Electronic device

Abstract

The embodiment of the utility model discloses electronic equipment. The electronic equipment comprises a heat conduction assembly; the first heating part is arranged on the first surface side of the heat conduction assembly, and a distance is formed between the first heating part and the heat conduction assembly; the functional part is at least partially arranged on the first surface side of the heat conduction assembly; the functional part is located at the position where the heat conduction assembly is limited to move towards the side of the first heating part; at least part of the first target component is arranged between the heat conduction assembly and the first heating component, and the first target component is used for dissipating heat of the first heating component; the first target component is provided with a first group of heat exchange channels; the first group of heat exchange channels are used for accommodating a first heat exchange medium; and the driving part is used for driving the first heat exchange medium to flow in the first group of heat exchange channels.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of electronics, and in particular to an electronic device. BACKGROUND

[0002] An electronic device is a device frequently used by people; in the related art, a heat-conducting structure of an electronic device and a heat-generating component are connected by a heat-conducting member, and the heat dissipation capacity of the electronic device is limited by the heat dissipation capacity of the heat-conducting structure, resulting in that the heat dissipation capacity of the electronic device is limited. CONTENT OF THE UTILITY MODEL

[0003] Therefore, an embodiment of the present application aims to provide an electronic device.

[0004] To achieve the above-mentioned purpose, the technical solution of the present application is as follows:

[0005] An embodiment of the present application provides an electronic device, comprising:

[0006] a heat-conducting assembly;

[0007] a first heat-generating component disposed on a first surface side of the heat-conducting assembly and having a distance from the heat-conducting assembly;

[0008] a functional component at least partially disposed on the first surface side of the heat-conducting assembly; the functional component is located at a position limiting movement of the heat-conducting assembly toward the first heat-generating component;

[0009] a first target component at least partially disposed between the heat-conducting assembly and the first heat-generating component, the first target component being used for dissipating heat of the first heat-generating component; the first target component has a first set of heat exchange channels; the first set of heat exchange channels is used for accommodating a first heat exchange medium;

[0010] a driving member used for driving the first heat exchange medium to flow in the first set of heat exchange channels.

[0011] The heat dissipation can include "conduction to the heat-conducting assembly", which emphasizes that the heat dissipation can also conduct heat at the same time.

[0012] In some optional implementations, the first heat-generating component is in contact with a first side of the first target component, a second side of the first target component is in contact with the first surface side of the heat-conducting assembly, and the second side of the first target component is opposite to the first side of the first target component.

[0013] The functional component is in contact with the first surface side of the heat-conducting assembly.

[0014] In some optional implementations, the heat-conducting component includes a first region and a second region, the first heat-generating component is projected towards the first region of the heat-conducting component, and the functional component is projected towards the second region of the heat-conducting component,

[0015] The first heat-generating component is projected towards the first region of the heat-conducting component in a first direction, and the functional component is projected towards the second region of the heat-conducting component in a second direction, the first direction being the same as the second direction,

[0016] The first region of the heat-conducting component and the second region of the heat-conducting component satisfy a coplanar condition in the first direction.

[0017] In some optional implementations, a first part of the first target component is located between the first heat-generating component and the first surface of the heat-conducting component, a second part of the first target component is in contact with at least one side surface of the heat-conducting component, and the side surface of the heat-conducting component is located adjacent to the first surface of the heat-conducting component.

[0018] In some optional implementations, the first part of the first target component and the second part of the first target component enclose a receiving groove, and at least part of the heat-conducting component is located in the receiving groove.

[0019] In some optional implementations, the first target component is configured to conduct the absorbed first part of the heat of the first heat-generating component to the heat-conducting component, and the first target component is further configured to transfer the absorbed second part of the heat of the first heat-generating component to the first heat exchange medium through the driving member.

[0020] In some optional implementations, the first group of heat exchange channels includes at least two first heat exchange channels.

[0021] The electronic device further includes:

[0022] An export channel in communication with the outlet of the driving member, and a cross-sectional area of the export channel being greater than a cross-sectional area of the first heat exchange channel;

[0023] An import channel in communication with the inlet of the driving member, and a cross-sectional area of the import channel being greater than a cross-sectional area of the first heat exchange channel;

[0024] The first group of heat exchange channels are in communication with the export channel and the import channel, respectively, the driving member is spaced apart from the first target component, and the driving member is configured to drive the first heat exchange medium to circulate and flow in the export channel, the first group of heat exchange channels, and the import channel.

[0025] In some optional implementations, the electronic device further comprises:

[0026] a second heat-generating component;

[0027] a second target component disposed at least partially between the heat-conducting component and the second heat-generating component, the second target component configured to conduct heat from the second heat-generating component to the heat-conducting component; the second target component having a second set of heat exchange channels; the second set of heat exchange channels being in communication with the heat introduction channel;

[0028] a first sub-channel in communication with the heat export channel and the first set of heat exchange channels, respectively;

[0029] a second sub-channel in communication with the heat export channel and the second set of heat exchange channels, respectively.

[0030] In some optional implementations, the first heat-generating component comprises at least two first heat-generating regions arranged at intervals;

[0031] the first set of heat exchange channels comprises at least two first heat exchange channels arranged at intervals, the at least two first heat exchange channels being arranged between the at least two first heat-generating regions and the heat-conducting component.

[0032] In some optional implementations, the electronic device further comprises:

[0033] a first set of heat dissipation fins;

[0034] a connecting pipe at least partially disposed in the first set of heat dissipation fins, the connecting pipe being in communication with the first set of heat exchange channels and the inlet of the driving member, respectively; the driving member being configured to drive the first heat exchange medium to circulate in the first set of heat exchange channels and the connecting pipe.

[0035] In some optional implementations, the electronic device further comprises:

[0036] a first body having a receiving space;

[0037] the first heat-generating component, the first target component, and the heat-conducting component are stacked in the receiving space in a thickness direction of the first body;

[0038] the first heat-generating component and the functional component are arranged at intervals in the receiving space along a third direction, wherein the third direction is different from the thickness direction of the first body;

[0039] the driving member and the first target component are arranged at intervals in the receiving space along a fourth direction, wherein the fourth direction is different from the thickness direction of the first body.

[0040] In some optional implementations, the first set of heat exchange channels comprises at least two first heat exchange channels;

[0041] The size of the first heat exchange channel in a fifth direction is greater than the size of the first heat exchange channel in the thickness direction of the first body; wherein the fifth direction is different from the thickness direction of the first body; and / or,

[0042] The size of the heat conduction assembly in a sixth direction is greater than the size of the heat conduction assembly in the thickness direction of the first body, wherein the sixth direction is different from the thickness direction of the first body.

[0043] In some optional implementations, further comprising:

[0044] A second body rotatably connected with the first body;

[0045] An input assembly or a first display assembly arranged on the outside of the first body;

[0046] A second display assembly arranged on the outside of the second body; and / or,

[0047] The electronic device further comprises:

[0048] A carrier in the shape of a plate;

[0049] The first heat-generating component and the functional component are arranged on the carrier in a spaced manner, and the driving member is arranged on one side of the carrier close to the first set of heat exchange channels in a seventh direction; the seventh direction is perpendicular to the thickness direction of the carrier. BRIEF DESCRIPTION OF DRAWINGS

[0050] Figure 1 An optional structural schematic diagram of an electronic device in an embodiment of the present application, wherein the A direction is the stacking direction of the heat conduction assembly, the first target component and the first heat-generating component;

[0051] Figure 2 Another optional structural schematic diagram of an electronic device in an embodiment of the present application, wherein the A direction is the stacking direction of the heat conduction assembly, the first target component and the first heat-generating component;

[0052] Figure 3 Still another optional structural schematic diagram of an electronic device in an embodiment of the present application, wherein the A direction is the stacking direction of the heat conduction assembly, the first target component and the first heat-generating component;

[0053] Figure 4 A first optional structural schematic diagram of a first target component of an electronic device in an embodiment of the present application;

