Electronic device

Abstract

The utility model discloses electronic equipment, and relates to the technical field of electronic equipment. The electronic equipment comprises a shell, a mainboard and a heat dissipation piece, wherein an air inlet and an air outlet which are spaced from each other are formed in the first end of the shell; the mainboard is arranged in the shell, and a plurality of heat sources are distributed on the mainboard at intervals; the heat dissipation piece and the main board are arranged in a stacked mode, and the side, facing the main board, of the heat dissipation piece is attached to the heat sources so as to absorb heat of the heat sources; wherein a flow guide air channel is formed between the heat dissipation piece and the mainboard, and the flow guide air channel can guide inlet air of the air inlet to the second end of the shell in the first direction and wind the inlet air back to the first end of the shell, and air is discharged from the air outlet; the first direction is the direction from the first end of the shell to the second end.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of electronic equipment, in particular to an electronic equipment. BACKGROUND

[0002] With the development of science and technology, the function of electronic equipment is gradually powerful, and the power is also greatly improved.

[0003] The current system cooling corresponds to the main heat source to carry out cooling through the cooperation design of the radiator and the fan, and sets the heat pipe or the fin for other secondary heat sources to carry out cooling.

[0004] However, the design of the heat pipe or the fin corresponding to the secondary heat source will occupy a large space and the design and manufacturing cost will also increase. Content of the utility model

[0005] The present application provides an electronic equipment, which comprises

[0006] a shell, a first end of the shell is provided with an air inlet and an air outlet which are spaced from each other;

[0007] a mainboard, the mainboard is placed in the shell, and a plurality of heat sources are distributed on the mainboard in a spaced manner;

[0008] a heat dissipation piece, the heat dissipation piece is arranged in a stack with the mainboard, and one side of the heat dissipation piece facing the mainboard is attached to the plurality of heat sources to absorb the heat of the plurality of heat sources;

[0009] Wherein, a flow guide air duct is formed between the heat dissipation piece and the mainboard, the flow guide air duct can guide the air inlet shell of the air inlet to flow to the second end of the body along a first direction and return to the first end of the shell by the air outlet; the first direction is the direction from the first end of the shell to the second end.

[0010] In some modified embodiments of the present application, the foregoing electronic equipment further comprises a blowing part;

[0011] The blowing part is arranged in the shell corresponding to the air inlet, and the air outlet of the blowing part faces the second end of the shell.

[0012] The mainboard is arranged corresponding to the second end of the shell.

[0013] In some modified embodiments of the present application, the foregoing electronic equipment comprises a first barrier wall;

[0014] The first barrier wall is arranged on the side of the blowing part facing the air outlet, the first barrier wall extends along the first direction, and the two sides of the first barrier wall along the thickness direction of the electronic equipment respectively attach to the side surface of the heat dissipation piece facing the mainboard and the inner wall of the shell.

[0015] In some modified embodiments of the present application, the aforementioned electronic device comprises a second baffle wall;

[0016] The second baffle wall is arranged in the shell corresponding to the first end of the shell, and the second baffle wall extends from the inner wall of the first end of the shell to the second end of the shell to divide the air inlet and the air outlet to form an air inlet area and an air outlet area.

[0017] In some modified embodiments of the present application, the aforementioned electronic device, the first baffle wall comprises a first sub-baffle wall and a second sub-baffle wall;

[0018] The first sub-baffle wall is arranged on the air blowing part, and the first sub-baffle wall is attached to the air blowing part and the inner wall of the shell on both sides of the thickness direction of the electronic device, or the first sub-baffle wall is attached to the air blowing part and the surface of the heat dissipation member on the side facing the mainboard on both sides of the thickness direction of the electronic device;

[0019] The first sub-baffle wall and the second sub-baffle wall are arranged in sequence along the first direction, and the second sub-baffle wall is attached to the inner wall of the shell and the surface of the heat dissipation member on the side facing the mainboard on both sides of the thickness direction of the electronic device.

