Vacuum platform and laminating device
By designing a multi-zone vacuum adsorption and precise control vacuum platform on the semiconductor processing platform, the problems of uneven product adsorption and vacuum leakage were solved, achieving efficient and stable product processing and reducing costs and material losses.
Patent Information
- Application Number
- CN202520214499.X
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-02-11
- Publication Date
- 2025-12-19
- Estimated Expiration
- 2035-02-11
AI Technical Summary
Existing semiconductor processing platforms use a full vacuum adsorption method, which results in uneven product adsorption, easy vacuum leakage, affecting processing yield, and is cumbersome and costly to operate.
Design a vacuum platform with an adsorption surface divided into multiple adsorption areas, each connected by a vacuum input slot. Equipped with negative pressure pipelines, valves, and pressure monitoring devices, the platform achieves precise adsorption by controlling the negative pressure state of the adsorption holes, and secure fixation is achieved by combining the mounting clips and limit clips of the bonding device.
It improves product flatness and processing yield, simplifies operation, saves labor costs, reduces material loss, and improves processing reliability and stability.
Smart Images

Figure CN223693108U_ABST
Abstract
Description
TECHNICAL FIELD
[0001] The utility model relates to the field of semiconductor processing especially relates to a vacuum platform and laminating device. BACKGROUND
[0002] At present, in the semiconductor industry, the platform used by the machine often adopts the way of overall vacuum adsorption, and adsorbing a single product can cause vacuum leakage, resulting in uneven product adsorption and low processing yield. Even if the platform is full of products, due to the large number of products, it is easy to appear not in place, inevitably causing vacuum leakage, which will also lead to uneven product adsorption and low processing yield. INVENTION CONTENTS
[0003] In order to solve the problems existing in the prior art, one of the purposes of the utility model is to provide a vacuum platform.
[0004] The utility model provides the following technical scheme:
[0005] A vacuum platform, comprising a platform body;
[0006] The platform body has an adsorption surface, which comprises a plurality of adsorption areas, and the platform body is provided with adsorption holes and a vacuum input slot, the adsorption holes are exposed to the adsorption surface, and each adsorption hole in the same adsorption area is communicated through the vacuum input slot.
[0007] As a further optional scheme of the vacuum platform, the vacuum platform further comprises a negative pressure pipeline, the negative pressure pipeline comprises a main pipe and a plurality of branch pipes, and the branch pipes are correspondingly arranged with each adsorption area.
[0008] As a further optional scheme of the vacuum platform, a valve is arranged on the branch pipe, and the valve is used to communicate or cut off the lumen of the branch pipe and the adsorption hole in the corresponding adsorption area.
[0009] As a further optional scheme of the vacuum platform, a gas pressure monitoring member is arranged on the branch pipe, and the gas pressure monitoring member is located between the valve and the platform body.
[0010] The vacuum platform further comprises a gas pressure controller, and the gas pressure controller is electrically connected with the gas pressure monitoring member and the valve respectively.
[0011] As a further optional scheme of the vacuum platform, one end of the branch pipe is connected with the main pipe, and the other end of the branch pipe is connected with the platform body.
[0012] As a further optional solution to the vacuum platform, the platform body also has a mounting surface adjacent to the adsorption surface, part of the vacuum input slot is exposed to the mounting surface, the branch pipe is connected to the mounting surface, and the lumen of the branch pipe communicates with the adsorption hole in the corresponding adsorption area through the vacuum input slot.
[0013] As a further optional solution to the vacuum platform, the vacuum platform also includes a protective cover connected to the platform body, and the protective cover covers the branch pipe.
[0014] Another object of the present application is to provide a fitting device.
[0015] The present application provides the following technical solutions:
[0016] A fitting device includes a base and the above-mentioned vacuum platform, the base is provided with a pair of mounting buckles, and the mounting buckles are arranged on the side of the platform body away from the base.
