Power supply device
By placing insulating materials or capacitors between the switching module and the heat dissipation module, and between the heat dissipation module and the housing, the risk of electric shock caused by electrostatic discharge in high-power communication equipment is solved, improving user safety and heat dissipation efficiency.
Patent Information
- Application Number
- CN202422945745.7
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-11-29
- Publication Date
- 2025-12-19
- Estimated Expiration
- 2034-11-29
AI Technical Summary
In high-power communication devices, the heat sink of the secondary switching transistor may pose a potential risk of electric shock due to electrostatic discharge, especially under high operating voltages, and there is a safety hazard when users touch the metal casing.
Insulating material layers or capacitors are placed between the switch module and the heat dissipation module, and between the heat dissipation module and the housing, to ensure that the charge is not directly transferred to the housing and to improve the insulation performance.
It effectively prevents the risk of electric shock when users touch the metal casing, improves safety, and at the same time reduces costs and improves heat dissipation efficiency while meeting insulation requirements.
Smart Images
Figure CN223693814U_ABST
Abstract
Description
TECHNICAL FIELD
[0001] Embodiments of the present application relate to the technical field of power equipment, in particular to a power supply device. BACKGROUND
[0002] As an essential part of the communication system, the task of the communication power supply is to provide energy to the communication equipment safely, reliably, efficiently, stably and uninterruptedly.
[0003] With the rapid development of the field of artificial intelligence and the communication industry, the power consumption of high-performance graphics processing cards and fifth-generation (5G) communication devices is increasing, and the application scenarios of high-voltage charging are increasing, which leads to the gradual increase of the working voltage of the secondary switch tube circuit in the communication power supply, that is, the power will also gradually increase. In order to prevent the temperature from being too high, the secondary switch tube is usually cooled by a heat sink. If the heat sink itself is not electrified but accumulates static electricity or other charges, it may discharge to the surrounding electronic components. This discharge may damage sensitive electronic components and even cause circuit failure. Therefore, connecting the heat sink to the grounded shell can ensure that the accumulated charges are released to the ground in time, avoiding damage to the equipment caused by static discharge. However, in actual application, users can often directly touch the metal shell of the communication equipment. When the secondary switch tube is working at a high voltage, if there is a lack of effective isolation measures, the above setting method is likely to pose a potential safety risk to the user. CONTENT OF THE UTILITY MODEL
[0004] Embodiments of the present application provide a power supply device, which can improve the use safety of the power supply device.
[0005] In a first aspect, a power supply device is provided, which comprises: a shell, and a switch module and a heat dissipation module arranged inside the shell; the switch module is connected with the heat dissipation module, and the heat dissipation module is grounded through the shell; the heat dissipation module is configured to dissipate heat for the switch module; wherein the switch module and the heat dissipation module are insulated, and / or the heat dissipation module and the shell are insulated.
[0006] In some embodiments, the power supply device further comprises a first insulating material layer; the first insulating material layer is arranged between the switch module and the heat dissipation module, and the switch module and the heat dissipation module are connected through the first insulating material layer.
[0007] In some embodiments, the first insulating material layer comprises one of a mica sheet, a ceramic substrate, an insulating adhesive tape and a heat-conducting insulating film.
[0008] In some embodiments, the first insulating material layer is a Mylar sheet with a thickness of no less than 0.25 mm; or, the first insulating material layer is a ceramic substrate with a thickness of no less than 0.25 mm; or, the first insulating material layer is at least one layer of insulating tape; or, the first insulating material layer is at least one layer of insulating film.
[0009] In some embodiments, the first insulating material layer is a Mylar sheet with a thickness of no less than 0.4 mm; or, the first insulating material layer is a ceramic substrate with a thickness of no less than 0.4 mm; or, the first insulating material layer is at least two layers of insulating tape; or, the first insulating material layer is at least two layers of insulating film.
[0010] In some embodiments, the heat dissipation module is spaced apart from the shell.
[0011] In some embodiments, the power supply device further comprises a second insulating material layer; the second insulating material layer is arranged between the heat dissipation module and the shell, and the heat dissipation module and the shell are connected through the second insulating material layer.
