Welding-free phase change cold plate

Abstract

The utility model relates to a welding-free phase change cold plate, belongs to the technical field of heat dissipation of electronic equipment, and solves the problems that welding connection and sealing are not thorough and the mechanical property of the cold plate is reduced. A welding-free phase change cold plate comprises a phase change medium shell, a phase change medium and a sealing cover plate. A concave phase change medium cavity is formed in the phase change medium shell and is filled with a phase change medium; a plurality of heat conduction columns are arranged in the phase change medium cavity in an array mode. The sealing cover plate is arranged above the phase change medium shell, is used for sealing the phase change medium cavity and is fixedly connected with the phase change medium shell through glue; a plurality of positioning sleeves corresponding to the heat conduction columns are arranged on the inner side wall surface of the sealing cover plate; when the sealing cover plate and the phase change medium shell are bonded and fixed, the positioning sleeve and the heat conduction column are also bonded and fixed through the sealant. According to the utility model, non-welding type sealing connection of the phase change cold plate is realized, and the sealing effect is improved on the premise that the structural strength is not influenced.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of electronic equipment heat dissipation, and in particular to a welding-free phase change cold plate. BACKGROUND

[0002] With the continuous improvement of the performance of hypersonic vehicles, the internal electronic components of the vehicles are rapidly developing towards high integration, multi-function and intelligence. With the improvement of the performance of the vehicles, the heat power and working time of the internal electronic components are continuously improved, resulting in a sharp increase in the overall heat generation. Due to the limitation of space and weight, it is urgent to improve the heat conduction and temperature uniformity performance of the thermal control system of the vehicles, further tap the structural heat capacity and reduce the cost.

[0003] At present, the design of the thermal control system of the vehicles mainly focuses on passive thermal control measures with high reliability, long service life and good economic performance. The improvement of the thermal conductivity and heat capacity of the thermal control system has always been the key direction of the thermal design of high-power microwave and electronic equipment. The use of phase change heat storage technology to improve the system heat capacity under limited weight and space is the main way of thermal control of high-power equipment. Solid-liquid phase change has achieved widespread development and has gained a lot of research and application experience in the field of thermal control of hypersonic vehicles. In order to ensure the sealing performance of the phase change cold plate, vacuum brazing is required during the production of the phase change cold plate. However, the vacuum brazing process has the risk of incomplete welding. At the same time, the high-temperature process of vacuum brazing is equivalent to annealing treatment of the metal material, resulting in a decrease in the mechanical properties of the material. In addition, vacuum brazing can cause deformation of the structure, which seriously affects the normal use of the phase change cold plate.

[0004] Therefore, it is necessary to provide a phase change cold plate structure that is assembled without welding. SUMMARY

[0005] In view of the above analysis, the present application aims to provide a welding-free phase change cold plate to solve the problems of incomplete sealing and reduced mechanical properties of the cold plate caused by the welding process of the existing phase change cold plate.

[0006] The main purpose of the present application is achieved by the following technical solutions:

[0007] A welding-free phase change cold plate comprises a phase change medium shell, a phase change medium and a sealing cover plate.

[0008] The phase change medium shell is internally provided with a concave phase change medium cavity for filling the phase change medium.

[0009] A plurality of heat conducting columns are arranged in an array in the phase change medium cavity; the heat conducting columns are fixedly connected with the phase change medium shell or are an integral structure.

[0010] The sealing cover plate is arranged above the phase change medium shell and is fixedly connected with the phase change medium shell by adhesive.

[0011] A plurality of positioning sleeves are arranged on the inner wall surface of the sealing cover plate and are in one-to-one alignment with the heat-conducting columns.

[0012] Further, the edge of the phase change medium cavity is provided with an annular glue groove surrounding the phase change medium cavity.

[0013] Further, the outer side of the sealing cover plate is provided with a second adhesive surface.

[0014] Further, the upper end surface of the heat-conducting column is provided with a column end glue groove for coating sealing glue.

[0015] Further, the positioning sleeve can be clamped into the column end glue groove and is adhesively connected with the heat-conducting column.

