Circuit wafer scribing tool

Abstract

The utility model discloses a circuit wafer scribing tool, and relates to the technical field of electronic manufacturing. The circuit wafer scribing tool comprises a mould, a positioning cavity is formed in the top of the mould, a blade is arranged at the bottom of the positioning cavity, the blade is vertically arranged, and a cutting edge is arranged at the top of the blade. The circuit wafer scribing tool provided by the embodiment of the utility model is used for processing a visible line on a circuit wafer; during processing, the circuit wafer is placed in the positioning cavity, and the circuit wafer is pressed downwards, so that a visual line can be pressed on the electroplated surface of the circuit wafer at one time by utilizing the cutting edge of the blade; compared with the prior art, the method is simple and efficient, the consistency of visual lines is good, the precision is high, burrs are not prone to being generated, and mistaken and missed machining is avoided.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of electronic manufacturing, in particular to a circuit board scribe tool. BACKGROUND

[0002] With the development of electronic manufacturing technology, the requirements of electronic device packaging integration and module assembly sealing are increasing. In this process, the electrician needs to perform fine operations such as docking, welding and position adjustment of small parts under a microscope. In order to meet these special requirements, visible lines need to be scribed on the electroplated surface of the circuit board to facilitate accurate operation.

[0003] At present, the visible line processing of the circuit board mainly relies on the traditional mold supplemented by the drawing needle method. This method has poor consistency, low precision, is easy to produce burrs, and is easy to cause missed processing. In addition, this method has a large workload and has a great impact on subsequent processing procedures, which leads to the extension of output time and affects the overall production efficiency. CONTENT OF THE INVENTION

[0004] The purpose of the present application is to provide a circuit board scribe tool to solve the problems of poor consistency, low precision and easy burr production in visible line processing.

[0005] The technical solution adopted by the present application to solve its technical problems is:

[0006] A circuit board scribe tool, comprising a mold, a positioning cavity is arranged on the top of the mold, a blade is arranged at the bottom of the positioning cavity, and the blade is vertically arranged and has a blade edge at the top.

[0007] Further, a fixing groove is arranged at the bottom of the positioning cavity, and the blade is fixed in the fixing groove.

[0008] Further, a plurality of positioning cavities are arranged on the top of the mold.

[0009] Further, the depth of the positioning cavity is less than the thickness of the circuit board to be scribed.

[0010] Further, the depth of the positioning cavity is h, and the thickness of the circuit board to be scribed is t; wherein 2t / 3 < h < 3t / 4.

[0011] Further, the cross-sectional shape of the positioning cavity is rectangular, and the four corners are provided with a recess.

[0012] Further, the projection of the blade on the horizontal plane is L-shaped.

[0013] Further, the jig comprises a locating plate and a carrier plate arranged in a stack from top to bottom, the locating plate is provided with a locating hole penetrating through, the locating hole forms the locating cavity, the blade is arranged in the locating hole and connected with the carrier plate.

[0014] Further, the locating plate and the carrier plate are provided with a locating structure.

[0015] Further, the locating structure comprises a locating protrusion and a locating groove matched with the locating protrusion; one of the locating plate and the carrier plate is provided with the locating protrusion, and the other of the locating plate and the carrier plate is provided with the locating groove.

[0016] The beneficial effects of the present application are as follows:

[0017] The circuit chip line processing tool provided by the embodiment of the present application is used for processing visible lines on a circuit chip; when processing, the circuit chip is placed in the locating cavity, the circuit chip is pressed downward, and the blade edge of the blade is used to press out visible lines on the electroplated surface of the circuit chip at one time; compared with the prior art, the circuit chip line processing tool is simple and efficient, the consistency of the visible lines is good, the precision is high, burrs are not easy to be generated, and the processing errors and omissions are avoided. BRIEF DESCRIPTION OF DRAWINGS

[0018] In order to more clearly illustrate the technical solutions of the embodiments of the present application, the following will briefly introduce the drawings needed to be used in the embodiments. It should be understood that the following drawings only show some embodiments of the present application, and therefore should not be regarded as a limitation on the scope, and for those skilled in the art, other related drawings can also be obtained without creative labor on the basis of these drawings.