[0012] In some embodiments, the second insulating material layer comprises a Mylar sheet.
[0013] In some embodiments, the heat dissipation module and the shell are connected through a capacitor, and the capacitor is one of a multilayer ceramic capacitor, a metal film capacitor, a ceramic capacitor, an X capacitor and a Y capacitor.
[0014] In some embodiments, the power supply device further comprises a circuit board, and the switch module and the heat dissipation module are arranged on the circuit board.
[0015] The power supply device provided by the embodiments has the following beneficial effects: the embodiments provide a power supply device, which comprises a shell and a switch module and a heat dissipation module arranged in the shell; the switch module is connected with the heat dissipation module, and the heat dissipation module is grounded through the shell; the heat dissipation module is configured to dissipate heat of the switch module. By insulating the switch module and the heat dissipation module and / or insulating the heat dissipation module and the shell, the insulating performance between the switch module and the shell is improved, the risk of electric shock when a user touches the metal shell is avoided, and the safety of the user during use is improved. BRIEF DESCRIPTION OF DRAWINGS
[0016] One or more embodiments are illustrated by way of example in the figures that form a part of this patent document. These illustrations are not intended to limit the application in any way but are intended to illustrate the application in accordance with its principles. Identical reference numbers in the figures indicate identical elements and same numbers are intended to indicate like elements, unless expressly stated otherwise. The figures in the drawings are not intended to be to scale.
[0017] Figure 1A partial structure schematic diagram of a power supply device provided by an embodiment of the present application is shown in FIG. 1.
[0018] Figure 2 A partial structure schematic diagram of another power supply device provided by an embodiment of the present application is shown in FIG. 2.
[0019] Figure 3 A structure schematic diagram of a power supply device provided by an embodiment of the present application is shown in FIG. 3.
[0020] Figure 4 A partial circuit schematic diagram of a power supply device provided by an embodiment of the present application is shown in FIG. 4.
[0021] Figure 5 A structure schematic diagram of another power supply device provided by an embodiment of the present application is shown in FIG. 5. DETAILED DESCRIPTION
[0022] In order to facilitate the understanding of the present application, the present application will be described in more detail below in conjunction with the accompanying drawings and specific embodiments. It should be noted that when an element is described as being "fixed to" another element, it can be directly on the other element or one or more intervening elements can be present therebetween. When an element is described as being "electrically connected to" another element, it can be directly connected to the other element or one or more intervening elements can be present therebetween. The terms "upper", "lower", "inner", "outer", "bottom", and the like used in the present specification indicate the orientation or positional relationship based on the orientation or positional relationship shown in the drawings, and are merely for the purpose of facilitating the description of the present application and simplifying the description, and are not intended to indicate or imply that the device or element referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore cannot be understood as limiting the present application. In addition, the terms "first", "second", "third", and the like are only for the purpose of description and cannot be understood as indicating or implying relative importance.
[0023] Unless otherwise defined, all technical and scientific terms used in the present specification have the same meaning as commonly understood by one of ordinary skill in the art to which the present application belongs. The terms used in the specification of the present application are only for the purpose of describing specific embodiments and are not intended to limit the present application. The term "and / or" used in the present specification includes any and all combinations of one or more of the related listed items. In addition, the technical features involved in the different embodiments of the present application described below can be combined with each other as long as they do not conflict with each other.
[0024] The secondary switch tube 1 in the communication power supply usually has high power, and is usually matched with a heat sink 2 to assist heat dissipation. In order to further improve the heat dissipation efficiency, the secondary switch tube 1 can be directly fixed on the heat sink 2 through a screw or bonded on the heat sink 2 through a heat-conducting silica gel, and the heat sink 2 is connected to a metal grounding shell through a mechanical fixing mode, such as Figure 1As shown, thereby improving the heat dissipation rate; or the secondary switch tube 1 is fixed on the heat sink 2 by screws, and the heat sink 2 is connected to the metal ground shell in a functionally insulated manner such as Figure 2 However, when the operating voltage of the secondary switch tube 1 is high, the above design may have a potential electric shock risk, which does not meet the requirements of the insulation design.
