Super-thick copper multilayer PCB

Abstract

The utility model provides a super-thick copper multilayer PCB, and belongs to the technical field of circuit boards. The super-thick copper multilayer PCB comprises a substrate, the substrate is provided with a plurality of layers of prepregs, the plurality of layers of prepregs are stacked, and a copper layer and a jig are arranged between the prepregs on two adjacent sides; and the substrate, the plurality of layers of prepregs, the copper layer and the jig are laminated to form a base material. According to the PCB, the jigs are arranged between the prepregs, so that the prepregs can be prevented from sliding when the ultra-thick copper PCB is laminated, and glue filling holes or plate surface recesses are prevented from appearing in an ultra-thick copper pattern area after lamination, so that the product quality is improved, and the defective rate is reduced.

Description

TECHNICAL FIELD

[0001] The utility model relates to the technical field of circuit board especially relates to a super thick copper multilayer PCB. BACKGROUND

[0002] PCB is the core component of modern electronic equipment. With the increasing complexity and diversification of electronic equipment functions, the performance requirements of PCB are also continuously improved. Especially in some high-power, high-current device applications, traditional conventional PCB products have been unable to meet these harsh use scenarios. Therefore, in order to meet the needs of customers for high power, high voltage, and large current, thick copper process technology has emerged. Thick copper refers to the thickness of copper in PCB exceeding the conventional standard. The standard copper thickness of PCB is usually 1oz (35μm), while the copper thickness of PCB thick copper is ≥3oz (105μm), and in some special application scenarios, the copper thickness can even reach 12oz (420μm) or more. The application of thick copper technology greatly improves the carrying capacity and electrical conductivity of PCB, making it an ideal choice for high-power, high-current devices.

[0003] However, with the increase of copper thickness, the difficulty of PCB manufacturing also greatly increases. In the process of manufacturing thick copper PCB, the processes such as pattern making and pressing are facing new challenges. Especially in the pressing process, due to the increase of copper thickness, the traditional method of using only prepreg to fill glue cannot meet the requirements. When the copper thickness is greater than 8oz, using too much prepreg for pressing can easily cause the prepreg to slide, and then cause the problem of local insufficient glue filling and glue filling cavity. In addition, the glass fibers between the prepregs are easy to bend and enter between the lines during the pressing process, increasing the risk of short circuit during the later use.

[0004] Therefore, it is necessary to improve the existing thick copper PCB to overcome the defects of the prior art. INVENTION CONTENTS

[0005] In order to overcome the problems in the related art, the purpose of the utility model is to provide a super thick copper multilayer PCB. The PCB can prevent the prepreg from sliding during the pressing of the super thick copper PCB, avoid the appearance of glue filling cavity or plate surface depression in the super thick copper pattern area after pressing, thereby improving product quality and reducing the rate of defective products.

[0006] A super thick copper multilayer PCB, comprising:

[0007] A substrate, a plurality of layers of prepregs are provided on the substrate, the plurality of layers of prepregs are stacked, and a copper layer and a jig are provided between the two adjacent prepregs;

[0008] The substrate, the plurality of layers of prepreg, the copper layer and the jig are laminated to form a substrate.

[0009] In the preferable technical scheme of the utility model, a plurality of window openings are arranged on the jig, and the edges of the window openings are provided with bosses.

[0010] In the preferable technical scheme of the utility model, the cross section of the boss is circular or polygonal.

[0011] In the preferable technical scheme of the utility model, the boss protrudes upward from the edge of the window opening, and the distance between the top of the boss and the bottom of the window opening is 20-50 μm.

[0012] In the preferable technical scheme of the utility model, the plurality of layers of prepreg include a first prepreg and a second prepreg, and the first prepreg and the second prepreg are provided with the jig and the copper layer.

[0013] The thickness of the first prepreg is D1, the thickness of the second prepreg is D2, the thickness of the jig is D3, the thickness of the copper layer is D4, and D1+D2+D3-D4≥100 μm.

