Coating equipment for solder strip

Abstract

The utility model relates to coating equipment for a welding strip. The coating equipment for the welding strip comprises winding equipment, a vapor deposition mechanism and an anti-adhesion plate. The winding equipment comprises a pay-off roller and a take-up roller, the pay-off roller is used for releasing the triangular welding strip, the take-up roller winds the triangular welding strip, and the pay-off roller and the take-up roller rotate synchronously; the vapor deposition mechanism is located between the pay-off roller and the take-up roller and used for depositing films on the two film coating faces of the triangular welding strip. The anti-attachment plate is used for being arranged on the side, away from the vapor deposition mechanism, of the triangular welding strip, and the anti-attachment plate is used for being attached to the connecting face of the triangular welding strip so as to shield the connecting face. According to the coating equipment for the triangular welding strip, the triangular welding strip can be continuously coated, the two surfaces of the triangular welding strip can be coated at the same time, the coating efficiency is high, and the production cost is low.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of coating equipment for solder strips, in particular to a coating equipment for solder strips. BACKGROUND

[0002] The cross section of the triangular solder strip is triangular. Compared with a circular solder strip with the same cross-sectional area, the triangular solder strip has a smaller projected area perpendicular to the direction of light incidence, thereby reducing the shading of sunlight and allowing more light to irradiate the effective power generation area of the cell, thereby increasing the short-circuit current of the cell.

[0003] However, due to the special shape of the triangular solder strip, the coating process is relatively complex, resulting in a relatively high production cost of the triangular solder strip, which is not as competitive as the price of traditional circular or flat solder strips. CONTENT OF THE UTILITY MODEL

[0004] Therefore, it is necessary to provide a coating equipment for solder strips to solve the problem of complex coating process of triangular solder strips.

[0005] A coating equipment for solder strips, the solder strips including triangular solder strips, the triangular solder strips including a connecting surface and two coating surfaces, the coating equipment including:

[0006] A winding device including a pay-off reel and a take-up reel, the pay-off reel being used to release the triangular solder strips, the take-up reel being used to wind the triangular solder strips, the pay-off reel and the take-up reel being synchronously rotated;

[0007] A vapor deposition mechanism located between the pay-off reel and the take-up reel, the vapor deposition mechanism being used to deposit a thin film on the two coating surfaces of the triangular solder strips;

[0008] A shading plate being used to be arranged on the side of the triangular solder strips away from the vapor deposition mechanism, the shading plate being used to be attached to the connecting surface of the triangular solder strips to shield the connecting surface.

[0009] In one of the embodiments, the number of the winding devices is multiple, the plurality of pay-off reels are arranged in sequence along a first direction, the plurality of take-up reels are arranged in sequence along the first direction, the first direction being perpendicular to the transmission direction of the triangular solder strips, and the vapor deposition mechanism is used to simultaneously deposit a thin film on the plurality of triangular solder strips.

[0010] In one of the embodiments, the coating equipment includes a cooling drum, the cooling drum being arranged downstream of the vapor deposition mechanism along the transmission direction of the triangular solder strips.

[0011] In one of the embodiments, the cooling drum includes an arc-shaped shell and a refrigeration pipeline, the refrigeration pipeline being arranged in the arc-shaped shell.

[0012] The arc-shaped shell is used to fit the connecting surface of part of the triangular welding strip, so that part of the triangular welding strip is arranged around the outer periphery of the arc-shaped shell.

[0013] In one of the embodiments, the vapor deposition mechanism is a linear evaporation source, which is used to heat the film deposition material in a first direction.

[0014] In one of the embodiments, the film deposition device comprises a vacuum chamber, and the vapor deposition mechanism and the anti-sticking plate are arranged in the vacuum chamber.

[0015] In one of the embodiments, the film deposition device comprises a cleaning mechanism, which is arranged upstream of the vapor deposition mechanism along the transmission direction of the triangular welding strip.

[0016] In one of the embodiments, the film deposition device further comprises a deviation correction drum, which comprises a detection member, a mounting shaft, a deviation correction drum body sleeved on the mounting shaft, and a power mechanism arranged at one end of the deviation correction drum body, and the mounting shaft is used for arranging part of the triangular welding strip thereon.

[0017] The detection member is in signal connection with the power mechanism, the detection member is used to detect the position of the triangular welding strip, and the power mechanism is used to push the deviation correction drum body in the axial direction of the mounting shaft, so that the deviation correction drum body drives the triangular welding strip to move in the axial direction of the mounting shaft.

[0018] In one of the embodiments, the deviation correction drum is arranged upstream and / or downstream of the vapor deposition mechanism along the transmission direction of the triangular welding strip.