[0017] As a further optional solution to the fitting device, the platform body is provided with a first alignment hole on the side facing the base, and the base is provided with a second alignment hole on the side facing the platform body, and the first alignment hole and the second alignment hole are embedded with elastic pads.
[0018] As a further optional solution to the fitting device, the base is also provided with a limiting buckle, and the limiting buckle is connected with the platform body.
[0019] The embodiments of the present application have the following beneficial effects:
[0020] In the above-mentioned vacuum platform, the adsorption surface of the platform body is divided into a plurality of adsorption areas, a plurality of adsorption holes exist in each adsorption area, and the plurality of adsorption holes are communicated through a vacuum input slot. On this basis, the staff can make the adsorption holes in a specific adsorption area in a negative pressure state to adsorb the product. Without filling the product on the adsorption surface, it is not easy to appear the situation of vacuum leakage, which can improve the flatness of the product and improve the processing yield.
[0021] In order to make the above-mentioned purposes, features and advantages of the present application more obvious and easy to understand, the following preferred embodiments are described in detail below, and the accompanying drawings are described as follows. BRIEF DESCRIPTION OF DRAWINGS
[0022] In order to more clearly illustrate the technical scheme of the embodiments of the present application, the drawings required to be used in the embodiments will be briefly introduced as follows. It should be understood that the following drawings only show some embodiments of the present application, and therefore should not be regarded as a limitation to the scope. Other related drawings can also be obtained by those skilled in the art without creative labor on the premise of not paying creative labor.
[0023] Figure 1 A top view schematic diagram of a vacuum platform provided by an embodiment of the present application is shown.
[0024] Figure 2 A top view schematic diagram of a vacuum platform provided by another embodiment of the present application is shown.
[0025] Figure 3 A top view schematic diagram of a vacuum platform provided by still another embodiment of the present application is shown.
[0026] Figure 4 A sectional view schematic diagram of a laminating device provided by an embodiment of the present application is shown.
[0027] Figure 5 A structural schematic diagram of a base in a laminating device provided by an embodiment of the present application is shown.
[0028] Main element symbol explanation:
[0029] 10-base; 11-mounting buckle; 12-limiting buckle; 13-second alignment hole; 14-elastic pad; 100-platform body; 110-suction surface; 111-suction area; 120-suction hole; 130-vacuum input slot; 140-mounting surface; 150-first alignment hole; 200-negative pressure pipeline; 210-valve; 220-main pipe; 230-branch pipe; 240-air pressure monitoring member; 300-air pressure controller; 400-protective cover; X-first direction; Y-second direction. DETAILED DESCRIPTION
[0030] The embodiments of the present application will be described in detail below, and examples of the embodiments are shown in the drawings, wherein the same or similar reference signs represent the same or similar elements or elements having the same or similar functions throughout. The embodiments described below by referring to the drawings are exemplary and are only used to explain the present application, and should not be understood as a limitation to the present application.
[0031] It should be noted that when an element is referred to as being "on" another element, it can be directly on the other element or intervening elements can also be present. In contrast, when an element is referred to as being "directly on" another element, there are no intervening elements present. As used herein the terms "vertical", "horizontal", "left", "right", and the like are merely used for illustration and do not imply any particular orientation of the device.
[0032] In the present application, unless otherwise explicitly specified and limited, the terms "mounting", "connecting", "connecting", "fixing" and the like should be understood in a broad sense, for example, it can be fixedly connected, or it can be detachably connected, or it can be integrated; it can be mechanically connected, or it can be electrically connected; it can be directly connected, or it can be indirectly connected through an intermediate medium; it can be the internal communication of two elements or the interaction relationship between two elements. For those skilled in the art, the specific meaning of the above terms in the present application can be understood according to the specific circumstances.
[0033] In addition, the terms "first", "second" are only for descriptive purposes, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of indicated technical features. Therefore, the features defined as "first", "second" can explicitly or implicitly include one or more features. In the description of the present application, the meaning of "multiple" is two or more, unless otherwise explicitly specified and limited.
