Flow rate measuring mechanism and gas flow rate measuring device

Abstract

According to the flow measuring mechanism and the gas flow measurer, the flow measuring mechanism comprises the thermoelectric unit, after the thermoelectric unit is electrified, one end of the thermoelectric unit absorbs heat, the other end of the thermoelectric unit releases heat, and current flows to the end absorbing heat from the end releasing heat. The heat sink and the thermocouple are arranged at one end for absorbing heat, and the end is exposed to the gas to be detected. After the gas flows for a preset time, the temperature of one end absorbing heat is reduced, and voltage change is generated at the two ends of the thermoelectric unit. The processing unit calculates the gas flow value according to the voltage change, and the measurement precision is improved through the tiny change (reaching the millivolt level) of the voltage value. The gas flow measurer is provided with the flow measuring mechanism, a heat dissipation piece and a thermocouple of the gas flow measurer are exposed, other mechanisms are located in the flow measurer, and one end of the heat dissipation piece extends into gas to be measured, so that the detection precision can be improved.

Description

TECHNICAL FIELD

[0001] The application relates to the technical field of gas flow measurement, in particular to a flow measurement mechanism and a gas flow measurement device. BACKGROUND

[0002] The Seebeck effect, also known as the first thermoelectric effect, is a thermoelectric phenomenon that refers to the voltage difference between two substances caused by the temperature difference of two different conductors or semiconductors. This phenomenon is called the Seebeck effect, which was discovered by German physicist Thomas Seebeck in 1821.

[0003] In the fields of industrial production, environmental monitoring, etc., there is a demand for accurate measurement of gas flow. Traditional flow measurement methods such as turbine flow meters and differential pressure flow meters calculate gas flow values by gas flow rate and pipeline pressure values, which have certain limitations in terms of accuracy. CONTENT OF THE UTILITY MODEL

[0004] The technical problem to be solved by the application is that in the fields of industrial production, environmental monitoring, etc., there is a demand for accurate measurement of gas flow. Traditional flow measurement methods such as turbine flow meters and differential pressure flow meters calculate gas flow values by gas flow rate and pipeline pressure values, which have certain limitations in terms of accuracy.

[0005] In order to solve the above technical problems or at least partially solve the above technical problems, the application provides a flow measurement mechanism and a gas flow measurement device.

[0006] In a first aspect, the utility model discloses a flow measurement mechanism, which comprises a control unit, a processing unit, a thermoelectric unit, a heat dissipation piece and a thermocouple, the thermoelectric unit is electrically connected with the control unit, and the control unit is electrically connected with the processing unit.

[0007] The heat dissipation piece is arranged at the first end of the thermoelectric unit, and the thermocouple is mounted on the heat dissipation piece.

[0008] The control unit obtains the temperature value sensed by the thermocouple and the second end temperature value of the thermoelectric unit, the processing unit calculates the first voltage value according to the temperature value obtained by the control unit, the thermocouple and the heat dissipation piece are exposed in the gas to be detected, after a predetermined time, the processing unit calculates the second voltage value according to the temperature value change value sensed by the thermocouple, and obtains the gas flow value in the predetermined time according to the second voltage value.

[0009] Preferably, a heating piece is arranged at the second end of the thermoelectric unit, and the heating piece is connected with the control unit.

[0010] Preferably, the thermoelectric unit comprises at least one P-N thermoelectric pair and two insulating substrates, the P-N thermoelectric pair is electrically connected with the control unit, and the two insulating substrates are respectively arranged at the first end and the second end of the P-N thermoelectric pair.

[0011] Preferably, the heating element and the heat dissipation element are fixedly connected with one insulating substrate respectively.

[0012] Preferably, the P-N thermoelectric pairs are uniformly distributed, and the P-N thermoelectric pairs are vertically arranged with the insulating substrates.

[0013] Preferably, the P-N thermoelectric pair comprises a P-type semiconductor and an N-type semiconductor, adjacent P-type semiconductors and N-type semiconductors are connected end to end, and the P-type semiconductor and the N-type semiconductor are connected through a metal conductive element.

[0014] Preferably, the heating element is provided with a heating wire, and the heating wire is uniformly distributed on the insulating substrate.

