High-frequency mixed-voltage circuit board capable of rapidly dissipating heat

By designing a protective frame and heat dissipation components on the high-frequency mixed-voltage circuit board, and utilizing high thermal conductivity materials and micro-motor driven blower blades to achieve rapid heat dissipation, the heat dissipation and wear problems of traditional high-frequency mixed-voltage circuit boards are solved, improving the operational stability and lifespan of the circuit board.

CN223681258UActive Publication Date: 2025-12-16SHENZHEN YUWEIXING ELECTRONIC CO LTD
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Patent Information

Application Number
CN202423099542.7
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2024-12-16
Publication Date
2025-12-16
Estimated Expiration
2034-12-16

AI Technical Summary

Technical Problem

Traditional high-frequency mixed voltage circuit boards require auxiliary heat dissipation during use, and the sides of the board are prone to wear, affecting the normal operation and function of the circuit board.

Method used

A high-frequency hybrid circuit board with rapid heat dissipation, including a protective frame and heat dissipation components, was designed. The protective frame, made of a high thermal conductivity material, protects the main circuit board, and the airflow is accelerated by a blower blade driven by a micro motor. Combined with heat sinks and connecting pipes, efficient heat dissipation is achieved.

Benefits of technology

It effectively protects the sides of the circuit board from wear and cracking, while improving heat dissipation efficiency, ensuring the normal operation of the circuit board and extending its service life.

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Abstract

The utility model discloses a high-frequency mixed-voltage circuit board capable of rapidly dissipating heat, and relates to the technical field of circuit boards. The circuit board comprises a circuit main board and a heat dissipation assembly, the heat dissipation assembly comprises a protective frame and a mounting frame, and the protective frame is arranged on the peripheral side of the circuit main board. The heat dissipation assembly is arranged, the protection frame is buckled on the peripheral side of the circuit mainboard, the side edge of the circuit mainboard can be protected, the side face of the circuit mainboard is prevented from being abraded and cracked, the peripheral side of the protection frame is fixedly connected with the multiple sets of fixing blocks, the screw holes are formed in the fixing blocks for installation, and therefore the heat dissipation effect is improved. A through screw hole can be prevented from being formed in the circuit mainboard; the cooling fins are used for carrying out auxiliary heat dissipation on the circuit mainboard, and the through holes are formed in the cooling fins, so that the contact area between the cooling fins and the external environment can be increased, and heat dissipation can be effectively facilitated; the communication pipe groove is formed in the protection frame, heat of the circuit main board is rapidly brought out according to the airflow principle, and the good heat dissipation effect is achieved.
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Description

TECHNICAL FIELD

[0001] The utility model belongs to circuit board technical field, especially, relate to a quick heat dissipation high frequency mixed voltage circuit board. BACKGROUND

[0002] The high frequency mixed voltage circuit board adopts base materials of different materials to carry out laminating combination, such as the high frequency material with low dielectric constant and low loss factor is mixed with ordinary FR-4 material and so on, and is used.

[0003] The traditional high frequency mixed voltage circuit board needs to carry out auxiliary heat dissipation when using, avoids the normal operation of circuit board, and the side of the plate material is easy to be abraded after long time work, and then the function of the circuit board is affected. UTILITY MODEL CONTENTS

[0004] The utility model discloses a quick heat dissipation high frequency mixed voltage circuit board, solves the problem that the traditional high frequency mixed voltage circuit board needs to carry out auxiliary heat dissipation when using, avoids the normal operation of circuit board, and the side of the plate material is easy to be abraded after long time work, and then the function of the circuit board is affected.

[0005] To solve the above technical problem, the utility model is realized through the following technical schemes:

[0006] The utility model discloses a quick heat dissipation high frequency mixed voltage circuit board, including circuit mainboard and heat dissipation subassembly, the heat dissipation subassembly includes protection frame and mounting bracket, the protection frame sets up in the circumferential side of circuit mainboard, and is buckled with circuit mainboard, the protection frame is formed by two groups U type frame, and the both ends of one group U type frame are fixedly connected with the plug-in rod, the both ends of another group U type frame are all set up with the slot, the plug-in rod is inserted with the slot, the both sides of protection frame are all fixedly connected with a plurality of radiating fins, the surface of radiating fin is set up with multiple groups through -hole, the inside of the both ends of protection frame is all set up with the communicating pipe groove, the communicating pipe groove is formed by multiple groups U type groove head -to -tail connection, the both sides of the end of protection frame are all fixedly connected with the air outlet pipe, the air outlet pipe is linked with the communicating pipe groove, and the air outlet pipe is set up in one side of radiating fin.

