Host device
By designing air inlets, air outlets, and heat dissipation channels in the host device, and combining them with a fan and temperature monitoring system, the problem of poor heat dissipation of the host device was solved, achieving more efficient heat dissipation and stable operation.
Patent Information
- Application Number
- CN202423109911.6
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-12-17
- Publication Date
- 2025-12-19
- Estimated Expiration
- 2034-12-17
AI Technical Summary
Modern conference room main unit equipment often suffers from large functional modules that occupy a lot of space and have an unreasonable layout, making it difficult for the heat dissipation system to function effectively and affecting the normal and stable operation of the equipment.
The design features air inlets and outlets on both sides of the enclosure, with a cooling fan inside. The motherboard modules are arranged vertically to form heat dissipation channels, allowing cooling air to pass through these channels and carry away heat. The fan speed is optimized using a temperature monitoring device and a heat dissipation control module.
It improves the heat dissipation performance of the host equipment, ensures that each control motherboard has sufficient heat dissipation space, extends the service life of the equipment, and ensures stable operation.
Smart Images
Figure CN223694169U_ABST
Abstract
Description
TECHNICAL FIELD
[0001] The utility model relates to electronic equipment technical field especially a kind of host equipment. BACKGROUND
[0002] In the host equipment used in modern conference room, through the integration of multiple mainboard modules with functions such as high-integration audio processing and video processing, integrated management and control of the equipment are realized, but due to the large space occupied by the functional modules and the unreasonable layout design in the host, the heat dissipation system of the host is difficult to play an effective role, affecting the normal and stable operation of the host equipment. UTILITY MODEL CONTENT
[0003] The utility model aims at providing a kind of host equipment to solve the technical problem that the heat dissipation effect is poor due to the arrangement of multiple functional modules inside the host equipment to meet the needs of audio processing, power amplifier, conference system control and power timing management.
[0004] In order to achieve the above purpose, the utility model provides a kind of host equipment, comprising:
[0005] A cabinet is provided with an air inlet and an air outlet on opposite sides, and a heat dissipation fan is arranged inside the cabinet.
[0006] A mainboard module is arranged inside the cabinet. The mainboard module comprises multiple control mainboards, and the control mainboards are arranged vertically and spaced apart. A heat dissipation channel is formed between adjacent control mainboards.
[0007] The heat dissipation fan is used to suck cooling air outside the cabinet from the air inlet, so that the cooling air is blown from the heat dissipation channel to the air outlet.
[0008] In the host equipment of the present application, the heat dissipation fan is arranged on the side close to the air inlet.
[0009] In the host equipment of the present application, the host equipment comprises a first power module and a second power module, and the first power module and the second power module are arranged inside the cabinet, and the first power module and the second power module are arranged along the extension line of the air inlet and the air outlet.
[0010] In the host equipment of the present application, the host equipment further comprises a timing module, and the timing module is arranged on the side of the second power module away from the first power module.
[0011] In the host equipment of the present application, the host equipment further comprises a temperature monitoring device, and the temperature monitoring device is arranged inside the cabinet and electrically connected with the heat dissipation fan.
[0012] In the host device of the present application, the box comprises a first side plate, a second side plate, a third side plate and a fourth side plate connected in sequence, the position of the first side plate is opposite to the position of the third side plate, and the position of the second side plate is opposite to the position of the fourth side plate.
[0013] The air inlet is arranged on the first side plate, the air outlet is arranged on the second side plate, and a plurality of control main boards are connected to the third side plate in a vertical direction.
[0014] The utility model provides a kind of host device, its beneficial effect is in:
[0015] The utility model is equipped with air inlet and air outlet on the opposite sides of box respectively, to form the circulation path of cooling air. Multiple control main boards are arranged in vertical direction from top to bottom at intervals, and heat dissipation channel is formed between adjacent two control main boards, to ensure that each control main board has sufficient heat dissipation space, and multiple heat dissipation channels are formed by these control main boards inside box. Radiator fan is installed inside box, and the role is to suck cooling air from air inlet outside box, and push cooling air through each heat dissipation channel, finally discharge from air outlet, to carry away heat generated by control main board inside box, improve the heat dissipation performance of host device. BRIEF DESCRIPTION OF DRAWINGS
[0016] In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings needed in the embodiment description will be briefly introduced below. Obviously, the drawings in the following description are some embodiments of the present application, and those skilled in the art can obtain other drawings according to these drawings without creative labor.
