Die bonding swing arm mechanism and die bonding equipment

By setting a drive unit and a transmission unit in the die-bonding swing arm mechanism, the rotation correction of the nozzle structure is realized, which solves the problem of poor die-bonding accuracy and improves the die-bonding accuracy.

CN223693098UActive Publication Date: 2025-12-19ZHONGSHAN XINYICHANG AUTOMATION EQUIP CO LTD
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Patent Information

Application Number
CN202423323695.5
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2024-12-31
Publication Date
2025-12-19
Estimated Expiration
2034-12-31

AI Technical Summary

Technical Problem

The existing die-bonding swing arm mechanism has the problem of poor die-bonding accuracy during operation.

Method used

A die-bonding swing arm mechanism was designed, including a nozzle structure, a swing arm body, and a drive unit. By connecting the mounting end to the drive end of the power unit, the swing arm body can move. A transmission unit between the drive unit and the nozzle structure is set on the swing arm body to realize the rotation of the nozzle structure, thereby correcting the chip offset and improving the die-bonding accuracy.

Benefits of technology

The rotation of the nozzle structure is driven by the drive unit, which ensures the accuracy of the die bonding process, avoids changes in transmission distance caused by the movement of the swing arm, and improves the precision of die bonding.

✦ Generated by Eureka AI based on patent content.

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Abstract

The utility model is applicable to the technical field of semiconductor equipment, and provides a die bonding swing arm mechanism and die bonding equipment, and the die bonding swing arm mechanism comprises a suction nozzle structure, a swing arm body and a driving unit. The die bonding equipment comprises any one of the die bonding swing arm mechanisms. When the die bonding swing arm mechanism carries out die bonding work, the suction nozzle structure can be driven to rotate through the driving unit while the suction nozzle structure moves along with the swing arm body, deviation of a chip can be corrected during die bonding, and therefore the die bonding precision is guaranteed. Meanwhile, the driving unit and the suction nozzle structure are arranged on the swing arm body, so that the distance between the driving end of the driving unit and the suction nozzle structure cannot be changed due to the movement or mounting condition of the swing arm body, and the transmission between the driving end of the driving unit and the suction nozzle structure is more accurate; therefore, the rotation precision of the suction nozzle assembly during working is ensured, and the die bonding precision is further improved.
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Description

TECHNICAL FIELD

[0001] The utility model belongs to semiconductor equipment technical field especially relates to a fixed crystal swing arm mechanism and fixed crystal equipment. BACKGROUND

[0002] The fixed crystal machine is one of the devices for semiconductor device manufacturing, which connects the semiconductor wafer and other components together. In the working process of the fixed crystal machine, the crystal ring is usually supported by the crystal supply platform, then the chip on the crystal ring is separated from the blue film through the needle device, finally the chip on the crystal ring is moved and sucked by the swing arm driven suction nozzle structure, then the chip is transported and firmly connected with the welding point of the packaging substrate to realize the fixed crystal. The fixed crystal swing arm mechanism is an important part of the fixed crystal machine, which needs to realize the high-frequency reciprocating motion through the fixed crystal swing arm mechanism to realize the crystal taking and placing in the working process of the fixed crystal machine. However, the existing fixed crystal swing arm mechanism mostly has the technical problem of poor fixed crystal precision in the working process. SUMMARY

[0003] The utility model aims at providing a kind of fixed crystal swing arm mechanism and fixed crystal equipment, to solve the technical problem of poor fixed crystal precision of the fixed crystal swing arm mechanism in the working process in prior art.

[0004] The utility model is realized as follows, first, a kind of fixed crystal swing arm mechanism is provided, comprising:

[0005] Suction nozzle structure is used to suck chip by negative pressure;

[0006] The swing arm body has oppositely arranged fixed crystal end and mounting end, the mounting end is used to be connected with the driving end of power unit, and the suction nozzle structure is rotationally arranged at the fixed crystal end of the swing arm body;And

[0007] Driving unit is arranged in the region close to the mounting end of the swing arm body, for driving the suction nozzle structure to rotate, and transmission unit is arranged between the driving unit and the suction nozzle structure.

[0008] In an optional embodiment, the swing arm body includes a bottom surface portion and two mutually spaced side surface portions, the bottom surface portion is connected between the two side surface portions, the two side surface portions and the bottom surface portion form an accommodation space, the transmission unit and the driving end of the driving unit are located in the accommodation space, the bottom surface portion is a closed structure, and the side surface portion is further provided with a through hole, and the through hole is used to reduce the resistance when the swing arm body rotates horizontally.

[0009] In an optional embodiment, the bottom surface portion has a slope rib arranged along the length direction of the swing arm body, and the slope rib is located in the accommodation space.

[0010] In an optional embodiment, the nozzle structure comprises a main sleeve, a working assembly and an elastic member, the main sleeve is rotationally arranged at the end of the swing arm body, the main sleeve has a first channel, the first channel has a first opening and a second opening, the working assembly comprises a nozzle guide rod and a nozzle body, the first end of the nozzle guide rod is movably inserted into the first channel, the second end of the nozzle guide rod extends out of the main sleeve through the first opening, the nozzle body is arranged at the second end of the nozzle guide rod for adsorbing a chip, a second channel for connecting the nozzle body and the first channel is arranged on the nozzle guide rod, and the elastic member is located in the first channel, the first end of the elastic member abuts against the nozzle guide rod, and the elastic member is used for deforming when the nozzle body is pressed to buffer the working assembly.

