Electronic equipment

Abstract

The utility model discloses an electronic device. The electronic equipment comprises a body, a heating part, a heat conduction part, a first heat dissipation part and a second heat dissipation part, the body is provided with an accommodating space and a ventilation part, and the accommodating space is communicated with the ventilation part; the heating component is positioned in the accommodating space; the heat conduction part is located in the containing space and connected with the heating part so as to transfer heat generated by the heating part; the first heat dissipation component is provided with a first air outlet, and the first air outlet faces the heat conduction component. The second first heat dissipation component is provided with a second air outlet, and the second air outlet faces the heating component.

Description

TECHNICAL FIELD

[0001] Embodiments of the present application relate to the technical field of electronic devices, and in particular to an electronic device. BACKGROUND

[0002] With the progress of science and technology, electronic devices are ubiquitous in people's lives. In the related art, an electronic device has a heat generating component and a heat conducting component arranged inside the electronic device. Heat generated by the heat generating component is mainly conducted to the shell of the electronic device through the heat conducting component, and is dissipated to the outside through the shell. As the power of the heat generating component increases, the above-mentioned heat dissipation method cannot meet the heat dissipation requirements of the heat generating component. SUMMARY

[0003] The present application provides an electronic device, which includes a shell, a first heat generating component, a first heat dissipation component, and a first heat conducting component. The shell has a receiving cavity and a vent, and the receiving cavity is in communication with the outside through the vent. The first heat generating component is arranged in the receiving cavity. The first heat dissipation component has a first air outlet and a second air outlet, the first air outlet is arranged towards the vent, and the orientation of the second air outlet is different from that of the vent. The first heat conducting component has a first part and a second part connected to each other, the first part is connected to the first heat generating component, and the second air outlet blows air through the second part.

[0004] In a possible implementation manner of the present application, the electronic device further includes a partition arranged in the receiving cavity to divide the receiving cavity to form an air cooling flow channel. The second air outlet is in communication with the air cooling flow channel, and the second part is arranged in the air cooling flow channel so that the air blown by the second air outlet passes through the second part through the air cooling flow channel.

[0005] In a possible implementation manner of the present application, the electronic device further includes a flow guiding component having a flow guiding air channel. The second air outlet is in communication with the air cooling flow channel through the flow guiding air channel, and the second part is connected to the flow guiding component to transfer heat generated by the first heat generating component to the flow guiding component.

[0006] In a possible implementation manner of the present application, the extension direction of the flow guiding air channel is arranged at an angle to the thickness direction of the shell. Along the thickness direction of the shell, the second part and the flow guiding component are stacked.

[0007] In a possible implementation manner of the present application, the electronic device further includes a second heat conducting component. One side of the second heat conducting component is connected to the first heat generating component, and the other side of the second heat conducting component is connected to the side wall of the receiving cavity to transfer heat generated by the first heat generating component to the shell.

[0008] In a possible implementation manner of the present application, along the thickness direction of the shell, the first part and the second heat conducting component are respectively located on opposite sides of the first heat generating component.

[0009] In a possible implementation of the present application, the first portion extends along a first direction, and the second portion extends along a second direction, and an included angle between the first direction and the second direction is not equal to zero.

[0010] In a possible implementation of the present application, the electronic device further includes a second heat-generating component and a third heat-conducting component, the third heat-conducting component has a third portion and a fourth portion connected to each other, the third portion is connected to the second heat-generating component, and the airflow blown by the first air outlet passes through the fourth portion, and the second heat-generating component has a heat generation power greater than that of the first heat-generating component.

[0011] In a possible implementation of the present application, the electronic device further includes a second heat-dissipating component, the second heat-dissipating component has a third air outlet, an orientation of the third air outlet is different from that of the vent, the airflow blown by the third air outlet passes through the second heat-generating component, or the airflow blown by the third air outlet passes through the second heat-generating component and the second portion.