[0020] In some modified embodiments of the present application, the aforementioned electronic device, the side of the heat dissipation member facing the mainboard has a plurality of first protrusions, and the plurality of first protrusions correspond one-to-one to the plurality of heat sources to form the flow guide air duct between the heat dissipation member between the plurality of first protrusions and the mainboard.

[0021] In some modified embodiments of the present application, the aforementioned electronic device, at least part of the heat dissipation member has a hollow cavity, and the cavity is filled with a heat-conducting fluid.

[0022] In some modified embodiments of the present application, the aforementioned electronic device, a plurality of second protrusions are arranged on the heat dissipation member, and the second protrusions are hollow inside to form the cavity;

[0023] The plurality of second protrusions are spaced apart and communicate with each other.

[0024] In some modified embodiments of the present application, the aforementioned electronic device, the heat dissipation member comprises a first plate body and a second plate body facing away from each other;

[0025] The first plate body faces the mainboard;

[0026] The second plate body comprises

[0027] A first area, the first area protrudes in a direction away from the first plate body to form the cavity.

[0028] The second region is placed within the first region and is attached to the first plate.

[0029] In some modified embodiments of this application, the aforementioned electronic device has a flat surface on the side of the first board facing the motherboard. Attached Figure Description

[0030] The above and other objects, features, and advantages of exemplary embodiments of this application will become readily understood by reading the following detailed description with reference to the accompanying drawings. In the drawings, several embodiments of this application are illustrated by way of example and not limitation, with the same or corresponding reference numerals denoteing the same or corresponding parts, wherein:

[0031] Figure 1 A schematic diagram of the structure of the electronic device provided in this embodiment is shown.

[0032] Figure 2 A schematic diagram of a second structure of the electronic device provided in this embodiment is shown.

[0033] Figure 3 A schematic diagram of the internal structure of the electronic device provided in this embodiment is shown.

[0034] Figure 4 The schematic diagram illustrates the other structural components of the electronic device provided in this embodiment, excluding the heat sink.

[0035] Figure 5 schematically shown Figure 3 A schematic cross-sectional view of the electronic device shown;

[0036] Figure 6 A schematic diagram of a second internal structure of the electronic device provided in this embodiment is shown.

[0037] Figure 7 A schematic diagram of the structure of the heat sink in the electronic device provided in this embodiment is shown.

[0038] Reference numerals: 1. Housing; 11. Air inlet; 12. Air outlet; 2. Mainboard; 3. Heat sink; 31. Second protrusion; 32. First board; 33. Second board; 4. Heat source; 41. CPU; 42. GPU; 43. I / O chip; 44. Image scaling processor; 45. WIFI antenna chip; 46. Memory; 5. Air blower; 6. First baffle; 61. First sub-baffle; 62. Second sub-baffle; 7. Second baffle; 8. First direction a. Detailed Implementation

[0039] Exemplary embodiments of the present disclosure will be described in greater detail below with reference to the accompanying drawings. While exemplary embodiments of the present disclosure are shown in the drawings, it is understood that the present disclosure can be embodied in various forms without being limited by the embodiments set forth herein. Rather, these embodiments are provided so that the present disclosure will be thoroughly and completely understood, and will fully convey the scope of the present disclosure to those skilled in the art.

[0040] It should be noted that, unless otherwise specified, the technical terms or scientific terms used in the present application should be understood as the general meaning understood by those skilled in the art to which the present application belongs.

[0041] The technical solutions of the embodiments of the present application are to solve the above technical problems, and the general idea is as follows:

[0042] Embodiment 1

[0043] Reference is made to the accompanying drawings Figure 1 and Figure 3 The electronic device provided by the embodiments of the present application includes a shell 1, a mainboard 2 and a heat dissipation piece 3, the first end of the shell 1 is provided with an air inlet 11 and an air outlet 12 which are spaced apart from each other; the mainboard 2 is placed in the shell 1, and a plurality of heat sources 4 are distributed on the mainboard 2; the heat dissipation piece 3 is stacked with the mainboard 2, and one side of the heat dissipation piece 3 facing the mainboard 2 is attached to the plurality of heat sources 4 to absorb the heat of the plurality of heat sources 4;

[0044] Among them, the heat dissipation piece 3 and the mainboard 2 form a flow guide air duct, the flow guide air duct can guide the air inlet of the air inlet 11 to the second end of the shell 1 along the first direction a and return to the first end of the shell 1 by the air outlet 12; the first direction a is the direction from the first end to the second end of the shell 1.

