High and low temperature probe station testing device

Abstract

The utility model provides a high and low temperature probe station testing device comprising a probe station body which is provided with a chuck and a probe card; the temperature measuring unit comprises a temperature measuring cover body and a temperature sensor, and the temperature measuring cover body covers the concave cavity of the chuck; a probe of the temperature sensor penetrates through the first through hole in the temperature measurement cover body and enters the concave cavity for temperature measurement; the upper cover is provided with a concave space, a light source is arranged in the middle area of the concave space, and a first sealing ring is arranged around the circumferential annular area of the light source. Blowing air into a closed space enclosed by the upper cover and the probe card through a second through hole in the upper cover; and the air blocking sheet is arranged near the air outlet of the fan of the probe station. The temperature measuring unit improves the temperature uniformity and stability of high and low temperature testing of the wafer, and solves the problem of frosting of the chuck. The blowing and sealing design of the upper cover solves the problem of frosting of the probe card and the wafer during low-temperature testing. And the wind shield sheet solves the problem of non-uniformity of the temperature of the wafer during high-temperature testing.

Description

TECHNICAL FIELD

[0001] The utility model belongs to integrated circuit manufacturing technical field, concretely relates to a high and low temperature probe station testing arrangement. BACKGROUND

[0002] In order to guarantee the quality of wafer that production and processing complete and the stability of production line process, must carry out testing to wafer before wafer leaves factory. Test system includes tester and probe station, and probe station is loaded with chuck and probe card, and chuck is used for fixing wafer, and probe card carries out contact test to wafer;Tester is used to output voltage and current and the like excitation, and according to the pre-set program, the voltage and current that are fed back from probe card are calculated, and finally output test result.

[0003] As shown in Figure 1 And Figure 2 When wafer is in high and low temperature test (for example-40 ℃~125 ℃) environment, on the one hand: temperature is not stable and not uniform due to the temperature of the open top of chuck being not good control. On the other hand: when carrying out low temperature test, due to imperfect sealing, the recessed cavity of chuck is in low temperature environment, and the lower surface of probe card is located just above the recessed cavity of chuck, and the temperature of the lower surface of probe card will be low, and when carrying out low temperature test to vehicle-mounted product wafer, the temperature difference between the upper and lower surfaces of probe card is too large, causing multiple test failures, and reducing the service life of probe card;Moreover, when carrying out low temperature test, chuck and wafer are seriously frosted, reducing the service life of probe station. On the other hand: when carrying out high temperature test to probe station, the air flow on the surface of chuck caused by the air blowing of the front and rear fans of probe station causes inaccurate temperature measurement value. CONTENT OF UTILITY MODEL

[0004] The utility model aims at providing a kind of high and low temperature probe station testing arrangement, and temperature measuring unit improves the temperature uniformity and stability of wafer high and low temperature test, solves the problem of chuck frosting. The air blowing design of upper cover solves the problem of probe card and wafer frosting when low temperature test. Wind deflector solves the problem of wafer temperature non-uniformity when high temperature test.

[0005] The utility model provides a kind of high and low temperature probe station testing arrangement, comprising:

[0006] Probe station body, chuck and probe card located above the chuck are configured on the probe station body, and the chuck has recessed cavity for accommodating and fixing wafer;

[0007] Temperature measuring unit, the temperature measuring unit includes temperature measuring cover body and temperature sensor, the temperature measuring cover body is located at the top of the chuck and covers the recessed cavity;A plurality of first through holes are formed in the temperature measuring cover body;The probe of temperature sensor passes through the first through hole and enters the recessed cavity to measure temperature;

[0008] The upper cover has a recessed space, a middle region of the recessed space is provided with a light source, a circumferential annular region of the recessed space surrounding the light source is provided with a first sealing ring; the upper cover and the upper surface of the probe card form a closed space; a plurality of second through holes are arranged on the upper cover, and air is blown into the closed space formed by the upper cover and the probe card through the second through holes;

[0009] The wind baffle is arranged near a fan outlet of the probe station body, and is used for preventing the wind formed by the fan from blowing to the recessed cavity of the chuck.

[0010] Further, the temperature measuring unit is used in the formation of a preset temperature process in the recessed cavity of the chuck, and the temperature measuring unit is removed once the temperature is stable; the probes on the probe card are used to contact the chip pads on the wafer for testing.