[0011] In an optional embodiment, an elastic force adjusting member is arranged at the second opening, the elastic force adjusting member has a degree of freedom of movement along the axis of the first channel relative to the main sleeve, one end of the elastic member abuts against the elastic force adjusting member, and the other end of the elastic member abuts against the nozzle guide rod, the elastic force adjusting member is used for adjusting the initial compression amount of the elastic member by changing its position, and the elastic force adjusting member has a third channel for connecting the first channel and the outside.

[0012] In an optional embodiment, a mounting end cover is further fixed on the swing arm body, a sealing structure is arranged between the main sleeve and the mounting end cover, the main sleeve is sealingly connected with the mounting end cover through the sealing structure and can rotate relative to the mounting end cover, and a fourth channel is further arranged on the mounting end cover, the fourth channel is used for connecting the second opening and an external air path.

[0013] In an optional embodiment, a limiting member is detachably arranged at the first opening, an avoiding structure is arranged on the limiting member, the avoiding structure is used for allowing the nozzle guide rod to penetrate through the limiting member, a anti-dropping part is arranged at the first end of the nozzle guide rod, and the anti-dropping part is used for cooperating with the limiting member to avoid the first end of the nozzle guide rod from being pulled out of the first channel.

[0014] In an optional embodiment, the transmission unit comprises a first pulley, a second pulley and a transmission belt, the first pulley is arranged on the main sleeve, and the first pulley is coaxially arranged with the main sleeve, the second pulley is arranged on the driving end of the driving unit, and the transmission belt is wound around the outside of the first pulley and the second pulley at the same time.

[0015] In an alternative embodiment, the swing arm body is provided with a mounting hole, the main sleeve body is rotationally arranged in the mounting hole, an external sleeve of the main sleeve body is provided with a rotation positioning sleeve, an outer ring of the rotation positioning sleeve abuts against an inner wall of the mounting hole, and the number of the rotation positioning sleeves is two, and the two rotation positioning sleeves are respectively located on two sides of the first belt pulley.

[0016] In a second aspect, a die bonding swing arm mechanism is provided.

[0017] The technical effect of the present application is that the swing arm body is provided with a die bonding end and a mounting end, and the mounting end is connected with the driving end of the power unit, so that the swing arm body can move under the driving of the power unit. The suction nozzle structure is also rotationally arranged on the die bonding end of the swing arm body. In addition, the driving unit is arranged on the region of the swing arm body close to the mounting end. The driving end of the driving unit and the suction nozzle structure are also provided with a transmission unit. Compared with the prior art, when performing die bonding work, the suction nozzle structure can also be driven to rotate by the driving unit while moving with the swing arm body. The offset of the chip during die bonding can be corrected, thereby ensuring the accuracy of die bonding. The driving unit and the suction nozzle structure are arranged on the swing arm body, so that the distance between the driving end of the driving unit and the suction nozzle structure will not change due to the movement or installation of the swing arm body, thereby making the transmission between the driving end of the driving unit and the suction nozzle structure more accurate, thereby ensuring the rotation accuracy of the suction nozzle assembly during work, and further improving the accuracy of die bonding.

[0018] It can be understood that the beneficial effects of the second aspect described above can be referred to the related description in the first aspect described above, which will not be repeated here. BRIEF DESCRIPTION OF DRAWINGS

[0019] In order to more clearly illustrate the technical scheme of the embodiments of the present application, the following will briefly introduce the drawings needed to be used in the embodiments of the present application or the prior art description. Obviously, the drawings described below are only some embodiments of the present application, and for those skilled in the art, other drawings can also be obtained without creative labor on the basis of these drawings.

[0020] Figure 1 is a structure diagram of the die bonding swing arm mechanism provided by the embodiments of the present application Figure One ;

[0021] Figure 2 is a structure diagram of the die bonding swing arm mechanism provided by the embodiments of the present application Figure Two ;

[0022] Figure 3 is a structure schematic view of a suction nozzle structure adopted by an embodiment of the present utility model;

[0023] Figure 4 is a sectional structure schematic view of a suction nozzle structure adopted by an embodiment of the present utility model;

[0024] Figure 5 is an explosion structure schematic view of a suction nozzle structure adopted by an embodiment of the present utility model;

[0025] Figure 6 is Figure 4 enlarged structure schematic view of A in the figure.

[0026] Explanation of reference signs:

[0027] 1, swing arm body;11, die bonding end;12, mounting end;13, side surface part;14, bottom surface part;15, through hole;16, inclined surface rib;17, mounting hole;18, containing space;2, suction nozzle structure;21, main sleeve body;211, first channel;212, first opening;213, second opening;22, working assembly;221, suction nozzle guide rod;222, suction nozzle body;223, second channel;224, anti-dropping part;23, elastic member;24, elastic force adjusting member;241, third channel;25, limiting member;26, mounting end cover;261, fourth channel;262, pipeline connecting column;263, containing groove;27, rotary positioning sleeve;28, sealing structure;3, driving unit;4, transmission unit;41, first belt pulley;42, second belt pulley;43, transmission belt. DETAILED DESCRIPTION

[0028] The embodiments of the present utility model are described in detail below, examples of the embodiments are shown in the drawings, wherein the same or similar reference signs represent the same or similar elements or elements with the same or similar functions throughout. The embodiments described below by referring to the drawings are exemplary, and are intended to explain the present utility model, and cannot be understood as a limitation of the present utility model.