[0017] Figure 1 The structure diagram of the host device provided by the utility model embodiment is shown in the figure.
[0018] Figure 2 Another structure diagram of the host device provided by the utility model embodiment is shown in the figure.
[0019] Figure 3 The explosion diagram of the host device provided by the utility model embodiment is shown in the figure.
[0020] Figure 4 The internal structure diagram of the host device provided by the utility model embodiment is shown in the figure.
[0021] The following markings are used in the diagram: 10. Cabinet; 11. First side panel; 12. Second side panel; 13. Third side panel; 14. Fourth side panel; 15. Cover plate; 16. Bottom plate; 20. Control main board; 30. Air inlet; 40. Air outlet; 50. Cooling fan; 60. First power module; 70. Second power module; 80. Timing module; 90. Knob module; 100. Main unit. Detailed Implementation
[0022] The specific embodiments of this utility model will be described in further detail below with reference to the accompanying drawings and examples. The following examples are used to illustrate this utility model, but are not intended to limit its scope.
[0023] In the description of this utility model, it should be noted that the terms "upper", "lower", "front", "rear", "inner", "outer" and other terms used in this utility model to indicate the orientation or positional relationship are based on the positional relationship shown in the accompanying drawings, and are only for the convenience of describing this utility model and simplifying the description, and are not intended to indicate or imply that the device and components referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this utility model.
[0024] In the description of this utility model, it should be understood that the terms "first," "second," etc., are used to describe various information, but this information should not be limited to these terms. These terms are only used to distinguish information of the same type from each other. For example, without departing from the scope of this utility model, "first" information can also be referred to as "second" information, and similarly, "second" information can also be referred to as "first" information.
[0025] like Figures 1 to 4 As shown, this utility model embodiment provides a host device 100, including a housing 10 and a motherboard module 20. The housing 10 has an air inlet 30 and an air outlet 40 on opposite sides, and a cooling fan 50 is provided inside the housing 10. The motherboard module is located inside the housing 10 and includes multiple control motherboards 20. The multiple control motherboards 20 are arranged at intervals along the vertical direction, and a heat dissipation channel is formed between two adjacent control motherboards 20. The cooling fan 50 is used to draw in cooling air from outside the housing 10 through the air inlet 30, so that the cooling air is blown from the heat dissipation channel to the air outlet 40.
[0026] In this embodiment, the housing 10 can be made of high-strength metal material, and the housing 10 has high structural strength, forming a drawer-type structure. The housing 10 can be a sealed or semi-sealed structure to house and protect the internal components of the main unit and prevent external dust and impurities from entering.
[0027] Based on the above technical scheme, the air inlet 30 and the air outlet 40 are arranged on opposite sides of the box body 10, forming a cooling air flow path. A plurality of control mainboards 20 are arranged in the vertical direction from top to bottom, and a heat dissipation channel is formed between adjacent two control mainboards 20, ensuring that each control mainboard 20 has sufficient heat dissipation space. The control mainboards 20 are arranged inside the box body 10 to form a plurality of heat dissipation channels. The heat dissipation fan 50 is installed inside the box body 10, which functions to suck the cooling air outside the box body from the air inlet 30, and push the cooling air through each heat dissipation channel, and finally discharge from the air outlet 40, thereby taking away the heat generated by the control mainboard 20 inside the box body 10, and improving the heat dissipation performance of the host device 100.
[0028] As an embodiment, the host device 100 further comprises a temperature monitoring device (not shown in the figure) arranged inside the box body 10 and electrically connected with the heat dissipation fan 50.
[0029] Specifically, the temperature monitoring device can be a temperature sensor. The heat dissipation control module can also be arranged inside the box body 10. The temperature sensor is used to monitor the temperature inside the box body 10 in real time, and transmit the temperature information to the heat dissipation control module. The heat dissipation control module automatically adjusts the rotating speed of the heat dissipation fan 50 according to the temperature information, so as to realize more accurate heat dissipation control.