[0011] Further, the circumferential annular region of the temperature measuring cover is sealed with the sidewall of the chuck through a second sealing ring.

[0012] Further, in the first through hole, the temperature sensor is sleeved with an annular sealing gasket and the sidewall of the first through hole.

[0013] Further, a handle is arranged on the upper surface of the temperature measuring cover.

[0014] Further, the temperature measuring cover comprises a connected middle circular region and circumferential annular region, and the thickness of the middle circular region is less than the thickness of the circumferential annular region.

[0015] Further, the probe station body comprises a plurality of fan outlets, and the wind baffles are arranged at each fan outlet.

[0016] Further, the wind baffle is in the form of a sheet, and a groove is arranged on the wind baffle, and the groove is used for wiring or fixing related electrical signal lines.

[0017] Further, the temperature sensor comprises any one of a platinum resistance temperature sensor, a thermistor temperature sensor and a thermocouple temperature sensor.

[0018] Further, the second through hole is arranged on the annular outer side of the first sealing ring; half of the second through holes are used as air inlet holes, and the other half of the second through holes are used as air outlet holes, and the air inlet holes and the air outlet holes are arranged in pairs.

[0019] Compared with the prior art, the utility model has the beneficial effects that:

[0020] The utility model provides a high and low temperature probe platform test device, include: probe platform body, the chuck and the probe card located chuck top are configured to probe platform body, the chuck has recessed cavity for accommodating and fixed wafer, temperature measurement unit, temperature measurement unit includes temperature measurement cover and temperature sensor, temperature measurement cover is located the top of chuck and covers recessed cavity, be provided with a plurality of first through -hole of the temperature measurement cover on temperature measurement cover, the probe of temperature sensor passes first through -hole and enters recessed cavity temperature measurement, upper cover, upper cover has recessed space, the middle region of recessed space is provided with light source, the circumferential annular region of surrounding light source in recessed space is provided with first sealing ring, upper cover and probe card upper surface surround and form airtight space, be provided with a plurality of second through -hole of upper cover on upper cover, through second through -hole, the airtight space of upper cover and probe card surround and blow gas, wind -baffle, wind -baffle sets up in the fan outlet near of probe platform body, for preventing the wind of fan blowing to the recessed cavity of chuck.

[0021] Temperature measurement unit improves wafer high and low temperature test temperature uniformity and stability, solves the frost problem of chuck. The gas blowing design of upper cover solves the frost problem of probe card and wafer during low temperature test. Wind -baffle solves the wafer temperature non -uniformity problem during high temperature test. BRIEF DESCRIPTION OF DRAWINGS

[0022] Figure 1 It is the frost and unfrosted contrast diagram for wafer.

[0023] Figure 2 It is the uniform and non -uniform contrast diagram for wafer temperature.

[0024] Figure 3 It is the temperature measurement cover physical object schematic diagram of the utility model embodiment.

[0025] Figure 4 It is the temperature measurement cover three -dimensional schematic diagram of the utility model embodiment.

[0026] Figure 5 It is the upper cover physical object bottom view schematic diagram of the utility model embodiment.

[0027] Figure 6 It is the upper cover bottom view mechanical schematic diagram of the utility model embodiment.

[0028] Figure 7 It is the upper cover and probe card sealing front view of the utility model embodiment.

[0029] Figure 8 It is the wind -baffle schematic diagram of the utility model embodiment.

[0030] Among them, the sign follows:

[0031] 01-chuck; 10-temperature measuring cover; 11-intermediate circular area; 12-circumferential annular area; 13-first through hole; 14-handle; 20-upper cover; 21-light source; 22-first sealing ring; 23-second through hole; 24-upper cover bottom surface; 25-positioning hole; 26-threaded hole; 31-first wind deflector; 32-second wind deflector; 32a-groove; 40-probe card. DETAILED DESCRIPTION

[0032] The utility model is further explained in detail below in combination with the drawings and specific embodiments. The advantages and features of the utility model will be more apparent according to the following description. It should be noted that the drawings are all in a very simplified form and use non-precise proportions, only to facilitate, clear and assist the purpose of explaining the embodiment of the utility model.