[0045] It can be understood that, in order to solve the problem that the setting of the heat dissipation structure corresponding to different heat sources in the electronic device not only occupies a large space but also causes the cost to rise, in the electronic device provided by the embodiments of the present application, the heat dissipation piece 3 is provided to realize the synchronous heat absorption and heat conduction of the plurality of heat sources 4, and the flow guide air duct extending from the first end to the second end of the shell 1 and returning to the first end is provided to comprehensively and efficiently dissipate heat from the heat dissipation piece 3, thereby improving the overall heat dissipation efficiency of the electronic device, and the single heat dissipation piece 3 avoids the problem of occupying too much space and generating high cost caused by too many different heat dissipation devices.

[0046] Among them, the electronic device provided by the embodiments of the present application can be but is not limited to a mobile phone, a tablet computer, a notebook computer, an all-in-one system terminal, a gamepad and the like, for example Figure 2 The electronic device provided by the embodiments of the present application is a system terminal device 9 in the all-in-one machine device cooperating with the display screen 8.

[0047] The housing 1 is a rigid hollow structure, which can be, but is not limited to, a combination of an opening slot and a cover plate. It provides space for the motherboard 2, heat sink 3, heat source 4, and other components. The housing 1 can be made of plastic, polymer, metal, etc., and its shape can be designed and adjusted according to the overall appearance design of the electronic device. Figure 1 The dimensions of the racetrack-shaped housing 1 shown can be adjusted according to the actual product requirements of the electronic device, which will not be elaborated upon here. The first and second ends of the housing 1 can be either end of any straight line on the housing 1, for example: Figure 1 At both ends of the length direction shown, air inlets 11 and air outlets 12 are spaced apart on the first end. The air inlets 11 and air outlets 12 can be arranged opposite each other along a direction perpendicular to the first direction a, or they can be arranged opposite each other along an inclined direction having a specified angle with the first direction a. They can also be arranged according to the position of the internal blowing section 5 or the required air volume, for example... Figure 1 As shown, an air inlet 11 is provided on more than half of the continuous portion at the first end, and an air outlet 12 is provided on the remaining portion, which increases the air intake volume and improves the directionality of the air outlet. Of course, it can be understood that after the electronic device is assembled, any gaps on the housing 1 can become air inlets 11. In this embodiment, the air inlet 11 and the air outlet 12 can be separated by the structure of the housing 1 itself, or they can be separated by an additional barrier structure, which is not limited here. The air inlet 11 and the air outlet 12 can be a single opening or each include multiple openings. The specific shape and size of the openings are not limited here and can be designed and adjusted according to actual needs.

[0048] In this embodiment, the motherboard 2 (Mobo, Motherboard, Mainboard) is a circuit board. The shape and size of the motherboard 2 are not limited here and can be designed and adjusted according to the needs of the housing 1 or the electronic device product. The motherboard 2 serves as the carrier for the heat source 4 and other electronic components, and as the platform for connecting circuits. It can house a CPU, GPU, I / O chip, expansion slots, panel control switch interfaces, indicator light connectors, DC power supply connectors, etc. Therefore, it is easy to understand that the heat source 4 described in this embodiment can be, but is not limited to, a CPU 41, GPU 42, I / O chip 43, image scaling processor 44 (scaler DB), WIFI antenna chip 45, memory 46 (DDR), battery, etc. It is also understood that the electronic device provided in this embodiment may include a display screen (not shown in the figure). The display screen can be located on the side of the heat sink 3 away from the motherboard 2. This configuration is easily understood by those skilled in the art and will not be elaborated upon here.