[0014] In the preferable technical scheme of the utility model, a circuit pattern is arranged on the copper layer.

[0015] The first prepreg and the second prepreg are of the same size, and the first prepreg is provided with a pattern opposite to the circuit pattern on the copper layer.

[0016] In the preferable technical scheme of the utility model, the thickness of the copper layer is ≥105 μm.

[0017] In the preferable technical scheme of the utility model, a window opening is arranged on the jig, and the window opening is opposite to the circuit pattern on the copper layer.

[0018] In the pressing process, the circuit pattern on the copper layer corresponds to the window opening, and the distance between the edge of the circuit pattern on the copper layer and the edge of the window opening is 40-60 μm.

[0019] The utility model has the advantages of:

[0020] The utility model provides a kind of super-thick copper multilayer PCB, the super-thick copper multilayer PCB, including substrate, several layers of prepreg are provided on substrate, several layers of prepreg are laminated, and copper layer and jig are provided between adjacent two sides prepreg;Substrate, several layers of prepreg, copper layer and jig are formed by pressing base material.The PCB is introduced by the laminated structure between several layers of prepreg and jig, limiting prepreg using jig, can prevent excessive prepreg between sliding during pressing, so as to avoid the situation that super-thick copper pattern area appears glue filling cavity or board surface recess after pressing, improve the reliability and stability of PCB product, reduce the rate of defective product in production process. BRIEF DESCRIPTION OF DRAWINGS

[0021] REFERENCE NUMERALS:

[0022] 1, substrate; 2, copper layer; 3, jig; 31, window; 32, boss; 4, prepreg. BRIEF DESCRIPTION OF DRAWINGS:

[0024] Fig. 1 It is the structure schematic diagram of a kind of super-thick copper multilayer PCB provided by the embodiment of the utility model;

[0025] Fig. 2 It is the structure schematic diagram of jig provided by the embodiment of the utility model. DETAILED DESCRIPTION

[0026] The preferred embodiments of the utility model will be described in more detail below with reference to the drawings. Although the preferred embodiments of the utility model are shown in the drawings, it should be understood that the utility model can be implemented in various forms and should not be limited by the embodiments described herein. On the contrary, these embodiments are provided to make the utility model more thorough and complete, and to fully convey the scope of the utility model to those skilled in the art.

[0027] The thick copper of PCB refers to the thickness of copper in PCB exceeding the conventional standard. The conventional standard PCB copper thickness is 1oz (35μm), while the copper thickness of PCB thick copper is ≥3oz (105μm). In some special application scenarios, the copper thickness can even exceed 12oz (420μm). The application of thick copper technology greatly improves the carrying capacity and conductive performance of PCB, making it an ideal choice for high-power and high-current devices.

[0028] However, with the increase of copper thickness, the difficulty of PCB manufacturing is also greatly increased. In the process of thick copper PCB manufacturing, the processes such as pattern making and pressing are facing new challenges. Especially in the pressing process, due to the increase of copper thickness, the traditional method of using only prepreg glue filling cannot meet the requirements. When the copper thickness is greater than 8oz, using too much prepreg for pressing is easy to cause the prepreg to slide, and then the problems of local insufficient glue filling and glue filling cavity appear. In addition, the glass fibers between the prepregs are easy to bend and enter between the lines during the pressing process, increasing the risk of short circuit during the later use.

[0029] Based on this, the application provides a kind of super thick copper multilayer PCB.

[0030] Embodiment

[0031] As Figs. 1-2 The embodiment provides a kind of super thick copper multilayer PCB, comprising:

[0032] The substrate 1 is provided with a plurality of layers of prepreg 4, a plurality of layers of prepreg 4 are stacked, and copper layer 2 and jig 3 are arranged between adjacent two sides of prepreg 4;Specifically, the thickness of copper layer 2 is greater than or equal to 105 μm.