[0012] In a possible implementation of the present application, the electronic device further includes a third heat-generating component, the first heat-conducting component further has a third portion connected to the second portion, the third portion is connected to the third heat-generating component, and / or the electronic device further includes a fourth heat-generating component and a fourth heat-conducting component, the fourth heat-conducting component has a fifth portion and a sixth portion connected to each other, the fifth portion is connected to the third heat-generating component, and the airflow blown by the second air outlet passes through the sixth portion. BRIEF DESCRIPTION OF DRAWINGS

[0013] Figure 1 A structural schematic diagram of an electronic device provided by an embodiment of the present application (first example);

[0014] Figure 2 A position schematic diagram of a first heat-conducting component and a second heat-conducting component provided by an embodiment of the present application;

[0015] Figure 3 A structural schematic diagram of a first heat-conducting component and a first heat-dissipating component provided by an embodiment of the present application;

[0016] Figure 4 A structural schematic diagram of a first heat-conducting component and a first heat-dissipating component provided by an embodiment of the present application; Figure 3 A sectional view at A-A in FIG. 8;

[0017] Figure 5 A structural schematic diagram of an electronic device provided by an embodiment of the present application (second example);

[0018] Figure 6 A structural schematic diagram of an electronic device provided by an embodiment of the present application (third example);

[0019] Figure 7A structural schematic diagram of an electronic device provided in an embodiment of the present application (the fourth example);

[0020] Figure 8 A structural schematic diagram of an electronic device provided in an embodiment of the present application (the fifth example).

[0021] Reference signs:

[0022] 1 - housing; 11 - accommodating cavity; 111 - air cooling flow channel; 12 - air vent; 13 - partition; 2 - heat generating component; 21 - first heat generating component; 22 - second heat generating component; 23 - third heat generating component; 24 - fourth heat generating component; 3 - first heat dissipation component; 31 - first air outlet; 32 - second air outlet; 4 - first heat conduction component; 41 - first part; 42 - second part; 43 - seventh part; 44 - heat conduction adhesive; 45 - support copper sheet; 5 - second heat conduction component; 6 - flow guide component; 7 - third heat conduction component; 71 - third part; 72 - fourth part; 73 - eighth part; 8 - second heat dissipation component; 81 - third air outlet; 82 - fourth air outlet; 9 - fourth heat conduction component; 91 - fifth part; 92 - sixth part; 93 - ninth part. DETAILED DESCRIPTION

[0023] In order to make the purpose, technical solutions and advantages of the embodiments of the present application clearer, the specific technical solutions of the present application will be further described in detail below with reference to the drawings in the embodiments of the present application. The following embodiments are used to illustrate the present application, but not to limit the scope of the present application.

[0024] In the embodiments of the present application, the terms "first", "second" are only used for descriptive purposes, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined with "first", "second" can explicitly or implicitly include one or more of the features. In the description of the embodiments of the present application, unless otherwise specified, the meaning of "a plurality of" is two or more.

[0025] In addition, in the embodiments of the present application, the orientation terms such as "up", "down", "left" and "right" are defined with respect to the orientation of the components shown in the drawings, and it should be understood that these directional terms are relative concepts, which are used for relative description and clarification, and can be changed accordingly according to the change of the orientation of the components placed in the drawings.

[0026] In the embodiments of the present application, unless otherwise explicitly specified and limited, the term "connection" should be understood in a broad sense, for example, "connection" can be fixed connection, or can be detachable connection, or can be integrated; can be directly connected, or can be indirectly connected through an intermediate medium.

[0027] In the embodiments of the present application, the terms "comprising", "containing" or any other any conjugations of these terms are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include those elements solely, but can also include other elements not expressly listed or inherent to such process, method, article, or apparatus. Without more limitations, the element defined by the phrase "comprising a" does not exclude the presence of additional identical elements in the process, method, article, or apparatus that includes the element.

[0028] In the embodiments of the present application, the words "exemplary" or "for example" are used to mean serving as an example or illustration. Any embodiment or design presented as "exemplary" or "for example" in the embodiments of the present application should not be construed as preferred or advantageous over other embodiments or designs. Rather, the use of "exemplary" or "for example" is intended to present concepts in a concrete manner.