[0019] In one of the embodiments, the film deposition device further comprises a detection mechanism, which is arranged downstream of the vapor deposition mechanism.

[0020] The film deposition device of the above welding strip, the unwinding roller and the winding roller rotate synchronously, which is used to continuously transmit the triangular welding strip, the vapor deposition mechanism is used to continuously deposit film on the two film deposition surfaces of the triangular welding strip, and the anti-sticking plate can always fit the connecting surface of the triangular welding strip during the transmission of the triangular welding strip, so as to protect the connecting surface of the triangular welding strip from being plated with film when the vapor deposition mechanism performs vapor deposition. That is, through the film deposition device of the triangular welding strip of the present application, the triangular welding strip can be continuously plated, and the two surfaces of the triangular welding strip can be plated at the same time, the plating efficiency is high, and the production cost is low. BRIEF DESCRIPTION OF DRAWINGS

[0021] Fig. 1 It is a structural schematic view of the film deposition device of the welding strip in one embodiment.

[0022] Fig. 2A schematic view of the structure of the vapor deposition mechanism when depositing on a plurality of solder strips in an embodiment.

[0023] Fig. 3 A schematic view of the structure of the triangular solder strip in an embodiment.

[0024] Reference numerals: 11, pay-off roll; 12, take-up roll; 20, vapor deposition mechanism; 30, anti-sticking plate; 40, cooling drum; 50, cleaning mechanism; 60, deviation correction drum; 61, guide roll; 62, guide-in piece; 70, detection mechanism; 80, triangular solder strip; 81, connecting surface; 82, plated surface. DETAILED DESCRIPTION

[0025] In order to make the above objectives, features and advantages of the present application more apparent, specific embodiments of the present application will be described in detail below with reference to the accompanying drawings. In the following description, numerous specific details are set forth in order to provide a thorough understanding of the present application. However, the present application can be practiced in a number of different ways beyond the specific embodiments described and it is therefore contemplated to cover all such modifications as fall within the scope of the application. It is to be understood that the application is not limited in its application to the details set forth in the description below.

[0026] In the description of the present application, it should be understood that, if there are terms such as "center", "longitudinal", "transverse", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc., these terms indicate the orientation or positional relationship based on the orientation or positional relationship shown in the drawings, and are only for the purpose of facilitating the description of the present application and simplifying the description, and are not intended to indicate or imply that the device or element referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore cannot be understood as a limitation on the present application.

[0027] In addition, if there are terms such as "first", "second", these terms are only for the purpose of description, and cannot be understood as indicating or implying relative importance or implying the number of technical features indicated. Therefore, the features limited by "first", "second" can explicitly or implicitly include at least one of the features. In the description of the present application, if the term "plurality" appears, the meaning of "plurality" is at least two, for example, two, three, etc., unless otherwise specifically limited.

[0028] In the present application, unless specifically defined otherwise and limited, if there are terms such as "mount", "connect", "connect", "fix", etc., these terms should be broadly understood. For example, it can be fixedly connected, or it can be detachably connected, or it can be integrated; it can be mechanically connected, or it can be electrically connected; it can be directly connected, or it can be indirectly connected through an intermediate medium; it can be the internal communication of two elements or the interaction relationship between two elements, unless otherwise specifically limited. For those skilled in the art, the specific meaning of the above terms in the present application can be understood according to the specific circumstances.

[0029] In the present application, unless specifically defined otherwise and limited, if there are similar descriptions such as "first feature on" or "second feature", the meaning can be that the first and second features are in direct contact, or the first and second features are indirectly in contact through an intermediate medium. Moreover, the first feature "above", "above" and "above" of the second feature can be directly above or obliquely above the first feature, or only indicates that the horizontal height of the first feature is higher than that of the second feature. The first feature "below", "below" and "below" of the second feature can be directly below or obliquely below the first feature, or only indicates that the horizontal height of the first feature is less than that of the second feature.

[0030] It should be noted that if an element is referred to as "fixed to" or "provided to" another element, it can be directly on another element or there can be a middle element. If an element is considered to be "connected" to another element, it can be directly connected to another element or there can be a middle element. If present, the terms "vertical", "horizontal", "up", "down", "left", "right" and similar expressions used in the present application are for illustrative purposes only and are not the only embodiment.