[0033] The substrate 1, a plurality of layers of prepreg 4, copper layer 2 and jig 3 are formed into a base material by pressing.

[0034] The above-mentioned super thick copper multilayer PCB, the super thick copper multilayer PCB, comprising substrate 1, substrate 1 is provided with a plurality of layers of prepreg 4, a plurality of layers of prepreg 4 are stacked, and copper layer 2 and jig 3 are arranged between adjacent two sides of prepreg 4;The substrate 1, a plurality of layers of prepreg 4, copper layer 2 and jig 3 are formed into a base material by pressing. The PCB introduces the superposition structure between a plurality of layers of prepreg 4 and jig 3, and limits prepreg 4 by jig 3, which can prevent the sliding between too much prepreg 4 during pressing, so as to avoid the situation that glue filling cavity or plate surface depression appears in super thick copper pattern area after pressing, improve the reliability and stability of PCB product, and reduce the rejection rate in production process.

[0035] Further, a plurality of window openings 31 are arranged on the jig 3, and the edge of the window opening 31 is provided with a boss 32. Specifically, the cross section of the boss 32 is circular or polygonal. More specifically, the boss 32 protrudes upward from the edge of the window opening 31, and the distance between the top of the boss 32 and the bottom of the window opening 31 is 20 μm-50 μm.

[0036] The boss 32 is arranged at the edge of the window 31 of the jig 3 to avoid direct contact between the single edge of the jig 3 and the thick copper circuit, so that a gap is formed between the jig 3 and the circuit pattern, facilitating subsequent pressing and glue filling. This design avoids the problem of insufficient glue filling caused by direct contact between the single edge of the jig 3 and the thick copper circuit, and makes the glue filling more uniform.

[0037] In a specific embodiment, the plurality of layers of the prepreg 4 includes a first prepreg 4 and a second prepreg 4, and the first prepreg 4 and the second prepreg 4 are provided with the jig 3 and the copper layer 2;

[0038] In the specific embodiment, the thickness of the first prepreg 4 is D1, the thickness of the second prepreg 4 is D2, the thickness of the jig 3 is D3, and the thickness of the copper layer 2 is D4, and D1+D2+D3-D4≥100μm.

[0039] In the specific embodiment, the thickness of the first prepreg 4 is D1, the thickness of the second prepreg 4 is D2, the thickness of the jig 3 is D3, and the thickness of the copper layer 2 is D4, and D1+D2+D3-D4≥100μm.

[0040] Further, the copper layer 2 is provided with a circuit pattern;

[0041] The first prepreg 4 and the second prepreg 4 have the same size, and the first prepreg 4 is provided with a pattern opposite to the circuit pattern on the copper layer 2. The prepreg 4 is PP, the first prepreg 4 is arranged at the bottom of the jig 3 and is made according to the size of the pattern, and the second PP is a whole PP without pattern.

[0042] Further, the jig 3 is provided with a window 31, and the window 31 is opposite to the circuit pattern on the copper layer 2.

[0043] During the pressing process, the circuit pattern on the copper layer 2 corresponds to the window 31, and the distance between the edge of the circuit pattern on the copper layer 2 and the edge of the window 31 is 40μm-60μm.

[0044] In the specific embodiment, the distance between the edge of the window 31 and the edge of the circuit pattern on the copper layer 2 is 40μm-60μm, and more preferably, the distance between the edge of the window 31 and the edge of the circuit pattern on the copper layer 2 is 50μm. This design can ensure that sufficient prepreg 4 enters between the jig 3 and the super-thick copper circuit pattern during the pressing process, thereby improving the reliability of the product.

[0045] Specifically, the manufacturing method of the super-thick copper multilayer PCB of the present application is as follows:

[0046] First, a preliminary PCB board is prepared, and an ultra-thick copper circuit pattern is formed.