[0029] In the embodiments of the present application, directions are marked for convenience of description, Figures 1 to 8 In the embodiments of the present application, the first direction is the length direction of the shell 1, and also the extension direction of the first part 41; the second direction is the width direction of the shell 1, and also the extension direction of the second part 42, and also the direction of the air vent 12; the third direction is the thickness direction of the shell 1, and the first direction, the second direction and the third direction are perpendicular to each other. It should be noted that the direction marking is only used to describe the present application, but not to limit the scope of the present application.

[0030] With the progress of science and technology, electronic devices are everywhere in people's lives. In the related art, the internal part of the electronic device is provided with a heat generating component and a heat conducting component. The heat generated by the heat generating component is mainly conducted to the shell of the electronic device through the heat conducting component, and the heat is dissipated to the outside through the shell. With the increase of the power of the heat generating component, the above heat dissipation mode cannot meet the heat dissipation demand of the heat generating component.

[0031] To solve the above problems, the embodiments of the present application provide an electronic device. Here, it needs to be explained that the electronic device mentioned in the embodiments of the present application can be a notebook computer, can be a computer host, can also be a television, and can also be a game console, etc. The embodiments of the present application do not limit this. In one implementation manner provided by the embodiments of the present application, the electronic device is a notebook computer.

[0032] Referring to Figure 1, the electronic device can include a shell 1, a first heat generating component 21, a first heat dissipation component 3 and a first heat conducting component 4, the shell 1 can have a containing cavity 11 and a ventilation opening 12, the containing cavity 11 can be communicated with the outside through the ventilation opening 12; the first heat generating component 21 can be arranged in the containing cavity 11; the first heat dissipation component 3 can have a first air outlet 31 and a second air outlet 32, the first air outlet 31 can be arranged towards the ventilation opening 12, and the direction of the second air outlet 32 can be different from that of the ventilation opening 12; the first heat conducting component 4 can have a first part 41 and a second part 42 connected with each other, the first part 41 can be connected with the first heat generating component 21, and the airflow blown out by the second air outlet 32 can pass through the second part 42.

[0033] In the embodiment of the present application, the shell 1 can be a structure used by the electronic device to protect the internal circuit board and components. The containing cavity 11 can provide installation space for the first heat generating component 21, the first heat dissipation component 3 and the first heat conducting component 4. The ventilation opening 12 can be a ventilation opening through which cold air from the outside enters the containing cavity 11, and / or can also be a ventilation opening through which hot air in the containing cavity 11 is discharged, so as to reduce the temperature in the containing cavity 11.

[0034] In the embodiment of the present application, the first heat generating component 21 can refer to a component that generates heat in work due to current passing, energy conversion or other physical processes, therefore, the structure form of the first heat generating component 21 has multiple possibilities, for example, the first heat generating component 21 can be a central processing unit (CPU), can also be a graphics processing unit (GPU), can also be a solid state drive (SSD), etc., and the embodiment of the present application does not limit this.

[0035] In the embodiment of the present application, the structure design of the first heat dissipation component 3 has multiple possibilities, for example, the first heat conducting component 4 can be an axial flow fan, can also be a direct current fan, can also be a fan, etc., and the embodiment of the present application does not limit this.

[0036] In the embodiment of the present application, the angle between the direction of the second air outlet 32 and the direction of the ventilation opening 12 has multiple possibilities, for example, the included angle between the direction of the second air outlet 32 and the direction of the ventilation opening 12 can be 30°, can also be 60°, can also be 90°, etc., and the embodiment of the present application does not limit this.

[0037] In the embodiments of the present application, the size relationship between the first air outlet 31 and the second air outlet 32 has multiple possibilities. For example, the size of the first air outlet 31 can be greater than the size of the second air outlet 32, so that the air flow rate blown out by the first air outlet 31 is greater than the air flow rate blown out by the second air outlet 32. Alternatively, the size of the first air outlet 31 can be greater than the size of the second air outlet 32, so that the air flow rate blown out by the first air outlet 31 is equal to the air flow rate blown out by the second air outlet 32. Alternatively, the size of the first air outlet 31 can be less than the size of the second air outlet 32, so that the air flow rate blown out by the first air outlet 31 is less than the air flow rate blown out by the second air outlet 32. The embodiments of the present application do not limit this.