[0031] Referring to Figs. 1-3 The solder strip plating equipment provided by an embodiment of the present application, the solder strip includes a triangular solder strip 80, the triangular solder strip 80 includes a connecting surface 81 and two plating surfaces 82, the solder strip plating equipment includes a winding device, a vapor deposition mechanism 20 and a shading plate 30. The winding device includes a pay-off reel 11 and a take-up reel 12, the pay-off reel 11 is used to release the triangular solder strip 80, the take-up reel 12 winds the triangular solder strip 80, the pay-off reel 11 and the take-up reel 12 rotate synchronously; the vapor deposition mechanism 20 is located between the pay-off reel 11 and the take-up reel 12, the vapor deposition mechanism 20 is used to deposit a thin film on the two plating surfaces 82 of the triangular solder strip 80; the shading plate 30 is used to be arranged on the side of the triangular solder strip 80 away from the vapor deposition mechanism 20, the shading plate 30 is used to be attached to the connecting surface 81 of the triangular solder strip 80 to shield the connecting surface 81.

[0032] In this embodiment, the pay-off roller 11 and take-up roller 12 rotate synchronously to continuously transport the triangular welding ribbon 80. The vapor deposition mechanism 20 continuously deposits a thin film onto the two coating surfaces 82 of the triangular welding ribbon 80. During the transport of the triangular welding ribbon 80, the anti-stick plate 30 remains in contact with the connecting surface 81 of the triangular welding ribbon 80 to protect the connecting surface 81 of the triangular welding ribbon 80 during vapor deposition by the vapor deposition mechanism 20, preventing the connecting surface 81 from being coated with a thin film. In other words, the coating equipment for the triangular welding ribbon 80 of this application can continuously coat the triangular welding ribbon 80 and simultaneously coat both surfaces of the triangular welding ribbon 80, resulting in high coating efficiency and low production cost.

[0033] Specifically, the vapor deposition unit 20 is used to deposit reflective coatings, such as high-reflectivity materials like silver, gold, and chromium, onto the two coating surfaces of the triangular solder strip to improve the light absorption of the photovoltaic cell, thereby increasing the photoelectric conversion efficiency. The connecting surface of the triangular solder strip refers to the surface that connects to the solar cell.

[0034] It should be noted that the coating equipment for welding strips in this application can also be used to coat round, flat, and other irregularly shaped welding strips.

[0035] In some embodiments, the number of winding devices is multiple, multiple pay-off rollers 11 are arranged sequentially along the first direction OA, multiple take-up rollers 12 are arranged sequentially along the first direction OA, the first direction OA is used to be perpendicular to the transmission direction of the triangular welding strip 80, and the vapor deposition mechanism 20 is used to deposit thin films on multiple triangular welding strips 80 simultaneously.

[0036] In this embodiment, since the smaller the size of the triangular solder ribbon 80, the smaller the area it obstructs on the battery cell, the smaller the size of the triangular solder ribbon 80 is. During the coating process, multiple winding devices arranged sequentially along the first direction OA can be set up simultaneously. The multiple winding devices are used to simultaneously transport multiple triangular solder ribbons 80, and the multiple triangular solder ribbons 80 are parallel to each other, so that the vapor deposition mechanism 20 can simultaneously deposit thin films on multiple triangular solder ribbons 80, further improving the coating efficiency.

[0037] In some embodiments, the coating apparatus includes a cooling drum 40 disposed downstream of the vapor deposition unit 20 along the transport direction of the triangular welding strip 80.

[0038] In this embodiment, the cooling drum 40 is located downstream of the vapor deposition unit 20 and is used to cool the film layer on the triangular solder strip 80 so that the film layer can cool and adhere to the two coating surfaces 82 of the triangular solder strip 80 more quickly.

[0039] Specifically, the cooling drum 40 includes an arc-shaped shell and a refrigeration pipeline, the refrigeration pipeline is arranged in the arc-shaped shell; the arc-shaped shell is used for being attached to the connecting surface 81 of the partial triangular welding strip 80, so that the partial triangular welding strip 80 is arranged around the outer periphery of the arc-shaped shell.

[0040] In the embodiment, the triangular welding strip 80 is arranged around the outer periphery of the arc-shaped shell, so that the welding strip is tightened by the arc-shaped shell, and meanwhile, the connecting surface 81 of the welding strip is attached to the arc-shaped shell; the arc-shaped shell is internally provided with the refrigeration pipeline, so that the triangular welding strip 80 can be rapidly cooled by the refrigeration pipeline.