[0029] In the description of the present utility model, it is understood that the orientations or position relationships indicated by the terms "length", "width", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer" and the like are based on the orientations or position relationships shown in the drawings, and are only for the convenience of describing the present utility model and simplifying the description, and therefore cannot be understood as a limitation of the present utility model.

[0030] In addition, the terms "first", "second", "third", "fourth", "fifth", "sixth", "seventh" and "eighth" are only used for descriptive purpose and cannot be understood as indicating or implying relative importance or implicitly indicating the number of the technical features indicated. Therefore, the features defined with "first", "second", "third", "fourth", "fifth", "sixth", "seventh" and "eighth" can explicitly or implicitly include one or more of the features. In the description of the present application, the meaning of "a plurality of" is two or more than two, unless otherwise specifically defined.

[0031] In the present application, unless otherwise specifically defined and limited, the terms "mounting", "connecting", "connecting", "fixing" and the like should be understood in a broad sense, for example, it can be fixedly connected, or it can be detachably connected, or it can be integrated; it can be mechanically connected, or it can be electrically connected; it can be directly connected, or it can be indirectly connected through an intermediate medium; it can be the communication or interaction relationship between two elements. For those skilled in the art, the specific meaning of the above terms in the present application can be understood according to the specific circumstances.

[0032] In order to make the purpose, technical scheme and advantages of the present application more clear, the present application will be further described in detail below with reference to the drawings and examples.

[0033] Please refer to Figures 1 to 2 In the embodiment of the present application, the first aspect provides a die bonding swing arm mechanism, which comprises a suction nozzle structure 2, a swing arm body 1 and a driving unit 3. The suction nozzle structure 2 is used to suck or place the chip by negative pressure. The swing arm body 1 has a die bonding end 11 and a mounting end 12 arranged oppositely, the mounting end 12 is used to connect with the driving end of the power unit, and the suction nozzle structure 2 is rotatably arranged on the die bonding end 11 of the swing arm body 1. The driving unit 3 is arranged on the region of the swing arm body 1 close to the mounting end 12, the driving unit 3 is used to drive the suction nozzle structure 2 to rotate, and the transmission unit 4 is arranged between the driving unit 3 and the suction nozzle structure 2.

[0034] Specifically, the nozzle structure 2 refers to a component or assembly for picking up and placing a chip, and the working principle of the nozzle structure 2 is that a vacuum system generates negative pressure at the head of the nozzle through the internal channel of the nozzle during work. This negative pressure enables the nozzle to firmly adsorb the chip, and when it is necessary to place the chip, the chip can be separated from the nozzle structure 2 by disconnecting the connection with the vacuum system. The swing arm body 1 refers to a component with a certain length, which can be plate-shaped, columnar or strip-shaped, etc. The swing arm body 1 can also be composed of multiple shapes. The die bonding end 11 and the mounting end 12 can refer to the two ends of the swing arm body 1, respectively, and the mounting end 12 can be connected to the driving end of the power unit through clamping, fastener connection or plug-in connection, etc. The power unit can be a voice coil motor, etc. The die bonding end 11 refers to the end of the swing arm body 1 away from the power unit, and a mounting hole 17 can be provided on the die bonding end 11, so that the nozzle structure 2 can be rotatably arranged in the mounting hole 17. The driving unit 3 refers to a component or assembly that can output torque, and the driving unit 3 can be a servo motor, etc. The transmission unit 4 refers to a structure or assembly that can transmit power and motion, and the transmission unit 4 can adopt belt, chain or gear transmission.

[0035] The die bonding swing arm mechanism provided by the embodiment of the utility model, through setting the swing arm body 1 with the die bonding end 11 and the mounting end 12, and by connecting the mounting end 12 with the driving end of the power unit, the swing arm body 1 can move under the driving of the power unit. At the same time, the nozzle structure 2 can also be rotatably arranged at the die bonding end 11 of the swing arm body 1, and in addition, the driving unit 3 is also arranged in the region of the swing arm body 1 close to the mounting end 12, and the transmission unit 4 is also arranged between the driving end of the driving unit 3 and the nozzle structure 2. Compared with the die bonding swing arm mechanism in the prior art, when performing die bonding work, the nozzle structure 2 can also be driven to rotate by the driving unit 3 while moving with the swing arm body 1, and the offset of the chip during die bonding can be corrected, thereby ensuring the precision of die bonding. At the same time, the driving unit 3 and the nozzle structure 2 are both arranged on the swing arm body 1, so that the distance between the driving end of the driving unit 3 and the nozzle structure 2 will not change due to the movement or mounting of the swing arm body 1, thereby making the transmission between the driving end of the driving unit 3 and the nozzle structure 2 more accurate, thereby ensuring the rotation accuracy of the nozzle assembly during work, and further improving the precision of die bonding.