[0015] Preferably, the heating element is provided with a temperature sensor, the temperature sensor is connected with the control unit, and the temperature sensor is used for detecting the temperature value of the heating element.

[0016] Preferably, a support is arranged, and the support is connected with the heat dissipation fin, the heating element and the thermoelectric unit respectively.

[0017] In the second aspect, the utility model discloses a gas flow measuring device, including above-mentioned flow measuring mechanism.

[0018] Compared with the prior art, the above technical scheme provided by the application has the following advantages:

[0019] The flow measuring mechanism and the gas flow measuring device provided by the application are mentioned, the thermoelectric unit is powered on, the first end absorbs heat, the second end releases heat, the current flows from the second end to the first end, the heat dissipation element and the thermocouple are arranged at the first end, the first end is exposed in the gas to be detected, after a certain preset time of gas flow, the temperature of the first end is reduced, the voltage between the first end and the second end of the thermoelectric unit changes, the processing unit calculates the gas flow value according to the voltage change, the current gas flow value is reflected according to the change of the voltage value, and the change of the voltage value can reach the order of millivolt, so that the measurement accuracy can be improved.

[0020] The gas flow measuring device is mentioned, the flow measuring mechanism is arranged on the gas flow measuring device, the heat dissipation element and the thermocouple are exposed, other mechanisms are arranged inside the gas flow measuring device, one end of the heat dissipation element of the gas flow measuring device is connected into the gas to be detected, the flow value of the detected gas is detected, and the accuracy of the gas flow value detection can be improved.

[0021] Further, the heat dissipating member and the thermocouple are arranged at the end of the heat absorbing member which is exposed to the gas to be measured. After the gas flows for a predetermined time, the temperature of the end of the heat absorbing member decreases, resulting in a voltage change between the two ends of the thermoelectric unit. The processing unit calculates the gas flow value according to the voltage change. The small voltage change (up to the millivolt level) improves the measurement accuracy.

[0022] Further, the flow measuring mechanism can improve the response speed according to the voltage change. BRIEF DESCRIPTION OF DRAWINGS

[0023] The drawings constituting a part of this specification illustrate embodiments consistent with the present application and, together with the specification, serve to explain the principles of the present application.

[0024] In order to more clearly illustrate the technical solutions in the embodiments of the present application or the prior art, the following will briefly introduce the drawings needed to be used in the embodiments or the prior art description. Obviously, for those of ordinary skill in the art, other drawings can also be obtained based on these drawings without any creative effort.

[0025] Figure 1 A structural schematic diagram of a flow measuring mechanism provided by the present application is shown in the figure.

[0026] Figure 2 A sectional structural schematic diagram of a flow measuring mechanism provided by the present application is shown in the figure.

[0027] Figure 3 A structural schematic diagram of a thermoelectric unit of a flow measuring mechanism provided by the present application is shown in the figure.

[0028] Figure 4 A structural schematic diagram of a gas flow measuring device provided by the present application is shown in the figure.

[0029] Explanation of the reference signs:

[0030] 100, gas flow measuring device;

[0031] 1, flow measuring mechanism;

[0032] 11, thermoelectric unit; 111, first end; 112, second end; 113, P-N thermoelectric pair; 1131, P-type semiconductor; 1132, N-type semiconductor; 114, insulating substrate; 1141, first substrate; 1142, second substrate; 115, metal conductive member;

[0033] 12, heat dissipating member;

[0034] 13, thermocouple;

[0035] 14, heating element; 141, heating wire;

[0036] 15, control unit;

[0037] 16, processing unit;

[0038] 17, bracket. DETAILED DESCRIPTION

[0039] In order to make the purpose, technical scheme and advantages of the present application clearer, the technical scheme of the present application will be described clearly and completely below in combination with the drawings in the present application. Obviously, the described embodiments are part of the embodiments of the present application, rather than all the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without creative labor fall within the scope of protection of the present application.