[0041] The arc-shaped shell is made of a metal material with a high thermal conductivity, so as to ensure good heat transfer performance. The outer surface of the arc-shaped shell is polished, so as to ensure the flatness and smoothness of the outer surface, thereby uniformly distributing the triangular welding strip 80 on the surface. The cooling drum 40 further includes a rotating shaft, the arc-shaped shell can rotate around the rotating shaft, so as to reduce the friction between the arc-shaped shell and the triangular welding strip 80, and avoid damaging the triangular welding strip 80. The arc-shaped shell is provided with a cooling liquid inlet and a cooling liquid outlet, and the two ends of the refrigeration pipeline are respectively communicated with the cooling liquid inlet and the cooling liquid outlet, so that the cooling liquid circulates in the cooling pipeline to rapidly take away the heat in the arc-shaped shell.

[0042] Specifically, the plurality of welding strips are arranged in sequence along the first direction OA, and simultaneously attached to one anti-sticking plate 30 and arranged around the outer periphery of the same cooling drum 40.

[0043] In some embodiments, in combination Fig. 2 The vapor deposition mechanism 20 is a linear evaporation source, which is used for heating the film deposition material along the first direction OA.

[0044] The linear evaporation source evaporates the film deposition material along the first direction OA by heating, so that the linear evaporation source can uniformly deposit a film on the plurality of welding strips, and improve the uniformity of film deposition on the same batch of welding strips.

[0045] In other embodiments, the vapor deposition mechanism 20 can be a resistance film deposition source, an electron beam film deposition source, a magnetron sputtering source, etc.

[0046] In some embodiments, the film deposition device includes a vacuum chamber, and the vapor deposition mechanism 20 and the anti-sticking plate 30 are arranged in the vacuum chamber.

[0047] In the embodiment, the vapor deposition mechanism 20 is used for film deposition in the vacuum chamber, so as to reduce the interference of impurities in the air on the film deposition process. Meanwhile, in the vacuum chamber, the density of gas molecules is extremely low, which greatly reduces the collision probability of atoms or molecules in the vapor deposition mechanism 20 during the movement from the evaporation source or the gas source to the surface of the triangular welding strip 80, so that the film deposition material can be uniformly deposited.

[0048] In some embodiments, the coating device comprises a cleaning mechanism 50, which is arranged upstream of the vapor deposition mechanism 20 along the transmission direction of the triangular ribbon 80.

[0049] In the present embodiment, the cleaning mechanism 50 can be a plasma cleaning mechanism 50, which is used to clean the coating surface 82 of the ribbon first, and then coat the coating surface 82 through the vapor deposition mechanism 20 to improve the coating quality.

[0050] For example, a plasma physical cleaning device, a plasma chemical cleaning device, or a plasma physical-chemical cleaning device. Among them, the physical cleaning mainly uses the kinetic energy generated by the high-energy ions in the plasma under the action of bias to physically impact the contaminants on the workpiece surface, so that the contaminants are vaporized and separated from the workpiece. Chemical cleaning is to ionize reactive gases such as oxygen and hydrogen into plasma in a vacuum state. These highly active plasmas chemically react with contaminants on the workpiece surface. Physical-chemical cleaning combines the characteristics of physical cleaning and chemical cleaning, which not only utilizes the physical impact of plasma, but also utilizes the chemical reaction of active groups, which can more thoroughly remove contaminants on the workpiece surface and has good cleaning effect on various types of contaminants.

[0051] In some embodiments, the coating device further comprises a deviation correction drum 60, which comprises a detection member, a mounting shaft, a deviation correction drum body sleeved on the mounting shaft, and a power mechanism arranged at one end of the deviation correction drum body. The mounting shaft is used for winding part of the triangular ribbon 80. The detection member is signal connected with the power mechanism. The detection member is used to detect the position of the triangular ribbon 80. The power mechanism is used to push the deviation correction drum body along the axial direction of the mounting shaft, so that the deviation correction drum body drives the triangular ribbon 80 to move along the axial direction of the mounting shaft.

[0052] In the present embodiment, the triangular ribbon 80 is relatively thin. In order to prevent the triangular ribbon 80 from deviating during transmission and affecting the coating quality, a deviation correction drum 60 is further arranged during transmission. The detection member can be a photoelectric sensor or a pressure sensor. When the detection member detects the deviation position of the triangular ribbon 80, the deviation signal can be transmitted to the power mechanism. The power mechanism pushes the deviation correction drum body to move along the axial direction according to the signal. The deviation correction drum body in turn drives the triangular ribbon 80 to return to the correct position.

[0053] Further, the deviation correction drum 60 is arranged upstream and / or downstream of the vapor deposition mechanism 20 along the transmission direction of the triangular ribbon 80. The deviation correction drum 60 arranged upstream of the vapor deposition mechanism 20 is used to make the triangular ribbon 80 accurately enter the vacuum chamber for vapor deposition. The deviation correction drum 60 arranged downstream of the vapor deposition mechanism 20 is used to make the triangular ribbon 80 accurately wind on the winding roller.