[0025] In order to provide the insulation performance of the power supply device, the embodiments of the present application provide a power supply device, which is insulated between the switching module and the heat dissipation module, and / or is insulated between the heat dissipation module and the shell, thereby improving the insulation performance between the switching module and the shell, avoiding electric shock risk when the user touches the metal shell, and improving the safety of the user during use.
[0026] In a first aspect, the embodiments of the present application provide a power supply device 100, please refer to Figure 3 The power supply device 100 includes a shell 10, and a switching module 20 and a heat dissipation module 30 arranged inside the shell 10. The switching module 20 is connected to the heat dissipation module 30, and the heat dissipation module 30 is grounded through the shell 10. The heat dissipation module 30 is configured to dissipate heat for the switching module 20. Wherein, the switching module 20 and the heat dissipation module 30 are insulated, and / or the heat dissipation module 30 and the shell 10 are insulated.
[0027] The power supply device 100 refers to a power supply device with a primary circuit and a secondary circuit inside, the primary circuit is usually directly connected to the input power of the power supply device 100, please refer to Figure 4 The primary circuit is usually directly connected to the input port L and the output port N of the power supply device 100, and the secondary circuit is usually directly connected to the output positive port V+ and the output negative port V- of the power supply device 100, for example, the primary circuit can include a fuse 11 and a fuse 12, and the secondary circuit can include a switching module 20.
[0028] The switching module 20 can include at least one switch tube, which can be located in the primary circuit or the secondary circuit. In the present application, the switching tube is located in the secondary circuit as an example. The switching tube can be a field effect tube, and by controlling the on-off state and on-off time of the switching module 20, the voltage and current of the output power of the secondary circuit can be adjusted. For example, the switching tube can be TO-247.
[0029] The heat dissipation module 30 is a component in the power supply device 100 for dissipating heat for the switching module 20, which can include heat sinks, fans, etc., which can absorb and dissipate the heat generated by the switching module 20, preventing the power supply device 100 from overheating and causing performance degradation or damage.
[0030] The shell 10 is a peripheral protection structure of the power supply device 100, which is usually made of metal, plastic or other durable materials. It can be used to provide a closed space to accommodate and protect various components inside the power supply device 100, such as the switch module 20, the heat dissipation module 30, etc. The shell 10 can also serve as a barrier between the external environment and the internal components, preventing external factors such as dust and moisture from interfering or damaging the internal components. In this application, the power supply device 100 is a Class I product, i.e. the shell 10 is connected to the protective earth. Specifically, the shell 10 can be grounded by connecting a ground wire.
[0031] The heat dissipation module 30 is grounded through the shell 10, which means that the heat dissipation module 30 is connected to the shell 10, and the shell 10 itself is grounded, for example, the shell 10 is grounded by connecting a ground wire.
[0032] The switch module 20 and the heat dissipation module 30 are insulated, which means that when the two modules are connected, they are connected in an insulating manner to prevent electrical signals from being transmitted between the two modules.
[0033] The heat dissipation module 30 and the shell 10 are insulated, which means that when the heat dissipation module 30 and the shell 10 are connected, they are also designed to be insulated to prevent the charge on the heat dissipation module 30 from being transferred to the shell 10.
[0034] In this embodiment, by insulating the switch module 20 and the heat dissipation module 30, the charge on the switch module 20 is prevented from being transferred to the heat dissipation module 30, thereby preventing the charge on the switch module 20 from being transferred to the shell 10 through the heat dissipation module 30. By insulating the heat dissipation module 30 and the shell 10, the charge on the heat dissipation module 30 is prevented from being directly transferred to the shell 10. It can be seen that the above two setting methods can effectively ensure that the charge on the switch module 20 is transferred to the shell 10, avoiding the risk of electric shock when the user touches the shell, and improving the safety of the user during use. Moreover, this embodiment provides multiple design methods: one is to insulate the switch module 20 and the heat dissipation module 30, the second is to insulate the heat dissipation module 30 and the shell 10, and the third is to insulate the switch module 20 and the heat dissipation module 30 and insulate the heat dissipation module 30 and the shell 10. In actual application, the appropriate structure can be selected by considering the cost and heat dissipation efficiency of the product, so that the power supply device 100 can reduce the cost and improve the heat dissipation efficiency under the condition of meeting the insulation requirement, thereby improving the comprehensive competitiveness of the power supply device 100.
