Efficient, uniform and mixed gas spraying structure of CVD (Chemical Vapor Deposition) equipment

Abstract

The utility model discloses an efficient, uniform and mixed gas spraying structure of CVD (chemical vapor deposition) equipment, a plurality of gas uniformizing devices arranged in concentric circles are arranged in a spraying main body, the adjacent gas uniformizing devices are arranged in an isolated manner, and gas inlet holes communicated with a gas inlet pipe I and gas inlet holes communicated with a gas inlet pipe II are arranged at intervals; the bottom of the gas uniformizing device is communicated with a plurality of spray pipes which are uniformly distributed, and the spray pipes spray the uniformly distributed gas into the reaction chamber, so that the laminar flow nesting design of the gas uniformizing device is realized, two gases are alternately sprayed out, the uniformity of the gases is improved, the mixing uniformity of the two gases is improved, and the reaction efficiency is improved. The molding uniformity is improved; the growth speed is increased; the gas uniformizing device comprises multiple layers of gas uniformizing chambers up and down, the adjacent gas uniformizing chambers are communicated through a plurality of flow guide holes, the gas uniformizing chambers are of annular cavity structures in the horizontal direction, gas enters each layer of cavity to be evenly distributed and flows into the next layer of gas uniformizing chamber along the flow guide holes to be evenly distributed again, and the uniformity of the gas is improved.

Description

TECHNICAL FIELD

[0001] The utility model relates to chemical vapor deposition technical field especially, relates to a kind of CVD equipment high-efficiency uniform and mixed gas's spray structure. BACKGROUND

[0002] In semiconductor manufacturing process, for making discrete devices and integrated circuits, different kinds of thin films need to be deposited on the substrate of wafer, and in the method of depositing thin films, chemical vapor deposition (CVD) is a commonly used method. Chemical vapor deposition method includes low pressure chemical vapor deposition, high pressure chemical vapor deposition, plasma enhanced chemical vapor deposition and other chemical vapor deposition methods used in various semiconductor manufacturing processes.

[0003] Chemical vapor deposition equipment is the core equipment for preparing compound semiconductor epitaxial materials, especially has obvious advantages in preparing superlattice, quantum well, etc., has been used in the large-scale industrial production of optoelectronic industry, and is an indispensable strategic high-tech semiconductor equipment under the development trend of information industry and national defense high technology.

[0004] For chemical vapor deposition equipment, the spray structure for uniform gas is the most core part of the equipment, and whether the pre-mixing of multiple gases is uniform directly relates to the film forming quality. The spray structure of CVD equipment, as the most core part of the equipment, has always existed the problems of poor film forming quality and slow growth rate caused by poor uniform gas effect. UTILITY MODEL CONTENT

[0005] In view of the problems in the related art, the present application discloses a kind of CVD equipment high-efficiency uniform and mixed gas's spray structure, solve the problem of poor uniform gas effect of chemical vapor deposition equipment in the related art.

[0006] To achieve the above object, the present application provides the following technical scheme:

[0007] A kind of CVD equipment high-efficiency uniform and mixed gas's spray structure, including spray main body, the top of the spray main body is equipped with inlet pipe one and inlet pipe two, the inlet pipe one and inlet pipe two gas inlet end are communicated with inlet system respectively, the inside of the spray main body is equipped with multiple uniform gas devices, the outlet end of the inlet pipe one and inlet pipe two is communicated with the uniform gas device respectively, the bottom of the uniform gas device is communicated with multiple evenly distributed spray pipes, the bottom of the spray main body is communicated with reaction chamber, the spray pipe is evenly distributed gas and is sprayed to the inside of reaction chamber.

[0008] As a further scheme of the present application, the air inlet one pipe and the air inlet two pipe are respectively connected with a plurality of air inlet holes, and the lower part of the air inlet hole is respectively connected with a uniform air device, a plurality of the uniform air devices are arranged in concentric circles, and adjacent uniform air devices are isolated, and the air inlet hole connected with the air inlet one pipe and the air inlet hole connected with the air inlet two pipe are arranged in a spaced manner with the uniform air device.