[0054] Figure 5 A second optional structural schematic diagram of a first target component of an electronic device in an embodiment of the present application;

[0055] Figure 6 A third alternative structural schematic diagram of a first target component of an electronic device in an embodiment of the present application;

[0056] Figure 7 A fourth alternative structural schematic diagram of a first target component of an electronic device in an embodiment of the present application, wherein the arrows represent the flow direction of the first heat exchange medium;

[0057] Figure 8 A fifth alternative structural schematic diagram of a first target component of an electronic device in an embodiment of the present application, wherein the arrows represent the flow direction of the first heat exchange medium;

[0058] Figure 9 A sixth alternative structural schematic diagram of an electronic device in an embodiment of the present application, wherein the A direction is the stacking direction of the heat conduction assembly, the first target component, and the first heat generating component;

[0059] Figure 10 A seventh alternative partial structural schematic diagram of an electronic device in an embodiment of the present application, wherein the arrows represent the flow direction of the first heat exchange medium;

[0060] Figure 11a An eighth alternative partial structural schematic diagram of an electronic device in an embodiment of the present application, wherein the A direction is the stacking direction of the heat conduction assembly, the first target component, and the first heat generating component;

[0061] Figure 11b A ninth alternative partial structural schematic diagram of an electronic device in an embodiment of the present application, wherein the A direction is the stacking direction of the heat conduction assembly, the first target component, and the first heat generating component;

[0062] Figure 12 A tenth alternative partial structural schematic diagram of an electronic device in an embodiment of the present application, wherein the A direction is the stacking direction of the heat conduction assembly, the first target component, and the first heat generating component;

[0063] Figure 13 An eleventh alternative partial structural schematic diagram of an electronic device in an embodiment of the present application;

[0064] Figure 14 A twelfth alternative structural schematic diagram of an electronic device in an embodiment of the present application, wherein the A direction is the stacking direction of the heat conduction assembly, the first target component, and the first heat generating component;

[0065] Figure 15 A thirteenth alternative structural schematic diagram of an electronic device in an embodiment of the present application, wherein the A direction is the stacking direction of the heat conduction assembly, the first target component, and the first heat generating component.

[0066] 100, first target component; 110, first group of heat exchange channels; 111, first heat exchange channel; 120, first part; 130, second part; 140, accommodating groove; 200, second target component; 210, second group of heat exchange channels; 211, second heat exchange channel; 400, heat conduction assembly; 410, first surface; 510, first heat generating component; 520, functional component; 530, second heat generating component; 600, driving member; 710, leading-out channel; 720, leading-in channel; 730, connecting pipe; 740, filter; 750, first sub-channel; 760, second sub-channel; 810, first group of radiating fins; 820, first fan; 910, first body; 911, accommodating space; 920, bearing member. DETAILED DESCRIPTION

[0067] The technical solutions of the present application are further described in detail below in combination with the accompanying drawings and specific embodiments.

[0068] In the embodiments of the present application, it should be noted that unless otherwise stated and limited, the term "connection" should be understood broadly, for example, it can be an electrical connection, or a connection between two elements, it can be directly connected, or indirectly connected through an intermediate medium. For those skilled in the art, the specific meaning of the above-mentioned term can be understood according to the specific circumstances.

[0069] It should be noted that the terms "first", "second", "third" involved in the embodiments of the present application are only to distinguish similar objects, and do not represent a specific order of the objects. Understandably, "first", "second", "third" can be interchanged in specific order or sequence as allowed. It should be understood that the objects distinguished by "first", "second", "third" can be interchanged under appropriate circumstances, so that the embodiments of the present application described herein can be implemented in an order other than those illustrated or described herein.

[0070] In the related art, the heat conduction structure of the electronic device and the heat generating component are connected by the heat conduction member, and the heat dissipation capacity of the electronic device is limited by the heat dissipation capacity of the heat conduction structure, resulting in limited heat dissipation capacity of the electronic device.

[0071] The following is combined Figures 1 to 15 The electronic device described in the embodiments of the present application is described in detail.

[0072] The electronic device comprises a heat-conducting component 400, a first heat-generating component 510, a functional component 520, a first target component 100 and a driving member 600. The first heat-generating component 510 is arranged on the side of the first surface 410 of the heat-conducting component 400, and a distance is provided between the first heat-generating component 510 and the heat-conducting component 400; at least part of the functional component 520 is arranged on the side of the first surface 410 of the heat-conducting component 400; the functional component 520 is located at a position for limiting the movement of the heat-conducting component 400 towards the side of the first heat-generating component 510; at least part of the first target component 100 is arranged between the heat-conducting component 400 and the first heat-generating component 510, and the first target component 100 is used for dissipating the heat of the first heat-generating component 510; the first target component 100 has a first set of heat exchange channels 110; the first set of heat exchange channels 110 is used for containing a first heat exchange medium; and the driving member 600 is used for driving the first heat exchange medium to flow in the first set of heat exchange channels 110.

[0073] The electronic device of the embodiment of the present application, since the first target component 100 further has the first set of heat exchange channels 110, the heat of the first heat-generating component 510 can be conducted to the heat-conducting component 400 through the first target component 100, so that the heat of the first heat-generating component 510 can be quickly dissipated through the heat-conducting component 400, and the heat of the first heat-generating component 510 can also be taken away by the first heat exchange medium in the first set of heat exchange channels 110, so that the heat dissipation capacity of the electronic device can be greatly improved. At the same time, since the functional component 520 is located at a position for limiting the movement of the heat-conducting component 400 towards the side of the first heat-generating component 510, and a distance is provided between the first heat-generating component 510 and the heat-conducting component 400; the height of the first heat-generating component 510 can be further compensated by the first target component 100, so as to solve the problem that the first heat-generating component 510 cannot directly contact the heat-conducting component 400; in other words, through the first target component 100 which is a heat-conducting structure for compensating the height, the heat dissipation capacity of the electronic device for the first heat-generating component 510 can be greatly improved.

[0074] In the embodiment of the present application, the structure of the electronic device is not limited. For example, the electronic device can be a tablet computer, a mobile phone, a notebook computer, a game console, etc. However, the present application is not limited thereto, i.e., those skilled in the art can adjust or set according to specific needs.

[0075] In the embodiment of the present application, the structure of the heat-conducting component 400 is not limited. As long as the heat-conducting component 400 can take away the heat generated by the first heat-generating component 510.

[0076] For example, the heat-conducting component 400 can have a closed cavity, and the closed cavity can have a second heat exchange medium; here, the second heat exchange medium can flow in the closed cavity to take away the heat generated by the first heat-generating component 510, so that the heat-conducting component 400 can continuously take away the heat generated by the first heat-generating component 510.

[0077] Here, the second heat exchange medium can have two states in the closed cavity, and switching of the second heat exchange medium between the two states can transfer the heat absorbed by the heat conduction assembly 400.

[0078] As an example, the second heat exchange medium can have a liquid state and a gas state; the heat conduction assembly 400 can have a hot end and a cold end, and the closed cavity can also have a capillary structure. The first target component 100 is used to conduct the heat of the first heat generating component 510 to the hot end of the heat conduction assembly 400, and after the hot end absorbs heat, the liquid second heat exchange medium absorbs heat and evaporates to form a gaseous second heat exchange medium. The gaseous second heat exchange medium flows to the cold end under the action of the pressure difference, releases heat at the cold end and condenses into liquid second heat exchange medium, and then returns to the hot end by capillary action of the capillary structure, forming a closed heat conduction cycle.

[0079] The cold end of the heat conduction assembly 400 can be a location capable of volatilizing heat, and the hot end of the heat conduction assembly 400 can be a location capable of absorbing heat.

[0080] The form of the second heat exchange medium is not limited. For example, the second heat exchange medium can be liquid ammonia, freon, liquid nitrogen, water, methanol, acetone, liquid metal, etc. However, the present application is not limited thereto, i.e., those skilled in the art can adjust or set according to specific needs.