[0038] In the embodiments of the present application, the structure design of the first heat conduction component 4 has multiple possibilities. For example, the first heat conduction component 4 can be a heat pipe, a heat conduction bridge, or a heat conduction copper bar, and the like. The embodiments of the present application do not limit this.

[0039] In the technical solutions provided by the embodiments of the present application, the electronic device can include a shell 1, a first heat generating component 21, a first heat dissipation component 3, and a first heat conduction component 4. The shell 1 can have a containing cavity 11 and a vent 12. The first heat generating component 21, the first heat dissipation component 3, and the first heat conduction component 4 are arranged in the containing cavity 11, and the airflow in the containing cavity 11 can be exchanged with the outside through the vent 12. The first heat dissipation component 3 has a first air outlet 31 and a second air outlet 32. The first air outlet 31 is arranged towards the vent 12, and the orientation of the second air outlet 32 is different from the orientation of the vent 12. The first heat conduction component 4 has a first part 41 and a second part 42 connected to each other. The first part 41 is connected to the first heat generating component 21, and the airflow blown out by the second air outlet 32 passes through the second part 42. In this way, the heat generated by the first heat generating component 21 can be transmitted to the second part 42 through the first part 41, and the heat dissipation heat is blown out through the second air outlet 32.

[0040] Compared with the way that the heat generating component 2 dissipates heat through the shell 1 in the related art, the electronic device in the embodiments of the present application includes the first heat conduction component 4. The first heat conduction component 4 can conduct the heat generated by the first heat generating component 21 to the flow path of the airflow blown out by the second air outlet 32, so that the first heat generating component 21 can dissipate heat through the first heat dissipation component 3 without being arranged on the flow path of the airflow blown out by the second air outlet 32. On the one hand, the heat dissipation effect of the first heat generating component 21 is improved. On the other hand, the flexibility of the position design of the first heat generating component 21 is improved.

[0041] Reference Figure 1 , Figure 5 , Figure 6 , Figure 7 and Figure 8In the embodiment, the electronic device can further include a partition 13, which can be arranged in the accommodating cavity 11 to divide the accommodating cavity 11 into a wind cooling flow channel 111. The second air outlet 32 can be in communication with the wind cooling flow channel 111, and the second part 42 can be arranged in the wind cooling flow channel 111, so that the airflow blown out of the second air outlet 32 can pass through the second part 42 through the wind cooling flow channel 111. Here, the wind cooling flow channel 111 arranged in the accommodating cavity 11 can make the airflow flow along the designed path, so that the heat can be quickly taken away. In addition, the first heat generating component 21 is usually provided with a fan blade to generate airflow by rotating the fan blade, and the design of the wind cooling flow channel 111 can reduce the resistance of the airflow flow, thereby reducing the speed requirement of the fan blade. When the fan blade works at a low speed, the noise generated by the fan blade is significantly reduced, which helps to improve the user experience.

[0042] In the embodiment, the partition 13 can divide the accommodating cavity 11 into the wind cooling flow channel 111, and therefore the partition 13 can be made of a metal material such as aluminum, copper, etc. Alternatively, the partition 13 can also be made of a plastic material such as polycarbonate, polystyrene, etc. The embodiment does not limit the partition 13.

[0043] In the embodiment, the first heat generating component 21 can be arranged in various positions. For example, the first heat generating component 21 can be arranged outside the wind cooling flow channel 111. Alternatively, the first heat generating component 21 can be arranged in the wind cooling flow channel 111. Alternatively, a part of the first heat generating component 21 can be arranged outside the wind cooling flow channel 111, and another part of the first heat generating component 21 can be arranged in the wind cooling flow channel 111. The embodiment does not limit the arrangement of the first heat generating component 21.

