COF substrate hot-pressing positioning device
By combining buffer bumps and compression springs with urethane cushioning, the problem of circuit board wear during COF bonding machine pressing and positioning is solved, achieving a more efficient pressing effect and reducing costs.
Patent Information
- Application Number
- CN202423061407.3
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-12-11
- Publication Date
- 2025-12-19
- Estimated Expiration
- 2034-12-11
AI Technical Summary
In existing COF bonding machines, the circuit board is prone to excessive force or impact during pressing and positioning, which leads to wear and increases production costs.
The design employs a combination of buffer bumps and compression springs to reduce the impact and vibration of the pressure plate on the circuit board, while using urethane adhesive pillars to buffer the pressure and extend the contact time.
It effectively reduces circuit board wear, lowers defect rates, improves production efficiency, and reduces costs.
Smart Images
Figure CN223694075U_ABST
Abstract
Description
TECHNICAL FIELD
[0001] The utility model relates to a circuit board processing technical field, concretely is a COF substrate hot pressing positioning device. BACKGROUND
[0002] COF is commonly called thin film die, is the die soft film construction technology that will be fixed on the flexible circuit board (IC) of integrated circuit, uses the soft additional circuit board as the package chip carrier to combine the chip with the soft base circuit, or the soft additional circuit board of single -chip package, including tape packaging production, soft board connection chip assembly, soft IC carrier package, therefore COF bonding machine has been widely used.
[0003] COF tooling process usually utilizes the heating pressboard to heat and press the circuit contact or the solder pad on the IC and the soft film circuit board, and the two are joined, in the COF bonding machine processing process, the existing compression mechanism is not convenient for providing good buffering protection effect for the circuit board when compression positioning alignment, in the compression process of single layer circuit board, when the circuit board is too large or is impacted, easy to cause certain wear and tear to the circuit board, leading to the high defective rate of processing, improve the production cost. UTILITY MODEL CONTENTS
[0004] The utility model provides a kind of COF substrate hot pressing positioning device to solve the problem in the background art.
[0005] To achieve the above object, the utility model provides the following technical scheme: a kind of COF substrate hot pressing positioning device, including pedestal, first rotary cylinder is installed on the side wall of the pedestal, and rotary table is installed on the first rotary cylinder, and the rotary table of first rotary cylinder, the lower part of the adapter plate is embedded with first air slip ring, and the rotary table of first rotary cylinder is located on the same axis with first air slip ring, second rotary cylinder is installed on the upper part of the adapter plate, and fixed plate is installed on the rotary table of second rotary cylinder, the middle part of the fixed plate is embedded with second air slip ring, and the rotary table of second rotary cylinder is located on the same axis with second air slip ring, high-strength glue column is installed on the fixed plate by equal-height bolt, and load plate is installed on the high-strength glue column, vacuum chuck is embedded on the load plate, both ends of the load plate are equipped with sink, and compression spring is installed in the sink, buffer boss is installed on the compression spring, and the buffer boss is movably arranged in the sink.
[0006] Further, air source triplex and electromagnetic valve group are respectively installed on the pedestal, and air source triplex and electromagnetic valve group are connected by gas supply hose.
[0007] Further, the electromagnetic valve group is connected with first rotary cylinder and first air slip ring by gas supply hose respectively, and first air slip ring is connected with second rotary cylinder and second air slip ring by gas supply hose respectively.
[0008] Further, the adapter plate is provided with a chuck electromagnetic valve, and the inlet and outlet of the chuck electromagnetic valve are connected with the second air slip ring and the vacuum chuck respectively through gas supply hoses.
[0009] Further, the fixing plate is provided with a blind hole, and the super strength glue column is located in the blind hole.
[0010] Further, the fixing plate is provided with a wire hole, and the wire hole corresponds to the position of the vacuum chuck.
[0011] Compared with the prior art, the COF substrate hot pressing positioning device has the following beneficial effects:
[0012] The COF substrate hot pressing positioning device can reduce the impact and vibration of the pressing plate on the circuit board when the pressing plate contacts the circuit board, avoids the stress abrasion of the circuit board, and prolongs the contact time between the pressing plate and the circuit board, thereby providing a certain buffering effect for the circuit board and ensuring the pressing effect of the circuit board. BRIEF DESCRIPTION OF DRAWINGS
[0013] Fig. 1 It is a structural schematic view of the utility model;
[0014] Fig. 2 It is a side view of the utility model;
[0015] Fig. 3 It is a top view of the utility model.