[0040] In the first aspect, referring to Figures 1-3 The utility model discloses a flow measuring mechanism 1 for measuring gas flow. The flow measuring mechanism 1 includes a control unit 15, a processing unit 16, a thermoelectric unit 11, a heat dissipation element 12, a thermocouple 13, a heating element 14, the thermoelectric unit 11 is electrically connected with the control unit 15, the control unit 15 is electrically connected with the processing unit 16, the control unit 15 is connected with the heat dissipation element 12, the heating element 14 and the thermocouple 13 respectively, the control unit 15 can control the start or shutdown of the heat dissipation element 12, the thermoelectric unit 11, the heating element 14 and the thermocouple 13, the thermocouple 13 is connected with the heat dissipation element 12, wherein the thermoelectric unit 11 is used for generating Seebeck voltage, the thermocouple 13 is used for sensing the temperature on the heat dissipation element 12, the heating element 14 is used for providing stable heat source, the heat dissipation element 12 is used for the heat dissipation of the thermoelectric unit 11, and the heat exchange efficiency of the thermoelectric unit 11 is enhanced, and the processing unit 16 calculates the flow value of the current gas to be detected according to the value obtained by the control unit 15.

[0041] The thermoelectric unit 11 includes a first end 111 and a second end 112, the first end 111 is a cold end for heat absorption, and the second end 112 is a hot end for heat release. The heat dissipation element 12 is arranged at the first end 111 of the thermoelectric unit 11, the thermocouple 13 is installed on the heat dissipation element 12, and the heating element 14 is arranged at the second end 112 of the thermoelectric unit 11. The control unit 15 obtains the temperature value sensed by the thermocouple 13 and the temperature value of the second end 112 of the thermoelectric unit 11, the processing unit 16 calculates the first voltage value according to the temperature value obtained by the control unit 15, the thermocouple 13 and the heat dissipation element 12 are exposed in the gas to be detected, after a predetermined time, the processing unit 16 calculates the second voltage value according to the temperature value change value sensed by the thermocouple 13, and obtains the gas flow value in the predetermined time according to the second voltage value.

[0042] Specifically, by energizing the thermoelectric unit 11, the first end 111 absorbs heat and the second end 112 releases heat, and the current flows from the second end 112 to the first end 111. The heat sink 12 and the thermocouple 13 are arranged at the first end 111, which is exposed to the gas to be detected. After a certain period of gas flow, the temperature of the first end 111 decreases, causing the voltage between the first end 111 and the second end 112 of the thermoelectric unit 11 to change. The processing unit 16 calculates the gas flow value based on the voltage change. The change in voltage value reflects the current gas flow value. The change in voltage value can reach the order of millivolts (10-4V to 10-5V), which can improve the accuracy of the measurement. Furthermore, the flow measurement mechanism 1 reflects the flow size based on the change in voltage value. The change in voltage value is relatively small (reaching the order of millivolts), and the response speed of the measurement result can be improved through electrical signal excitation and response.

[0043] As an embodiment, the thermocouple 13 is arranged at any position of the heat sink 12, for example, between the position close to the thermoelectric unit 11 and the position away from the thermoelectric unit 11. That is, the temperature on the heat sink 12 gradually decreases due to the different distances from the cold end of the thermoelectric unit 11. The thermocouple 13 can be installed along this direction. Multiple thermocouples 13 can be arranged and installed on the heat sink 12. The temperature values at multiple positions can be collected, and the average temperature value can be calculated based on the collected temperature values to serve as the temperature value sensed by the thermocouple 13. This can improve the accuracy of the measurement and avoid the influence of single-point temperature anomalies on the measurement results.

[0044] As an embodiment, the control unit 15 and the processing unit 16 can be arranged in the bracket 17, making the flow measurement mechanism 1 a whole, which is convenient to install and use. Alternatively, the control unit 15 and the processing unit 16 can be external, and the control unit 15 and the processing unit 16 can transmit signals to the structures in the flow measurement mechanism 1 through wired connection. In this embodiment, the control unit 15 and the processing unit 16 are arranged in the bracket 17, but their installation positions are not limited to the arrangement in this embodiment.

[0045] The thermoelectric unit 11 includes at least one P-N thermoelectric pair 113 and two insulating substrates 114. The P-N thermoelectric pair 113 is electrically connected to the control unit 15. The two insulating substrates 114 are respectively arranged at the first end 111 and the second end 112 of the P-N thermoelectric pair 113. The heating element 14 and the heat sink 12 are respectively fixedly connected to one insulating substrate 114.