[0081] Here, the electronic device can further include a second set of heat dissipation fins, and the heat absorbed by the heat conduction assembly 400 can be used to be taken away by the second set of heat dissipation fins, and the second set of heat dissipation fins can take away heat by exchanging heat with air. The cold end of the heat conduction assembly 400 can be connected to the second set of heat dissipation fins by clamping, bonding, welding, etc., so that the heat of the cold end of the heat conduction assembly 400 is conducted to the second set of heat dissipation fins.

[0082] Here, the electronic device can further include a second fan, and the second set of heat dissipation fins can be located on the air path of the second fan, so as to improve the heat dissipation effect of the second set of heat dissipation fins by the second fan.

[0083] Of course, the electronic device can also include only one of the second set of heat dissipation fins and the second fan, and in the case where the electronic device only includes the second fan, the cold end of the heat conduction assembly 400 can be located on the air path of the second fan, so as to improve the heat dissipation effect of the cold end of the heat conduction assembly 400 by the second fan. Alternatively, the electronic device can also not include the second set of heat dissipation fins and the second fan, and the cold end of the heat conduction assembly 400 can directly exchange heat with air. Here, the cold end of the heat conduction assembly 400 can be located at a relatively cold position of the electronic device, or the cold end of the heat assembly can be located at a position of the electronic device that can contact with external air.

[0084] Here, the structure of the heat conduction assembly 400 is not limited. For example, the heat conduction assembly 400 can include a heat pipe assembly. For another example, the heat conduction assembly 400 can also include a vapor chamber assembly, etc. For further example, the heat conduction assembly 400 can also include a heat pipe assembly and a vapor chamber assembly.

[0085] For further example, the heat conduction assembly 400 can also not have a closed cavity. As an example, the heat conduction assembly 400 can be a copper strip, a copper plate, etc. The heat conduction assembly 400 can be used to transfer the heat absorbed by the first heat generating component 510 to other areas, and the heat transferred to the other areas by the heat conduction assembly 400 can be dissipated by the above-mentioned cold end heat dissipation, which will not be described here. However, the present application is not limited thereto, that is, those skilled in the art can adjust or set, etc. according to specific needs.

[0086] In the embodiments of the present application, the structure of the first heat generating component 510 is not limited. For example, the first heat generating component 510 can include electronic components of electronic devices. As an example, the first heat generating component 510 can be a resistor, a capacitor, an inductor, a diode, a triode, a field effect transistor, a transformer, an integrated circuit, etc. As another example, the first heat generating component 510 can be a central processing unit (CPU), a graphics processing unit (GPU), a solid state disk (SSD), etc.

[0087] The first surface 410 of the heat conduction assembly 400 can be the surface of the heat conduction assembly 400 facing the first heat generating component 510. The shape of the first surface 410 of the heat conduction assembly 400 is not limited. For example, the first surface 410 of the heat conduction assembly 400 can be a plane. For another example, the first surface 410 of the heat conduction assembly 400 can be a curved surface. However, the present application is not limited thereto, that is, those skilled in the art can adjust or set, etc. according to specific needs.

[0088] The first heat-generating component 510 can include at least two first heat-generating regions arranged at intervals; the first group of heat exchange channels 110 can include at least two first heat exchange channels 111 arranged at intervals, and the at least two first heat exchange channels 111 arranged at intervals can be located between the at least two first heat-generating regions and the heat conduction assembly 400. By arranging the first heat exchange channels 111 between the first heat-generating regions and the heat conduction assembly 400, the heat of the first heat-generating regions can be quickly taken away by the first heat exchange medium in the first heat exchange channels 111. At the same time, arranging the first heat exchange channels 111 in the first heat-generating regions with relatively high temperature can also improve the heat dissipation efficiency of the first heat exchange channels 111. In addition, the heat of the first heat-generating component 510 can also be quickly conducted to the heat conduction assembly 400 from the region between the first target component 100 and the adjacent two first heat exchange channels 111, so that the heat conduction assembly 400 and the first heat exchange medium can simultaneously and quickly dissipate the heat of the first heat-generating component 510, and the heat transfer efficiency of the first heat-generating component 510 to the heat conduction assembly 400 can be improved.

[0089] The temperature of the first heat-generating region is relatively high, and the manner in which the first heat-generating component 510 has at least two first heat-generating regions arranged at intervals is not limited. For example, the first heat-generating component 510 can include 2 first processing cores arranged at intervals, 4 first processing cores arranged at intervals, 6 first processing cores arranged at intervals, 8 first processing cores arranged at intervals, 10 first processing cores arranged at intervals, 12 first processing cores arranged at intervals, 16 first processing cores arranged at intervals, etc. The temperature of the region corresponding to the first processing core of the first heat-generating component 510 is high, forming a first heat-generating region.

[0090] The number of first heat-generating regions can be the same as or different from the number of first heat exchange channels 111. As an example, the first heat-generating component 510 can include 16 first heat-generating regions arranged at intervals, and the 16 first heat-generating regions arranged at intervals can be arranged in 4 rows and 4 columns; the first group of heat exchange channels 110 can include 4 first heat exchange channels 111 arranged at intervals, and each first heat exchange channel 111 is located on a row or a column of first heat-generating regions, so that one first heat exchange channel 111 dissipates heat for 4 first heat-generating regions. However, the present application is not limited thereto, and those skilled in the art can adjust or arrange according to specific needs.

[0091] In the embodiments of the present application, the at least part of the first target component 100 arranged between the heat conduction assembly 400 and the first heat-generating component 510 can include all of the first target component 100 arranged between the heat conduction assembly 400 and the first heat-generating component 510, or part of the first target component 100 arranged between the heat conduction assembly 400 and the first heat-generating component 510, and part of the first target component 100 not arranged between the heat conduction assembly 400 and the first heat-generating component 510.

[0092] As an example, such as Figures 1 to 3 As shown, the first heating element 510 contacts the first side of the first target element 100, the second side of the first target element 100 contacts the first surface side of the heat-conducting assembly 400, and the second side of the first target element 100 is opposite to the first side of the first target element 100. Here, the heat-conducting assembly 400, the first target element 100, and the first heating element 510 are stacked together in sequence, which can reduce the space occupied.

[0093] The first target component 100 can be used to dissipate heat from the first heating component 510, thereby achieving heat dissipation for the first heating component 510. The first target component 100 can also be used to conduct a first portion of the absorbed heat from the first heating component 510 to the heat-conducting component 400, so that the first portion of the heat from the first heating component 510 is carried away by the heat-conducting component 400; here, the first target component 100 can achieve heat dissipation based on the thermal conductivity of the material. The first target component 100 can also be used to transfer a second portion of the absorbed heat from the first heating component 510 through the driving member 600, so that the second portion of the heat from the first heating component 510 is transferred away by the flowing first heat-conducting medium; here, the first target component 100 can achieve heat dissipation based on the internally flowing first heat-conducting medium. Here, the heat dissipation performance of the first target component 100 based on the thermal conductivity of the material and the heat dissipation performance based on the flowing first heat-conducting medium are not limited. As an example, the heat dissipation performance of the first target component 100 based on the thermal conductivity of the material can be greater than or equal to the heat dissipation performance based on the flowing first heat-conducting medium. As yet another example, the heat dissipation performance of the first target component 100 based on the thermal conductivity of the material may be less than the heat dissipation performance based on the flow of the first heat exchange medium.

[0094] The material of the first target component 100 can have good thermal conductivity. The material of the first target component 100 is not limited. For example, the material of the first target component 100 can be copper, aluminum, etc. However, this application is not limited to this; that is, those skilled in the art can adjust or set it according to specific needs.