[0016] Further, the outer surface of the positioning sleeve is a first adhesive surface which can be adhesively connected with the column end glue groove.

[0017] Further, the middle part of the positioning sleeve is provided with a first threaded hole penetrating the sealing cover plate.

[0018] Further, the lower end of the column end glue groove is provided with a second threaded hole in communication with each other.

[0019] Further, the column end glue groove is a circular hole groove.

[0020] Further, the phase change medium is a solid-liquid phase change medium or a solid-solid phase change medium.

[0021] The technical scheme of the present application can achieve at least one of the following effects:

[0022] 1. The welding-free phase change cold plate of the utility model, through setting up mutual adhesion and sealing between phase change medium shell and sealing cover plate, avoids vacuum brazing process in production process, realizes cold plate manufacturing in welding-free mode, reduces production cost, improves production efficiency and sealing reliability, and simultaneously improves cold plate heat storage capacity.

[0023] 2. The welding-free phase change cold plate of the utility model adopts solid-liquid phase change material / solid-solid phase change material, fills and seals in solid state, avoids phase change material liquid filling process, and directly puts phase change material into phase change cavity in solid state, and the solid-solid phase change material can also use this packaging mode.

[0024] 3. The welding-free phase change cold plate of the utility model, through setting up multiple positioning sleeve pipes and multiple heat conduction columns butt joint and sleeve pipe bolt fixation, improves the connection reliability of the overall structure of the phase change cold plate, simultaneously, the outer surface of the positioning sleeve pipe cooperates with the column end glue liquid groove on the heat conduction column and is fixed by sealing glue adhesion, guarantees the sealing effect of the overall phase change cold plate.

[0025] In the application, the above technical solutions can be combined with each other to realize more preferred combination solutions. Other features and advantages of the application will be described in the subsequent specification, and some advantages will become apparent from the specification or be understood by implementing the application. The purpose and other advantages of the application can be realized and obtained from the contents specifically indicated in the specification and the drawings. BRIEF DESCRIPTION OF DRAWINGS

[0026] The drawings are only for the purpose of showing specific embodiments and are not considered as limiting the application, and in the whole drawings, the same reference signs represent the same parts.

[0027] Figure 1 It is a structure schematic view of the welding-free phase change cold plate of the utility model;

[0028] Figure 2 It is a phase change cavity shell of the welding-free phase change cold plate of the utility model;

[0029] Figure 3 It is an enlarged view of the heat conduction column inside the phase change cavity shell of the welding-free phase change cold plate of the utility model;

[0030] Figure 4 It is a sealing cover plate of the welding-free phase change cold plate of the utility model.

[0031] Reference signs:

[0032] 1-phase change medium shell; 2-phase change medium; 3-fastening screw; 4-sealing cover plate; 5-heat conduction column; 6-annular glue liquid groove; 7-column end glue liquid groove; 8-threaded hole; 9-positioning sleeve pipe; 10-first adhesive surface; 11-second adhesive surface. DETAILED DESCRIPTION

[0033] The preferred embodiments of the present application are described below in detail with reference to the accompanying drawings, which form a part of this application, and are shown by way of illustration of the principles of the application, and not by way of limitation of the scope of the application.

[0034] Embodiment 1

[0035] In one embodiment of the present application, a solder-free phase change cold plate is disclosed, as shown in Figure 1 , Figure 2 , Figure 4 The phase change cold plate comprises a phase change medium shell 1, a phase change medium 2 and a sealing cover plate 4; the phase change medium shell 1 is internally provided with a concave phase change medium cavity for filling the phase change medium 2; a plurality of heat-conducting columns 5 are arranged in an array in the phase change medium cavity; the heat-conducting columns 5 are fixedly connected with the phase change medium shell 1 or are an integral structure; the sealing cover plate 4 is arranged above the phase change medium shell 1 and is used for sealing the phase change medium cavity and is fixedly connected with the phase change medium shell 1 through adhesive.