[0036] In one embodiment, please refer to Figure 1 With Figure 2The swing arm body 1 includes a bottom surface part 14 and two side surface parts 13 which are spaced apart from each other, the bottom surface part 14 is connected between the two side surface parts 13, the two side surface parts 13 and the bottom surface part 14 surround a containing space 18, the drive end of the driving unit 3 and the transmission unit 4 are located in the containing space 18, the bottom surface part 14 is a closed structure, and a through hole 15 is further arranged on the side surface part 13, and the through hole 15 is used to reduce the resistance when the swing arm body 1 rotates horizontally. Specifically, the side surface part 13 and the bottom surface part 14 are both plate-shaped parts with a certain thickness, and the bottom surface part 14 and the side surface part 13 can be an integral structure. The bottom surface part 14 and the side surface part 13 can also be a split structure, and the bottom surface part 14 and the side surface part 13 can be connected and assembled into a whole by welding, fasteners or clamping. The through hole 15 is a via structure that can allow objects or airflow to pass through, and the through holes 15 on the two side surface parts 13 can be correspondingly arranged. In the embodiment, by spacing the two side surface parts 13 and connecting the bottom surface part 14 between the two side surface parts 13, the two side surface parts 13 and the bottom surface part 14 surround the containing space 18, the drive end of the driving unit 3 and the transmission unit 4 are located in the containing space 18, which makes the overall structure of the swing arm body 1 more simple. At the same time, the bottom surface part 14 is located at the bottom surface area of the entire swing arm body 1 and the bottom surface part 14 is a closed structure, and the through hole 15 is arranged on the side surface part 13, which can make the swing arm body 1 have smaller wind resistance when swinging in a direction parallel to the bottom surface part 14 (usually horizontal direction), making it easier for the swing arm body 1 to rotate. At the same time, it can also reduce the influence of the movement of the swing arm body 1 on the blue film, making the wafer blue film vibrate smaller, and improving the precision of suction and die bonding.

[0037] In an optional embodiment, referring to Figure 1 and Figure 2 , a support rib is further arranged between the two side surface parts 13. Specifically, the support rib is a component with a certain volume, which can be block-shaped, plate-shaped or strip-shaped, etc. By arranging the support rib on the two side surface parts 13, the overall strength of the swing arm body 1 can be better. At the same time, the support rib can be provided with a relief structure, which can avoid the support rib blocking between the through holes 15 arranged opposite on the two side surface parts 13, so that the gas flow at the through holes 15 is smoother, thereby reducing the wind resistance of the swing arm body 1 when rotating horizontally.

[0038] In another optional embodiment, referring to Figure 1 and Figure 2 , the bottom surface part 14 and the two side surface parts 13 are an integral structure. Specifically, the bottom surface part 14 and the two side surface parts 13 can be integrally formed by machining, die casting or injection molding, etc., which can make the overall strength of the swing arm body 1 better.

[0039] In an embodiment, referring toFigure 1 With Figure 2 The bottom surface part 14 is provided with a slope rib 16 along the length direction of the swing arm body 1, and the slope rib 16 is located in the accommodation space 18. Specifically, the slope rib 16 refers to a component with a certain volume, and the slope rib 16 can be block-shaped, plate-shaped, or strip-shaped, etc. The arrangement of the slope rib 16 increases the strength of the swing arm body 1 at the bottom surface part 14, and also enhances the overall strength of the swing arm body 1. Similarly, the slope rib 16 can be provided with a relief structure, which can avoid the slope rib 16 blocking between the through holes 15 oppositely arranged on the two side surface parts 13, so that the gas flow at the through holes 15 is more smooth, and the wind resistance when the swing arm body 1 moves is reduced.

[0040] In one embodiment, please refer to Figures 3 to 6 The suction nozzle structure 2 includes a main sleeve body 21, a working assembly 22, and an elastic member 23. The main sleeve body 21 is rotationally arranged at the end of the swing arm body 1, and has a first channel 211 with a first opening 212 and a second opening 213. The working assembly 22 includes a suction nozzle guide rod 221 and a suction nozzle body 222. The first end of the suction nozzle guide rod 221 is movably inserted into the first channel 211, and the second end of the suction nozzle guide rod 221 extends out of the main sleeve body 21 through the first opening 212. The suction nozzle body 222 is arranged at the second end of the suction nozzle guide rod 221. A second channel 223 is arranged on the suction nozzle guide rod 221 for connecting the suction nozzle body 222 and the first channel 211. The elastic member 23 is located in the first channel 211 and abuts against the first end of the suction nozzle guide rod 221, so as to deform when the suction nozzle body 222 is pressed, thereby buffering the working assembly 22.

[0041] Specifically, the main sleeve body 21 refers to a component with a certain length, and the main sleeve body 21 can be column-shaped, rod-shaped, or block-shaped, etc. The first channel 211 refers to a channel structure with a certain length, which can be arranged along the axis direction of the main sleeve body 21, and the first channel 211 can have a first opening 212 and a second opening 213 oppositely arranged with the first opening 212. The first opening 212 and the second opening 213 can be respectively located at the two ends of the main sleeve body 21.

[0042] The working assembly 22 refers to an assembly or component for sucking the chip, and includes a suction nozzle guide rod 221 and a suction nozzle body 222. The suction nozzle guide rod 221 and the suction nozzle body 222 can be a split structure, and can be fixed by clamping, inserting or bonding. The suction nozzle guide rod 221 and the suction nozzle body 222 can also be an integral structure, that is, two different parts of the same component. The suction nozzle guide rod 221 refers to a component with a certain length, which can be columnar, rod-shaped or block-shaped, etc. The suction nozzle body 222 refers to a component or assembly for sucking objects. The suction nozzle body 222 is usually provided with a suction port, which usually uses the method of generating negative pressure (lower than atmospheric pressure) at the suction port to adsorb objects or new products. The second channel 223 also refers to a channel structure with a certain length, both ends of the second channel 223 are open, and the second channel 223 can be arranged along the axis direction of the suction nozzle guide rod 221. The communication between the suction nozzle body 222 and the first channel 211 refers to the communication between the suction port on the suction nozzle body 222 and the first channel 211 through the second channel 223.