[0019] Figure 1 is a structural schematic diagram of the circuit chip line processing tool provided by the embodiment of the present application;

[0020] Figure 2 is a top view of Figure 1 ;

[0021] Figure 3 is a structural schematic diagram of the jig;

[0022] Figure 4 is a state diagram of processing visible lines on a circuit chip by using the circuit chip line processing tool provided by the embodiment of the present application;

[0023] Figure 5 is a structural schematic diagram after processing visible lines on a circuit chip;

[0024] Figure 6 is another structural schematic diagram of the circuit chip line processing tool provided by the embodiment of the present application;

[0025] Figure 7 is a schematic view of a positioning structure.

[0026] Reference signs:

[0027] 10 - fixture;

[0028] 101 - positioning cavity; 102 - fixing groove; 103 - avoiding recess;

[0029] 11 - blade;

[0030] 111 - blade edge;

[0031] 20 - circuit sheet;

[0032] 201 - visible line;

[0033] 30 - positioning plate;

[0034] 301 - positioning hole;

[0035] 40 - carrier plate;

[0036] 50 - positioning structure;

[0037] 501 - positioning protrusion; 502 - positioning recess. DETAILED DESCRIPTION

[0038] The technical solutions in the embodiments of the present application will be described clearly and completely below with reference to the drawings in the embodiments of the present application. Obviously, the described embodiments are only some of the embodiments of the present application, but not all the embodiments of the present application. Based on the embodiments in the present application, all the other embodiments obtained by those skilled in the art without creative work fall within the scope of protection of the present application. The embodiments in the present application and the features in the embodiments can be combined with each other without conflict.

[0039] In the description of the present application, the terms "upper", "lower", "left", "right", "front", "back", "inner", "outer" and the like indicate the orientation or positional relationship shown in the drawings, and are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the devices or elements referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore cannot be understood as a limitation on the present application. Unless otherwise specified, the above orientation description can be flexibly arranged in the process of actual application under the condition of meeting the relative positional relationship shown in the drawings.

[0040] In the description of the present application, it should be noted that unless otherwise explicitly specified and limited, the terms "set", "install", "connect", "connect" should be understood broadly, for example, it can be fixedly connected, or it can be detachably connected, or integrally connected; it can be directly connected, or indirectly connected through an intermediate medium, or the communication inside two elements. For those skilled in the art, the specific meaning of the above terms in the present application can be understood according to the specific circumstances.

[0041] When the electrician performs fine operations such as butt joint, welding and position adjustment of micro parts under a microscope, there are strict size requirements for the visual line on the circuit sheet, including the consistency of the visual line, the size accuracy and the avoidance of burrs.

[0042] At present, the processing of the visual line of the circuit sheet mainly relies on the traditional mold supplemented by the drawing needle method. This method has the following disadvantages: 1. Because it depends on manual operation, the operation of different operators and the operation of the same operator at different times may lead to differences in the processed visual line, making it difficult to ensure consistency. 2. The manual drawing needle method is difficult to achieve high precision requirements, especially in fine operations such as butt joint, welding and position adjustment of micro parts, insufficient precision will affect the performance of the circuit sheet. 3. When drawing lines on the electroplated surface of the circuit sheet, burrs are easily generated, which not only affects the appearance, but also may affect the performance of the circuit sheet. 4. Because it is a manual operation, the operator may miss some parts or make processing errors, resulting in product defects. 5. The drawing needle method requires a lot of manual operation, which makes the workload huge and the efficiency low, which may cause the delay of subsequent processing procedures, thereby affecting the entire production process.

[0043] Based on this, referring to Figure 1 、 Figure 2 The circuit sheet marking line tool provided by the embodiment of the present application comprises a mold 10, the top of the mold 10 is provided with a positioning cavity 101, the bottom of the positioning cavity 101 is provided with a blade 11, the blade 11 is vertically arranged, and the top of the blade 11 is a blade edge 111.