[0049] The heat dissipation piece 3 is a rigid structure, which can absorb the heat of the heat source 4 by being attached to the heat source 4 and dissipate the heat by itself. The heat dissipation piece 3 can be a plate-shaped structure with a continuous single-side surface, thereby ensuring that a plurality of heat sources 4 are attached at the same time while reducing the precision requirement for attaching the heat sources 4. The heat dissipation piece 3 can also be in a discontinuous form on the single-side surface, for example, the positions not attached to the heat sources 4 can be discontinuously arranged. The heat dissipation piece 3 can be a solid heat-conducting structure, for example, graphite, copper plate, etc., which realizes efficient heat absorption and dissipation by using its high thermal conductivity and large surface area. The heat dissipation piece 3 can also be a hollow heat-conducting structure, for example, filled with a heat-conducting fluid inside to form a heat pipe or a vapor chamber structure, which absorbs and dissipates heat from the heat source 4 by the circulation, evaporation and liquefaction of the heat-conducting fluid inside. In the embodiment, the heat dissipation piece 3 can be attached to part of the heat sources 4 or all of the heat sources 4, which can be designed and adjusted according to the heat dissipation requirement of the electronic device. It can be understood that the thicknesses of the heat sources 4 are different, and the side of the heat dissipation piece 3 facing the heat sources 4 can be arranged in different heights to meet the attachment requirement of different heat sources 4. The side of the heat dissipation piece 3 facing the heat sources 4 can also be arranged as a flat surface, and the height difference between the heat sources 4 and the heat dissipation piece 3 can be filled by a heat-conducting element, for example, graphite, heat-conducting silicone, heat-conducting cotton, etc.

[0050] Due to the presence of the heat sources 4, there is a gap between the heat dissipation piece 3 and the main board 2, and the flow guide air duct can be formed by attaching the heat dissipation piece 3 to the heat sources 4 or by arranging a guide structure in front of the heat dissipation piece 3 and the main board 2. The flow guide air duct can guide the air flow from the first end of the shell 1 to the second end of the shell 1 and make it return to the air outlet 12 at the first end to be discharged, so that the air flow flows from the first end to the second end of the heat dissipation piece 3 and returns to the first end, thereby dissipating heat from the entire surface of the heat dissipation piece 3 and improving the heat dissipation efficiency.

[0051] According to the above, the electronic device provided by the application can realize efficient and synchronous heat dissipation for a plurality of heat sources by arranging a heat dissipation piece in the shell and forming a flow guide air duct for efficiently covering the main board, so that the heat of the heat sources can be transferred to the heat dissipation piece and efficiently and comprehensively dissipated through the flow guide air duct, thereby solving the problem that the heat dissipation structures corresponding to different heat sources in the electronic device not only occupy a large space but also cause an increase in cost.

[0052] In this document, the term "and / or" merely describes an associated relationship with the associated objects, which means that there can be three relationships, for example, A and / or B, which can be specifically understood as: A and B can exist at the same time, A can exist alone, B can exist alone, and any one of the above three cases can exist.

[0053] Further, reference is made to the accompanying drawings Figure 4The electronic device provided in this embodiment further includes a blower 5 in a specific implementation; the blower 5 is disposed inside the housing 1 corresponding to the air inlet 11, and the air outlet of the blower 5 faces the second end of the housing 1; the motherboard 2 is disposed corresponding to the second end of the housing 1.