[0043] The elastic member 23 refers to a component that can be elastically deformed when subjected to external force. The elastic member 23 usually has a certain length. The elastic member 23 can be a metal spring, a rubber column or a nitrogen spring, etc. At least part of the elastic member 23 abuts against the first end of the suction nozzle guide rod 221, and the other part is fixed by clamping, abutting or fastener connection, etc. so that the elastic member 23 can be compressed after being stressed to exert a counterforce on the suction nozzle guide rod 221.

[0044] In the embodiment, the first channel 211 with the first opening 212 and the second opening 213 is arranged along the axis direction of the main sleeve body 21. When the working assembly 22 is assembled with the main sleeve body 21, the first end of the suction nozzle guide rod 221 can be movably inserted into the first channel 211, the second end of the suction nozzle guide rod 221 extends out of the main sleeve body 21 through the first opening 212, and the suction nozzle body 222 is installed at the second end of the suction nozzle guide rod 221. In addition, the second channel 223 for connecting the suction nozzle body 222 with the first channel 211 is also arranged on the suction nozzle guide rod 221. Furthermore, the elastic member 23 is arranged in the first channel 211, and abuts against the first end of the suction nozzle guide rod 221, so as to deform when the suction nozzle body 222 is extruded, thereby buffering the movement of the working assembly 22 as a whole.

[0045] When the suction work is performed, the second opening 213 on the main sleeve body 21 can be communicated with the external air path, at this time, the first channel 211 and the second channel 223 form a passage connecting the suction nozzle body 222 and the external air path, so that the negative pressure can be generated at the suction nozzle body 222 to suck the chip. In addition, the elastic member 23 is arranged in the first channel 211 and abuts against the first end of the suction nozzle guide rod 221. When the suction nozzle body 222 is in contact with the chip and is extruded, the elastic member 23 can be deformed, so that the elastic member 23 can buffer the whole working assembly 22, thereby avoiding the problem that the suction nozzle is easy to damage the chip due to the inertia of the swing arm body, thereby improving the quality and precision of die bonding.

[0046] In addition, it needs to be explained that in the embodiment, the elastic member 23 is arranged in the first channel 211, so that the whole volume of the suction nozzle structure 2 is smaller. At the same time, the elastic member 23 is arranged in the first channel 211 to buffer the working assembly 22, so that it is not necessary to additionally arrange the buffering structure inside the working assembly 22, thereby making the whole structure of the working assembly 22 simpler and reducing the overall manufacturing cost and production cost of the working assembly 22.

[0047] In one embodiment, please refer to Figure 4 With Figure 6 The second opening 213 is provided with an elastic force adjusting member 24, the elastic force adjusting member 24 has a degree of freedom of moving along the axis of the first channel 211 relative to the main sleeve body 21, one end of the elastic member 23 abuts against the elastic force adjusting member 24, and the other end of the elastic member 23 abuts against the suction nozzle guide rod 221. The elastic force adjusting member 24 is used to adjust the initial compression amount of the elastic member 23 by changing its own position, and the elastic force adjusting member 24 is provided with a third channel 241 for connecting the first channel 211 and the outside.

[0048] Specifically, the elastic force adjusting member 24 refers to a component with a certain volume. The elastic force adjusting member 24 can be located entirely in the first channel 211, or only partially in the first channel 211. The elastic force adjusting member 24 can be connected to the main sleeve body 21 through sliding connection or threaded connection, etc., so as to have the freedom of movement along the axis of the main sleeve body 21 while being installed. In the working process, the elastic member 23 is generally in a compressed state. The initial compression amount of the elastic member 23 refers to the length of the elastic member 23 compressed when the nozzle guide rod 221 is not subjected to extrusion force. When the elastic member 23 is compressed by the same distance on the basis of the initial compression amount, the force exerted by the elastic member 23 on the nozzle guide rod 221 will also be different. When the nozzle body 222 contacts the chip, the force exerted by the nozzle body 222 on the chip will also be different. When the elastic force adjusting member 24 moves towards the nozzle guide rod 221, the initial compression amount of the elastic member 23 increases, and at this time, the force exerted by the elastic member 23 on the nozzle guide rod 221 will also increase, and when the nozzle body 222 contacts the chip, the force exerted by the nozzle body 222 on the chip will also increase. When the elastic force adjusting member 24 moves away from the nozzle guide rod 221, the initial compression amount of the elastic member 23 decreases, and the force exerted by the elastic member 23 on the nozzle guide rod 221 will also decrease, and when the nozzle body 222 contacts the chip, the force exerted by the nozzle body 222 on the chip will also decrease. The third channel 241 refers to a channel structure with a certain length, and the third channel 241 penetrates through the elastic force adjusting member 24.

[0049] In the embodiment, the elastic force adjusting member 24 is arranged at the second opening 213, and the elastic member 23 is located between the elastic force adjusting member 24 and the first end of the working assembly 22. At the same time, the elastic force adjusting member 24 has the freedom of movement along the axis of the main sleeve body 21. The position of the elastic force adjusting member 24 can be adjusted along the axis of the main sleeve body 21, so as to adjust the initial compression amount of the elastic member 23, and further adjust the elastic force of the elastic member 23 in the working process, so as to control the extrusion force exerted by the nozzle on the chip when the nozzle contacts the chip, i.e., the die bonding force, and make the use of the nozzle structure 2 more convenient. At the same time, the third channel 241 is arranged on the elastic force adjusting member 24, and the second opening 213 is communicated with the outside through the third channel 241. On the premise of realizing the torque adjustment of the elastic force adjusting member 24 on the elastic member 23, the elastic force adjusting member 24 can avoid affecting the communication between the second opening 213 and the external air path.