[0034] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs. The terms used in the specification of the template are only for the purpose of describing the specific embodiments and are not intended to limit the present application. The term "and / or" used herein includes any and all combinations of one or more related listed items.
[0035] In the semiconductor industry, the vacuum platform of the equipment is an important structure for placing the carrier plate. Especially for equipment such as laminators, the vacuum platform is the most important, which relates to the binding relationship between the product and the material. How to ensure that the layers can be accurately positioned and stable during the pressing process is a problem that needs to be solved in the production process. In particular, in the pressing process, the laminating process is a crucial link in packaging. For example: when the FPC (Flexible Printed Circuit Board) material is laminated and bound with the product, high precision, high accuracy, high flatness, small offset, etc. are required.
[0036] Please refer to Figure 1The embodiment provides a vacuum platform, in particular, a vacuum platform capable of randomly controlling vacuum adsorption positions.
[0037] The platform body 100 is provided with an adsorption surface 110, and the adsorption surface 110 comprises a plurality of adsorption areas 111. The platform body 100 is provided with adsorption holes 120 and vacuum input grooves 130, the adsorption holes 120 are exposed to the adsorption surface 110, and each adsorption hole 120 in the same adsorption area 111 is communicated through the vacuum input groove 130.
[0038] In the above-mentioned vacuum platform, the adsorption surface 110 of the platform body 100 is divided into a plurality of adsorption areas 111, a plurality of adsorption holes 120 exist in each adsorption area 111, and the plurality of adsorption holes 120 are communicated through the vacuum input groove 130. On this basis, the worker can make the adsorption holes 120 in the specific adsorption area 111 in a negative pressure state to adsorb the product. The product does not need to be placed on the adsorption surface 110, and the vacuum leakage is not easy to occur, the flatness of the product can be improved, and the processing yield can be improved.
[0039] In addition, the conventional platform adopts the mode of full vacuum adsorption, and it is difficult to individually control the vacuum adsorption of a single product, so the product needs to be placed on the platform, which leads to unstable process requirements such as flatness of product placement and product fitting precision, affects the product yield, and is complicated to operate, high in labor cost, has a product placement omission situation, and is high in material loss and energy consumption.
[0040] In comparison, when the worker uses the above-mentioned vacuum platform, the product can be placed randomly, and the adsorption holes 120 in the adsorption area 111 where the product is placed only need to be in a negative pressure state, which is especially convenient for single piece operation, is more convenient to operate, can save labor cost, reduce product placement omission rate, and reduce material loss. The adsorption holes 120 in the adsorption area 111 where the product is not placed are in an atmospheric pressure state, which can effectively save energy.
[0041] Optionally, the platform body 100 is made of steel material which is high in flatness and material strength, and can reduce the manufacturing cost.
[0042] In some embodiments, the above-mentioned vacuum platform further comprises a negative pressure pipeline 200. The negative pressure pipeline 200 comprises a main pipe 220 and a plurality of branch pipes 230, and the branch pipes 230 are arranged correspondingly to the adsorption areas 111.
[0043] In use, one end of the negative pressure pipeline 200, which is away from the platform body 100, is connected with a vacuum generating device (such as an air compressor, etc.). When the vacuum generating device is turned on, the main pipeline 220 always maintains a negative pressure state. The worker makes one or more branch pipelines 230 communicate with the main pipeline 220, so that the suction holes 120 in the corresponding suction area 111 are in a negative pressure state, thereby enabling the product to be adsorbed.
[0044] Specifically, one end of the branch pipeline 230 is connected with the main pipeline 220, and the other end of the branch pipeline 230 is connected with the platform body 100.
[0045] In addition, one end of the main pipeline 220, which is away from the branch pipeline 230, is connected with the vacuum generating device.
[0046] It can be understood that a plurality of branch pipelines 230 are arranged corresponding to the plurality of suction areas 111, and the branch pipeline 230 is used to connect the main pipeline 220 with the corresponding suction area 111 on the platform body 100, which is more convenient for individually controlling the suction holes 120 in each suction area 111 to adsorb the product.