[0009] As a further scheme of the present application, the uniform air device comprises a plurality of uniform air chambers arranged in multiple layers, and adjacent uniform air chambers are connected through a plurality of flow guide holes.

[0010] As a further scheme of the present application, the uniform air chamber is a circular ring chamber structure in the horizontal direction.

[0011] As a further scheme of the present application, adjacent uniform air devices are sealed by an O-shaped sealing ring.

[0012] As a further scheme of the present application, the bottom of the spray body is provided with a cooling cavity, and cooling water flows in the cooling cavity to cool the spray body.

[0013] In summary, the present application has the following advantages:

[0014] 1. A spray structure for efficiently and uniformly mixing gases in a CVD device, wherein the top of a spray body is provided with an air inlet one pipe and an air inlet two pipe, the air inlet end of the air inlet one pipe and the air inlet two pipe is respectively connected with an air inlet system, the inside of the spray body is provided with a plurality of uniform air devices arranged in concentric circles, adjacent uniform air devices are isolated, and the air inlet hole connected with the air inlet one pipe and the air inlet hole connected with the air inlet two pipe are arranged in a spaced manner, the bottom of the uniform air device is connected with a plurality of uniformly distributed spray pipes, the spray pipes spray the uniformly distributed gas into the reaction chamber, thereby realizing the laminar flow nesting design of the uniform air device, spraying the two kinds of gases alternately, improving the uniformity of the gas, improving the mixing uniformity of the two kinds of gases, improving the uniformity of the growth and increasing the growth rate.

[0015] 2. The uniform air device comprises a plurality of uniform air chambers arranged in multiple layers, adjacent uniform air chambers are connected through a plurality of flow guide holes, and the uniform air chamber is a circular ring chamber structure in the horizontal direction, the gas enters each layer of chamber for uniform distribution, and flows into the next layer of uniform air chamber through the flow guide hole for uniform distribution again, thereby improving the uniformity of the gas.

[0016] 3. The bottom of the spray body is provided with a cooling cavity, cooling water flows in the cooling cavity to cool the spray body, thereby effectively preventing the deformation and damage of the spray structure caused by high temperature during CVD growth. BRIEF DESCRIPTION OF DRAWINGS

[0017] The accompanying drawings are used to provide a further understanding of the present application, and constitute a part of the specification, and are used to explain the present application together with the embodiments of the present application, and do not constitute a limitation of the present application.

[0018] In the drawings:

[0019] Fig. 1 is a perspective view of the present application.

[0020] Fig. 2 is a top sectional view of the present application.

[0021] Fig. 3 is a sectional view of the present application in the direction of I-I.

[0022] Reference signs annotations:

[0023] 1, spray body; 21, air inlet one pipe; 22, air inlet two pipe; 23, air inlet hole; 3, air uniformizing device; 31, air uniformizing chamber; 32, flow guiding hole; 4, spray pipe; 5, O-shaped sealing ring; 6, cooling cavity; 61, cooling inlet; 62, cooling outlet; DETAILED DESCRIPTION

[0024] The exemplary embodiments will be described in detail hereinbelow with reference to the drawings. In the following description, the same numbers are used to denote the same elements throughout the several views, unless otherwise indicated. The embodiments described in the following exemplary embodiments are not meant to represent all embodiments consistent with the present application. Rather, they are merely examples of apparatus and methods consistent with some aspects of the present embodiments as detailed in the appended claims.

[0025] It should be noted that all directional references (e.g., upper, lower, left, right, front, rear, etc.) contained in the embodiments described herein are in reference to the structures as they are oriented in the drawings. The reference to direction can change as the structures are oriented in other drawings. In addition, in the description herein, all connections are direct connections, where beings between different elements, unless otherwise specified herein.