[0044] In the embodiment, the second part 42 can be arranged close to the second air outlet 32, so that the airflow blown out of the second air outlet 32 can directly pass through the second part 42. Referring to Figure 1 In a possible embodiment, the electronic device can further include a flow guide component 6, which can have a flow guide air channel. The second air outlet 32 and the wind cooling flow channel 111 can be in communication through the flow guide air channel, and the second part 42 can be connected to the flow guide component 6 to transfer the heat generated by the first heat generating component 21 to the flow guide component 6. Here, the heat generated by the first heat generating component 21 is transferred to the flow guide component 6 through the first heat conducting component 4, and the second air outlet 32 can be in communication with the wind cooling flow channel 111 through the flow guide air channel, so that the airflow blown out of the second air outlet 32 can carry away the heat on the flow guide component 6 when passing through the flow guide air channel. The arrangement of the flow guide air channel can increase the contact area between the airflow and the flow guide component 6, which helps to improve the heat dissipation effect of the first heat generating component 21.

[0045] In the embodiments of the present application, the structure of the flow guide component 6 has multiple possibilities. For example, the flow guide component 6 can be a flow guide block, flow guide holes can be arranged on the flow guide block, and the flow guide air duct can be formed by the flow guide holes. Alternatively, the flow guide component 6 can be a heat dissipation fin, the heat dissipation fin can have heat dissipation fins arranged at intervals, and the flow guide air duct can be formed by the gaps between the heat dissipation fins.

[0046] In the embodiments of the present application, the positional relationship between the second part 42 and the flow guide component 6 has multiple possibilities. For example, in the extension direction of the flow guide air duct, the second part 42 can be arranged side by side with the flow guide component 6. In a possible embodiment of the present application, the extension direction of the flow guide air duct can be arranged at an angle to the thickness direction of the shell 1. Referring to Figure 3 and Figure 4 , the second part 42 can be arranged stacked with the flow guide component 6. In this way, the space occupied by the second part 42 and the flow guide component 6 in the planar area can be reduced, which helps to improve the space utilization of the accommodation cavity 11.

[0047] In the embodiments of the present application, the angle between the extension direction of the flow guide air duct and the thickness direction of the shell 1 has multiple possibilities. For example, the angle between the extension direction of the flow guide air duct and the thickness direction of the shell 1 can be 45°, 70°, 90°, etc. The embodiments of the present application do not limit this.

[0048] Referring to Figure 1 and Figure 2 , in the embodiments of the present application, in order to quickly transfer the heat of the first heat generating component 21 to the first part 41, the first part 41 can be connected with the first heat generating component 21 through the support copper sheet 45 and the heat conductive glue 44. In this way, the heat dissipation area can be increased, thereby improving the heat dissipation effect of the first heat generating component 21.

[0049] Referring to Figure 1 and Figure 2 , in the embodiments of the present application, the electronic device can further include a second heat conduction component 5. One side of the second heat conduction component 5 can be connected with the first heat generating component 21, and the other side of the second heat conduction component 5 can be connected with the side wall of the accommodation cavity 11, so as to transfer the heat generated by the first heat generating component 21 to the shell 1. In this way, the heat generated by the first heat generating component 21 can also be transmitted to the shell 1 through the second heat conduction component 5 and dissipated to the external environment through the shell 1, further improving the heat dissipation effect of the first heat generating component 21.

[0050] In the embodiments of the present application, the structure of the second heat conduction component 5 has multiple possibilities. For example, the second heat conduction component 5 can be a heat conductive glue pad, a liquid cooling plate, a heat pipe, etc. The embodiments of the present application do not limit this.

[0051] In the embodiments of the present application, the first portion 41 and the second heat conduction component 5 can be arranged at various positions, for example, the first portion 41 and the second heat conduction component 5 can be arranged at the same side of the first heat generating component 21. Referring to Figure 2 In a possible embodiment of the present application, the first portion 41 and the second heat conduction component 5 can be arranged at opposite sides of the first heat generating component 21 along the thickness direction of the shell 1. In this way, heat can be conducted from the two sides of the first heat generating component 21 to the first portion 41 and the second heat conduction component 5 respectively, thereby improving the heat dissipation efficiency.