[0047] Further, the platform body 100 also has a mounting surface 140 adjacent to the suction surface 110, and part of the vacuum input groove 130 is exposed on the mounting surface 140. The branch pipeline 230 is connected with the mounting surface 140, and the lumen of the branch pipeline 230 communicates with the suction holes 120 in the corresponding suction area 111 through the vacuum input groove 130.
[0048] When the platform body 100 is processed, holes are drilled from the mounting surface 140 of the platform body 100 to pass through each suction hole 120 in the same suction area 111. At this time, the part of the vacuum input groove 130 exposed on the mounting surface 140 refers to the vacuum input groove 130 located between the mounting surface 140 and the suction hole 120 on the side edge of the suction area 111 close to the mounting surface 140. The hole of the branch pipeline 230 is connected with the vacuum input groove 130, so that the suction hole 120 can be communicated through the vacuum input groove 130.
[0049] In some embodiments, a valve 210 is arranged on the branch pipeline 230, and the valve 210 is used to make the lumen of the branch pipeline 230 communicate with or cut off the suction holes 120 in the corresponding suction area 111.
[0050] In use, the worker opens the valve 210 on the branch pipeline 230, so that the lumens of the main pipeline 220, the branch pipeline 230, and the suction holes 120 in the corresponding suction area 111 are sequentially communicated. Since the main pipeline 220 always maintains a negative pressure state, the suction holes 120 in the corresponding suction area 111 are also in a negative pressure state, thereby enabling the product to be adsorbed.
[0051] Conversely, the staff closes the valve 210 on the branch pipe 230, so as to cut off the lumen of the branch pipe 230 from the adsorption hole 120 in the corresponding adsorption area 111, so that the adsorption hole 120 in the corresponding adsorption area 111 is in a normal pressure state.
[0052] Please see Figure 1 and Figure 2 Further, the branch pipe 230 is provided with a gas pressure monitoring member 240, and the gas pressure monitoring member 240 is located between the valve 210 and the platform body 100.
[0053] In use, the pipe section of the branch pipe 230 provided with the gas pressure monitoring member 240 is always in communication with the adsorption hole 120, and the gas pressures are the same, so that the gas pressure monitoring member 240 can monitor the gas pressure at the adsorption hole 120 in real time.
[0054] On this basis, the above-mentioned vacuum platform further comprises a gas pressure controller 300, and the gas pressure controller 300 is electrically connected with the gas pressure monitoring member 240 and the valve 210 respectively.
[0055] In use, the staff can pre-input the required gas pressure, i.e., the preset gas pressure value, into the control chip of the gas pressure controller 300. The gas pressure controller 300 compares the preset gas pressure value with the actual gas pressure value at the adsorption hole 120. When there is a deviation between the actual gas pressure value and the preset gas pressure value, the gas pressure controller 300 controls the valve 210 to increase or decrease the opening degree until the actual gas pressure value is equal to the preset gas pressure value, so as to achieve the best adsorption effect, while ensuring that the product is effectively adsorbed and fixed, and avoiding that the pressure applied to the product is too large to cause the product to be deformed or even damaged.
[0056] In some embodiments, the adsorption area 111 is arranged along a first direction X, and a plurality of adsorption areas 111 are arranged along a second direction Y.
[0057] The first direction X and the second direction Y are intersected, and the first direction X and the second direction Y are both parallel to the adsorption surface 110.
[0058] Specifically, a plurality of adsorption holes 120 are arranged in each adsorption area 111, and the plurality of adsorption holes 120 are uniformly distributed in the adsorption area 111.
[0059] For example, the plurality of adsorption holes 120 are arranged in a column along the first direction X in the adsorption area 111, and are sequentially connected by a plurality of vacuum input grooves 130. When the platform body 100 is processed, only holes need to be drilled from the side surface of the platform body 100 along the first direction X, and each adsorption hole 120 in the same column is connected to each other. The drilled hole serves as the vacuum input groove 130, and the hole is connected to the negative pressure pipeline 200. The hole diameter of the vacuum input groove 130 can be about 3mm.