[0026] In addition, the descriptions in the embodiments such as "first", "second", etc. are merely intended for differentiation rather than particularly indicating the order or sequence, nor limiting the present application, and are merely for differentiating the components or operations described by the same technical terms, and cannot be understood as indicating or implying the relative importance of the indicated technical features or implying the number of the indicated technical features. Thus, the features defined as "first", "second" can explicitly or implicitly include at least one of the features. In addition, the technical solutions of the various embodiments can be combined with each other, but it must be based on the realization of the ordinary skilled in the art, and when the combination of technical solutions contradicts each other or cannot be realized, it should be considered that the combination of technical solutions does not exist, nor within the protection scope required by the present application.

[0027] In order to further understand the content, characteristics and effects of the present application, the following examples are given, and the details are described as follows with reference to the accompanying drawings.

[0028] As shown in Figs. 1-3 :

[0029] The CVD device high-efficiency uniform and mixed gas spraying structure, comprising a spraying main body 1, the top of the spraying main body 1 is provided with an inlet pipe 21 and an inlet pipe 22, the inlet ends of the inlet pipe 21 and the inlet pipe 22 are respectively communicated with an inlet system, six uniform gas devices 3 are arranged in the spraying main body 1, the outlet ends of the inlet pipe 21 and the inlet pipe 22 are respectively communicated with the uniform gas devices 3, a plurality of uniformly distributed spraying pipes 4 are arranged at the bottom of the uniform gas devices 3, the bottom of the spraying main body 1 is communicated with a reaction chamber, and the spraying pipes 4 spray the uniformly distributed gas into the reaction chamber.

[0030] Among them, the inlet pipe 21 and the inlet pipe 22 are respectively communicated with three inlet holes 23, the lower parts of the inlet holes 23 are respectively communicated with the uniform gas devices 3, the six uniform gas devices 3 are arranged in concentric layers, the adjacent uniform gas devices 3 are sealed by O-shaped sealing rings 5, and the inlet holes 23 communicated with the inlet pipe 21 and the inlet holes 23 communicated with the inlet pipe 22 are respectively arranged in the adjacent uniform gas devices 3.

[0031] The uniform gas device 3 comprises upper and lower uniform gas chambers 31, and the adjacent uniform gas chambers 31 are communicated by a plurality of flow guide holes 32. The uniform gas chamber 31 is a circular chamber structure in the horizontal direction, and the flow guide holes 32 are uniformly distributed at the bottom of the upper uniform gas chamber 31.

[0032] The cross-sectional area of the lower uniform gas chamber 31 is larger than that of the upper uniform gas chamber 31, which is beneficial to improve the uniformity of the gas.

[0033] The inlet holes 23 and the flow guide holes 32 are arranged in a staggered manner, and when there are multiple layers of flow guide holes 32, the adjacent layers of flow guide holes 32 are arranged in a staggered manner, which can improve the uniformity of the gas.

[0034] In addition, the bottom of the spraying main body 1 is provided with a cooling cavity 6, the cooling cavity 6 is communicated with a cooling inlet 61 and a cooling outlet 62, and cooling water flows in the cooling cavity 6 to cool the spraying main body 1.

[0035] In practical application:

[0036] The CVD device high-efficiency uniform and mixed gas spraying structure, the spraying main body 1 top is equipped with the air inlet pipe 21 and the air inlet pipe 22, and the air inlet pipe 21 and the air inlet pipe 22 air inlet end are communicated with the air inlet system respectively, the spraying main body 1 inside is equipped with multiple concentric circle setting's uniform gas device 3, adjacent uniform gas device 3 insulates setting, and with the air inlet pipe 21 communication's air inlet hole 23 and with the air inlet pipe 22 communication's air inlet hole 23 interval setting, the uniform gas device 3 bottom is communicated and is equipped with multiple evenly distributed spraying pipes 4, and the spraying pipe 4 evenly distributed gas is sprayed to the reaction chamber inside, so realizes the laminar flow nesting design of uniform gas device 3, makes two kinds of gas interval spray, improves the uniformity of gas, improves the mixing uniformity of two kinds of gas, improves the uniformity of growth and increases the growth speed.