[0095] The shape of the first target component 100 is not limited. For example, in some embodiments, the first target component 100 may be a plate-like structure, a block-like structure, etc. The thickness of the first target component 100 is not limited. For example, the thickness of the first target component 100 between the first surface 410 and the first heating component 510 may be less than or equal to 2 mm. The thickness of the first target component 100 may be less than the thickness of the heat-conducting assembly 400 so that the heat from the first heating component 510 can be quickly conducted to the heat-conducting assembly 400. For example, in some embodiments, the thickness of the first target component 100 between the first surface 410 and the first heating component 510 may be a fraction of the thickness of the heat-conducting assembly 400 in the stacking direction of the heat-conducting assembly 400, the first target component 100, and the first heating component 510. to

[0096] The form of the first heat exchange medium is not limited. For example, the first heat exchange medium can be water, oil, an aqueous solution of ethylene glycol, liquid metal, etc. However, this application is not limited to these, meaning that those skilled in the art can adjust or set it according to specific needs.

[0097] During operation, the state of the first heat exchange medium can remain unchanged; in other words, the first heat exchange medium may not undergo a phase change during operation. As an example, the first heat exchange medium can remain in a liquid, gas, or other state during operation.

[0098] The number of first heat exchange channels 111 in the first group of heat exchange channels 110 is not limited. For example, the first group of heat exchange channels 110 may include at least two first heat exchange channels 111, which may be spaced apart. By using at least two spaced first heat exchange channels 111, the amount of first heat exchange medium flowing within the first target component 100 can be increased, thereby increasing the heat carried away by the first heat exchange medium. Simultaneously, the heat from the first heating component 510 can also be rapidly conducted from the area of ​​the first target component 100 located between two adjacent first heat exchange channels 111 to the heat-conducting assembly 400. As an example, such as... Figures 1 to 3 As shown, the first group of heat exchange channels 110 may include six spaced-apart first heat exchange channels 111. As another example, the first group of heat exchange channels 110 may include two spaced-apart first heat exchange channels 111, three spaced-apart first heat exchange channels 111, four spaced-apart first heat exchange channels 111, five spaced-apart first heat exchange channels 111, eight spaced-apart first heat exchange channels 111, ten spaced-apart first heat exchange channels 111, etc. However, this application is not limited to these, meaning that those skilled in the art can adjust or configure them according to specific needs.

[0099] The cross-sectional shape of the first heat exchange channel 111 is not limited. For example, as shown in the figure... Figure 4As shown, the cross-section of the first heat exchange channel 111 can be rectangular. For example, as... Figure 5 As shown, the cross-section of the first heat exchange channel 111 can be trapezoidal. For example, as... Figure 6 As shown, the cross-section of the first heat exchange channel 111 can be semi-circular, etc. However, this application is not limited to this, that is, those skilled in the art can adjust or set it according to specific needs.

[0100] The number of layers in the first heat exchange channel 111 of the first target component 100 is not limited. For example, as Figures 4 to 7 As shown, the first heat exchange channel 111 in the first target component 100 can be arranged in a single layer. Alternatively, the first heat exchange channel 111 in the first target component 100 can be arranged in at least two layers, etc. As an example, ... Figure 8 As shown, the first heat exchange channel 111 in the first target component 100 can be arranged in a double layer. However, this application is not limited to this, that is, those skilled in the art can adjust or set it according to specific needs.

[0101] The cross-sectional dimensions of the first heat exchange channel 111 are not limited. For example, the maximum width of the cross-section of the first heat exchange channel 111 can be less than or equal to 1 mm and greater than or equal to 0.3 mm. As an example, the maximum width of the cross-section of the first heat exchange channel 111 can be equal to 1 mm, 0.9 mm, 0.8 mm, 0.7 mm, 0.6 mm, 0.5 mm, 0.4 mm, 0.3 mm, etc. However, this application is not limited to this, that is, those skilled in the art can adjust or set it according to specific needs.

[0102] The cross-sectional orientation of the first heat exchange channel 111 is not limited. For example, the minimum width direction of the cross-section of the first heat exchange channel 111 can be the same as the direction in which the heat-conducting component 400, the first target component 100, and the first heating component 510 are stacked, thereby facilitating the placement of the first heat exchange channel 111 within the relatively thin first target component 100. As an example, such as Figures 1 to 3 As shown, the cross-section of the first heat exchange channel 111 can be rectangular, and the short side of the cross-section of the first heat exchange channel 111 can be stacked in the same direction as the heat conduction component 400, the first target component 100 and the first heating component 510.

[0103] In the embodiments of the present application, the structure of the functional component 520 is not limited. The structure of the functional component 520 can be the same as or different from the structure of the first heat-generating component 510. For example, the functional component 520 can include electronic components of the electronic device. As an example, the functional component 520 can be a resistor, a capacitor, an inductor, a diode, a triode, a field effect transistor, a transformer, an integrated circuit, or the like. As another example, the functional component 520 can be a CPU, a GPU, an SSD, or the like. For another example, the functional component 520 can be a frame structure, a support structure, a connection structure, or the like of the electronic device. As an example, the functional component 520 can be a middle frame structure of the electronic device.

[0104] The functional component 520 can or can not generate heat. In the case that the functional component 520 generates heat, the heat generated by the functional component 520 can be carried away by the heat-conducting assembly 400. Of course, the heat generated by the functional component 520 can also be carried away by air; or the heat generated by the functional component 520 can also be carried away by other heat exchange structures.

[0105] The functional component 520 can be entirely disposed on the first surface side of the heat-conducting assembly 400, or can be partially disposed on the first surface side of the heat-conducting assembly 400.

[0106] The functional component 520 is located at a position that limits the movement of the heat-conducting assembly 400 toward the first heat-generating component 510; in other words, based on the limiting effect of the functional component 520 on the heat-conducting assembly 400, the heat-conducting assembly 400 cannot move toward the first heat-generating component 510 to contact the first heat-generating component 510, so that the heat of the first heat-generating component 510 needs to be conducted through the first target component 100.

[0107] The manner in which the functional component 520 limits the heat-conducting assembly 400 is not limited. For example, as shown in FIGS. 5A and 5B, the functional component 520 can be entirely disposed on the first surface side of the heat-conducting assembly 400, and the functional component 520 can contact the heat-conducting assembly 400. For another example, part of the functional component 520 can be disposed on the first surface side of the heat-conducting assembly 400, and the functional component 520 can contact part of the heat-conducting assembly 400. As an example, the functional component 520 can contact the first surface side of the heat-conducting assembly 400. Figure 1 Figure 2 Figure 3

[0108] ​​​In some embodiments, the heat-conducting component 400 can include a first region and a second region, the first heat-generating component 510 is towards the first region of the orthographic projection region of the heat-conducting component 400, the functional component 520 is towards the second region of the orthographic projection region of the heat-conducting component 400, the projection direction of the first heat-generating component 510 is towards the orthographic projection region of the heat-conducting component 400 is a first direction, the projection direction of the functional component 520 is towards the orthographic projection region of the heat-conducting component 400 is a second direction, the first direction and the second direction can be the same, and the first region of the heat-conducting component 400 and the second region of the heat-conducting component 400 can satisfy the coplanar condition in the first direction.

[0109] Of course, in other embodiments, the first direction and the second direction can also be different, and the first region of the heat-conducting component 400 and the second region of the heat-conducting component 400 can also not satisfy the coplanar condition in the first direction.

[0110] Here, the first region and the second region can be different regions of the first surface, the first region and the second region can both be planar structures, and the first region and the second region can also both be curved surface structures.

[0111] Here, the coplanar condition can be coplanar or substantially coplanar, based on the first region of the heat-conducting component 400 and the second region of the heat-conducting component 400 being coplanar or substantially coplanar in the first direction, the functional component 520 and the first heat-generating component 510 are substantially in contact with the same level of the heat-conducting component 400; in other words, the heat-conducting component 400 can not be bent towards the first heat-generating component 510 side or the functional component 520 side in the region corresponding to the first region to the second region, and the heat-conducting component 400 can be substantially located at the same level in the region corresponding to the first region to the second region.