[0050] In addition, by arranging the elastic force adjusting member 24 at the second opening 213, the second opening 213 is located at the end region of the main sleeve body 21, and after the main sleeve body 21 is installed, the second opening 213 and the elastic force adjusting member 24 are generally located at the uppermost position of the main sleeve body 21, avoiding the elastic force adjusting member 24 from being blocked by other components, thereby making the elastic force adjustment of the elastic member 23 more convenient.

[0051] In an optional embodiment, referring to Figure 6 , the elastic member 23 comprises a spring. Specifically, the spring refers to a mechanical part that works by using elasticity. It is generally made of elastic material by spiral, and by arranging the spring between the elastic force adjusting member 24 and the suction nozzle guide rod 221, and because the spring itself has a passage structure and a gap for the gas flow to pass through, the working assembly 22 can play a buffering role while not blocking the gas flow in the first passage 211, making the working assembly 22 more smooth and convenient during the crystal pulling work.

[0052] In an embodiment, referring to Figure 6 , the elastic force adjusting member 24 is connected with the inner wall of the first passage 211 through threads. Specifically, the elastic force adjusting member 24 is connected with the inner wall of the first passage 211 through threads, which can make the installation of the elastic force adjusting member 24 more firm and reliable. When the position of the elastic force adjusting member 24 needs to be adjusted, by rotating the elastic force adjusting member 24 along its axis direction, the elastic force adjusting member 24 can move along the axis direction of the main sleeve body 21 under the action of the threads, making the position adjustment of the elastic force adjusting member 24 more convenient and accurate.

[0053] In an embodiment, referring to Figure 5 , the second end of the suction nozzle guide rod 221 is detachably connected with the suction nozzle body 222. By detachably connecting the suction nozzle body 222 with the suction nozzle guide rod 221, only the suction nozzle body 222 which is easy to wear needs to be replaced after the working assembly 22 is used for a long time, reducing the cost loss in the production process.

[0054] In an embodiment, referring to Figure 4, the first opening 212 is also detachably provided with a limiting piece 25, the limiting piece 25 is provided with a avoiding structure, the avoiding structure is used for the suction nozzle guide rod 221 to penetrate the limiting piece 25, the first end of the suction nozzle guide rod 221 is provided with an anti-off part 224, the anti-off part 224 is used for cooperating with the limiting piece 25 to avoid the first end of the suction nozzle guide rod 221 from being taken out of the first channel 211. Specifically, the limiting piece 25 refers to a component with a certain volume, and the limiting piece 25 can be block-shaped, columnar or rod-shaped. The avoiding structure refers to a structure for avoiding other objects, which can be an avoiding hole, an avoiding slot or an avoiding space. The anti-off part 224 also refers to a component with a certain volume, which can be block-shaped, columnar or plate-shaped. In the embodiment, by detachably arranging the limiting piece 25 at the first opening 212, and providing the avoiding structure on the limiting piece 25, and providing the anti-off part 224 at the first end of the suction nozzle guide rod 221, the suction nozzle guide rod 221 can be penetrated through the avoiding structure to realize the relative movement between the suction nozzle guide rod 221 and the limiting piece 25 during installation, and then the limiting piece 25 is installed at the first opening 212, so as to block the anti-off part 224 by the limiting piece 25, without affecting the movement of the suction nozzle guide rod 221, to avoid the first end of the suction nozzle guide rod 221 from being taken out of the first channel 211, so that the installation of the suction nozzle guide rod 221 is more stable, and the stability of the suction nozzle structure 2 is improved.

[0055] In one embodiment, referring to Figure 3 With Figure 5 , the mounting end 12 cover is also fixedly arranged on the swing arm body 1, the sealing structure 28 is arranged between the main sleeve body 21 and the mounting end 12 cover, the main sleeve body 21 is sealingly connected with the mounting end 12 cover through the sealing structure 28 and can relatively rotate, the fourth channel 261 is also arranged on the mounting end 12 cover, the fourth channel 261 is used for connecting the second opening 213 with the external air path. Specifically, the mounting end 12 cover refers to a component with a certain volume, which can be fixedly installed on the swing arm body 1 by clamping, welding or fastener connection. The fourth channel 261 refers to a channel structure with a certain length, one end of the fourth channel 261 is open and can be communicated with the second opening 213, and the other end is open and used for external air path communication. The sealing structure 28 refers to a structure or assembly that can seal the connection area of two components, which can be a sealing ring or a sealing bearing.

[0056] In the embodiment, by rotating the main sleeve body 21 arranged on the swing arm body 1, the angle of the crystal can be finely adjusted by rotating the main sleeve body 21 during the crystal suction work, so that the position and posture of the chip during die bonding are more accurate, and the die bonding is more accurate. At the same time, the mounting end 12 cover is fixedly arranged on the swing arm body 1, and the fourth channel 261 is further arranged on the mounting end 12 cover. The fourth channel 261 is used for connecting the second opening 213 with an external air path, so that the main sleeve body 21 can still communicate with the external air path through the fourth channel 261 while rotating. In addition, the sealing structure 28 is arranged between the main sleeve body 21 and the mounting end 12 cover, so that the main sleeve body 21 can be sealingly connected with the mounting end 12 cover during rotation, thereby making the sealing between the fourth channel 261 and the second opening 213 better, and making the crystal suction and die bonding work of the die bonding swing arm mechanism more convenient.