[0054] It is understandable that, in order to improve the heat dissipation efficiency of electronic devices, this embodiment includes a blower 5 to improve air intake and exhaust efficiency. In this embodiment, the blower 5 is located inside the first end of the housing 1, corresponding to the air inlet 11 and air outlet 12. Correspondingly, the motherboard 2 is located at the second end of the housing 1, either adjacent to or spaced apart from the blower 5. The air inlet of the blower 5 corresponds to the air inlet 11 of the housing 1, and the air outlet of the blower 5 faces the second end of the housing 1, i.e., towards the motherboard 2, thus directly and quickly delivering airflow to the motherboard 2 for heat dissipation. The air outlet 12 on the housing 1 exhausts air outwards under the pressure difference created by the increase in internal temperature and pressure with the outside of the housing 1, thereby improving heat dissipation efficiency. In this embodiment, the blower 5 can be, but is not limited to, a fan or blower. For example, in this embodiment, it can be... Figure 4 The centrifugal fan shown has its thickness direction parallel to that of the electronic device. Both the inlet and outlet of the centrifugal fan are located on the side of the fan, thus forming the inlet of the blowing section 5 on the side facing the inlet 11 and the outlet of the blowing section 5 on the side facing the second end of the housing 1, thereby increasing the airflow and improving heat dissipation efficiency. Accordingly, the blowing section 5 has a certain thickness. In this embodiment, the heat sink 3 can be... Figure 1 As shown, it simultaneously covers both the motherboard 2 and the blower section 5, and can also be used as... Figure 6 The diagram shows that only the motherboard 2 is covered. When the heat sink 3 only covers the motherboard 2, the size of the heat sink 3 is relatively small and the manufacturing cost is low. When the heat sink 3 covers both the motherboard 2 and the air blower 5, the size and heat dissipation area of ​​the heat sink 3 are relatively large. The air inlet at the shaft of the axial fan can also perform a certain amount of heat exchange on the heat sink 3, improving the heat dissipation efficiency. In this configuration, the size and heat dissipation area of ​​the heat sink 3 are relatively large, and there is no need to avoid the fitting design at the joint of the air blower 5, reducing the difficulty of the manufacturing process.

[0055] Further, see attached document. Figure 4 and attached Figure 5 The electronic device provided in this embodiment includes a first baffle 6 in a specific implementation. The first baffle 6 is disposed on the side of the blowing part 5 facing the air outlet 12. The first baffle 6 extends along the first direction a. The two sides of the first baffle 6 along the thickness direction of the electronic device are respectively attached to the side surface of the heat sink 3 facing the motherboard 2 and the inner wall of the housing 1.

[0056] It can be understood that, in order to realize the formation of the guide wind channel, the first barrier wall 6 is arranged in the embodiment to form the guide wind channel by spacing, and the first barrier wall 6 is arranged on the side of the heat dissipation member 3 facing the mainboard 2, and cooperates with the inner wall of the mainboard 2 or the heat dissipation member 3 or the shell 1 to form the guide wind channel. The first barrier wall 6 is arranged on the side of the blowing part 5 facing the air outlet 12 of the second end of the shell 1, so as to space the blowing part 5 facing the air outlet of the second end of the shell 1 and the air outlet 12 of the shell 1 on both sides of the first barrier wall 6. The first barrier wall 6 extends to the second end of the shell 1 to lengthen the length of the guide wind channel in the first direction a, so that the air flow passes through the mainboard 2 as much as possible to the one end of the second end of the shell 2 and then returns to the first end of the shell 1, thereby improving the heat dissipation efficiency. In the embodiment, the first barrier wall 6 is made of rigid or elastic material, which can be but is not limited to plastic material, rubber material, foam structure and the like. The first barrier wall 6 can be a long strip structure, which can be a straight line structure extending along the first direction a, or a non-straight line structure extending along the first direction a, such as a wave shape, an arc shape and the like. The distance between the one end of the first barrier wall 6 facing the second end of the shell 1 and the inner wall of the second end of the shell 1 can be designed and adjusted according to actual needs, as long as the guide speed and the heat dissipation efficiency are satisfied.

[0057] Correspondingly, since the arrangement of the blowing part 5 will limit the continuity of the first barrier wall 6 on the positions corresponding to the blowing part 5 and the positions corresponding to the mainboard 2, the first barrier wall 6 can be arranged in the embodiment in a split form including a first sub-barrier wall 61 and a second sub-barrier wall 62. The first sub-barrier wall 61 and the second sub-barrier wall 62 are arranged in sequence along the first direction a. The first sub-barrier wall 61 is arranged on the blowing part 5, specifically on the side of the blowing part 5 facing the display screen in the thickness direction of the electronic device, to prevent the air flow returning to the first end of the shell 1 from the second end of the shell 1 from affecting the air inlet state of the air inlet side of the blowing part 5 at the position corresponding to the first sub-barrier wall 61. The second sub-barrier wall 62 is arranged corresponding to the region where the mainboard 2 is located, and then the two sides of the second sub-barrier wall 62 in the thickness direction of the electronic device are respectively attached to the inner wall of the shell 1 and the surface of the heat dissipation member 3 facing the mainboard 2. Correspondingly, the attachment objects of the two sides of the first sub-barrier wall 61 in the thickness direction in the embodiment can correspond to the two kinds of arrangement modes of the heat dissipation member 3 described above, at least including the following two kinds:

[0058] The first kind: the two sides of the first sub-barrier wall 61 in the thickness direction of the electronic device are respectively attached to the blowing part 5 and the inner wall of the shell 1. This arrangement mode corresponds to the case that the heat dissipation member 3 does not cover the blowing part 5. In this arrangement mode, the first sub-barrier wall 61 can make up for the distance between the blowing part 5 and the inner wall of the shell corresponding to the display screen or the side of the shell, to prevent the high-temperature air flow to be output on the side of the air outlet 12 from flowing back to the blowing part 5 or the air inlet 11 side beyond the first sub-barrier wall 61.

[0059] The second kind: the first sub-wall 61 is attached to the surface of the side of the heat dissipation member 3 facing the mainboard 2 and the side of the air blowing part 5 along the thickness direction of the electronic device; in this arrangement, the heat dissipation member 3 covers the air blowing part 5, and in this arrangement, the first sub-wall 61 needs to make up the distance between the air blowing part 5 and the heat dissipation member 3 to prevent the high-temperature air flow on the side of the air outlet 12 from flowing back to the side of the air inlet 11 or the air blowing part 5.

[0060] It can be understood that the attachment of the first wall 6 to the shell, the heat dissipation member 3, and the air blowing part 5 can be, but is not limited to, adhesive attachment, interference attachment, and the like.

[0061] Further, with reference to the accompanying drawings, Figure 4 The electronic device provided in the embodiment further includes a second wall 7, which is arranged in the shell 1 corresponding to the first end of the shell 1 and extends from the inner wall of the first end of the shell 1 to the second end of the shell 1 to separate the air inlet 11 and the air outlet 12 to form an air inlet area and an air outlet area.

[0062] It can be understood that in order to separate the air inlet 11 and the air outlet 12, the second wall 7 is arranged in the embodiment, the second wall 7 is arranged on the side of the air blowing part 5 facing the first end of the shell 1, the thickness of the second wall 7 can be equal to the internal thickness of the electronic device, one end of the second wall 7 facing the second end of the shell 1 can be lapped on the air blowing part 5 to separate the space between the air blowing part 5 and the first end of the shell 1 into an air inlet area and an air outlet area on both sides of the second wall 7, correspondingly, the air inlet 11 is arranged in the air inlet area, and the air outlet 12 is arranged in the air outlet area. The second wall 7 is made of rigid or elastic material, which can be, but is not limited to, plastic material, rubber material, foam structure, and the like. The second wall 7 can be a long strip structure, which can be a straight line structure extending along the first direction a or a non-straight line structure extending along the first direction a, such as a wave shape, an arc shape, and the like. In the embodiment, the second wall 7 can be connected to the first wall 6, staggered, or spaced apart.

[0063] Further, the electronic device provided in the embodiment has a plurality of first protrusions on the side of the heat dissipation member 3 facing the mainboard 2, and the plurality of first protrusions correspond to the plurality of heat sources 4 in one-to-one correspondence to attach to the heat dissipation member 3 to form the flow guide air duct between the heat dissipation member 3 and the mainboard 2.