[0033] For the convenience of description, some embodiments of the present application can use spatial relative terms such as "above", "below", "top", "bottom", etc. to describe the relationship between one element or component and another (or another) element or component as shown in the drawings of the embodiments. It should be understood that in addition to the orientation described in the drawings, the spatial relative terms are also intended to include different orientations of the device in use or operation. For example, if the device in the drawings is turned over, the element or component described as "below" or "under" the other element or component will be positioned "above" or "over" the other element or component. The terms "first", "second", etc. in the following are used to distinguish between similar elements, and are not necessarily used to describe a specific order or time sequence. It is understood that these terms used in this way can be replaced under appropriate circumstances.

[0034] The utility model embodiment provides a kind of high-low temperature probe station testing device, as shown in Figures 3 to 8 It includes:

[0035] Probe station body is configured with chuck 01 and probe card above chuck on probe station body, chuck 01 has recessed cavity for accommodating and fixed wafer;

[0036] Temperature measuring unit, temperature measuring unit includes temperature measuring cover 10 and temperature sensor, temperature measuring cover 10 is located at the top of chuck and covers recessed cavity;Temperature measuring cover 10 is provided with a plurality of first through holes 13 penetrating temperature measuring cover 10;The probe of temperature sensor enters recessed cavity temperature measurement through first through hole 13;

[0037] The upper cover 20 has a recessed space, a middle region of the recessed space is provided with a light source 21, and a circumferential annular region of the recessed space surrounding the light source 21 is provided with a first sealing ring 22; the upper cover 20 and the upper surface of the probe card 40 form a closed space; a plurality of second through holes 23 penetrating the upper cover 20 are arranged on the upper cover 20, and the closed space formed by the upper cover 20 and the probe card 40 is blown through the second through holes 23;

[0038] The wind shield is arranged near a fan outlet of the probe station body, and is used for preventing the wind formed by the fan from blowing to the recessed cavity of the chuck.

[0039] Specifically, the temperature measuring unit is used in the formation of a preset temperature process in the recessed cavity of the chuck, and the temperature measuring unit is removed once the temperature is stable; and the probes on the probe card are used to contact the chip pads on the wafer for testing. The circumferential annular region of the temperature measuring cover body 10 is sealed with the sidewall of the chuck through the second sealing ring. In the first through hole 13, the temperature sensor is sleeved with an annular sealing gasket and the sidewall of the first through hole 13. The upper surface of the temperature measuring cover body 10 is provided with a handle 14. The temperature measuring cover body 10 comprises a connected middle circular region 11 and a circumferential annular region 12, the thickness of the middle circular region 11 is less than the thickness of the circumferential annular region 12, so as to form the first through hole 13 in the middle circular region 11. For example, one first through hole 13 is formed in the center of the middle circular region 11, and four first through holes 13 are uniformly distributed on the circumferential side of the middle circular region 11, so that the probe of the temperature sensor enters from the first through hole 13 to monitor the temperature of each region. The middle circular region 11 and the circumferential annular region 12 form a stepped shape. The temperature sensor comprises any one of a platinum resistance temperature sensor, a thermistor temperature sensor and a thermocouple temperature sensor.

[0040] Compared with the unstable and uneven temperature caused by the poor temperature control of the open top of the chuck 01 before the improvement, the wafer is fixed in the recessed cavity of the chuck 01, the temperature measuring cover body 10 covers the recessed cavity of the chuck 01 to form a closed space, which is more easy to form a stable and accurate temperature field, and the probe of the temperature sensor enters the recessed cavity of the chuck 01 from the first through hole 13 to test the temperature in real time and on site, accurately test the temperature of the environment where the wafer is located, and the temperature control system of the probe station body can adjust the heating or cooling in time according to the test temperature, improve the temperature uniformity and stability of the wafer high-low temperature test, and solve the problem of frost formation of the chuck 01.

[0041] When the wafer is tested, the temperature measuring cover 10 and the temperature sensor are removed, and the wafer is still fixed in the recessed cavity of the chuck 01, and the probes in the probe card above the chuck 01 contact the pads of the chips on the wafer to perform testing. When low-temperature testing is performed, the recessed cavity of the chuck 01 is in a low-temperature environment, the lower surface of the probe card is located directly above the recessed cavity of the chuck, and the temperature of the lower surface of the probe card will be lowered accordingly. When low-temperature testing of a vehicle-mounted product is performed, a large temperature difference between the upper and lower surfaces of the probe card will cause multiple test items to fail, and the service life of the probe card is also reduced.