[0052] In the embodiments of the present application, the first portion 41 and the second portion 42 can extend in various directions, for example, the first portion 41 and the second portion 42 can extend in the same direction or in opposite directions, which is not limited in the embodiments of the present application. Referring to Figure 1 In a possible embodiment of the present application, the first portion 41 can extend in a first direction, and the second portion 42 can extend in a second direction. An included angle between the first direction and the second direction can be not equal to zero. Here, the first portion 41 can be connected with the first heat generating component 21, and the second portion 42 can be connected with the flow guide component 6. The first portion 41 and the second portion 42 can be arranged at an angle not equal to zero, so that the first heat generating component 21 and the flow guide component 6 have more optional arrangement positions, thereby improving the flexibility of the electronic device design.

[0053] In the embodiments of the present application, the angle between the first portion 41 and the second portion 42 can be various, for example, the angle between the first portion 41 and the second portion 42 can be 30°, 60°, 90°, etc., which is not limited in the embodiments of the present application.

[0054] Referring to Figure 1In the embodiment, the electronic device can further include a second heat generating component 22 and a third heat conducting component 7. The third heat conducting component 7 can have a third part 71 and a fourth part 72 connected to each other. The third part 71 can be connected to the second heat generating component 22. The airflow blown out of the first air outlet 31 passes through the fourth part 72. The heat generating power of the second heat generating component 22 is greater than that of the first heat generating component 21. In this way, when the first heat generating component 21 and the second heat generating component 22 are cooled, the heat generated by the first heat generating component 21 can be transmitted to the second air outlet 32 through the first heat conducting component 4, and the heat generated by the second heat generating component 22 can be conducted to the first air outlet 31 through the second heat conducting component 5, so that the first heat dissipation component 3 can cool the first heat generating component 21 and the second heat generating component 22 at the same time, and the heat dissipation efficiency of the first heat dissipation component 3 is improved. The heat generating power of the second heat generating component 22 is greater than that of the first heat generating component 21. Since the first air outlet 31 is arranged towards the air vent 12, the airflow at the first air outlet 31 has better flowability than that at the second air outlet 32. Therefore, the heat generated by the second heat generating component 22 conducted to the first air outlet 31 can fully utilize the heat dissipation performance of the first heat dissipation component 3, thereby further improving the heat dissipation effect of the second heat generating component 22.

[0055] In the embodiment, the type of the second heat generating component 22 can be the same as or different from that of the first heat generating component 21. For example, the second heat generating component 22 can be a central processing unit, a graphics processing unit, a solid state disk, or the like. The embodiment is not limited in this regard.

[0056] In the embodiment, the second heat generating component 22 and the first heat generating component 21 can have various possible positional relationships. For example, the first heat generating component 21 can be arranged outside the air cooling flow channel 111, and the second heat generating component 22 can be arranged inside the air cooling flow channel 111. Alternatively, the first heat generating component 21 can be arranged inside the air cooling flow channel 111, and the second heat generating component 22 can be arranged outside the air cooling flow channel 111. Alternatively, the first heat generating component 21 and the second heat generating component 22 can both be arranged inside the air cooling flow channel 111. The embodiment is not limited in this regard.

[0057] In the embodiment, the third heat conducting component 7 and the first heat conducting component 4 can have the same type or different types. For example, the third heat conducting component 7 can be a heat conducting adhesive pad, a liquid cooling plate, a heat pipe, or the like. The embodiment is not limited in this regard. In a possible embodiment, the third heat conducting component 7 and the first heat conducting component 4 can both be heat pipes. The diameter of the third heat conducting component 7 can be greater than that of the first heat conducting component 4, so that the heat conducting capacity of the third heat conducting component 7 is greater than that of the first heat conducting component 4.

[0058] Reference is made to Figure 1 , Figure 5、 Figure 6 、 Figure 7 、 Figure 8 In the embodiment, the electronic device can further include a second heat dissipation component 8. The second heat dissipation component 8 can have a third air outlet 81. The direction of the third air outlet 81 can be different from the direction of the air vent 12. The airflow blown by the third air outlet 81 can pass through the second heat generating component 22. Alternatively, the airflow blown by the third air outlet 81 can pass through the second heat generating component 22 and the second part 42. In this way, in the case that the airflow blown by the third air outlet 81 passes through the second heat generating component 22, the heat dissipation effect on the second heat generating component 22 can be further improved. In the case that the airflow blown by the third air outlet 81 passes through the second heat generating component 22 and the second part 42, the heat dissipation effect on the first heat generating component 21 and the second heat generating component 22 can be simultaneously improved.