[0036] The functional principle of the phase change cold plate is that the phase change medium 2 encapsulated in the phase change medium cavity of the phase change medium shell 1 absorbs heat at a specific temperature, and the phase change material is used to control the temperature of electronic components by utilizing the melting phase change characteristics of the phase change material at a specific temperature. In use, the reverse side of the phase change cold plate directly contacts the heat-generating electronic components to absorb heat, and the phase change material is encapsulated inside the cavity of the phase change cold plate to absorb heat during the working process, thereby achieving temperature control of the electronic components.

[0037] Since the phase change cold plate involves a solid-liquid conversion process during the working process, in order to ensure its performance and the reliability of electronic products, the cold plate is required to have good sealing performance and not to leak.

[0038] In one embodiment of the present application, the edge of the phase change medium cavity is provided with an annular glue tank 6 surrounding the phase change medium cavity; the sealing cover plate 4 can be clamped and matched with the annular glue tank 6; the outer side of the sealing cover plate 4 is provided with a second adhesive surface 11; the second adhesive surface 11 can be sealingly connected with the annular glue tank 6 on the phase change medium shell 1 through sealing glue.

[0039] Further, as shown in Figure 4 , a plurality of positioning sleeves 9 are arranged on the inner wall surface of the sealing cover plate 4 and are in one-to-one alignment with the heat-conducting columns 5.

[0040] Further, when the sealing cover plate 4 is bonded and fixed with the phase change medium shell 1, the positioning sleeve 9 and the heat conducting column 5 are also bonded and fixed by the sealing glue.

[0041] Further, the upper end surface of the heat conducting column 5 is provided with a column end glue liquid groove 7 for coating the sealing glue; the positioning sleeve 9 can be clamped into the column end glue liquid groove 7, and the heat conducting column 5 is bonded by the sealing glue.

[0042] Further, the outer surface of the positioning sleeve 9 is a first bonding surface 10, and the first bonding surface 10 can be bonded with the column end glue liquid groove 7 by the sealing glue.

[0043] The welding-free phase change cold plate is characterized in that the heat conducting column 5 is arranged in the phase change medium cavity, the heat conducting column 5 is used for quickly transferring heat to the phase change material and quickly absorbing heat generated by electronic components, the threaded holes and the column end glue liquid groove 7 are arranged on all or part of the heat conducting column 5, the connection reliability and sealing performance of the structure are ensured, the annular glue liquid groove 6 is also arranged on the cold plate cavity, and the structural strength and sealing performance of the phase change cold plate are ensured.

[0044] Further, the middle part of the positioning sleeve 9 is provided with a first threaded hole penetrating through the sealing cover plate 4; and the fastening screw 3 is arranged in the first threaded hole.

[0045] Further, the lower end of the column end glue liquid groove 7 is provided with a second threaded hole 8 in communication with each other; when the positioning sleeve 9 and the column end glue liquid groove 7 are clamped with each other, the first threaded hole is aligned with the second threaded hole 8, and the fastening screw 3 can be screwed into the second threaded hole 8.

[0046] Further, the column end glue liquid groove 7 is a circular hole groove; and the positioning sleeve 9 is a cylindrical pipe.

[0047] Further, the phase change medium 2 adopts a solid-liquid phase change medium; the phase change medium 2 is arranged in the phase change medium cavity in a solid state, and a plurality of mounting holes matched with the heat conducting column 5 are arranged on the phase change medium 2.

[0048] Preferably, a plurality of boss structures are arranged on one side of the phase change medium shell 1, the boss structures are embedded with chips of different height dimensions on the printed board, the heat source and the metal base have high adhesion, and heat can be smoothly transferred to the metal cold plate.

[0049] The welding-free phase change cold plate is characterized in that the phase change medium shell is used as a bearing component of an electronic equipment printed board, directly contacts with a heat source on the printed board, and is a basic component of a heat equalizing device.

[0050] In one specific embodiment of the present application, the sealant glue solution uses anaerobic glue, the main component of which is urethane methacrylate, and the characteristics of which are anaerobic curing, high strength, stable chemical properties, no reaction with metals and alkane substances, and can be applied to the bonding of phase change cold plates.