[0016] In the drawing: 1, base; 2, first rotary air cylinder; 3, adapter plate; 4, first air slip ring; 5, second rotary air cylinder; 6, fixing plate; 7, second air slip ring; 8, super strength glue column; 9, carrier plate; 10, vacuum chuck; 11, sink; 12, compression spring; 13, buffer boss; 14, gas source triplex; 15, electromagnetic valve group; 16, chuck electromagnetic valve; 17, blind hole; 18, wire hole. DETAILED DESCRIPTION
[0017] The technical solutions in the embodiments of the utility model will be clearly and completely described below with reference to the drawings in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by those skilled in the art without creative labor fall within the protection scope of the utility model.
[0018] Please refer to Figs. 1-3The utility model discloses a COF substrate hot pressing positioning device, including base 1, the lateral wall of base 1 is installed with first rotary air cylinder 2, and the rotary table of first rotary air cylinder 2 is installed with adapter plate 3, the lower part of adapter plate 3 is embedded with first air slide ring 4, and first air slide ring 4 and the rotary table of first rotary air cylinder 2 are located on the same axis, the upper part of adapter plate 3 is installed with second rotary air cylinder 5, and the rotary table of second rotary air cylinder 5 is installed with fixed plate 6, the middle part of fixed plate 6 is embedded with second air slide ring 7, and second air slide ring 7 and the rotary table of second rotary air cylinder 5 are located on the same axis, the fixed plate 6 is installed with superior glue column 8 through the equal height bolt, and superior glue column 8 is installed with carrier plate 9, the carrier plate 9 is embedded with vacuum chuck 10, both ends of carrier plate 9 are equipped with the sunken groove 11, and the sunken groove 11 is installed with compression spring 12, the compression spring 12 is installed with buffer boss 13, and buffer boss 13 is movably arranged in sunken groove 11, in the process of pressing, through the cooperation between buffer boss 13 and compression spring 12, when the heating presser plate contacts with the circuit board, can reduce the impact and vibration of presser plate directly to the circuit board, avoid the emergence of the stress wear of circuit board, and the superior glue column 8 at the bottom can buffer the pressure between heating presser plate and carrier plate 9, prolongs the contact time between heating presser plate and circuit board, provides certain buffering effect for circuit board, and also guarantees the pressing effect of circuit board.
[0019] Specifically, the base 1 is respectively installed with air source three-way piece 14 and electromagnetic valve group 15, and the air source three-way piece 14 and the electromagnetic valve group 15 are connected through gas supply hose.
[0020] In the embodiment, the air source three-way piece 14 is one of the widely used components in the industrial automatic control system, and the air source three-way piece 14 refers to the combination of an air filter, a pressure reducing valve and an oil atomizer, which functions to filter, reduce pressure and add oil to the gas to ensure the normal operation of the pneumatic actuator and prevent faults caused by impurities, excessive pressure or lack of oil.
[0021] Specifically, the electromagnetic valve group 15 is connected with the first rotary air cylinder 2 and the first air slide ring 4 through the gas supply hose, and the first air slide ring 4 is connected with the second rotary air cylinder 5 and the second air slide ring 7 through the gas supply hose.
[0022] In this embodiment, the gas slip ring is used to realize the transmission and sealing of gas in rotating or oscillating mechanical devices to ensure the normal operation of the equipment. The working principle is to transmit the gas signal during rotation through the internal gas channel. It is usually composed of a housing, a rotating part and a gas channel. The housing is made of metal material with high mechanical strength and wear resistance to protect the internal rotating part. The rotating part contains a gas guide channel and a sealing structure to ensure stable gas signal transmission during equipment rotation. The rotary air cylinder is a commonly used pneumatic actuator that realizes rotary motion through air pressure control.
[0023] Specifically, the adapter plate 3 is provided with a suction cup electromagnetic valve 16, and the inlet and outlet ends of the suction cup electromagnetic valve 16 are connected with the second gas slip ring 7 and the vacuum suction cup 10 through gas supply hoses.