[0060] Alternatively, when the adsorption area 111 has a large width along the second direction Y, a plurality of adsorption holes 120 can also be arranged in multiple columns within the adsorption area 111, and the adsorption holes 120 in each column are arranged side by side. At this time, a hole is drilled from the side of the platform body 100 along the first direction X to form a vacuum input slot 130 extending along the first direction X, and the adsorption holes 120 in the same column can be connected to each other. A hole is drilled from the side of the platform body 100 along the second direction Y to form a vacuum input slot 130 extending along the second direction Y, and the adsorption holes 120 in the adjacent two columns can be connected to each other. The holes of a part of the vacuum input slots 130 are connected to the negative pressure pipeline 200, and the holes of the remaining vacuum input slots 130 are re-sealed.
[0061] In particular, when the adsorption surface 110 is arranged in a rectangular shape, the first direction X and the second direction Y are perpendicular to each other, and the first direction X is parallel to one side of the adsorption surface 110, and the second direction Y is parallel to the other adjacent side of the adsorption surface 110.
[0062] Further, the negative pressure pipeline 200 is arranged in pairs at both ends of the platform body 100 along the first direction X, and each adsorption hole 120 in the same adsorption area 111 is simultaneously connected to the lumens of the two negative pressure pipelines 200.
[0063] For example, when drilling from the side of the platform body 100 along the first direction X, the platform body 100 is completely penetrated. The holes at one end are connected to one of the negative pressure pipelines 200, and the holes at the other end are connected to the other negative pressure pipeline 200.
[0064] At this time, one of the negative pressure pipelines 200 can be used as a backup to ensure uniform air pressure distribution when the number of adsorption holes 120 in the adsorption area 111 is large.
[0065] It should be noted that the adsorption area 111 arranged along the first direction X can be further divided into two, three, four or more. In particular, please refer to Figure 3 When the adsorption area 111 is divided into two along the first direction X, the two adsorption areas 111 can be connected to the negative pressure pipeline 200 in proximity, respectively, to simplify the pipeline layout.
[0066] Further, the above-mentioned vacuum platform further comprises a protective cover 400. The protective cover 400 is connected to the platform body 100, and the protective cover 400 covers the branch pipe 230.
[0067] In use, the protective cover 400 covers the branch pipe 230, the valve 210, the air pressure monitoring member 240 and part of the main pipe 220 to protect them from being damaged by external impact, and at the same time, the valve 210 and the air pressure monitoring member 240 are in a relatively clean environment, which is conducive to the long-term stable operation of the valve 210 and the air pressure monitoring member 240.
[0068] Optionally, the air pressure controller 300 is installed on the protective cover 400.
[0069] In summary, the vacuum platform described above does not need to be filled with products on the adsorption surface 110 during use, and is not prone to vacuum leakage, which can improve the reliability and stability of the products and is conducive to improving the processing yield. At the same time, it is convenient for single piece operation, and the operation is more simple, which can save labor cost, reduce product placement omission rate and reduce material loss. For the adsorption area 111 without placing products, the corresponding valve 210 remains closed, which can effectively save energy.
[0070] Please refer to Figure 4 The embodiment also provides a fitting device, which comprises the base 10 and the vacuum platform described above. The base 10 is provided with a pair of mounting buckles 11 on the side facing away from the base 10.
[0071] Exemplarily, the mounting buckle 11 has a rod part and a head part. The rod part of the mounting buckle 11 penetrates the side of the base 10 facing the platform body 100 and is threadedly connected with the base 10. During assembly, the platform body 100 is first placed on the base 10, then the mounting buckle 11 is connected with the base 10, and the mounting buckle 11 is gradually tightened until the head part of the mounting buckle 11 abuts against the side of the platform body 100 facing away from the base 10, so that the platform body 100 is fixed on the base 10 by the friction force.