[0054] In some embodiments, the coating equipment further comprises a detection mechanism 70, which is arranged downstream of the vapor deposition mechanism 20.

[0055] The detection mechanism 70 is arranged downstream of the vapor deposition mechanism 20, and is used to monitor the size, uniformity, adhesion, hardness, optical performance, etc. of the coated triangular strip 80.

[0056] In some embodiments, a plurality of guide rollers 61 are arranged between the winding roller and the unwinding roller, and are used to guide the triangular strip 80 to change the transmission direction of the triangular strip 80.

[0057] Specifically, an inlet member 62 is arranged upstream of the winding roller, and the inlet member 62 is provided with an inlet groove, which is used to accurately wind the triangular strip 80 onto the winding roller.

[0058] The technical features of the above embodiments can be combined in any manner. In order to make the description simple, all possible combinations of the technical features in the above embodiments are not described, however, as long as the combinations of the technical features do not contradict, they should be considered as the scope of the present application.

[0059] The above embodiments only express several implementation manners of the present application, and the description is relatively specific and detailed, but it should not be understood as a limitation on the patent scope of the present application. It should be pointed out that, for those skilled in the art, several modifications and improvements can be made without departing from the concept of the present application, and these all belong to the protection scope of the present application. Therefore, the patent protection scope of the present application should be subject to the appended claims.

Claims

1. A plating apparatus for a solder strip, the solder strip comprising a triangular solder strip including a connection surface and two plating surfaces, characterized in that, The coating equipment comprises: A winding device comprising a pay-off roll for releasing the triangular ribbon and a take-up roll for winding the triangular ribbon, the pay-off roll and the take-up roll rotating synchronously; A vapor deposition mechanism between the pay-off roll and the take-up roll, the vapor deposition mechanism being used for depositing a film on two coating surfaces of the triangular ribbon; A shadow board arranged on a side of the triangular ribbon away from the vapor deposition mechanism, the shadow board being used for abutting against a connecting surface of the triangular ribbon to shield the connecting surface.

2. The plating apparatus for a solder strip according to claim 1, wherein The number of the winding devices is multiple, the plurality of pay-off rolls are arranged in sequence along a first direction, the plurality of take-up rolls are arranged in sequence along the first direction, the first direction being perpendicular to a transmission direction of the triangular ribbon, and the vapor deposition mechanism is used for simultaneously depositing a film on a plurality of triangular ribbons.

3. The plating apparatus for a solder strip according to claim 2, wherein The coating equipment comprises a cooling drum arranged downstream of the vapor deposition mechanism along the transmission direction of the triangular ribbon.

4. The plating apparatus for a solder strip according to claim 3, wherein The cooling drum comprises an arc-shaped shell and a refrigeration pipeline arranged in the arc-shaped shell; The arc-shaped shell is used for abutting against a connecting surface of part of the triangular ribbon to enable part of the triangular ribbon to be arranged around an outer periphery of the arc-shaped shell.

5. The plating apparatus for a solder strip according to claim 2, wherein The vapor deposition mechanism is a linear evaporation source used for heating a coating material along the first direction.

6. The plating apparatus of the solder strip according to claim 1, wherein The coating equipment comprises a vacuum chamber, and the vapor deposition mechanism and the shadow board are arranged in the vacuum chamber.

7. The plating apparatus of the solder strip according to claim 1, wherein The coating equipment comprises a cleaning mechanism arranged upstream of the vapor deposition mechanism along the transmission direction of the triangular ribbon.

8. The plating apparatus of the solder strip according to claim 1, wherein The coating equipment further comprises a deviation rectifying drum, the deviation rectifying drum comprising a detection member, a mounting shaft, a deviation rectifying drum body sleeved on the mounting shaft, and a power mechanism arranged at one end of the deviation rectifying drum body, the mounting shaft being used for part of the triangular ribbon to be arranged thereon; The detection member is in signal connection with the power mechanism, the detection member being used for detecting a position of the triangular ribbon, and the power mechanism being used for pushing the deviation rectifying drum body along an axial direction of the mounting shaft to enable the deviation rectifying drum body to drive the triangular ribbon to move along the axial direction of the mounting shaft.

9. The plating apparatus for a solder strip according to claim 8, wherein The deviation rectifying drum is arranged upstream and / or downstream of the vapor deposition mechanism along the transmission direction of the triangular ribbon.

10. The plating apparatus of the solder strip according to claim 1, wherein The coating equipment further comprises a detection mechanism arranged downstream of the vapor deposition mechanism.

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