[0057] In an optional embodiment, referring to Figure 5 and Figure 6 , the sealing structure 28 includes a sealing ring arranged around the axis of the main sleeve body 21. Specifically, the sealing ring is a ring-shaped component with a certain elasticity, and the sealing ring can be made of rubber. The sealing ring can be sleeved on the outside of the main sleeve body 21, and a pressing surface is arranged on the outside of the main sleeve body 21 and the mounting end 12 cover. The sealing ring is pressed and fixed by the two pressing surfaces, so as to realize the static sealing connection and dynamic sealing connection between the main sleeve body 21 and the mounting end 12 cover.

[0058] In another optional embodiment, referring to the drawings, the mounting end 12 cover is further provided with a containing groove 263. The first end of the main sleeve body 21 can be inserted into the containing groove 263, and the second opening 213 is arranged at the first end of the main sleeve body 21. One end of the fourth channel 261 is arranged at the bottom of the containing groove 263. At the same time, the sealing ring can be arranged around the mouth of the containing groove 263, so that the connection between the first channel 211 and the fourth channel 261 is more convenient, and the sealing between the second opening 213 and the fourth channel 261 is better, thereby making the installation of the main sleeve body 21 and the mounting end 12 cover more stable.

[0059] In an embodiment, referring to Figure 5The fourth channel 261 is arranged along the axis direction of the pipeline connecting column 262. Specifically, the pipeline connecting column 262 refers to a component with a certain height, and the pipeline connecting column 262 can be columnar, rod-shaped or block-shaped, etc. In the embodiment, the pipeline connecting column 262 is arranged on the mounting end 12 cover, and the fourth channel 261 penetrates the mounting end 12 cover and the pipeline connecting column 262. When the fourth channel 261 is connected with the external air path, the pipeline in the external air path can be sleeved outside the pipeline connecting column 262, so that the connection between the fourth channel 261 and the external air path is more firm and stable, and the stability and safety of the suction nozzle structure 2 are improved.

[0060] In one embodiment, referring to Figure 2 The transmission unit 4 comprises a first belt wheel 41, a second belt wheel 42 and a transmission belt 43. The first belt wheel 41 is arranged on the main sleeve body 21 and coaxially arranged with the main sleeve body 21. The second belt wheel 42 is arranged on the driving end of the driving unit 3. The transmission belt 43 is arranged around the outside of the first belt wheel 41 and the second belt wheel 42. Specifically, the first belt wheel 41 and the second belt wheel 42 both refer to disc-shaped components with a certain diameter size. The transmission belt 43 refers to a flexible component with a whole annular shape. In the embodiment, the first belt wheel 41 is coaxially arranged with the main sleeve body 21, the second belt wheel 42 is arranged on the driving end of the driving unit 3, and the transmission belt 43 is arranged around the outside of the first belt wheel 41 and the second belt wheel 42. The torque output by the driving unit 3 can be transmitted to the main sleeve body 21 through the transmission belt 43, so as to drive the main sleeve body 21 to rotate, and the overall adjustment of the suction nozzle structure 2 is more convenient.

[0061] In an optional embodiment, referring to Figure 5 The first belt wheel 41 and the main sleeve body 21 are integrally formed. The main sleeve body 21 can be reasonably arranged in structure by integrally forming the first belt wheel 41 and the main sleeve body 21, and the length of the suction nozzle face swing arm body 1 can be reduced, so as to improve the accuracy of the suction nozzle structure 2 during crystal suction and crystal fixing.

[0062] In one embodiment, referring to Figure 5 And Figure 6The mounting hole 17 is arranged on the swing arm body 1, the main sleeve body 21 is rotationally arranged in the mounting hole 17, the outer sleeve of the main sleeve body 21 is sleeved with a rotary positioning sleeve 27, the outer ring of the rotary positioning sleeve 27 abuts against the inner wall of the mounting hole 17, the number of the rotary positioning sleeve 27 is two, and the two rotary positioning sleeves 27 are located on the two sides of the first belt pulley 41. Specifically, the rotary positioning sleeve 27 refers to a sleeve-shaped component with a certain length, the mounting hole 17 for mounting and containing the main sleeve body 21 is usually arranged on the swing arm body 1, the rotary positioning sleeve 27 is located between the inner wall of the mounting hole 17 and the outer surface of the main sleeve body 21, the rotary positioning sleeve 27 can limit the position of the main sleeve body 21 in the radial direction of the main sleeve body 21, so that the installation position of the main sleeve body 21 in the radial direction is more accurate. The two rotary positioning sleeves 27 are located on the two sides of the transmission structure, and the main sleeve body 21 is limited in the axial direction of the main sleeve body 21, so that the installation of the main sleeve body 21 in the axial direction is more stable, and the stability of the suction nozzle structure 2 is improved.

[0063] In an optional embodiment, referring to Figure 6 The rotary positioning sleeve 27 can be a rotary bearing, the inner ring of the rotary bearing is sleeved on the outer surface of the main sleeve body 21, and the outer ring of the rotary bearing abuts against the inner wall of the mounting hole 17 on the swing arm plate body 1, so that the rotation of the main sleeve body 21 is more flexible and convenient.