[0042] In the utility model, the light source 21 in the upper cover 20 provides illumination for wafer testing, and the first sealing ring 22 is arranged in the circumferential annular region of the light source 21 in the recessed space of the upper cover 20, and the first sealing ring 22 is used for protecting the light source 21 and preventing cold air or hot air from entering the light source 21 from the circumferential ring. The upper cover 20 and the upper surface of the probe card 40 form a sealed space; specifically, the upper cover bottom surface 24 and the upper surface of the probe card 40 are in contact to form a sealed space. The upper cover bottom surface 24 is provided with positioning holes 25 at four corners. The upper cover bottom surface 24 is also provided with a plurality of threaded holes 26. The sealed space formed by the upper cover 20 and the probe card 40 is blown by the second through hole 23 on the upper cover 20, and the second through hole 23 is arranged on the outer side of the first sealing ring 22; half of the second through hole 23 is used as an air inlet hole, and the other half is used as an air outlet hole, and the air inlet hole and the air outlet hole are arranged in pairs; by arranging the air inlet hole and the air outlet hole, a continuous airflow is formed on the upper surface of the probe card 40, and the airflow blown through the second through hole 23 is filtered dry airflow, thereby enhancing the air circulation on the upper surface of the probe card 40 and solving the problem of frost formation on the probe card 40 and the wafer during low-temperature testing.

[0043] The probe station body is initially designed with a fan, and the fan outlet blows air to cool the whole probe station. However, when the probe station measures high temperature, the air flow on the surface of the chuck 01 caused by the fan outlet blowing air will cause inaccurate temperature measurement. In the utility model, the wind deflector is arranged near the fan outlet of the probe station body, which is used to prevent the wind formed by the fan from blowing to the recessed cavity of the chuck 01, so that the temperature on the surface of the chuck is uniform, and the problem of non-uniformity of wafer temperature during high-temperature testing is solved.

[0044] The probe station body includes a plurality of fan outlets, and a wind deflector is arranged at each fan outlet. For example, a first wind deflector 31 and a first wind deflector 32 are arranged, the wind deflectors are in the form of a sheet, and a groove 32a is arranged on the wind deflector. The groove 32a is used for wiring or fixing related electrical signal lines. The wind deflector can include a plurality of pieces, and the specific number is set according to actual needs.

[0045] The utility model discloses can provide better temperature uniformity and prolong the service life of probe station in wafer test of vehicle-mounted product, improve the sealing property and temperature uniformity of probe station, improve the temperature uniformity of whole wafer under the environment of high and low temperature test (for example -40 DEG C ~ 125 DEG C) of wafer.

[0046] On the basis of the existing probe station test platform, the whole wafer has good temperature uniformity by changing the air flow and designing the sealing jig. It is applied to the wafer high and low temperature test of all vehicle-mounted products, meets the temperature measurement and wafer temperature uniformity requirements of vehicle-mounted machine, provides better high and low temperature wafer test scheme, and solves the problems of chuck and wafer low temperature frosting and high temperature temperature non-uniformity.

[0047] In conclusion, the utility model provides a kind of high and low temperature probe station testing device, comprising: probe station body, chuck and probe card located above chuck are configured on probe station body, chuck has recessed cavity for accommodating and fixed wafer;Temperature measuring unit, temperature measuring unit includes temperature measuring cover and temperature sensor, temperature measuring cover is located at the top of chuck and covers recessed cavity;Temperature measuring cover is provided with a plurality of first through holes passing through temperature measuring cover;The probe of temperature sensor passes through first through hole and enters recessed cavity temperature measurement;Upper cover, upper cover has recessed space, recessed space middle region is provided with light source, and the circumferential annular region of light source in recessed space is provided with first sealing ring;Upper cover and probe card upper surface form closed space;Upper cover is provided with a plurality of second through holes passing through upper cover, and the closed space of upper cover and probe card is blown by second through hole;Wind deflector, wind deflector is arranged in the fan outlet near the fan of probe station body, for preventing the wind formed by fan from blowing to the recessed cavity of chuck.