[0035] In some embodiments, referring to Figure 3 , the power supply device 100 further comprises a first insulating material layer 40. The first insulating material layer 40 is arranged between the switch module 20 and the heat dissipation module 30, and the switch module 20 and the heat dissipation module 30 are connected through the first insulating material layer 40.
[0036] As shown in Figure 3 The switch module 20 and the heat dissipation module 30 are respectively attached to the opposite sides of the first insulating material layer 40, and are insulated from each other. The first insulating material layer 40 is usually made of a material with excellent insulating properties, such as plastic, rubber or other non-conductive materials, which can ensure the electrical isolation between the switch module 20 and the heat dissipation module 30, and prevent the transmission of current between them.
[0037] In this embodiment, by providing the first insulating material layer 40, the purpose of insulating between the two can be achieved, the electrical isolation between the two can be achieved, and the insulating performance of the power supply device 100 can be improved.
[0038] In some embodiments, the first insulating material layer 40 includes one of a Mylar sheet, a ceramic substrate, an insulating tape, and a heat-conducting insulating film.
[0039] The Mylar sheet, also known as a PET polyester film, is a film made of dimethyl terephthalate and ethylene glycol heated with the aid of a catalyst, through ester exchange and vacuum polycondensation, and then biaxially stretched. The ceramic substrate is a sheet-shaped material made of ceramic material as the substrate through a specific process and technology. The insulating tape, also known as insulating tape, is a tape that can be used to prevent leakage and insulation. The heat-conducting insulating film is a material used to isolate conductive substances in high-temperature environments for electronic components, which usually uses a polyimide film as a substrate, and then coats a layer of heat-conducting adhesive. To meet the insulation requirements, the selected Mylar sheet should pass the UL746C certification; the selected insulating tape and insulating film should pass the UL certification and meet the requirements of flame retardance and insulation level. The length and width of the first insulating material layer 40 meet the safety distance requirements of the basic insulation of the measured working voltage.
[0040] In this embodiment, the first insulating material layer 40 provides a variety of material options, so that in actual application, a suitable first insulating material layer can be selected according to actual needs and cost considerations, improving the flexibility of the design.
[0041] In some embodiments, the first insulating material layer 40 is a Mylar sheet with a thickness of not less than 0.25 mm; or the first insulating material layer 40 is a ceramic substrate with a thickness of not less than 0.25 mm; or the first insulating material layer 40 is at least one layer of insulating tape; or the first insulating material layer 40 is at least one layer of insulating film.
[0042] The thickness of the Mylar sheet refers to the size in the direction perpendicular to the plane in which the Mylar sheet is laid (the plane in which the Mylar sheet is laid on the plane of the switch module 20 or the plane in which the Mylar sheet is laid on the plane of the heat dissipation module 30). The thickness of the ceramic substrate refers to the size in the direction perpendicular to the plane in which the ceramic substrate is laid (the plane in which the ceramic substrate is laid on the plane of the switch module 20 or the plane in which the ceramic substrate is laid on the plane of the heat dissipation module 30).
[0043] In the embodiment, by the above manner, when the working voltage of the switch module 20 is greater than 60V and less than or equal to 120V, the current between the switch module 20 and the heat dissipation module 30 can be effectively isolated, and the insulation performance between the switch module 20 and the heat dissipation module 30 is ensured.
[0044] In some embodiments, the first insulation material layer 40 is a Mylar sheet with a thickness of not less than 0.4mm; or the first insulation material layer 40 is a ceramic substrate with a thickness of not less than 0.4mm; or the first insulation material layer 40 is at least two layers of insulation tape; or the first insulation material layer 40 is at least two layers of insulation film.
[0045] In the embodiment, by the above manner, when the working voltage of the switch module 20 is greater than 120V, the current between the switch module 20 and the heat dissipation module 30 can be effectively isolated, and the insulation performance between the switch module 20 and the heat dissipation module 30 is ensured.