[0007] Two sides of the other end of the protection frame are fixedly connected with air inlet pipes, the air inlet pipes are communicated with the communication pipe groove, the mounting frame is arranged on one side of the protection frame, both ends of the mounting frame are provided with fixed screws, one end of the fixed screw is screwed with the protection frame, the inside of the mounting frame is fixedly connected with a blowing box, one end of the blowing box is provided with a micro motor, the output end of the micro motor is fixedly connected with blowing blades, the blowing blades are arranged in the blowing box and are rotationally matched with the blowing box, and the blowing blades are arranged on one side of the heat dissipation fins.

[0008] The air inlet pipe is arranged on one side of the blowing blades.

[0009] The protection frame is fixedly connected with a plurality of fixed blocks on the circumferential side, and screw holes are formed in the inside of the fixed blocks.

[0010] A fastening screw is arranged at the joint of the plug-in rod and the plug-in groove, so that the protection frame can be fixed on the circumferential side of the circuit mainboard to provide protection.

[0011] The protection frame is made of high-thermal-conductivity material, so that the protection frame can provide protection for the circuit mainboard and improve the heat dissipation performance.

[0012] The utility model has the following beneficial effects:

[0013] The protection frame is buckled on the circumferential side of the circuit mainboard, so that the side of the circuit mainboard can be protected, the side surface of the circuit mainboard is prevented from being abraded and cracked, a plurality of fixed blocks are fixedly connected on the circumferential side of the protection frame, screw holes are formed in the fixed blocks for mounting, the through screw holes are prevented from being formed on the circuit mainboard, and the structure of the circuit mainboard is not damaged, the heat dissipation fins are used to assist in heat dissipation of the circuit mainboard, the through holes are formed in the heat dissipation fins, the contact area of the heat dissipation fins and the external environment is increased, and the heat dissipation is effectively assisted, the communication pipe groove is formed in the protection frame, the heat of the circuit mainboard is quickly taken out by using the principle of airflow, good heat dissipation effect is achieved, the mounting frame is fixed on one side of the protection frame by using the fixed screw, the blowing blades are driven to rotate by using the micro motor, the heat dissipation fins are blown, the air circulation rate is increased, the heat dissipation effect is improved, and the air blown by the blowing blades enters the communication pipe groove, and the heat dissipation efficiency is further improved by using the principle of airflow.

[0014] Of course, it is not necessary for any product implementing the utility model to achieve all the advantages mentioned above. BRIEF DESCRIPTION OF DRAWINGS

[0015] In order to more clearly illustrate the technical scheme of the embodiments of the present application, the following will briefly introduce the drawings needed to be used in the embodiment description, obviously, the drawings in the following description are only some embodiments of the present application, and for the ordinary skilled in the art, other drawings can also be obtained according to these drawings without creative labor.

[0016] Figure 1 It is a three-dimensional assembly structure schematic diagram of the present application.

[0017] Figure 2 It is a left view of the assembly structure of the present application.

[0018] Figure 3 It is Figure 2 A-A sectional structure schematic diagram.

[0019] In the drawings, the component list represented by each number is as follows:

[0020] 1, circuit mainboard; 2, heat dissipation assembly; 201, protection frame; 21, mounting rack; 202, plug-in rod; 203, fastening screw; 204, fixed block; 205, screw hole; 206, fixed screw; 207, micro motor; 208, heat dissipation fin; 209, through hole; 210, air outlet pipe; 211, blowing blade; 212, air inlet pipe; 213, communication pipe groove; 214, blowing box. DETAILED DESCRIPTION

[0021] The technical scheme in the embodiments of the present application will be described clearly and completely in the following by combining with the drawings in the embodiments of the present application, obviously, the described embodiments are only some embodiments of the present application, not all the embodiments. Based on the embodiments in the present application, all the other embodiments obtained by the ordinary skilled in the art without creative labor are within the protection scope of the present application.