[0112] In the embodiments of the present application, the structure of the driving member 600 is not limited, as long as the driving member 600 can drive the first heat exchange medium to flow in the first group of heat exchange channels 110 to increase the speed of the first heat exchange medium to take away heat. For example, the driving member 600 can be a pump, and correspondingly, the first heat exchange medium can be water, oil, ethylene glycol solution, etc. Here, the driving member 600 can be in communication with the first group of heat exchange channels 110 through a pipeline to drive the first heat exchange medium to circulate in the first group of heat exchange channels 110 and the driving member 600. For another example, the driving member 600 can be an electromagnetic pump, and correspondingly, the first heat exchange medium can be liquid metal; the electromagnetic pump can drive the liquid metal to flow. However, the present application is not limited thereto, i.e., those skilled in the art can adjust or set according to specific needs, etc.

[0113] In some optional implementation manners of the embodiments of the present application, the electronic device can further include an export channel 710 and an import channel 720. The export channel 710 is in communication with the outlet of the driving member 600; the import channel 720 is in communication with the inlet of the driving member 600; the first group of heat exchange channels 110 are respectively in communication with the export channel 710 and the import channel 720; the driving member 600 is configured to drive the first heat exchange medium to circulate and flow in the export channel 710, the first group of heat exchange channels 110 and the import channel 720; so that the first heat exchange medium can quickly take away the heat conducted to the first target component 100 by the first heat generating component 510.

[0114] In the implementation manners, the size of the cross-sectional area of the export channel 710 is not limited. As an example, the first group of heat exchange channels 110 can include at least two first heat exchange channels 111; the cross-sectional area of the export channel 710 is greater than that of the first heat exchange channel 111; here, the at least two first heat exchange channels 111 can be in communication with the export channel 710, so that the cross-sectional area of a single first heat exchange channel 111 can be reduced, which can facilitate the arrangement of the first heat exchange channel 111 in the first target component 100, and the total cross-sectional area of the first heat exchange channel 111 in the first target component 100 can be increased through the at least two first heat exchange channels 111.

[0115] In the implementation manners, the size of the cross-sectional area of the import channel 720 is not limited. As an example, the first group of heat exchange channels 110 can include at least two first heat exchange channels 111; the cross-sectional area of the import channel 720 is greater than that of the first heat exchange channel 111; here, the at least two first heat exchange channels 111 can be in communication with the import channel 720, so that the cross-sectional area of a single first heat exchange channel 111 can be reduced, which can facilitate the arrangement of the first heat exchange channel 111 in the first target component 100, and the total cross-sectional area of the first heat exchange channel 111 in the first target component 100 can be increased through the at least two first heat exchange channels 111.

[0116] In the implementation manners, as shown in Figure 3 The driving member 600 and the first target component 100 can be arranged in a spaced manner, here, the driving member 600 can not occupy the space in the stacking direction of the first heat generating component 510, the first target component 100 and the heat conduction assembly 400, in other words, the driving member 600 can not occupy the space in the stacking direction of the first heat generating component 510, the first target component 100 and the heat conduction assembly 400. By arranging the driving member 600 and the first target component 100 in a spaced manner, the space occupied by the driving member 600 in the stacking direction of the first heat generating component 510, the first target component 100 and the heat conduction assembly 400 can be reduced, so that the thickness of the electronic device in the stacking direction of the first heat generating component 510, the first target component 100 and the heat conduction assembly 400 can be reduced.

[0117] The stacking direction of the first heat generating component 510, the first target component 100, and the heat conducting assembly 400 can be A direction as shown in Figures 1 to 3 The stacking direction of the first heat generating component 510, the first target component 100, and the heat conducting assembly 400 can be the thickness direction of the first heat generating component 510. The stacking direction of the first heat generating component 510, the first target component 100, and the heat conducting assembly 400 can also be the thickness direction of the first target component 100. The stacking direction of the first heat generating component 510, the first target component 100, and the heat conducting assembly 400 can also be the thickness direction of the heat conducting assembly 400. By stacking the first heat generating component 510, the first target component 100, and the heat conducting assembly 400 together in the thickness direction, the setting size of the electronic device in the stacking direction of the first heat generating component 510, the first target component 100, and the heat conducting assembly 400 can be greatly reduced. For example, the setting size of the electronic device in the stacking direction of the first heat generating component 510, the first target component 100, and the heat conducting assembly 400 can be relatively fixed or as small as possible, and by stacking the first heat generating component 510, the first target component 100, and the heat conducting assembly 400 together in the thickness direction, the setting size requirement of the electronic device in the stacking direction of the first heat generating component 510, the first target component 100, and the heat conducting assembly 400 can be met. Of course, in other examples, the driving member 600 can also be located in the stacking direction of the first heat generating component 510, the first target component 100, and the heat conducting assembly 400.

[0118] In the present implementation, as Figure 11bAs shown, the electronic device can further include a second heat-generating component 530, a second target component 200, a first sub-channel 750, and a second sub-channel 760. At least part of the second target component 200 can be disposed between the heat-conducting assembly 400 and the second heat-generating component 530, and the second target component 200 can be configured to conduct heat of the second heat-generating component 530 to the heat-conducting assembly 400; the second target component 200 can have a second set of heat exchange channels 210; the second set of heat exchange channels 210 can be in communication with the import channel 720; the first sub-channel 750 can be in communication with the export channel 710 and the first set of heat exchange channels 110, respectively; the second sub-channel 760 can be in communication with the export channel 710 and the second set of heat exchange channels 210, respectively; so as to realize that the driving member 600 not only drives the first heat exchange medium in the first set of heat exchange channels 110 to flow, so as to quickly dissipate heat of the first heat-generating component 510 through the first target component 100, but also drives the first heat exchange medium in the second set of heat exchange channels 210 to flow, so as to quickly dissipate heat of the second heat-generating component 530 through the second target component 200. Meanwhile, the first heat exchange medium flowing out of the export channel 710 flows to the first set of heat exchange channels 110 and the second set of heat exchange channels 210 in a parallel manner, and carries away heat of the first heat-generating component 510 and the second heat-generating component 530, so as to enable the heat of the first heat-generating component 510 and the second heat-generating component 530 to be independent of each other.

[0119] Of course, in other implementations, the first heat exchange medium flowing out of the export channel 710 can also flow through the first set of heat exchange channels 110 and the second set of heat exchange channels 210 in sequence, as shown in FIG. 8B; or the first heat exchange medium flowing out of the export channel 710 can also flow through the second set of heat exchange channels 210 and the first set of heat exchange channels 110 in sequence. However, the present application is not limited thereto, i.e., a person skilled in the art can adjust or set according to specific needs. Figure 11a

[0120] The structure of the second heat-generating component 530 is not limited. For example, the second heat-generating component 530 can include electronic components of the electronic device. As an example, the second heat-generating component 530 can be a resistor, a capacitor, an inductor, a diode, a triode, a field effect transistor, a transformer, an integrated circuit, etc. As another example, the second heat-generating component 530 can be a CPU, a GPU, an SSD, etc.

[0121] The second heat-generating component 530 can be disposed on the first surface 410 side of the heat-conducting assembly 400, or can not be disposed on the first surface 410 side of the heat-conducting assembly 400. For example, as shown in FIG. 8A, the second heat-generating component 530 can be disposed on the first surface 410 side of the heat-conducting assembly 400; or as shown in FIG. 8B, the second heat-generating component 530 can not be disposed on the first surface 410 side of the heat-conducting assembly 400. Figure 9 ​As shown in FIG. 5, the second heat-generating component 530 can be disposed on the first surface 410 side of the heat-conducting component 400. Here, the stacking direction of the heat-conducting component 400, the second target component 200, and the second heat-generating component 530 can be the same as the stacking direction of the heat-conducting component 400, the first target component 100, and the first heat-generating component 510, so as to reduce the size of the electronic device in the stacking direction of the heat-conducting component 400, the first target component 100, and the first heat-generating component 510. However, the present application is not limited thereto, and the skilled in the art can adjust or set the same according to the specific needs.