[0048] Temperature measuring unit improves the temperature uniformity and stability of wafer high and low temperature test, and solves the problem of chuck frosting. The air blowing design of upper cover solves the problem of probe card and wafer frosting during low temperature test. Wind deflector solves the problem of wafer temperature non-uniformity during high temperature test.

[0049] Each embodiment in the specification is described in a progressive manner, and each embodiment focuses on the difference from other embodiments. The same or similar parts of each embodiment can be referred to each other. For the method disclosed by the embodiment, since it corresponds to the device disclosed by the embodiment, the description is relatively simple, and the related part can be referred to the method part.

[0050] The above description is only a description of the preferred embodiments of the present application, and is not any limitation on the scope of the present application. Any person skilled in the art can make possible changes and modifications to the technical scheme of the present application by using the disclosed methods and technical contents without departing from the spirit and scope of the present application. Therefore, any simple modification, equivalent change and modification made to the above embodiments according to the technical essence of the present application, which does not depart from the technical scheme of the present application, belongs to the protection scope of the technical scheme of the present application.

Claims

1. A high and low temperature probe station testing device, characterized in that, The high-low temperature probe station test device comprises: a probe station body, a chuck and a probe card above the chuck are arranged on the probe station body, the chuck has a recessed cavity for accommodating and fixing a wafer; a temperature measuring unit, the temperature measuring unit comprises a temperature measuring cover and a temperature sensor, the temperature measuring cover is located on the top of the chuck and covers the recessed cavity, a plurality of first through holes are arranged on the temperature measuring cover and penetrate the temperature measuring cover, the probe of the temperature sensor penetrates the first through hole and enters the recessed cavity to measure the temperature; an upper cover, the upper cover has a recessed space, a light source is arranged in the middle area of the recessed space, a first sealing ring is arranged in the circumferential annular area of the recessed space around the light source, the upper cover and the upper surface of the probe card form a sealed space, a plurality of second through holes are arranged on the upper cover and penetrate the upper cover, and air is blown into the sealed space formed by the upper cover and the probe card through the second through holes; a wind deflector, the wind deflector is arranged near the fan outlet of the probe station body and is used for preventing the wind formed by the fan from blowing to the recessed cavity of the chuck.

2. The high-low temperature probe station test device according to claim 1, wherein the temperature measuring unit is used in a preset temperature process of the recessed cavity of the chuck, and the temperature measuring unit is removed after the temperature is stable, and the probes on the probe card are used to contact the chip pads on the wafer for testing.

3. The high-low temperature probe station test device according to claim 1, wherein the circumferential annular area of the temperature measuring cover is sealed with a second sealing ring and the side wall of the chuck.

4. The high-low temperature probe station test device according to claim 1, wherein in the first through hole, the temperature sensor is sleeved with an annular sealing gasket and the side wall of the first through hole is sealed.

5. The high-low temperature probe station test device according to claim 1, wherein a handle is arranged on the upper surface of the temperature measuring cover.

6. The high-low temperature probe station test device according to claim 1, wherein the temperature measuring cover comprises a connected middle circular area and circumferential annular area, and the thickness of the middle circular area is less than the thickness of the circumferential annular area.

7. The high-low temperature probe station test device according to claim 1, wherein the probe station body comprises a plurality of fan outlets, and the wind deflector is arranged at each fan outlet.

8. The high-low temperature probe station test device according to claim 1, wherein the wind deflector is in the form of a sheet, and a groove is arranged on the wind deflector, and the groove is used for wiring or fixing related electrical signal lines.

9. The high-low temperature probe station test device according to claim 1, wherein the temperature sensor comprises any one of a platinum resistance temperature sensor, a thermistor temperature sensor and a thermocouple temperature sensor.

10. The high-low temperature probe station test device according to claim 1, wherein the second through hole is arranged on the annular outer side of the first sealing ring, half of the second through holes are used as air inlet holes, the other half of the second through holes are used as air outlet holes, and the air inlet holes and the air outlet holes are arranged in pairs. ​ ​ ​ ​ ​ ​ ​ ​ ​

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