[0037] The uniform gas device 3 includes multiple layers of uniform gas chambers 31, and the adjacent uniform gas chambers 31 are communicated through multiple flow guide holes 32. The uniform gas chamber 31 is a circular ring chamber structure in the horizontal direction. The gas enters each layer of the chamber for uniform distribution and flows into the next layer of the uniform gas chamber 31 through the flow guide hole 32 for uniform distribution again, thereby improving the uniformity of the gas.

[0038] The spraying main body 1 bottom is equipped with the cooling cavity 6, and the cooling cavity 6 is cooled by cooling water to cool the spraying main body 1, which can effectively prevent the deformation and damage of the spraying structure caused by high temperature during CVD growth.

[0039] Finally, it should be noted that: the above disclosure is only the preferred embodiment of the present application, and is not used to limit the present application, although the present application is described in detail with reference to the foregoing embodiments, for those skilled in the art, the technical solutions recorded in the foregoing embodiments can be modified, or some technical features can be replaced. Any modification, equivalent replacement, improvement, etc. within the spirit and principles of the present application shall be included in the protection scope of the present application. The scope of the present application is limited by the appended claims.

Claims

1. A spray structure for efficiently and uniformly mixing gases in a CVD apparatus, comprising a spray main body (1), characterized in that: The top of the spray body (1) is provided with an air inlet pipe (21) and an air inlet pipe (22), the air inlet ends of the air inlet pipe (21) and the air inlet pipe (22) are communicated with the air inlet system respectively, a plurality of air uniformizing devices (3) are arranged in the spray body (1), the air outlet ends of the air inlet pipe (21) and the air inlet pipe (22) are communicated with the air uniformizing devices (3) respectively, a plurality of spray pipes (4) are arranged in the bottom of the air uniformizing devices (3) in a uniform distribution mode, the bottom of the spray body (1) is communicated with a reaction chamber, and the spray pipes (4) spray the uniformly distributed gas into the reaction chamber.

2. The spray structure for efficiently and uniformly mixing gases in a CVD apparatus according to claim 1, wherein: The air inlet pipe (21) and the air inlet pipe (22) are respectively provided with a plurality of air inlet holes (23), the lower parts of the air inlet holes (23) are respectively communicated with air uniformizing devices (3), a plurality of the air uniformizing devices (3) are arranged in a concentric circle mode, the adjacent air uniformizing devices (3) are arranged in an isolated mode, the air inlet holes (23) communicated with the air inlet pipe (21) and the air inlet pipe (22) are arranged in an interval communication mode with the air uniformizing devices (3).

3. The spray structure for efficiently and uniformly mixing and spraying gas in a CVD apparatus according to claim 2, wherein: The air uniformizing device (3) comprises a plurality of air uniformizing chambers (31) arranged in multiple layers in an up-down mode, and the adjacent air uniformizing chambers (31) are communicated through a plurality of flow guide holes (32).

4. The shower structure for efficiently and uniformly mixing and spraying the gases in a CVD apparatus according to claim 3, wherein: The air uniformizing chamber (31) is a circular ring cavity structure in the horizontal direction.

5. The shower structure for efficiently and uniformly mixing and spraying the gases in a CVD apparatus according to claim 2, wherein: The adjacent air uniformizing devices (3) are sealed through O-shaped sealing rings (5).

6. The shower structure for efficiently and uniformly mixing and spraying gas in a CVD apparatus according to claim 1, wherein: The bottom of the spray body (1) is provided with a cooling cavity (6), cooling water flows in the cooling cavity (6) to cool the spray body (1).

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