[0122] As shown in FIG. 5, the first heat-generating component 510 and the heat-conducting component 400 can have a first distance H1, and the second heat-generating component 530 and the heat-conducting component 400 can have a second distance H2. The first distance H1 and the second distance H2 can be the same or different. As an example, the first distance H1 can be greater than the second distance H2, or can be less than the second distance H2. Figure 9

[0123] In the embodiments of the present application, the at least part of the second target component 200 disposed between the heat-conducting component 400 and the second heat-generating component 530 can include all of the second target component 200 disposed between the heat-conducting component 400 and the second heat-generating component 530, or can include part of the second target component 200 disposed between the heat-conducting component 400 and the second heat-generating component 530, and part of the second target component 200 not disposed between the heat-conducting component 400 and the second heat-generating component 530.

[0124] The second target component 200 can be used for heat conduction. The material of the second target component 200 has good thermal conductivity. The material of the second target component 200 is not limited. For example, the material of the second target component 200 can be copper, aluminum, or the like. However, the present application is not limited thereto, and the skilled in the art can adjust or set the same according to the specific needs.

[0125] ​The number of the second heat exchange channels 211 in the second group of heat exchange channels 210 is not limited. For example, the second group of heat exchange channels 210 can include at least two second heat exchange channels 211, which can be arranged at intervals. The at least two second heat exchange channels 211 arranged at intervals can increase the amount of the first heat exchange medium flowing in the second target component 200, thereby increasing the heat carried away by the first heat exchange medium. As an example, the second group of heat exchange channels 210 can include six second heat exchange channels 211 arranged at intervals. As another example, the second group of heat exchange channels 210 can include two second heat exchange channels 211 arranged at intervals, three second heat exchange channels 211 arranged at intervals, four second heat exchange channels 211 arranged at intervals, five second heat exchange channels 211 arranged at intervals, eight second heat exchange channels 211 arranged at intervals, ten second heat exchange channels 211 arranged at intervals, etc. However, the present application is not limited thereto, i.e., those skilled in the art can adjust or arrange, etc. according to specific needs.

[0126] The cross-sectional shape of the second heat exchange channel 211 is not limited. For example, the cross-section of the second heat exchange channel 211 can be rectangular. As another example, the cross-section of the second heat exchange channel 211 can be trapezoidal. As another example, the cross-section of the second heat exchange channel 211 can be semicircular, etc. However, the present application is not limited thereto, i.e., those skilled in the art can adjust or arrange, etc. according to specific needs.

[0127] The number of layers of the second heat exchange channel 211 in the second target component 200 is not limited. For example, the second heat exchange channel 211 in the second target component 200 can be arranged in a single layer. As another example, the second heat exchange channel 211 in the second target component 200 can be arranged in at least two layers, etc. As an example, the second heat exchange channel 211 in the second target component 200 can be arranged in two layers. However, the present application is not limited thereto, i.e., those skilled in the art can adjust or arrange, etc. according to specific needs.

[0128] The cross-sectional size of the second heat exchange channel 211 is not limited. For example, the maximum width of the cross-section of the second heat exchange channel 211 can be less than or equal to 1 mm and greater than or equal to 0.3 mm. As an example, the maximum width of the cross-section of the second heat exchange channel 211 can be equal to 1 mm, 0.9 mm, 0.8 mm, 0.7 mm, 0.6 mm, 0.5 mm, 0.4 mm, 0.4 mm, etc. However, the present application is not limited thereto, i.e., those skilled in the art can adjust or arrange, etc. according to specific needs.

[0129] The cross section of the second heat exchange channel 211 is not limited in the arrangement direction. For example, the minimum width direction of the cross section of the second heat exchange channel 211 can be the same as the arrangement direction of the heat conduction assembly 400, the second target component 200 and the second heat generating component 530, so as to facilitate the arrangement of the second heat exchange channel 211 in the second target component 200. As an example, the cross section of the second heat exchange channel 211 is rectangular, and the short side of the cross section of the second heat exchange channel 211 is the same as the arrangement direction of the heat conduction assembly 400, the second target component 200 and the second heat generating component 530.

[0130] The cross-sectional areas of the first sub-channel 750 and the second sub-channel 760 are not limited in size. For example, the cross-sectional area of the first sub-channel 750 can be greater than or equal to the cross-sectional area of the second sub-channel 760. For another example, the cross-sectional area of the first sub-channel 750 can also be less than the cross-sectional area of the second sub-channel 760.

[0131] The first sub-channel 750 can be a single channel or multiple channels. As an example, the first sub-channel 750 can include at least two first channels, and the number of the at least two first channels can be the same as the number of the first heat exchange channels 111 in the first group of heat exchange channels 110, so that each first channel corresponds to one first heat exchange channel 111 in communication.

[0132] The second sub-channel 760 can be a single channel or multiple channels. As an example, the second sub-channel 760 can include at least two second channels, and the number of the at least two second channels can be the same as the number of the second heat exchange channels 211 in the second group of heat exchange channels 210, so that each second channel corresponds to one second heat exchange channel 211 in communication.

[0133] The first group of heat exchange channels 110 can also be in communication with the import channel 720 through at least two third channels, and the number of the third channels can be the same as the number of the first heat exchange channels 111 in the first group of heat exchange channels 110.

[0134] The second group of heat exchange channels 210 can also be in communication with the import channel 720 through at least two fourth channels, and the number of the fourth channels can be the same as the number of the second heat exchange channels 211 in the second group of heat exchange channels 210.

[0135] In the present implementation, the electronic device can further include a first valve body, a second valve body and a controller. The first valve body can be arranged in the first sub-channel 750; the second valve body can be arranged in the second sub-channel 760; the controller can be electrically connected with the first valve body and the second valve body respectively; and the controller can be configured to control the working states of the first valve body and the second valve body based on the temperatures of the second heat generating component 530 and the first heat generating component 510.

[0136] The first valve body can have a working state of connecting or disconnecting the first sub-channel 750, and can also have a function of controlling the flow of the first heat exchange medium in the first sub-channel 750. The structure of the first valve body is not limited. For example, the first valve body can be a gate valve, a stop valve, a ball valve, a butterfly valve, a regulating valve, a solenoid valve, a hydraulic valve, etc.

[0137] The second valve body can have a working state of connecting or disconnecting the second sub-channel 760, and can also have a function of controlling the flow of the first heat exchange medium in the second sub-channel 760. The structure of the second valve body is not limited. For example, the second valve body can be a gate valve, a stop valve, a ball valve, a butterfly valve, a regulating valve, a solenoid valve, a hydraulic valve, etc.

[0138] Of course, in some other examples, the electronic device can only include one of the first valve body and the second valve body; or the electronic device can also not include the first valve body and the second valve body.

[0139] The controller is used to control the working state of the first valve body and the second valve body based on the temperature of the second heat generating component 530 and the first heat generating component 510. For example, in the case that the temperature of the first heat generating component 510 is greater than a first set value, the controller can be used to control the second valve body to be in a working state of disconnecting the second sub-channel 760, and can also be used to control the second valve body to reduce the flow of the first heat exchange medium in the second sub-channel 760, and can also be used to control the first valve body to increase the flow of the first heat exchange medium in the first sub-channel 750, so that more first heat exchange medium flows to the first group of heat exchange channels 110 to quickly cool the first heat generating component 510. The first set value is not limited. For example, the first set value can be 50 degrees, 55 degrees, 60 degrees, 70 degrees, etc. For example, in the case that the temperature of the second heat generating component 530 is greater than a second set value, the controller can be used to control the first valve body to be in a working state of disconnecting the first sub-channel 750, and can also be used to control the first valve body to reduce the flow of the first heat exchange medium in the first sub-channel 750, and can also be used to control the second valve body to increase the flow of the first heat exchange medium in the second sub-channel 760, so that more first heat exchange medium flows to the second group of heat exchange channels 210 to quickly cool the second heat generating component 530. The second set value is not limited. For example, the second set value can be 50 degrees, 55 degrees, 60 degrees, 70 degrees, etc.