[0072] Please refer to Figure 5 Further, the base 10 is also provided with a limiting buckle 12, and the limiting buckle 12 is connected with the platform body 100.
[0073] Understandably, the platform body 100 is provided with a limiting slot, and the limiting buckle 12 is connected with the limiting slot.
[0074] During installation of the platform body 100, the limiting slot on the platform body 100 is aligned with the limiting buckle 12, and then the platform body 100 is placed on the base, so that the limiting buckle 12 is passively clamped into the limiting slot, thereby preliminarily positioning the platform body 100 before fixing the platform body 100.
[0075] Please refer to Figure 4 and Figure 5 Further, the side of the platform body 100 facing the base 10 is provided with a first positioning hole 150, and the side of the base 10 facing the platform body 100 is correspondingly provided with a second positioning hole 13, and the first positioning hole 150 and the second positioning hole 13 are embedded with an elastic pad 14.
[0076] Similarly, when installing the platform body 100, the lower part of the elastic pad 14 is first embedded into the second positioning hole 13, and the upper part of the elastic pad 14 is exposed, then the first positioning hole 150 is aligned with the second positioning hole 13, and the platform body 100 is placed on the base, so that the upper part of the elastic pad 14 is passively embedded into the first positioning hole 150, and the platform body 100 can be accurately positioned before being fixed. In this process, the elastic pad 14 can also elastically buffer the platform body 100, reducing the collision between the platform body 100 and the base 10.
[0077] In all examples shown and described herein, any specific values should be interpreted as merely exemplary and not as a limitation, and thus other examples of the example embodiments can have different values.
[0078] It should be noted that like reference numerals and letters refer to like items throughout the several views, and once an item is defined in one view, it need not be further defined and explained in subsequent views.
[0079] The above-described embodiments only express several implementation manners of the present application, and the description is relatively specific and detailed, but it should not be understood as a limitation on the scope of the present application. It should be pointed out that, for ordinary skilled in the art, without departing from the concept of the present application, a number of modifications and improvements can be made, which all belong to the protection scope of the present application.
Claims
1. A vacuum platform, characterized in that, The platform body has an adsorption surface comprising a plurality of adsorption areas, and is provided with adsorption holes and vacuum input grooves, the adsorption holes being exposed to the adsorption surface, and each adsorption hole in the same adsorption area being communicated with the vacuum input grooves. The vacuum platform further comprises a negative pressure pipeline comprising a main pipe and a plurality of branch pipes corresponding to each adsorption area.
2. The vacuum platform of claim 1, wherein, The branch pipes are provided with valves for communicating or isolating the lumen of the branch pipes from the adsorption holes in the corresponding adsorption area.
3. The vacuum platform of claim 2, wherein, The branch pipes are provided with air pressure monitoring members between the valves and the platform body.
4. The vacuum platform of claim 3, wherein, The vacuum platform further comprises an air pressure controller electrically connected with the air pressure monitoring members and the valves. One end of the branch pipes is connected to the main pipe, and the other end is connected to the platform body.
5. The vacuum platform of claim 2, wherein, The platform body further has a mounting surface adjacent to the adsorption surface, part of the vacuum input grooves being exposed to the mounting surface, the branch pipes being connected to the mounting surface, and the lumen of the branch pipes being communicated with the adsorption holes in the corresponding adsorption area through the vacuum input grooves.
6. The vacuum platform of claim 5, wherein, The vacuum platform further comprises a protective cover connected to the platform body, and the protective cover covers the branch pipes.
7. The vacuum platform of claim 2, wherein, The base is provided with a pair of mounting buckles on the side facing the platform body, and the mounting buckles are arranged on the side of the platform body away from the base.
8. An application device characterized by comprising: The platform body is provided with a first positioning hole on the side facing the base, and the base is provided with a second positioning hole on the side facing the platform body, and the first and second positioning holes are embedded with elastic pads.
9. The application of claim 8, wherein, The base is further provided with a limiting buckle for clamping the platform body.
10. The application of claim 8, wherein