[0046] Specifically, the thermoelectric unit 11 is a packaged chip, internally provided with P-N thermoelectric pairs 113 and two insulating substrates 114, and externally extended with two connecting lines for power supply. The two insulating substrates 114 are arranged in parallel, and one insulating substrate 114 is arranged at each end of the P-N thermoelectric pairs 113. The P-N thermoelectric pairs 113 are uniformly distributed and arranged perpendicularly to the insulating substrates 114. The P-N thermoelectric pairs 113 include P-type semiconductors 1131 and N-type semiconductors 1132, and adjacent P-type semiconductors 1131 and N-type semiconductors 1132 are connected end to end. The P-type semiconductors 1131 and the N-type semiconductors 1132 are connected by metal conductive members 115. The P-N thermoelectric pairs 113 are divided into cold ends and hot ends at two ends. The hot ends are heated, and the cold ends are cooled. The heating member 14 and the cooling member 12 are both in heat exchange with the insulating substrates 114, so that the heat in the P-N thermoelectric pairs 113 is transferred between the cold ends and the hot ends, and the Seebeck effect is generated. By heating the hot ends and cooling the cold ends, at the cold ends, the current flows from the N-type semiconductors 1132 to the P-type semiconductors 1131, and at the hot ends, the current flows from the P-type semiconductors 1131 to the N-type semiconductors 1132. A voltage is generated between the hot ends and the cold ends, so as to realize the conversion from temperature difference to voltage.

[0047] Specifically, in the closed circuit including the thermoelectric unit 11 and the control unit 15, the cold ends are cooled, the hot ends are heated, the Seebeck effect is generated, and the thermoelectric unit 11 has a temperature difference at two ends, and the Seebeck voltage is generated at two ends. Before the P-N thermoelectric pairs 113 are put into the to-be-detected gas, the Seebeck voltage generated at two ends of the P-N thermoelectric pairs 113 is the first voltage value mentioned above. The cooling member 12 and the thermocouple 13 are put into the to-be-detected gas, and after a preset time, the temperature of the thermocouple 13 and the cooling member 12 changes, that is, the temperature of the cold end of the P-N thermoelectric pairs 113 changes, and the Seebeck voltage changes. At this time, the voltage value at two ends of the P-N thermoelectric pairs 113 is the second voltage value mentioned above. Through the temperature value on the insulating substrate 114 and the change value of the temperature value, the flow value of the to-be-detected gas within the preset time can be obtained through the calculation of the processing unit 16.

[0048] Optionally, the insulating substrate 114 is made of ceramic or other insulating materials. In the embodiment, the insulating substrate 114 is made of ceramic material. The ceramic material has good thermal conductivity, which is conducive to the heat exchange between the P-N thermoelectric pairs 113 and the insulating substrates 114.

[0049] As an embodiment, the P-N thermoelectric pairs 113 can be provided in plurality, and the P-N thermoelectric pairs 113 are uniformly distributed in the range where the insulating substrate 114 is located. The metal conductive member 115 is provided between the P-N thermoelectric pairs 113 and the insulating substrate 114, and the metal conductive member 115 is used to connect the P-N thermoelectric pairs 113 in series. The metal conductive member 115 is in conduction with the exposed connecting line, so that the P-N thermoelectric pairs 113 are in conduction with each other. The metal conductive member 115 can be in the form of a strip, a sheet or other shapes.

[0050] As an embodiment, the surface of the heat dissipation member 12, which is away from the thermoelectric unit 11, is provided with a concave-convex structure. The concave-convex structure can increase the surface area of the heat dissipation member 12, thereby increasing the heat dissipation efficiency. Alternatively, the surface of the heat dissipation member 12 can be in the form of a wave, a sawtooth, a step or other structures, or a combination of two or more structures.