[0140] The second heat-generating component 530 can include at least two second heat-generating regions arranged at intervals; the second group of heat exchange channels 210 can include at least two second heat exchange channels 211 arranged at intervals, and the at least two second heat exchange channels 211 can be arranged between the at least two second heat-generating regions and the heat conduction assembly 400. By arranging the second heat exchange channels 211 between the second heat-generating regions and the heat conduction assembly 400, the first heat exchange medium in the second heat exchange channels 211 can quickly take away the heat of the second heat-generating regions. At the same time, arranging the second heat exchange channels 211 in the second heat-generating regions with higher temperature can improve the heat dissipation efficiency of the second heat exchange channels 211. In addition, the heat of the second heat-generating component 530 can also be quickly conducted to the heat conduction assembly 400 from the region between the second target component 200 and the adjacent two second heat exchange channels 211, so as to realize the simultaneous and rapid heat dissipation of the heat conduction assembly 400 and the first heat exchange medium for the second heat-generating component 530, and improve the heat transfer efficiency of the heat conduction assembly 400 and the first heat exchange medium for the second heat-generating component 530.

[0141] The second heat-generating region is a region with relatively high temperature of the second heat-generating component 530. The number of the second heat-generating regions of the second heat-generating component 530 is not limited. For example, the second heat-generating component 530 can include 2 second processing cores arranged at intervals, 4 second processing cores arranged at intervals, 6 second processing cores arranged at intervals, 8 second processing cores arranged at intervals, 10 second processing cores arranged at intervals, 12 second processing cores arranged at intervals, 16 second processing cores arranged at intervals, etc. The temperature of the region corresponding to the second processing core of the second heat-generating component 530 is relatively high, and the region forms the second heat-generating region.

[0142] The number of the second heat-generating regions can be the same as or different from the number of the second heat exchange channels 211. As an example, the second heat-generating component 530 can include 16 second heat-generating regions arranged at intervals, and the 16 second heat-generating regions can be arranged in 4 rows and 4 columns. The second group of heat exchange channels 210 can include 4 second heat exchange channels 211 arranged at intervals, and each second heat exchange channel 211 is located on a row or a column of second heat-generating regions, so that one second heat exchange channel 211 dissipates heat for 4 second heat-generating regions. However, the present application is not limited to this, and those skilled in the art can adjust or arrange according to specific needs.

[0143] In some optional implementation of the embodiments of the present application, the electronic device can further include the first group of heat dissipation fins 810 and the connecting pipe 730. At least part of the connecting pipe 730 can be arranged in the first group of heat dissipation fins 810, and the connecting pipe 730 can be in communication with the first group of heat exchange channels 110 and the inlet of the driving member 600 respectively. The driving member 600 can be used to drive the first heat exchange medium to circulate and flow in the first group of heat exchange channels 110 and the connecting pipe 730. Thus, the heat of the first heat exchange medium absorbed by the first heat generating component 510 can be quickly taken away through the first group of heat dissipation fins 810, thereby improving the efficiency of the first heat exchange medium in dissipating heat for the first heat generating component 510.

[0144] In the implementation, the first heat exchange medium with relatively high temperature is introduced to the first group of heat dissipation fins 810 through the connecting pipe 730. Since the first group of heat dissipation fins 810 has strong heat dissipation capacity, the heat of the first heat exchange medium with relatively high temperature can be quickly dissipated to form the first heat exchange medium with relatively low temperature, and then the first heat exchange medium with relatively low temperature is driven to the first group of heat exchange channels 110 through the driving member 600 to again absorb the heat of the first heat generating component 510. Such circulation can enable the first heat exchange medium to continuously take away the heat of the first heat generating component 510.

[0145] In the implementation, the structure of the first group of heat dissipation fins 810 is not limited. For example, the first group of heat dissipation fins 810 can include at least two first heat dissipation fins, and part of the connecting pipe 730 can be arranged in the at least two first heat dissipation fins to increase the contact area of the connecting pipe 730 with the at least two first heat dissipation fins. As an example, the first group of heat dissipation fins 810 can include a water cooling row, a heat dissipation fin, etc.

[0146] In the implementation, the second electronic device can further include a first fan 820, and the first group of heat dissipation fins 810 can be located on the air path of the first fan 820 so as to improve the heat dissipation effect of the first group of heat dissipation fins 810 through the first fan 820.

[0147] Of course, the electronic device can also include only one of the first group of heat dissipation fins 810 and the first fan 820. In the case where the electronic device includes only the first fan 820, the connecting pipe 730 can be located on the air path of the first fan 820 so as to improve the heat dissipation effect of the first heat exchange medium through the first fan 820. Alternatively, the electronic device can not include the first group of heat dissipation fins 810 and the first fan 820, and the connecting pipe 730 can directly exchange heat with air. Here, the connecting pipe 730 can be located at a relatively cold position of the electronic device, or the connecting pipe 730 can be located at a position where the electronic device can contact with external air.

[0148] In the case that the electronic device comprises the first group of heat dissipation fins 810 and the second group of heat dissipation fins, the first group of heat dissipation fins 810 and the second group of heat dissipation fins can be the same structural member or different structural members; in the case that the electronic device comprises the first fan 820 and the second fan, the first fan 820 and the second fan can be the same structural member or different structural members.

[0149] In the present implementation, the electronic device can further comprise a filter 740 for filtering impurities in the first heat exchange medium; the filter 740 can be arranged at any position. The number of filters 740 is not limited. As an example, as shown in Figure 10 The electronic device can further comprise an export channel 710 and an import channel 720; the export channel 710 can be in communication with the first group of heat exchange channels 110, the first group of heat exchange channels 110 can be in communication with the connecting pipe 730, the connecting pipe 730 can guide the first heat exchange medium to the first group of heat dissipation fins 810, so as to take away the heat of the first heat exchange medium through the first group of heat dissipation fins 810, and the connecting pipe 730 can be in communication with the import channel 720; here, two filters 740 can be arranged on the export channel 710 and the import channel 720 respectively, of course, one of the two filters 740 can also be arranged on the connecting pipe 730; or the electronic device can also be provided with one filter 740. However, the present application is not limited thereto, that is, those skilled in the art can adjust or arrange according to specific needs.

[0150] In the present implementation, in the case that the electronic device comprises the second heat generating component 530, the heat of the second heat generating component 530 absorbed by the first heat exchange medium can also be quickly taken away through the first group of heat dissipation fins 810, so as to improve the efficiency of heat dissipation of the first heat exchange medium for the second heat generating component 530.

[0151] As an example, as shown in Figure 11a The export channel 710 is in communication with the first group of heat exchange channels 110, the first group of heat exchange channels 110 is in communication with the second group of heat exchange channels 210, the connecting pipe 730 is in communication with the second group of heat exchange channels 210 and the import channel 720 respectively, and the connecting pipe 730 guides the first heat exchange medium to the two first group of heat dissipation fins 810, so as to dissipate heat for the first heat exchange medium through the two first group of heat dissipation fins 810. The two first group of heat dissipation fins 810 can be respectively dissipated through the two first fans 820.

[0152] Of course, in other implementations, the electronic device can not include the first set of heat dissipation fins 810. As an example, the first heat exchange medium can be used to bring the heat of the first heat generating component 510 to a lower temperature area of the electronic device, so that the local high temperature of the electronic device in the area of the first heat generating component 510 can be reduced, and the first heat generating component 510 can work better. As another example, the electronic device can further include a heat conduction member, which can have a heat conduction channel therein, and the heat conduction channel can be in communication with the first set of heat exchange channels 110 through the connecting pipe 730, so as to dissipate heat for the first heat exchange medium through the heat conduction member. Here, the heat conduction member can be in contact with the heat conduction assembly 400, and the heat conduction member and the first target component 100 can be in contact with different areas of the heat conduction assembly 400. Of course, the heat conduction member can also be on the air path of the electronic device. Alternatively, part of the surface of the heat conduction member can also be in an exposed state, so that part of the surface of the heat conduction member can directly exchange heat with the outside air. However, the present application is not limited thereto, i.e., those skilled in the art can adjust or set according to specific needs.