[0064] It can be understood that, in order to improve the size of the flow guide air duct, increase the air volume, a plurality of first protruding portions 31 are arranged on the side of the heat dissipation member 3 facing the mainboard 2 in the embodiment for abutting and fitting the heat source 4. The side opposite to the side where the first protruding portions are arranged can be a flat surface or a non-flat surface. The first protruding portions 31 can be integrally formed with the heat dissipation member 3 or assembled into an integral whole by subsequent welding, bonding by heat-conducting adhesive or other connection methods. The shape of the first protruding portions 31 can be designed and adjusted according to actual needs, such as columnar, spherical, conical and the like. The abutting and fitting of the first protruding portions 31 with the heat source 4 can be with all surfaces of the side of the heat source 4 facing the heat dissipation member 3 or with part of the surfaces. The abutting and fitting can be designed and adjusted according to the need for heat dissipation and the design cost. The size of the first protruding portions 31 in the thickness direction of the heat dissipation member 3 can be designed and adjusted to be different according to the distance between the heat source 4 and the heat dissipation member 3, or can be designed to be of a uniform size, and then the height is filled with the heat-conducting element as described above. The selection of the heat-conducting element is described above and will not be described in detail here. The arrangement of the first protruding portions 31 can increase the space between the heat dissipation member 3 and the mainboard 2, so that the depth of the flow guide air duct is increased, and the outer surface of the first protruding portions 31 can be heated and dissipated when the air flow moves in the flow guide air duct, further improving the heat dissipation efficiency of the electronic device.

[0065] Further, the electronic device provided by the embodiment has a hollow cavity in at least part of the heat dissipation member 3, and the cavity is filled with a heat-conducting fluid.

[0066] It can be understood that, in order to improve the heat dissipation efficiency, the heat dissipation member 3 can be arranged in a hollow form filled with a heat-conducting fluid in the embodiment, so that the heat dissipation member 3 can absorb heat at the position in contact with the heat source 4 to evaporate the heat-conducting fluid, and the heat dissipation member 3 can be cooled by the air flow in the flow guide air duct at the position not in contact with the heat source 4 to liquefy the heat-conducting fluid and flow back, so as to circulate and greatly improve the heat dissipation efficiency in cooperation with the flow guide air duct. The heat dissipation member 3 can be made of, but is not limited to, a heat-conducting metal, such as copper, aluminum and the like. The heat-conducting fluid can be, but is not limited to, tetrafluoroethane, water and the like.

[0067] Further, with reference to the accompanying drawings, Figure 7 In the specific implementation, the heat dissipation member 3 is provided with a plurality of second protruding portions 31, the second protruding portions 31 are hollow to form the cavities, and the plurality of second protruding portions 31 are spaced apart and communicate with each other.

[0068] It can be understood that, in order to improve the pressure capacity of the heat dissipation piece, a plurality of second protrusions 31 can be arranged on the heat dissipation piece 3 in the embodiment, the second protrusions 31 are hollow inside, and the deformation such as bulging of the structure which is completely hollow inside is prevented from affecting the overall equipment form or structure during the pressure process. In the embodiment, the second protrusions 31 are away from the mainboard 2, and thus the heat dissipation area of the heat dissipation piece 3 is increased. Of course, the first protrusions and the second protrusions 31 can be arranged at the same time in the embodiment. The shape of the second protrusions 31 can be designed and adjusted according to actual needs, and can be but is not limited to columnar, spherical, hemispherical, conical, annular, strip-shaped and the like. When the second protrusions 31 are in the form of columnar, spherical, hemispherical, conical, annular and the like, the plurality of second protrusions 31 can be regularly distributed or irregularly distributed. When the second protrusions 31 are in the form of strip-shaped, the plurality of protrusions 32 can be arranged in the form of snake shape, meander shape and the like.

[0069] Further, with reference to the accompanying drawings Figure 7 The electronic device provided by the embodiment includes the first plate body 32 and the second plate body 33 which are opposite to each other, the first plate body 32 faces the mainboard 2, the second plate body 33 includes a first area and a second area, the first area protrudes in a direction away from the first plate body 32 to form the cavity, the second area is arranged in the first area, the second area is attached to the first plate body, and one side of the first plate body 32 facing the mainboard 2 is a flat plate surface.