[0051] The insulating substrate 114, on which the heat dissipation member 12 is mounted, is the first substrate 1141, and the insulating substrate 114, on which the heating member 14 is mounted, is the second substrate 1142. At this time, the relationship between the Seebeck voltage S, the temperature T1 of the first substrate 1141 and the temperature t of the second substrate 1142 can be expressed as S1=a(T1-t), where a is the coefficient of the Seebeck system, i.e. the coefficient of the hot spot unit package chip. Since the gas flow can take away the temperature on the heat dissipation member 12, the temperature sensed by the thermocouple 13 changes, thereby causing the temperature of the first substrate 1141 to change, the Seebeck voltage to change, and the gas flow value to change. At this time, the Seebeck voltage is S2, the temperature of the first substrate 1141 is T2, and the relationship can be expressed as S1=a(T2-t). Therefore, the gas flow value in a preset time can be expressed as Q=C / ΔS=C / (S2-S1); where C is a coefficient, which is measured according to experiments. It can be understood that the gas flow value Q is inversely proportional to the Seebeck voltage S. After a preset time, the temperature of the heat dissipation member 12 decreases, the temperature T1 of the first substrate 1141 decreases, and the Seebeck voltage S also decreases, while the gas flow value in the preset time increases. In particular, the coefficient C can be measured according to experiments, and the gas flow value Q and the Seebeck voltage S are fitted to obtain the coefficient C.

[0052] The heating wire 141 is provided in the heating member 14, and the heating wire 141 is uniformly distributed on the insulating substrate 114. It can be understood that the heating wire 141 can continuously provide a stable heat source for the second end 112, and the uniform distribution of the heating wire 141 on the insulating substrate 114 can ensure that the P-N thermoelectric pairs 113 at the other end of the insulating substrate 114 can be heated.

[0053] As an embodiment, the heating element 14 is provided with a temperature sensor connected with the control unit 15, which is used to detect the temperature value of the heating element 14.

[0054] The flow measurement mechanism 1 comprises a support 17 connected with the heat dissipation fin, the heating element 14 and the thermoelectric unit 11 respectively, which is used to fix the heat dissipation fin, the heating element 14 and the thermoelectric unit 11 to stably install each mechanism.

[0055] In the second aspect, referring to Figure 4 The utility model discloses a kind of gas flow measuring devices 100, which can be used for the measurement of gas flow, comprising the above-mentioned flow measurement mechanism 1, gas flow measuring device 100 adopts cylindrical shape, flow measurement mechanism 1 is arranged at one end of gas flow measuring device 100, and the other end of gas flow measuring device 100 is provided with connecting line, and the data results obtained by flow measurement mechanism 1 can be transmitted to upper system by connecting line, one end of gas flow measuring device 100 provided with flow measurement mechanism 1 is inserted into the gas to be detected, and the support 17 of flow measurement mechanism 1 is installed inside gas flow measuring device 100, and heat dissipation element 12 is exposed outside, which can be contacted with the gas to be detected.

[0056] Specifically, flow measurement mechanism 1 is arranged on gas flow measuring device 100, heat dissipation element 12 and thermocouple 13 are exposed, other mechanisms are arranged inside gas flow measuring device 100, one end of gas flow measuring device 100 provided with heat dissipation element 12 is inserted into the gas to be detected, and the flow value of the detected gas can be detected, which can improve the accuracy of gas flow value detection.

[0057] As an embodiment, gas flow measuring device 100 is inserted into the pipeline with the gas to be detected (or other containers with the gas to be detected), wherein one end of gas flow measuring device 100 provided with flow measurement mechanism 1 is inserted into the pipeline and contacted with the gas to be detected.

[0058] In the above embodiments, each embodiment is described with emphasis, and the parts not described in detail in a certain embodiment can be referred to the related description of other embodiments.

[0059] In the description of the utility model, it is understood that the directions or positional relationships indicated by the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise" and the like are the directions or positional relationships shown based on the drawings, and are only for the convenience of describing the utility model and simplifying the description, and therefore cannot be understood as indicating or implying that the devices or elements indicated must have a particular orientation, be constructed and operated in a particular orientation, and therefore cannot be understood as limiting the utility model.

[0060] In addition, the terms "first" and "second" are only for the purpose of description, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined with "first" and "second" can explicitly or implicitly include one or more of the features. In the description of the utility model, the meaning of "multiple" is two or more than two, unless otherwise specifically limited.

[0061] In the utility model, unless otherwise specifically defined and limited, the terms "mounting", "connection", "connection", "fixing" and the like should be understood broadly, for example, it can be connected, or it can be detachably connected, or it can be integrated; it can be mechanically connected, or it can be electrically connected; it can be directly connected, or it can be indirectly connected through an intermediate medium; it can be the communication or interaction relationship between two elements. For ordinary skilled in the art, the specific meaning of the above terms in the utility model can be understood according to the specific circumstances.