[0044] Specifically, the mold 10 can be a horizontal substrate, and an upper surface of the substrate is provided with a downwardly recessed positioning cavity 101 for accommodating the circuit sheet 20 to be engraved with lines and positioning the circuit sheet 20 in the horizontal direction to avoid displacement of the circuit sheet 20 in the horizontal direction in the positioning cavity 101. The shape of the positioning cavity 101 can be set according to the shape of the circuit sheet 20 to be engraved with lines, which is not specifically limited herein. The blade 11 is vertically arranged at the bottom of the positioning cavity 101, and a top portion of the blade 11 is a blade edge 111 for engraving lines on the electroplated surface of the circuit sheet 20. The shape, number and mounting position of the blade 11 should be set according to the design drawing, which is not specifically limited herein. The projection of the blade 11 on the horizontal plane is symmetrically distributed with the visible line 201 on the design drawing of the circuit sheet 20, so attention should be paid to this problem when designing the position of the blade 11. The distance between the blade edge 111 and the bottom of the positioning cavity 101 should be set according to the depth of the visible line 201 on the circuit sheet 20, which is not specifically limited herein.

[0045] Referring to Figure 4 , Figure 5 The embodiment of the present application provides a circuit sheet line engraving tool for processing the visible line 201 on the circuit sheet 20. The specific processing process is as follows: placing the mold 10 on the operation table, placing the electroplated surface of the circuit sheet 20 downwardly in the positioning cavity 101, contacting the blade edge 111 of the blade 11 with the electroplated surface of the circuit sheet 20, pressing the circuit sheet 20 downwardly, and using the blade edge 111 to press out clear engraved lines on the electroplated surface of the circuit sheet 20 at one time, and then taking out the circuit sheet 20 from the positioning cavity 101.

[0046] The circuit sheet line engraving tool provided by the embodiment of the present application has the following advantages: 1. It does not depend on manual operation, and the operations of different operators and the same operator at different times will not cause differences in the processed visible line 201, thereby ensuring the consistency of the visible line 201. 2. The blade edge 111 of the blade 11 is used to press out clear engraved lines at one time, which not only improves the precision of the visible line 201, but also is not easy to produce burrs, thereby avoiding affecting the performance of the circuit sheet 20. 3. The operation efficiency is high, and some parts are not missed or processed incorrectly, thereby avoiding delaying the subsequent processing procedures and affecting the entire production process.

[0047] In some embodiments, referring to Figure 3 , the bottom of the positioning cavity 101 is provided with a fixing groove 102, and the blade 11 is fixed in the fixing groove 102. Accordingly, by fixing the blade 11 in the fixing groove 102, the blade 11 can be quickly fixed, and no additional fixing device is needed, thereby saving costs.

[0048] In some embodiments, the top of the fixture 10 is provided with a plurality of positioning cavities 101. Wherein, the plurality means at least two, and the bottom of each positioning cavity 101 is provided with a blade 11. Correspondingly, a plurality of circuit boards 20 can be positioned at the same time by using the plurality of positioning cavities 101, so that the same set of tooling can be used to process visible lines 201 on a plurality of circuit boards 20 at the same time, thereby improving the processing efficiency.

[0049] In some embodiments, the depth of the positioning cavity 101 is less than the thickness of the circuit board 20 to be engraved. This structure can ensure that the top of the circuit board 20 is always located outside the positioning cavity 101, so that the same pressing plate can be used to press down a plurality of circuit boards 20 during processing, thereby improving the convenience of operation. Exemplarily, the depth of the positioning cavity 101 is h, and the thickness of the circuit board 20 to be engraved is t; wherein, 2t / 3 < h < 3t / 4.

[0050] In other embodiments, the depth of the positioning cavity 101 can also be equal to or greater than the thickness of the circuit board 20 to be engraved, which is not specifically limited here. After the visible line 201 is processed, the circuit board 20 can be taken out from the positioning cavity 101 by using a suction cup to adsorb the circuit board 20, or other ways can be used to take out the circuit board 20 from the positioning cavity 101, which is not specifically limited here.

[0051] In some embodiments, referring to Figure 2 , the cross-sectional shape of the positioning cavity 101 is rectangular, and the four corners thereof are provided with avoiding grooves 103. Correspondingly, the rectangular circuit board 20 can be positioned by using the positioning cavity 101 with a rectangular cross-sectional shape; by setting the avoiding grooves 103, when the circuit board 20 is placed in the positioning cavity 101, the four corners of the circuit board 20 can be located in the four avoiding grooves 103 respectively, so as to avoid the four corners of the circuit board 20 from being in contact with the surface of the positioning cavity 101 and being abraded. Of course, the cross-sectional shape of the positioning cavity 101 can also be set as circular, elliptical or other shapes according to the shape of the circuit board 20, which is not specifically limited here.