[0046] In some embodiments, referring to Figure 5 , the heat dissipation module 30 and the shell 10 are spaced apart.
[0047] The heat dissipation module 30 and the shell 10 are spaced apart, which means that there is a certain space distance between the heat dissipation module 30 and the shell 10, and the two are not in direct and close contact. By spacing the two, an air circulation channel is formed, so that the heat dissipation module 30 can better dissipate heat. There is a space distance between the two, and air is used as an isolation layer between the two, so that the two can also be electrically isolated.
[0048] In some embodiments, the power supply device 100 further comprises a second insulation material layer; the second insulation material layer is arranged between the heat dissipation module 30 and the shell 10, and the heat dissipation module 30 and the shell 10 are connected through the second insulation material layer.
[0049] That is, the heat dissipation module 30 and the shell 10 are respectively attached to the opposite sides of the second insulation material layer, so that the two are insulated. The second insulation material layer is usually made of materials with excellent insulation performance, such as plastic, rubber or other non-conductive materials, which can ensure the electrical isolation between the switch module 20 and the heat dissipation module 30, and prevent the transmission of current between the two.
[0050] In the embodiment, by the above manner, the purpose of insulation between the two is achieved, the electrical isolation between the two is achieved, and the insulation performance of the power supply device 100 is improved.
[0051] In some embodiments, the second insulation material layer comprises a Mylar sheet.
[0052] The Mylar sheet is arranged between the heat dissipation module 30 and the shell 10, that is, the heat dissipation module 30 and the shell 10 are respectively attached to the opposite sides of the Mylar sheet, and the Mylar sheet is arranged between the heat dissipation module 30 and the shell 10.
[0053] In the embodiment, by arranging the Mylar sheet as the second insulating material layer, the current path between the heat dissipation module 30 and the shell 10 can be effectively blocked, and the insulation performance is ensured.
[0054] In some embodiments, referring to Figure 3 , the heat dissipation module 30 and the shell 10 are connected through the capacitor 50, and the capacitor 50 is one of a multi-layer ceramic capacitor (MLCC), a metal film capacitor, a ceramic capacitor, an X capacitor and a Y capacitor.
[0055] The MLCC is a capacitor formed by using ceramic powder to be pressed and sintered into a ceramic medium, coating a metal layer (usually silver or nickel) on the surface of the ceramic medium, and finally sintering into a whole structure through the multi-layer superposition of internal electrodes. The metal film capacitor is a capacitor made of metal film as electrodes, formed on an insulating medium (such as ceramic, plastic, etc.) by vacuum evaporation or sputtering process, and then wound or stacked. The ceramic capacitor, also known as ceramic capacitor, is a capacitor using ceramic as medium and forming electrodes on the surface of the ceramic through metallization process. The X capacitor and the Y capacitor are both safety capacitors. The X capacitor is divided into X1 capacitor, X2 capacitor and X3 capacitor, and the Y capacitor is divided into Y1 capacitor and Y2 capacitor.
[0056] In practical applications, one of the above capacitors can be selected according to the insulation requirement to connect the heat dissipation module 30 and the shell 10. For example, when the working voltage of the switch module 20 is greater than 60V and less than or equal to 120V, a Y2 capacitor meeting the IEC / EN / UL60384-14 standard can be used, and when the working voltage of the switch module 20 is greater than 120V, a Y1 capacitor meeting the IEC / EN / UL60384-14 standard can be used. It can be understood that when the insulation requirement is low, the heat dissipation module 30 can be directly connected to the shell 10 by wire or mechanical fixation, so as to realize the grounding of the heat dissipation module 30.
[0057] In the embodiment, the above arrangement can improve the insulation performance between the heat dissipation module 30 and the shell 10. Moreover, the capacitor 50 has multiple options, so that in practical applications, a suitable capacitor 50 can be selected according to the actual requirement and cost, and the design flexibility is improved.
[0058] In some embodiments, referring to Figure 3 , the power supply device 100 further comprises a circuit board 60, and the switch module 20 and the heat dissipation module 30 are arranged on the circuit board 60.