[0062] In the utility model, unless otherwise specifically defined and limited, the "upper" or "lower" of the first feature to the second feature can include that the first and second features are in direct contact, or the first and second features are not in direct contact but are in contact through another feature between them. Moreover, the "upper", "upper" and "upper" of the first feature to the second feature include that the first feature is directly above and obliquely above the second feature, or only indicates that the horizontal height of the first feature is higher than that of the second feature. The "below", "below" and "below" of the first feature to the second feature include that the first feature is directly below and obliquely below the second feature, or only indicates that the horizontal height of the first feature is less than that of the second feature.

[0063] In the description of the present specification, the description referring to the terms "one embodiment", "some embodiments", "an example", "a specific example", or "some examples" and the like means that the specific features, structures, materials or characteristics described in connection with the embodiment or example are included in at least one embodiment or example of the present application. In the present specification, the illustrative description of the above terms should not be understood as necessarily referring to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described can be combined in any one or more embodiments or examples in a suitable manner. In addition, those skilled in the art can combine and combine different embodiments or examples described in the present specification.

[0064] Obviously, those skilled in the art can make various modifications and variations to the present application without departing from the spirit and scope of the present application. Thus, these modifications and variations of the present application are intended to be included within the scope of the claims of the present application and equivalents thereof. Therefore, the present application is intended to include these modifications and variations.

[0065] The above is a specific embodiment of the present application, but the protection scope of the present application is not limited to this. Any skilled person in the art can easily think of various equivalent modifications or replacements within the technical range disclosed by the present application, and these modifications or replacements should be included in the protection scope of the present application. Therefore, the protection scope of the present application should be subject to the protection scope of the claims.

Claims

1. A flow measuring mechanism, characterized by, The application relates to a flow measuring mechanism, which comprises a control unit, a processing unit, a thermoelectric unit, a heat dissipating piece and a thermocouple, wherein the thermoelectric unit is electrically connected with the control unit, and the control unit is electrically connected with the processing unit. The heat dissipating piece is arranged at the first end of the thermoelectric unit, and the thermocouple is arranged on the heat dissipating piece. The control unit acquires the temperature value sensed by the thermocouple and the second end temperature value of the thermoelectric unit, the processing unit calculates a first voltage value according to the temperature value acquired by the control unit, the thermocouple and the heat dissipating piece are exposed in the gas to be detected, after a preset time, the processing unit calculates a second voltage value according to the temperature value sensed by the thermocouple, and the gas flow value in the preset time is obtained according to the second voltage value.

2. The mechanism of claim 1, wherein, The application further discloses a flow measuring mechanism, which comprises a heating piece arranged at the second end of the thermoelectric unit, and the heating piece is connected with the control unit.

3. The mechanism of claim 2, wherein, The thermoelectric unit comprises at least one P-N thermoelectric pair and two insulating substrates, the P-N thermoelectric pair is electrically connected with the control unit, and the two insulating substrates are respectively arranged at the first end and the second end of the P-N thermoelectric pair.

4. The mechanism of claim 3, wherein, The heating piece and the heat dissipating piece are respectively fixedly connected with an insulating substrate.

5. The mechanism of claim 3, wherein, The P-N thermoelectric pairs are uniformly distributed, and the P-N thermoelectric pairs are vertically arranged with the insulating substrates.

6. The mechanism of claim 3, wherein, The P-N thermoelectric pair comprises a P-type semiconductor and an N-type semiconductor, adjacent P-type semiconductors and N-type semiconductors are connected end to end, and the P-type semiconductor and the N-type semiconductor are connected through a metal conductive piece.

7. The mechanism of claim 3, wherein, The heating piece is provided with heating wires, and the heating wires are uniformly distributed on the insulating substrates.

8. The mechanism of claim 2, wherein, The heating piece is provided with a temperature sensor, the temperature sensor is connected with the control unit, and the temperature sensor is used for detecting the temperature value of the heating piece.

9. The mechanism of claim 1, wherein, The application further discloses a flow measuring mechanism, which comprises a support connected with the heat dissipating piece, the heating piece and the thermoelectric unit.

10. A gas flow measuring device, characterized by The application further discloses a flow measuring mechanism, which comprises the flow measuring mechanism according to any one of claims 1-9.

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