[0022] In the description of the present application, it is understood that the terms "upper", "middle", "outer", "inner" and the like indicate the orientation or position relationship, only for the convenience of describing the present application and simplifying the description, and not indicate or imply that the indicated components or elements must have a particular orientation, be constructed and operated in a particular orientation, therefore, it cannot be understood as a limitation to the present application.

[0023] In the description of the utility model, it is to explain, unless there is definite and limited, the term "installation" "is provided with" "connection" and so on, should do broad sense understanding, for example "connection", can be fixed connection, also can be detachable connection, or integral connection;Can be mechanical connection, also can be electrical connection;Can be directly connected, also can be indirectly connected through the intermediate medium, can be the communication of two elements inside.For the ordinary skill in the art, the specific meaning of the above-mentioned terms in the utility model can be understood according to the specific circumstances.

[0024] Please refer to Figures 1-3 The utility model discloses a kind of quick heat dissipation high-frequency mixed voltage circuit board, including circuit mainboard 1 and heat dissipation component 2, heat dissipation component 2 includes protective frame 201 and mounting bracket 21, protective frame 201 is set to the lateral side of circuit mainboard 1, and with circuit mainboard 1 buckle cooperation, protective frame 201 is formed by two groups of U-shaped frame, one end of one group of U-shaped frame is fixedly connected with plug-in rod 202, the other group of U-shaped frame both ends are provided with insertion slot, plug-in rod 202 is inserted with insertion slot and cooperates, the lateral surface of protective frame 201 is fixedly connected with several radiating fins 208, the surface of radiating fin 208 is provided with multiple groups of through hole 209, the inside of both ends of protective frame 201 is provided with communicating pipe groove 213, communicating pipe groove 213 is formed by multiple groups of U-shaped groove head-to-tail connection, the lateral side of one end of protective frame 201 is fixedly connected with air outlet pipe 210, air outlet pipe 210 is communicated with communicating pipe groove 213, air outlet pipe 210 is set to one side of radiating fin 208.

[0025] The lateral side of the other end of protective frame 201 is fixedly connected with air inlet pipe 212, air inlet pipe 212 is communicated with communicating pipe groove 213, mounting bracket 21 is set to one side of protective frame 201, both ends of mounting bracket 21 are provided with fixed screw 206, one end of fixed screw 206 is fixedly screwed with protective frame 201, the inside of mounting bracket 21 is fixedly connected with blowing box 214, one end of blowing box 214 is installed with micro motor 207, the output end of micro motor 207 is fixedly connected with blowing blade 211, blowing blade 211 is set in blowing box 214, and is rotationally cooperated with blowing box 214, blowing blade 211 is set to one side of radiating fin 208.

[0026] Air inlet pipe 212 is set to one side of blowing blade 211.

[0027] The lateral side of protective frame 201 is fixedly connected with multiple groups of fixed block 204, and screw hole 205 is formed in the inside of fixed block 204.

[0028] The plug-in rod 202 and the insertion slot of insertion are provided with fastening screw 203;By setting fastening screw 203, it is convenient to fix protective frame 201 on the lateral side of circuit mainboard 1, and protection is provided.

[0029] The protective frame 201 is made of high-thermal-conductivity material, and provides protection for the circuit mainboard 1 and improves the heat dissipation performance.