[0052] In some embodiments, referring to Figure 2 , the projection of the blade 11 on the horizontal plane is L-shaped. Correspondingly, the L-shaped visible line 201 can be processed on the circuit board 20 by using the blade 11. Of course, the shape of the projection of the blade 11 on the horizontal plane can also be set as other shapes according to the shape of the visible line 201 on the circuit board 20, which is not specifically limited here.

[0053] In some embodiments, referring to Figure 6, the jig 10 comprises a locating plate 30 and a carrier plate 40 arranged in a stack from top to bottom, the locating plate 30 is provided with a locating hole 301 penetratingly arranged thereon, the locating hole 301 forms a locating cavity 101, the blade 11 is arranged in the locating hole 301 and connected with the carrier plate 40. Wherein, the locating plate 30 and the carrier plate 40 can be fixedly connected by means of bonding, clamping, bolt connection and the like. Correspondingly, the structure can replace the locating plate 30 with the locating hole 301 of corresponding shape and size according to the shape and size of the circuit piece 20 to be machined, so as to meet different machining requirements, and further improve the reusability of the parts.

[0054] In some embodiments, referring to Figure 6 , the locating plate 30 and the carrier plate 40 are provided with a locating structure 50. Correspondingly, the locating structure 50 can realize quick positioning and installation between the locating plate 30 and the carrier plate 40, and improve the assembly efficiency therebetween. For example, referring to Figure 7 , the locating structure 50 comprises a locating protrusion 501 and a locating groove 502 matched with the locating protrusion 501; one of the locating plate 30 and the carrier plate 40 is provided with the locating protrusion 501, and the other of the locating plate 30 and the carrier plate 40 is provided with the locating groove 502. For example, the locating protrusion 501 is arranged on the lower surface of the locating plate 30, and the locating groove 502 is arranged on the upper surface of the carrier plate 40.

[0055] The above is only a specific embodiment of the present application, but the protection scope of the present application is not limited thereto, any person skilled in the art can easily think of changes or replacements within the technical range disclosed in the present application, which shall be covered in the protection scope of the present application.

Claims

1. A circuit wafer scribing tool, characterized by, The utility model provides a kind of line marking device, including mould (10), the top of the mould (10) is equipped with positioning cavity (101), the bottom of the positioning cavity (101) is equipped with blade (11), the blade (11) is vertically arranged, and its top is blade edge (111).

2. The circuit chip scribe tool of claim 1, wherein, The bottom of the positioning cavity (101) is provided with a fixing groove (102), and the blade (11) is fixed in the fixing groove (102).

3. The circuit chip scribe tool of claim 1, wherein, The top of the mould (10) is provided with a plurality of positioning cavities (101).

4. The circuit chip scribe tool of claim 1, wherein, The depth of the positioning cavity (101) is less than the thickness of the circuit piece (20) to be marked.

5. The circuit chip scribe tool of claim 4, wherein, The depth of the positioning cavity (101) is h, and the thickness of the circuit piece (20) to be marked is t; wherein 2t / 3 6. The circuit chip scribe tool of claim 1, wherein, The cross-sectional shape of the positioning cavity (101) is rectangular, and the four corners are provided with avoidance grooves (103).

7. The circuit chip scribe tool of claim 1, wherein, The projection of the blade (11) on the horizontal plane is L-shaped.

8. The circuit chip scribe tool of any one of claims 1 to 7, wherein, The mould (10) includes a positioning plate (30) and a carrier plate (40) arranged in a stack from top to bottom, the positioning plate (30) has a positioning hole (301) arranged therethrough, the positioning hole (301) forms the positioning cavity (101), and the blade (11) is arranged in the positioning hole (301) and connected with the carrier plate (40).

9. The circuit chip scribe tool of claim 8, wherein, The positioning plate (30) and the carrier plate (40) are provided with a positioning structure (50) therebetween.

10. The circuit chip scribe tool of claim 9, wherein, The positioning structure (50) includes a positioning protrusion (501) and a positioning groove (502) matched with the positioning protrusion (501). One of the positioning plate (30) and the carrier plate (40) is provided with the positioning protrusion (501), and the other of the positioning plate (30) and the carrier plate (40) is provided with the positioning groove (502).

Images