[0064] In a second aspect, a die bonding device is provided, which comprises the die bonding swing arm mechanism according to any one of the preceding aspects. The mounting end 12 of the swing arm body 1 is connected to the driving end of the power unit. It can be understood that the beneficial effects of the second aspect can be understood with reference to the related description in the first aspect, and will not be described here.

[0065] The above only describes the preferred embodiments of the present application, and only the technical principles of the present application are described, and these descriptions are only for explaining the principles of the present application, and cannot be explained as the limitation of the protection scope of the present application in any way. Based on the explanation herein, any modification, equivalent replacement and improvement within the spirit and principles of the present application, and other specific embodiments of the present application that can be thought of by those skilled in the art without creative labor, should be included in the protection scope of the present application.

Claims

1. A flipper mechanism for die bonding, comprising: The utility model relates to a kind of pick-and-place device, including: Suction nozzle structure, for suction chip by negative pressure; Swing arm body, with oppositely arranged die bonding end and mounting end, the mounting end is connected with the driving end of power unit, the suction nozzle structure is rotationally arranged in the die bonding end of swing arm body; And Driving unit, arranged in the region of swing arm body close to the mounting end, for driving the rotation of suction nozzle structure, transmission unit is arranged between the driving unit and the suction nozzle structure.

2. The flip chip bonder of claim 1, wherein the arm is configured to rotate about the first axis and the second axis. The swing arm body includes bottom surface part and two mutually spaced side surface parts, the bottom surface part is connected between two side surface parts, and the bottom surface part and the two side surface parts form a containing space, the driving end of the driving unit and the transmission unit are located in the containing space, the bottom surface part is closed structure, and the side surface part is further provided with through hole, and the through hole is used to reduce the resistance when the swing arm body rotates horizontally.

3. The flip chip bonder of claim 2, wherein the arm is configured to rotate about the first axis and the second axis. The bottom surface part has inclined surface muscle arranged along the length direction of swing arm body, and the inclined surface muscle is located in the containing space.

4. The flipper mechanism of any one of claims 1 to 3, wherein, The suction nozzle structure includes main sleeve, working assembly and elastic member, the main sleeve is rotationally arranged in the end of swing arm body, the main sleeve has first channel, the first channel has first opening and second opening, the working assembly includes suction nozzle guide rod and suction nozzle body, the first end of suction nozzle guide rod is movably inserted into the first channel, the second end of suction nozzle guide rod extends to the outside of main sleeve through the first opening, the suction nozzle body is arranged on the second end of suction nozzle guide rod and is used for adsorbing chip, the second channel for connecting the suction nozzle body with the first channel is arranged on the suction nozzle guide rod, and the elastic member is located in the first channel, the first end of suction nozzle guide rod abuts against the elastic member, and the elastic member is used for deforming when the suction nozzle body is extruded to buffer the working assembly.

5. The flip chip bonder of claim 4, wherein the arm is configured to rotate about the first axis and the second axis. The second opening is provided with elastic force adjusting member, the elastic force adjusting member has the freedom of movement along the axis of the first channel relative to the main sleeve, one end of the elastic member abuts against the elastic force adjusting member, and the other end abuts against the suction nozzle guide rod, the elastic force adjusting member is used for adjusting the initial compression amount of the elastic member by changing its position, and the elastic force adjusting member has third channel for connecting the first channel with the outside.

6. The flip chip bonder of claim 5, wherein the arm is configured to rotate about the first axis and the second axis. The swing arm body is further provided with mounting end cover, sealing structure is arranged between the main sleeve and the mounting end cover, the main sleeve is sealingly connected with the mounting end cover and can rotate relatively, and the mounting end cover is further provided with fourth channel, and the fourth channel is used for connecting the second opening with external air path.

7. The flip chip bonder of claim 4, wherein the arm is formed of a material having a coefficient of thermal expansion that is substantially equal to a coefficient of thermal expansion of the semiconductor die. Limiting member is arranged at the first opening, the limiting member is provided with avoiding structure, the avoiding structure is used for making the suction nozzle guide rod penetrate through the limiting member, the first end of the suction nozzle guide rod is provided with anti-dropping part, and the anti-dropping part is used for cooperating with the limiting member to avoid the first end of the suction nozzle guide rod from being taken out of the first channel.

8. The flip chip bonder of claim 4, wherein the arm is formed of a material having a coefficient of thermal expansion that is substantially equal to a coefficient of thermal expansion of the semiconductor die. The transmission unit comprises a first belt wheel, a second belt wheel and a transmission belt, the first belt wheel is arranged on the main sleeve body and coaxially arranged with the main sleeve body, the second belt wheel is arranged on the driving end of the driving unit, and the transmission belt is arranged around the outside of the first belt wheel and the second belt wheel.

9. The flip chip bonder of claim 8 wherein the arm is configured to rotate about the axis of rotation to move the pick-up head from the pick-up position to the placement position. The swing arm body is provided with a mounting hole, the main sleeve body is rotationally arranged in the mounting hole, the outer sleeve of the main sleeve body is provided with a rotation positioning sleeve, the outer ring of the rotation positioning sleeve abuts against the inner wall of the mounting hole, the number of the rotation positioning sleeves is two, and the two rotation positioning sleeves are located on the two sides of the first belt wheel.

10. A die bonding apparatus, characterized in that, The solid crystal swing arm mechanism comprises the solid crystal swing arm mechanism according to any one of claims 1 to 9.