[0030] As an embodiment, a plurality of heat dissipation fans 50 can be arranged inside the box body 10. Each heat dissipation fan 50 is arranged at a heat accumulation position. When the temperature sensor detects that the temperature of a certain area abnormally rises, the heat dissipation control module immediately increases the rotating speed of the heat dissipation fan 50 near the corresponding area, so as to rapidly reduce the temperature of the area. When the overall temperature is stable or decreases, the rotating speed of the heat dissipation fan 50 is correspondingly reduced, so as to reduce energy consumption.
[0031] Therefore, if a plurality of heat dissipation fans 50 are arranged inside the box body 10, the heat dissipation control module can further realize linkage control between the heat dissipation fans 50. According to the temperature distribution, specific heat dissipation fans 50 are opened or closed, or their rotating speeds are adjusted, so as to form an optimal air flow path, and ensure that the heat inside the box body 10 is taken away.
[0032] As an embodiment, as shown in Figure 4 the heat dissipation fan 50 is arranged on the side close to the air inlet 30.
[0033] Specifically, the heat dissipation fan 50 is arranged on the side close to the air inlet 30, which can be installed in front of, above or obliquely above the air inlet 30, so as to ensure that the cooling air can be immediately sucked and accelerated after entering the box body 10.
[0034] It can be understood that the air inlet 30 and the air outlet 40 serve as the flow channel of the cooling air. In some cases, dust, particles, insects and other impurities in the air can enter the inside of the cabinet 10 along with the cooling air, causing pollution, blockage and even damage to the internal components.
[0035] As an embodiment, the air inlet 30 and the air outlet 40 are equipped with a dustproof screen (not shown in the figure), which is used to prevent dust and insects from entering the inside of the cabinet 10.
[0036] Specifically, the dustproof screen can block most of the dust, particles and other impurities from entering the inside of the cabinet 10, reducing the risk of reduced heat dissipation efficiency and increased failure rate of internal components due to dust accumulation, and prolonging the service life of the equipment. In addition, the dustproof screen has a blocking effect on insects, avoiding the serious problems of short circuit and damage to electronic components caused by the entry of insects into the inside of the cabinet 10, further ensuring the stable operation of the equipment. In addition, the dustproof screen has air permeability, which does not affect the smooth flow of cooling air while blocking dust, particles and insects, so as not to affect the heat dissipation performance.
[0037] As an embodiment, as shown in Figure 4 The host device 100 includes a first power module 60 and a second power module 70, which are arranged inside the cabinet 10 and along the extension line of the air inlet 30 and the air outlet 40.
[0038] Specifically, the first power module 60 and the second power module 70 also generate a large amount of heat inside the cabinet 10 during operation. In this embodiment, the two power modules are arranged along the extension line of the air inlet 30 and the air outlet 40, so that the two power modules can fully utilize the flow of cooling air to achieve effective heat dissipation. In other words, the cooling air introduced by the air inlet 30 carries away the heat generated by the two power modules when flowing through the two power modules, and is discharged through the air outlet 40, thereby reducing the working temperature of the two power modules.
[0039] As an embodiment, as shown in Figure 4 The host device 100 further includes a timing module 80, which is arranged on the side of the second power module 70 away from the first power module 60.
[0040] Specifically, the power timing module 80 is configured to control the switching sequence, timing and state switching of the two power modules in the host device 100. When a failure or abnormality is detected in a certain power module, the power timing module 80 automatically switches to the other power module for power supply to ensure the continuous and stable operation of the device. In some other embodiments, the power timing module 80 is capable of automatically switching back to the main power module after the failed power module recovers to normal, so as to realize efficient use of the power supply. Of course, the power timing module 80 can also monitor the working state of the power module, including the voltage, current, temperature and other key parameters, to ensure the healthy operation of the power module.
[0041] In this embodiment, the first power module 60, the second power module 70 and the power timing module 80 are arranged adjacently, so as to make full use of the internal space of the cabinet 10.