[0024] In this embodiment, the main function of the suction cup electromagnetic valve 16 is to control the pressure and flow direction of the gas in the suction cup. The vacuum suction cup 10 is connected to the gas source through the suction cup electromagnetic valve 16.
[0025] Specifically, the fixed plate 6 is provided with a blind hole 17, and the optim glue column 8 is located in the blind hole 17.
[0026] In this embodiment, the blind hole 17 is a mounting structure mainly used for positioning and mounting the optim glue column 8.
[0027] Specifically, the fixed plate 6 is provided with a wire hole 18, and the wire hole 18 corresponds to the position of the vacuum suction cup 10.
[0028] In this embodiment, the wire hole 18 is a position avoidance design to facilitate the connection of the vacuum suction cup 10 to the pipeline.
[0029] In use, during the pressing process, the cooperation between the buffer bump 13 and the compression spring 12 enables the heating press plate to reduce the impact and vibration of the press plate directly on the circuit board when it contacts the circuit board, avoiding the occurrence of stress wear of the circuit board. The optim glue column 8 at the bottom can buffer the pressure between the heating press plate and the carrier plate 9, prolong the contact time between the heating press plate and the circuit board, and provide a certain buffering effect for the circuit board while ensuring the pressing effect of the circuit board.
[0030] In summary, the COF substrate hot pressing positioning device, during the pressing process, the cooperation between the buffer bump 13 and the compression spring 12 enables the heating press plate to reduce the impact and vibration of the press plate directly on the circuit board when it contacts the circuit board, avoiding the occurrence of stress wear of the circuit board. The optim glue column 8 at the bottom can buffer the pressure between the heating press plate and the carrier plate 9, prolong the contact time between the heating press plate and the circuit board, and provide a certain buffering effect for the circuit board while ensuring the pressing effect of the circuit board.
[0031] While the embodiments of the present application have been illustrated and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made therein without departing from the spirit and scope of the application, which is defined by the appended claims and their equivalents.
Claims
1. A COF substrate hot-press positioning device comprising a base (1), characterized in that: The first rotary air cylinder (2) is installed on the sidewall of the base (1), and the adapter plate (3) is installed on the rotary table of the first rotary air cylinder (2), the first air slip ring (4) is embedded in the lower part of the adapter plate (3), and the first air slip ring (4) is located on the same axis as the rotary table of the first rotary air cylinder (2), the second rotary air cylinder (5) is installed on the upper part of the adapter plate (3), and the fixing plate (6) is installed on the rotary table of the second rotary air cylinder (5), the second air slip ring (7) is embedded in the middle part of the fixing plate (6), and the second air slip ring (7) is located on the same axis as the rotary table of the second rotary air cylinder (5), the optimal glue column (8) is installed on the fixing plate (6) through the equal height bolt, the load plate (9) is installed on the optimal glue column (8), the vacuum chuck (10) is embedded in the load plate (9), the sink (11) is arranged at both ends of the load plate (9), the compression spring (12) is installed in the sink (11), the buffer block (13) is installed on the compression spring (12), and the buffer block (13) is movably arranged in the sink (11).
2. The COF substrate hot-press positioning device of claim 1, wherein: The air source triplex (14) and the electromagnetic valve group (15) are respectively installed on the base (1), and the air source triplex (14) and the electromagnetic valve group (15) are connected through the gas supply hose.
3. The COF substrate hot-press positioning device of claim 2, wherein: The electromagnetic valve group (15) is connected with the first rotary air cylinder (2) and the first air slip ring (4) through the gas supply hose, and the first air slip ring (4) is connected with the second rotary air cylinder (5) and the second air slip ring (7) through the gas supply hose.
4. The COF substrate hot-press positioning device of claim 1, wherein: The chuck electromagnetic valve (16) is installed on the adapter plate (3), and the inlet and outlet ends of the chuck electromagnetic valve (16) are connected with the second air slip ring (7) and the vacuum chuck (10) through the gas supply hose.
5. The COF substrate hot-press positioning device of claim 1, wherein: The blind hole (17) is arranged on the fixing plate (6), and the optimal glue column (8) is located in the blind hole (17).
6. The COF substrate hot-press positioning device of claim 1, wherein: The wire hole (18) is arranged on the fixing plate (6), and the wire hole (18) corresponds to the position of the vacuum chuck (10).