[0059] The circuit board 60 can be referred to as a printed wiring board or printed circuit board, which is usually made of an insulating material such as glass fiber reinforced epoxy resin, phenolic resin, etc., on which conductive lines are usually printed for connecting various elements disposed on the circuit board 60. For example, the heat dissipation module 30 can be connected to the grounded housing 10 through the conductive lines on the circuit board 60, or the capacitor 50 can also be disposed on the circuit board 60, and the heat dissipation module 30 is connected to the capacitor 50 on the circuit board 60 through the conductive lines, and then connected to the grounded housing 10 through the capacitor 50.
[0060] In the present embodiment, by providing the circuit board 60, stable physical support can be provided for various elements, and electrical insulation between various devices can be ensured.
[0061] The specific design process of the power supply device 100 provided by the present application in actual application will be described in detail below in combination with specific embodiments.
[0062] First, the voltage of the switch module 20 to the reference ground under the normal working state of the power supply device 100 needs to be obtained, and the input port N and the output negative port V- of the power supply device 100 are short-circuited when testing the working voltage, and both are short-circuited with the protective ground. In addition, the power supply device 100 is kept under normal full load condition under the rated input voltage, so as to test the maximum working voltage of the switch module 20 to the reference ground. According to the measured value of the working voltage, it can be divided into the first grade ES1, the second grade ES2 and the third grade ES3. For example, when the working voltage is less than or equal to 60V, that is, the working voltage is in the first grade ES1, the functional insulation between the switch module 20 and the housing 10 needs to be met; when the working voltage is greater than 60V and less than or equal to 120V, that is, the working voltage is in the second grade ES2, the basic insulation between the switch module 20 and the housing 10 needs to be met; when the working voltage is greater than 120V, that is, the working voltage is in the third grade ES3, the enhanced insulation between the switch module 20 and the housing 10 needs to be met.
[0063] Then, when the working voltage is in the first level ES1, the switch module 20 and the heat dissipation module 30 can be directly attached and arranged if both are in the plastic package structure; when the working voltage is in the second level ES2, the switch module 20 and the heat dissipation module 30 are attached to the opposite sides of the first insulating material layer 40, and the thickness of the Mylar sheet selected by the first insulating material layer 40 is greater than or equal to 0.25 mm, the thickness of the ceramic substrate selected by the first insulating material layer 40 is greater than or equal to 0.25 mm, the number of layers of the insulating adhesive tape selected by the first insulating material layer 40 is at least one layer, and the number of layers of the insulating film selected by the first insulating material layer 40 is at least one layer; when the working voltage is in the second level ES3, the switch module 20 and the heat dissipation module 30 are attached to the opposite sides of the first insulating material layer 40, and the thickness of the Mylar sheet selected by the first insulating material layer 40 is greater than or equal to 0.40 mm, the thickness of the ceramic substrate selected by the first insulating material layer 40 is greater than or equal to 0.40 mm, the number of layers of the insulating adhesive tape selected by the first insulating material layer 40 is at least two layers, and the number of layers of the insulating film selected by the first insulating material layer 40 is at least two layers. And / or, when the working voltage is in the first level ES1, the heat dissipation module 30 and the shell 10 can be connected through a general capacitor, such as one of MLCC, metal film capacitor, ceramic capacitor and X capacitor; when the working voltage is in the second level ES2, the heat dissipation module 30 and the shell 10 should be connected through a Y2 capacitor meeting the IEC / EN / UL60384-14 standard; when the working voltage is in the second level ES3, the heat dissipation module 30 and the shell 10 should be connected through a Y1 capacitor meeting the IEC / EN / UL60384-14 standard, and there should be a spatial distance between the heat dissipation module 30 and the shell 10 or they should be arranged apart through a Mylar sheet.