[0059] In the embodiment, in the case that the airflow blown by the third air outlet 81 passes through the second heat generating component 22 and the second part 42, the positional relationship between the second heat generating component 22 and the second part 42 can have multiple possibilities. For example, along the direction of the third air outlet 81, the second heat generating component 22 can be arranged side by side with the second part 42. Alternatively, along the thickness direction of the shell 1, the second heat generating component 22 can be arranged in a stacked manner with the second part 42. The embodiment is not limited in this regard.

[0060] In the embodiment, the angle between the direction of the third air outlet 81 and the direction of the air vent 12 can have multiple possibilities. For example, the included angle between the direction of the third air outlet 81 and the direction of the air vent 12 can be 30°, 60°, 90°, etc. The embodiment is not limited in this regard.

[0061] Referring to Figure 1 、 Figure 5 、 Figure 6 、 Figure 7 and Figure 8 In the embodiment, the second heat dissipation component 8 can further have a fourth air outlet 82. The fourth air outlet 82 is arranged towards the air vent 12. The third heat conduction component 7 can further have an eighth part 73 connected with the third part 71. The airflow blown by the fourth air outlet 82 passes through the eighth part 73. In this way, the heat generated by the second heat generating component 22 can be further conducted to the eighth part 73 and dissipated to the outside through the airflow blown by the fourth air outlet 82. The heat dissipation effect on the second heat generating component 22 is further improved.

[0062] Referring to Figure 5 and Figure 6 In the embodiment, the electronic device can further include a third heat generating component 23. The first heat conduction component 4 can further have a seventh part 43 connected with the second part 42. The seventh part 43 can be connected with the third heat generating component 23. Alternatively,Figure 7 The electronic device can further include a fourth heat-generating component 24 and a fourth heat-conducting component 9, the fourth heat-conducting component 9 can have a fifth part 91 and a sixth part 92 connected to each other, the fifth part 91 can be connected to the third heat-generating component 23, and the airflow blown out of the second air outlet 32 can pass through the sixth part 92.

[0063] In the embodiments of the present application, when the electronic device includes the third heat-generating component 23, the heat generated by the third heat-generating component 23 can be transferred to the second part 42 by the seventh part 43 and dissipated by the airflow blown out of the second air outlet 32. In this way, the first heat-generating component 21 and the third heat-generating component 23 both transfer heat through the first heat-conducting component 4, which can reduce the number of heat-conducting components and thus reduce the design and manufacturing costs.

[0064] In the embodiments of the present application, the relationship between the seventh part 43 and the second part 42 has multiple possibilities, for example, referring to Figure 5 The seventh part 43 and the second part 42 can be connected in series; or referring to Figure 6 The seventh part 43 and the second part 42 can be connected in parallel, which is not limited in the embodiments of the present application.

[0065] In the embodiments of the present application, when the electronic device includes the fourth heat-generating component 24 and the fourth heat-conducting component 9, the heat generated by the fourth heat-generating component 24 can be transferred to the sixth part 92 by the fifth part 91 and dissipated by the airflow blown out of the second air outlet 32, further improving the utilization rate of the first heat-dissipating component 3.

[0066] Referring to Figure 8 In the embodiments of the present application, the fourth heat-conducting component 9 can further include a ninth part 93 connected to the fifth part 91, and the airflow blown out of the fourth air outlet 82 passes through the ninth part 93. In this way, the heat generated by the fourth heat-generating component 24 can be transferred to the ninth part 93 by the fifth part 91 and dissipated by the airflow blown out of the second air outlet 32, further improving the heat dissipation effect of the fourth heat-generating component 24.