[0070] It can be understood that, in order to realize the single-side formation of the second protrusions 31 of the heat dissipation piece 3 to increase the heat dissipation effect, the heat dissipation piece 3 can be arranged in the form of including the first plate body 32 and the second plate body 33 which are opposite to each other in the embodiment, the first plate body 32 and the second plate body 33 can be integrally formed or can be subsequently welded and connected, and the positions corresponding to the second protrusions 31 are the positions of the cavities. The formation of the second protrusions 31 can be realized by a blow molding process in the embodiment, which is easily understood by the person skilled in the art, and will not be described in detail here. One side of the first plate body 32 facing the mainboard 2 is arranged as a flat plate surface, which simplifies the preparation process of the heat dissipation piece 3. Of course, corresponding to the first protrusions, the first plate body 32 can also include a plurality of first protrusions.

[0071] The above merely describes a specific implementation of the present application, but the protection scope of the present application is not limited thereto. Any person skilled in the art can easily think of changes or replacements within the technical range disclosed by the present application, which shall be covered within the protection scope of the present application. Therefore, the protection scope of the present application shall be subject to the protection scope of the claims.

Claims

1. An electronic device, characterized in that, It includes: The housing has an air inlet and an air outlet spaced apart from each other at its first end; A motherboard, which is placed inside the housing, has several heat sources distributed at intervals on it; A heat sink is stacked with the motherboard, and the side of the heat sink facing the motherboard is attached to a plurality of heat sources to absorb the heat from the plurality of heat sources. Wherein, a guide air duct is formed between the heat sink and the motherboard, and the guide air duct can guide the air intake of the air inlet to the second end of the housing along a first direction and back to the first end of the housing and out through the air outlet; the first direction is the direction from the first end of the housing to the second end.

2. The electronic device according to claim 1, characterized in that: It also includes the blower section; The blower is disposed inside the housing corresponding to the air inlet, and the air outlet of the blower faces the second end of the housing; The motherboard is located at the second end of the housing.

3. The electronic device according to claim 2, characterized in that: Including the first retaining wall; The first baffle is disposed on the side of the blower facing the air outlet. The first baffle extends along the first direction. The first baffle is attached to the side surface of the heat sink facing the motherboard and the inner wall of the housing on both sides along the thickness direction of the electronic device, respectively.

4. The electronic device according to claim 1 or 2, characterized in that: Including the second retaining wall; The second baffle is disposed inside the housing corresponding to the first end of the housing. The second baffle extends from the inner wall of the first end of the housing to the second end of the housing, so as to separate the air inlet and the air outlet to form an air inlet area and an air outlet area.

5. The electronic device according to claim 3, characterized in that: The first retaining wall includes a first sub-retaining wall and a second sub-retaining wall; The first sub-baffle is disposed on the air blowing part, and the first sub-baffle is attached to the air blowing part and the inner wall of the housing on both sides along the thickness direction of the electronic device, or the first sub-baffle is attached to the air blowing part and the surface of the heat sink facing the motherboard on both sides along the thickness direction of the electronic device. The first sub-baffle and the second sub-baffle are arranged sequentially along the first direction. The second sub-baffle is attached to the inner wall of the housing and the surface of the heat sink facing the motherboard on both sides along the thickness direction of the electronic device.

6. The electronic device according to claim 1, characterized in that: The heat sink has a plurality of first protrusions on the side facing the motherboard, and the plurality of first protrusions abut against and fit against a plurality of heat sources in a corresponding manner, so that the heat sink and the motherboard form the airflow channel between the plurality of first protrusions.

7. The electronic device according to claim 1, characterized in that: At least a portion of the heat sink has a hollow cavity filled with a thermally conductive fluid.

8. The electronic device according to claim 7, characterized in that: The heat sink is provided with a plurality of second protrusions, and the interior of the second protrusions is hollow to form the cavity; Several of the second protrusions are spaced apart and interconnected.

9. The electronic device according to claim 8, characterized in that: The heat dissipation component includes a first plate and a second plate that are opposite to each other. The first plate faces the motherboard; The second plate includes A first region, the first region protruding in a direction away from the first plate to form the cavity; The second region is placed within the first region and is attached to the first plate.

10. The electronic device according to claim 9, characterized in that: The side of the first plate facing the motherboard is a flat plate surface.

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