[0064] In practical applications, settings can be made according to actual needs, and it is not necessary to be bound by the above limitations. For example, if the working voltage is in the third level ES3, in order to reduce the cost and optimize the heat dissipation, the heat dissipation module 30 and the shell 10 are connected through a Y2 capacitor meeting the IEC / EN / UL60384-14 standard, and there should be a spatial distance between the heat dissipation module 30 and the shell 10 or they should be arranged apart through a Mylar sheet, in addition, the switch module 20 and the heat dissipation module 30 are arranged in a basic insulating manner, i.e. the switch module 20 and the heat dissipation module 30 are attached to the opposite sides of the first insulating material layer 40, and the thickness of the Mylar sheet selected by the first insulating material layer 40 is greater than or equal to 0.25 mm, the thickness of the ceramic substrate selected by the first insulating material layer 40 is greater than or equal to 0.25 mm, the number of layers of the insulating adhesive tape selected by the first insulating material layer 40 is at least one layer, and the number of layers of the insulating film selected by the first insulating material layer 40 is at least one layer.
[0065] In summary, the power supply device 100 provided by the application provides various insulation structures. In actual application, a suitable insulation structure can be selected by comprehensively considering the cost and heat dissipation efficiency of the product, so that the product can meet the insulation requirements, reduce the cost, improve the heat dissipation efficiency, and further improve the comprehensive competitiveness of the product.
[0066] It should be noted that the apparatus embodiments described above are only illustrative, and the units described as separate components can or can not be physically separated, and the components shown as units can or can not be physical units, i.e., they can be located in one place or distributed on multiple network units. Part or all of the modules can be selected to achieve the purpose of the embodiment according to actual needs.
[0067] Finally, it should be noted that: the above embodiments are only used to illustrate the technical solutions of the application, and not to limit them; under the idea of the application, the technical features in the above embodiments or different embodiments can also be combined, the steps can be implemented in any order, and there are many other changes of different aspects of the application as described above. In order to be brief, they are not provided in detail; although the application has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that: the technical solutions recorded in the foregoing embodiments can still be modified, or some technical features can be replaced by equivalents; and these modifications or replacements do not make the essence of the corresponding technical solutions deviate from the scope of the technical solutions of the embodiments of the application.
Claims
1. A power supply device, characterized in that, The power supply device comprises: a shell, a switch module and a heat dissipation module arranged in the shell; the switch module is connected with the heat dissipation module, and the heat dissipation module is grounded through the shell; the heat dissipation module is configured to dissipate heat of the switch module; wherein, the switch module and the heat dissipation module are insulated, and / or the heat dissipation module and the shell are insulated.
2. The power supply device according to claim 1, characterized by The power supply device further comprises a first insulating material layer; the first insulating material layer is arranged between the switch module and the heat dissipation module, and the switch module and the heat dissipation module are connected through the first insulating material layer.
3. The power supply device according to claim 2, characterized by The first insulating material layer comprises one of a mica sheet, a ceramic substrate, an insulating tape and a heat-conducting insulating film.
4. The power supply device according to claim 2, wherein: the first insulating material layer is a mica sheet with a thickness not less than 0.25 mm; or, the first insulating material layer is a ceramic substrate with a thickness not less than 0.25 mm; or, the first insulating material layer is at least one layer of insulating tape; or, the first insulating material layer is at least one layer of insulating film.
5. The power supply device according to claim 2, wherein: the first insulating material layer is a mica sheet with a thickness not less than 0.4 mm; or, the first insulating material layer is a ceramic substrate with a thickness not less than 0.4 mm; or, the first insulating material layer is at least two layers of insulating tape; or, the first insulating material layer is at least two layers of insulating film.
6. The power supply device according to claim 1, characterized by The heat dissipation module and the shell are spaced apart.
7. The power supply device according to claim 1, wherein The power supply device further comprises a second insulating material layer; the second insulating material layer is arranged between the heat dissipation module and the shell, and the heat dissipation module and the shell are connected through the second insulating material layer.
8. The power supply device according to claim 7, characterized by The second insulating material layer comprises a mica sheet.
9. The power supply device according to any one of claims 6 to 8, characterized by, The heat dissipation module and the shell are connected through a capacitor, which is one of a multilayer ceramic capacitor, a metal film capacitor, a ceramic capacitor, an X capacitor and a Y capacitor.
10. The power supply device according to claim 1, characterized by The power supply device further comprises a circuit board, and the switch module and the heat dissipation module are arranged on the circuit board.