[0042] As an implementation, as shown in Figure 3 and Figure 4 The cabinet 10 comprises a first side plate 11, a second side plate 12, a third side plate 13 and a fourth side plate 14 connected in sequence, the first side plate 11 is opposite to the third side plate 13, and the second side plate 12 is opposite to the fourth side plate 14; wherein the air inlet 30 is arranged on the first side plate 11, the air outlet 40 is arranged on the second side plate 12, and the plurality of control mainboards 20 are connected to the third side plate 13 in the vertical direction.
[0043] Specifically, the cabinet 10 is formed by the first side plate 11, the second side plate 12, the third side plate 13 and the fourth side plate 14 connected in sequence, so as to form a space structure which is stable and well ventilated. The first side plate 11 is opposite to the third side plate 13, and the second side plate 12 is opposite to the fourth side plate 14. The first side plate 11 and the third side plate 13 are the left and right side plates of the cabinet 10, and the second side plate 12 and the fourth side plate 14 are the front and rear side plates of the cabinet 10. The overall structure of the cabinet 10 is symmetrical, forming a structure similar to a drawer, thereby improving the stability and durability of the cabinet 10. The air inlet 30 is arranged on the first side plate 11, the air outlet 40 is arranged on the second side plate 12, and the plurality of control mainboards 20 are connected to the third side plate 13 in the vertical direction. The cooling air forms a flow path from the left and right directions to cool the control mainboards 20 arranged in the front and rear directions in the cabinet 10. In addition, the cabinet 10 comprises a cover plate 15 and a bottom plate 16. The cover plate 15 covers the top of the four side plates to seal the cabinet 10, and the bottom plate 16 serves as a bearing for the components and modules in the cabinet 10.
[0044] As an implementation, as shown in Figures 1 to 3 The host device 100 further comprises a knob module 90 configured to realize the frequency adjustment function of the host device 100.
[0045] It should be understood that the term "and / or" as used in the specification and in the claims of the application is used to mean any combination of one or more of the associated listed items, and all possible combinations, and includes terms such as one or more, selected from the group consisting of, and / or. It is further noted that the term "comprising" or any other variation thereof is used in the document to refer to a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but can also include other elements not expressly listed or inherent to such process, method, article, or apparatus. An element proceeded by "comprises a..." does not, without more constraints, exclude the existence of additional identical elements in the process, method, article, or apparatus that comprises the recited element.
[0046] The above-mentioned embodiment serial numbers of the present application are only for description, and do not represent the advantages and disadvantages of the embodiments. The above-mentioned is only a specific embodiment of the present application, but the protection scope of the present application is not limited to this. Any person skilled in the art can easily think of various equivalent modifications or replacements within the technical range disclosed by the present application, and these modifications or replacements should be covered within the protection scope of the present application. Therefore, the protection scope of the present application should be subject to the protection scope of the claims.
Claims
1. A host device, characterized by The application relates to a mainframe device. The mainframe device comprises a box body, a mainboard module and a power module. The box body is provided with an air inlet and an air outlet on opposite sides, and is internally provided with a cooling fan. The mainboard module is arranged in the box body and comprises a plurality of control mainboards.
2. The host device of claim 1, wherein, The control mainboards are arranged in a vertical direction and are spaced apart.
3. The host device of claim 1, wherein, The cooling fan is arranged on one side close to the air inlet.
4. The host device of claim 3, wherein, The mainframe device comprises a first power module and a second power module.
5. The host device of claim 1, wherein, The first power module and the second power module are arranged in the box body and are arranged along the extension line of the air inlet and the air outlet.
6. The host device of claim 1, wherein, The mainframe device further comprises a timing module. The timing module is arranged on the side of the second power module away from the first power module. The mainframe device further comprises a temperature monitoring device. The temperature monitoring device is arranged in the box body and is electrically connected with the cooling fan. The box body comprises a first side plate, a second side plate, a third side plate and a fourth side plate which are sequentially connected. The first side plate is opposite to the third side plate, and the second side plate is opposite to the fourth side plate. The air inlet is arranged on the first side plate, the air outlet is arranged on the second side plate, and the control mainboards are arranged on the third side plate in a vertical direction.