[0030] It should be noted that the protective frame 201 is buckled on the peripheral side of the circuit mainboard 1 to protect the side of the circuit mainboard 1 from wear and tear and cracking, and a plurality of fixing blocks 204 are fixedly connected to the peripheral side of the protective frame 201, screw holes 205 are formed in the fixing blocks 204 for installation, so that the through screw holes 205 are not formed on the circuit mainboard 1, and the structure of the circuit mainboard 1 is not damaged; the heat dissipation fins 208 are used to assist in heat dissipation of the circuit mainboard 1, the through holes 209 are formed in the heat dissipation fins 208 to increase the contact area of the heat dissipation fins 208 with the external environment, and the heat dissipation is effectively assisted; the communication pipe grooves 213 are formed in the protective frame 201, the air outside the environment flows through the communication pipe grooves 213, the heat of the circuit mainboard 1 is quickly taken out by using the principle of air flow, good heat dissipation effect is achieved, and the mounting rack 21 is fixed on one side of the protective frame 201 by using the fixing screws 206, the micro motor 207 is electrically connected to the external power supply, the micro motor 207 drives the blowing blades 211 to rotate, blows the heat dissipation fins 208, accelerates the flow rate of the air, improves the heat dissipation effect, and the air blown by the blowing blades 211 enters the communication pipe grooves 213 to further improve the heat dissipation efficiency.

[0031] In the description of the present specification, the description of the terms "one embodiment", "example", "specific example" and the like means that the specific features, structures, materials or characteristics described in connection with the embodiment or example are included in at least one embodiment or example of the present application. In the present specification, the illustrative description of the above terms does not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described can be combined in any one or more embodiments or examples in a suitable manner.

[0032] The preferred embodiments of the present application disclosed above are only used to help explain the present application. The preferred embodiments do not describe all the details, nor limit the present application to the specific embodiments described. Obviously, many modifications and changes can be made according to the content of the present specification. The embodiments are selected and described in the present specification in order to better explain the principles and practical applications of the present application, so that the persons skilled in the art can well understand and utilize the present application. The present application is limited by the claims and the entire scope and equivalents thereof.

Claims

1. A high-frequency hybrid circuit board with rapid heat dissipation, comprising a circuit board (1) and a heat dissipation assembly (2), characterized in that: The heat dissipation assembly (2) comprises a protective frame (201) and a mounting rack (21), the protective frame (201) is arranged on the side of the circuit mainboard (1) and is buckled with the circuit mainboard (1), the protective frame (201) is composed of two groups of U-shaped frames, one end of one group of the U-shaped frames is fixedly connected with a plug-in rod (202), and the other end of the other group of the U-shaped frames is provided with a slot, the plug-in rod (202) is plugged with the slot, a plurality of heat dissipation fins (208) are fixedly connected to the two side surfaces of the protective frame (201), a plurality of through holes (209) are formed in the surface of the heat dissipation fin (208), a communication pipe groove (213) is formed in the inner part of the two ends of the protective frame (201), the communication pipe groove (213) is composed of a plurality of U-shaped grooves connected in head-to-tail mode, an air outlet pipe (210) is fixedly connected to the two sides of one end of the protective frame (201), the air outlet pipe (210) is in communication with the communication pipe groove (213), and the air outlet pipe (210) is arranged on one side of the heat dissipation fin (208).

2. The high-frequency hybrid circuit board of claim 1, wherein The other end of the protective frame (201) is fixedly connected with an air inlet pipe (212), the air inlet pipe (212) is in communication with the communication pipe groove (213), the mounting rack (21) is arranged on one side of the protective frame (201), the two ends of the mounting rack (21) are provided with fixed screws (206), one end of the fixed screw (206) is screwed with the protective frame (201), the inner part of the mounting rack (21) is fixedly connected with a blowing box (214), one end of the blowing box (214) is provided with a micro motor (207), the output end of the micro motor (207) is fixedly connected with a blowing blade (211), the blowing blade (211) is arranged in the blowing box (214) and is in rotating fit with the blowing box (214), and the blowing blade (211) is arranged on one side of the heat dissipation fin (208).

3. The high-frequency hybrid circuit board of claim 2, wherein The air inlet pipe (212) is arranged on one side of the blowing blade (211).

4. The high-frequency hybrid circuit board of claim 3, wherein A plurality of fixed blocks (204) are fixedly connected to the side of the protective frame (201), and a screw hole (205) is formed in the inner part of the fixed block (204).

5. The high-frequency hybrid circuit board of claim 4, wherein the high-frequency hybrid circuit board is configured to dissipate heat quickly. A fastening screw (203) is arranged at the plug-in position of the plug-in rod (202) and the slot.

6. The high-frequency hybrid circuit board of claim 5, wherein The protective frame (201) is made of high-thermal-conductivity material.