[0051] In one specific embodiment of the present application, the phase change material is used to absorb heat, and the characteristics of melting at a specific temperature can ensure that it absorbs a large amount of heat within the temperature range of the operation of electronic equipment. The phase change material usually uses high-grade alkane material, which is stable in chemical properties, non-toxic and harmless, can be recycled multiple times, and has very high reliability.

[0052] The phase change cold plate of the present application uses the same metal material as the phase change medium shell 1 for the sealing cover plate 4 to ensure good bonding performance, and the sealing cover plate 4 is pre-provided with multiple glue bonding surfaces and screw mounting through holes, and the cover plate and the cavity are fastened by screw installation, and the sealing performance of the phase change cold plate is achieved by multiple glue sealing surfaces.

[0053] The above is only the preferred specific embodiment of the present application, but the protection scope of the present application is not limited thereto, and any person skilled in the art can easily think of changes or replacements within the technical scope disclosed by the present application, which should be covered within the protection scope of the present application.

Claims

1. A solderless phase change cold plate, characterized by, The application relates to a phase-change medium shell (1), a phase-change medium (2) and a sealing cover plate (4). The phase-change medium shell (1) is internally provided with an inner-recessed phase-change medium cavity which is used for filling the phase-change medium (2); A plurality of heat-conducting columns (5) are arranged in the phase-change medium cavity; the heat-conducting columns (5) are fixedly connected with the phase-change medium shell (1) or are integrated structures; The sealing cover plate (4) is arranged above the phase-change medium shell (1) and is used for sealing the phase-change medium cavity and is fixedly connected with the phase-change medium shell (1) through adhesive bonding; A plurality of positioning sleeve pipes (9) are arranged on the inner wall surface of the sealing cover plate (4) and are arrayed and aligned with the heat-conducting columns (5); when the sealing cover plate (4) is fixedly bonded with the phase-change medium shell (1), the positioning sleeve pipes (9) and the heat-conducting columns (5) are also fixedly connected through sealing adhesive. The edge of the phase-change medium cavity is provided with an annular adhesive liquid groove (6) which surrounds the phase-change medium cavity.

2. The solderless phase change cold plate of claim 1, wherein, The outer side of the sealing cover plate (4) is provided with a second adhesive surface (11); the second adhesive surface (11) can be engaged with the annular adhesive liquid groove (6) and the two are fixedly connected through sealing adhesive.

3. The solderless phase change cold plate of claim 2, wherein, The upper end surface of the heat-conducting column (5) is provided with a column-end adhesive liquid groove (7) which is used for coating sealing adhesive.

4. The solderless phase change cold plate of claim 3, wherein, The positioning sleeve pipe (9) can be engaged into the column-end adhesive liquid groove (7) and is fixedly connected with the heat-conducting column (5) through sealing adhesive.

5. The solderless phase change cold plate of claim 4, wherein, The outer surface of the positioning sleeve pipe (9) is a first adhesive surface (10) which can be fixedly connected with the column-end adhesive liquid groove (7) through sealing adhesive.

6. The solderless phase change cold plate of claim 5, wherein, The middle part of the positioning sleeve pipe (9) is provided with a first screw hole which penetrates the sealing cover plate (4); a fastening screw (3) is arranged in the first screw hole.

7. The solderless phase change cold plate of claim 6, wherein, The lower end of the column-end adhesive liquid groove (7) is provided with second screw holes (8) which are mutually connected; when the positioning sleeve pipe (9) and the column-end adhesive liquid groove (7) are engaged with each other, the first screw hole is aligned with the second screw holes (8) and the fastening screw (3) can be screwed into the second screw holes (8).

8. The solderless phase change cold plate of claim 7, wherein, The column-end adhesive liquid groove (7) is a circular hole groove; the positioning sleeve pipe (9) is a cylindrical pipe.

9. The solder-joint-free phase-change cold plate of any of claims 5-8, wherein, The phase-change medium (2) is filled into the phase-change medium cavity in a solid state and a plurality of mounting holes which are matched with the heat-conducting columns (5) are arranged on the phase-change medium (2).

10. The solderless phase change cold plate of claim 1, wherein, ​

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