on the lower surface of the protective shell 21.

[0025] Furthermore, the circuit board body 3 and the second support plate 23 cooperate with each other; the circuit board body 3 and the third support plate 244 cooperate with each other.

[0026] In this invention, during use, the first support plate 22 and the second support plate 23 support and protect the circuit board body 3. When removing the circuit board body 3, rotating the rotating block 248 causes the threaded rod 241 to rotate, which in turn causes the threaded shell 242 to move. The movement of the threaded shell 242 causes the push plate 243 to move, which in turn causes the circuit board body 3 to move, thus separating the circuit board body 3 from the protective shell 2. This achieves heat dissipation and protection for the circuit board body 3, and also facilitates its removal, improving efficiency. The arrangement of the push plate 243, the third support plate 244, and the heat dissipation groove 245 improves the heat dissipation effect of the circuit board body 3, preventing overheating.

[0027] In the description of this utility model, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", etc., indicating the orientation or positional relationship are based on the orientation or positional relationship shown in the accompanying drawings, and are only for the convenience of describing this utility model and simplifying the description, and are not intended to indicate or imply that the device or component referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this utility model.

[0028] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of this utility model, "a plurality of" means two or more, unless otherwise explicitly specified.

[0029] The preferred embodiments of this utility model disclosed above are merely illustrative of the present utility model. These preferred embodiments do not exhaustively describe all details, nor do they limit the utility model to the specific implementations described. Clearly, many modifications and variations can be made based on the content of this specification. This specification selects and specifically describes these embodiments to better explain the principles and practical applications of this utility model, thereby enabling those skilled in the art to better understand and utilize it. This utility model is limited only by the claims and their full scope and equivalents.

Claims

1. A protective high-frequency circuit ceramic substrate, characterized in that, It includes a support column (1); a protector (2) is fixed to the upper surface of the support column (1); the protector (2) includes a protective shell (21) fixed to the upper surface of the support column (1); a first support plate (22) is fixed to the upper surface of the protective shell (21); a second support plate (23) is fixed to the inner surface of the protective shell (21); an auxiliary device (24) is fixed to the inner surface of the protective shell (21); and a circuit board body (3) is fixed to the upper surface of the first support plate (22).

2. The protective high-frequency circuit ceramic substrate according to claim 1, characterized in that, The circuit board body (3) includes a circuit board (31) fixed to the upper surface of the first support plate (22); a buffer layer (32) is fixed to the lower surface of the circuit board (31); a protective layer (33) is fixed to the upper surface of the circuit board (31); a ceramic coating (34) is fixed to the upper surface of the protective layer (33); and a waterproof layer (35) is fixed to the upper surface of the ceramic coating (34).

3. The protective high-frequency circuit ceramic substrate according to claim 1, characterized in that, The auxiliary device (24) includes a threaded rod (241) rotatably mounted on the inner surface of the protective shell (21); a threaded shell (242) is sleeved on the outer circular surface of the threaded rod (241); a push plate (243) is fixedly connected to the upper surface of the threaded shell (242); a third support plate (244) is fixedly connected to the upper surface of the push plate (243); a heat dissipation groove (245) is provided on the upper surface of the push plate (243); a first connecting rod (246) is fixedly connected to the lower surface of the push plate (243); a second connecting rod (247) is slidably mounted on the outer circular surface of the first connecting rod (246); and a rotating block (248) is fixedly connected to the lower surface of the threaded rod (241).

4. The protective high-frequency circuit ceramic substrate according to claim 3, characterized in that, The lower surface of the first connecting rod (246) is fixed to the inner bottom surface of the protective shell (21); the upper surface of the rotating block (248) is rotatably mounted on the lower surface of the protective shell (21).

5. The protective high-frequency circuit ceramic substrate according to claim 1, characterized in that, The circuit board body (3) cooperates with the second support plate (23); the circuit board body (3) cooperates with the third support plate (244).

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