[0047] Then, according to the actual copper thickness of the ultra-thick copper circuit pattern, a core plate and a PP with a suitable thickness are selected.

[0048] Using a numerical control milling or laser cutting method, the jig 3 and the PP are cut and manufactured according to the shape of the ultra-thick copper circuit pattern. The jig 3 is shaped to match the ultra-thick copper circuit pattern, and the jig 3 has a window 31 opened therein, which is opposite to the circuit pattern on the copper layer 2.

[0049] The overall size of the circuit of the jig 3 is 50 μm smaller than the size of the ultra-thick copper circuit pattern, so that when the circuit pattern on the copper layer 2 is opposite to the window 31, the distance between the edge of the circuit pattern and the edge of the window 31 can be controlled within the range of 40 μm-60 μm. Different PPs have the same size, wherein the first PP (arranged at the bottom of the jig 3) is manufactured according to the size of the pattern, and the second PP is a complete PP without manufacturing a pattern.

[0050] The jig 3 has a boss 32 arranged at the edge of the window, and the height and shape of the boss 32 are designed according to the filling requirement, so as to ensure that the filling is sufficient when pressing, and to avoid the direct contact between the jig 3 and the ultra-thick copper circuit, which may cause insufficient filling.

[0051] The board is arranged and pressed according to the pressing and stacking structure of the substrate 1+the first PP+the jig 3+the second PP+the copper foil. The thickness of the first PP+the jig 3+the second PP is slightly greater than the copper thickness of the ultra-thick copper circuit pattern, so as to ensure that the board surface will not have abnormality such as depression after pressing.

[0052] In addition, it should be noted that the terms "first", "second", etc. used to limit the parts are only used to facilitate the distinction of the corresponding parts, and the above terms have no special meaning unless otherwise stated, and therefore cannot be understood as a limitation on the protection scope of the present application.

[0053] The above only describes the preferred embodiments of the present application and is not intended to limit the present application. For those skilled in the art, the present application can have various modifications and changes. Any modification, equivalent replacement, improvement, etc. made within the spirit and principles of the present application shall be included in the protection scope of the present application.

Claims

1. An ultra-thick copper multi-layer PCB characterized by, The application relates to a super-thick copper multilayer PCB.

2. The super-thick copper multilayer PCB according to claim 1, wherein: the jig is provided with a plurality of window openings, and the edges of the window openings are provided with protrusions.

3. The super-thick copper multilayer PCB according to claim 2, wherein: the protrusions are circular or polygonal in cross section.

4. The super-thick copper multilayer PCB according to claim 2 or 3, wherein: the protrusions protrude upward from the edges of the window openings, and the distance between the top of the protrusion and the bottom of the window opening is 20-50 microns.

5. The super-thick copper multilayer PCB according to claim 3, wherein: the plurality of prepreg layers include a first prepreg layer and a second prepreg layer, and the first prepreg layer and the second prepreg layer are provided with the jig and the copper layer; wherein the thickness of the first prepreg layer is D1, the thickness of the second prepreg layer is D2, the thickness of the jig is D3, and the thickness of the copper layer is D4, and D1+D2+D3-D4 is greater than or equal to 100 microns.

6. The super-thick copper multilayer PCB according to claim 5, wherein: the copper layer is provided with a circuit pattern; the first prepreg layer and the second prepreg layer are the same size, and the first prepreg layer is provided with a pattern opposite to the circuit pattern on the copper layer.

7. The super-thick copper multilayer PCB according to claim 6, wherein: the thickness of the copper layer is greater than or equal to 105 microns.

8. The super-thick copper multilayer PCB according to claim 6, wherein: the jig is provided with a window opening, and the window opening is opposite to the circuit pattern on the copper layer; during the pressing process, the circuit pattern on the copper layer corresponds to the window opening, and the distance between the edge of the circuit pattern on the copper layer and the edge of the window opening is 40-60 microns. ​ ​

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