[0067] In the embodiments of the present application, the types of the third heat-generating component 23 and the fourth heat-generating component 24 can be the same or different, for example, the third heat-generating component 23 can be a central processing unit, and the third heat-generating component 23 can be a graphics processing unit; or the third heat-generating component 23 and the fourth heat-generating component 24 can both be solid state disks, which is not limited in the embodiments of the present application.

[0068] In the embodiments of the present application, the third heat-conducting component 7 and the fourth heat-conducting component 9 can be of the same type or different types. For example, the third heat-conducting component 7 can be a heat pipe, and the fourth heat-conducting component 9 can be a heat-conducting copper bar. Alternatively, the third heat-conducting component 7 and the fourth heat-conducting component 9 can both be heat pipes. The embodiments of the present application do not limit this.

[0069] The serial numbers of the above embodiments of the present application are only for description, and do not represent the advantages and disadvantages of the embodiments. The above is only the preferred embodiments of the present application, and does not limit the patent scope of the present application. Any equivalent structure or equivalent flow conversion, or direct or indirect application in other related technical fields, which is based on the content of the specification and drawings of the present application, is also included in the patent protection scope of the present application.

Claims

1. An electronic device, comprising: The electronic device comprises: a housing having a receiving cavity and a vent, the receiving cavity being in communication with the outside through the vent; a first heat generating component arranged in the receiving cavity; a first heat dissipating component having a first air outlet and a second air outlet, the first air outlet being arranged towards the vent, and the second air outlet being arranged towards a direction different from the vent; a first heat conducting component having a first part and a second part connected to each other, the first part being connected to the first heat generating component, and the second air outlet blowing air flow through the second part.

2. The electronic device of claim 1, wherein, The electronic device further comprises a partition arranged in the receiving cavity to divide the receiving cavity into a cooling flow channel, the second air outlet being in communication with the cooling flow channel, and the second part being arranged in the cooling flow channel so that the air flow blown by the second air outlet passes through the second part through the cooling flow channel.

3. The electronic device of claim 2, wherein, The electronic device further comprises a flow guiding component having a flow guiding air channel, the second air outlet being in communication with the cooling flow channel through the flow guiding air channel, and the second part being connected to the flow guiding component to transfer heat generated by the first heat generating component to the flow guiding component.

4. The electronic device of claim 3, wherein, The extension direction of the flow guiding air channel is arranged at an angle with respect to the thickness direction of the housing, and along the thickness direction of the housing, the second part and the flow guiding component are arranged in a stacked manner.

5. The electronic device of claim 1, wherein, The electronic device further comprises a second heat conducting component, one side of the second heat conducting component being connected to the first heat generating component, and the other side of the second heat conducting component being connected to the side wall of the receiving cavity to transfer heat generated by the first heat generating component to the housing.

6. The electronic device of claim 5, wherein, Along the thickness direction of the housing, the first part and the second heat conducting component are respectively located on opposite sides of the first heat generating component.

7. The electronic device of claim 1, wherein, The first part extends along a first direction, and the second part extends along a second direction, and an included angle between the first direction and the second direction is not equal to zero.

8. The electronic device of any of claims 1-7, wherein, The electronic device further comprises a second heat generating component and a third heat conducting component, the third heat conducting component having a third part and a fourth part connected to each other, the third part being connected to the second heat generating component, and the air flow blown by the first air outlet passing through the fourth part, and the heat generating power of the second heat generating component being greater than the heat generating power of the first heat generating component.

9. The electronic device of claim 8, wherein, The electronic device further comprises a second heat dissipating component having a third air outlet arranged towards a direction different from the vent, and the air flow blown by the third air outlet passing through the second heat generating component, or the air flow blown by the third air outlet passing through the second heat generating component and the second part.

10. The electronic device of any of claims 1-7, wherein, The electronic device further comprises a third heat generating component, the first heat conducting component further has a third part connected with the second part, and the third part is connected with the third heat generating component; and / or the electronic device further comprises a fourth heat generating component and a fourth heat conducting component, the fourth heat conducting component has a fifth part and a sixth part connected with each other, the fifth part is connected with the third heat generating component, and the airflow blown out by the second air outlet passes through the sixth part.

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