[0153] In some optional implementations of the embodiments of the present application, the first part 120 of the first target component 100 can be located between the first heat generating component 510 and the first surface 410 of the heat conduction assembly 400; the second part 130 of the first target component 100 can be in contact with at least one side surface of the heat conduction assembly 400; the side surface of the heat conduction assembly 400 can be arranged adjacent to the first surface 410 of the heat conduction assembly 400; and the contact of the second part 130 of the first target component 100 with the at least one side surface of the heat conduction assembly 400 can increase the area of the first target component 100 in contact with the heat conduction assembly 400, so that the heat of the first heat generating component 510 can be more conducted to the heat conduction assembly 400, thereby improving the heat dissipation capacity of the heat conduction assembly 400 for the first heat generating component 510.

[0154] Of course, in other implementations, as shown in Figure 13 The first target component 100 can also not include the second part 130. Here, the electronic device can be provided with at least two heat conduction assemblies 400 to improve the heat dissipation capacity of the heat conduction assembly 400 by increasing the contact area of the heat conduction assembly 400 with the first target component 100.

[0155] In the present implementation, the second part 130 of the first target component 100 can be in contact with one side surface of the heat conduction assembly 400, or in contact with two side surfaces of the heat conduction assembly 400. As an example, as shown in Figure 12 The second part 130 of the first target component 100 is in contact with two side surfaces of the heat conduction assembly 400; here, the two side surfaces of the heat conduction assembly 400 can be in the width direction of the heat conduction assembly 400, and the first heat generating component 510 and the functional component 520 can be spaced apart or adjacent in the length direction of the heat conduction assembly 400. Here,Figure 12 The part within the dashed box can be the first part 120 of the first target component 100.

[0156] In this implementation, the location of the first heat exchange channel 110 is not limited. For example, the first heat exchange channel 110 can be located only in the second part 130 of the first target component 100. In this case, the first part 120 of the first target component 100 may not have the first heat exchange channel 110, allowing the first part 120 of the first target component 100 to be thinner. Alternatively, the first heat exchange channel 110 can be located in both the first part 120 and the second part 130 of the first target component 100, thereby significantly increasing the volume of the first heat exchange channel 110 and thus greatly improving the heat dissipation capacity of the first heat exchange medium for the first heat-generating component 510. As an example, such as... Figure 12 As shown, the first portion 120 and the second portion 130 of the first target component 100 may have at least two first heat exchange channels 111 arranged in multiple layers; here, the shape of the at least two first heat exchange channels 111 arranged in multiple layers is not limited. For example, the at least two first heat exchange channels 111 may be arranged in a U-shape and surround the outer periphery of a portion of the heat-conducting component 400, thereby increasing the heat dissipation capacity of the first heat exchange medium by increasing the area of ​​the first heat exchange channels 111, and also increasing the heat dissipation capacity of the heat-conducting component 400 by increasing the area of ​​the first target component 100 located in adjacent first heat exchange channels 111. Of course, in other examples, the first set of heat exchange channels 110 may only be provided in the first portion 120 of the first target component 100.

[0157] As an example, such as Figure 12 As shown, the first part 120 and the second part 130 of the first target component 100 form a receiving groove 140, and at least a portion of the heat-conducting component 400 is located in the receiving groove 140, thereby enabling the second part 130 of the first target component 100 to contact the two sides of the heat-conducting component 400, so as to increase the contact area between the first target component 100 and the heat-conducting component 400.

[0158] In this implementation, the height of the second portion 130 of the first target component 100 protruding from the first surface 410 of the heat-conducting assembly 400 is not limited. For example, the height of the second portion 130 of the first target component 100 protruding from the first surface 410 of the heat-conducting assembly 400 can be less than or equal to the thickness of the heat-conducting assembly 400, so that the second portion 130 of the first target component 100 does not increase the size of the electronic device in the stacking direction of the heat-conducting assembly 400, the first target component 100, and the first heating component 510, thereby achieving a thinner and lighter electronic device in the stacking direction of the heat-conducting assembly 400, the first target component 100, and the first heating component 510. As an example, such as Figure 12 As shown, the height of the second part 130 of the first target component 100 protruding from the first surface 410 of the heat-conducting component 400 can be equal to the thickness of the heat-conducting component 400. This ensures that the second part 130 of the first target component 100 does not increase the size of the electronic device in the stacking direction of the heat-conducting component 400, the first target component 100 and the first heating component 510, and maximizes the contact area between the second part 130 of the first target component 100 and the heat-conducting component 400.

[0159] In some optional implementations of the embodiments of this application, the electronic device may include: a first body 910, which may have a receiving space 911; a first heating component 510, a first target component 100, a heat-conducting component 400, a functional component 520, and a driving component 600 may be disposed in the receiving space 911; so that the electronic device can be made neater overall by means of the first body 910, and at the same time, the first body 910 can also protect the first heating component 510, the first target component 100, the heat-conducting component 400, the functional component 520, and the driving component 600.

[0160] In this implementation, the structure of the first entity 910 is not limited. For example, as shown... Figure 14 As shown, the first body 910 can be a plate-like structure. Alternatively, the first body 910 can be a block-like structure, a spherical structure, etc. As an example, the first body 910 can be the casing of a mobile phone, the casing of a tablet computer, or the body containing the keyboard of a laptop computer.

[0161] In this implementation, such as Figure 14As shown, the first heat generating component 510, the first target component 100 and the heat conducting assembly 400 can be stacked in the thickness direction of the first body 910 in the accommodating space 911, so as to reduce the size of the first body 910 in the thickness direction. Here, the thickness direction of the first body 910 can be the same as the stacking direction of the first heat generating component 510, the first target component 100 and the heat conducting assembly 400, and the thickness direction of the first body 910 can be the A direction. Of course, the first heat generating component 510, the first target component 100 and the heat conducting assembly 400 can also be stacked in other directions of the first body 910 in the accommodating space 911.

[0162] In the present embodiment, as shown in Figure 14 The first heat generating component 510 and the functional component 520 can be arranged in the accommodating space 911 along a third direction, and the third direction can be different from the thickness direction of the first body 910. Here, by arranging the functional component 520 in a direction other than the thickness direction of the first body 910, the space of the first body 910 occupied by the functional component 520 in the thickness direction of the first body 910 can be reduced, so as to realize the thinness of the first body 910. As an example, the third direction can be perpendicular to the thickness direction of the first body 910. Here, the functional component 520 does not occupy the space of the first body 910 in the thickness direction of the first body 910, so as to realize the thinness of the first body 910. Of course, the third direction can also be non-perpendicular to the thickness direction of the first body 910, or the third direction can also be the same as the thickness direction of the first body 910.

[0163] In the present embodiment, the driving member 600 and the first target component 100 can be arranged in the accommodating space 911 along a fourth direction, and the fourth direction can be different from the thickness direction of the first body 910. Here, by arranging the driving member 600 in a direction other than the thickness direction of the first body 910, the space of the first body 910 occupied by the driving member 600 in the thickness direction of the first body 910 can be reduced, so as to realize the thinness of the first body 910. As an example, the fourth direction can be perpendicular to the thickness direction of the first body 910. Here, the driving member 600 does not occupy the space of the first body 910 in the thickness direction of the first body 910, so as to realize the thinness of the first body 910. Of course, the fourth direction can also be non-perpendicular to the thickness direction of the first body 910, or the fourth direction can also be the same as the thickness direction of the first body 910.

[0164] In the present implementation, the first group of heat exchange channels 110 can include at least two first heat exchange channels 111; the size of the first heat exchange channels 111 in the fifth direction can be greater than the size of the first heat exchange channels 111 in the thickness direction of the first body 910; wherein the fifth direction can be different from the thickness direction of the first body 910, and here the fifth direction can be a direction other than the thickness direction of the first body 910; by setting the minimum size of the first heat exchange channels 111 in the thickness direction of the first body 910, the space occupied by the first heat exchange channels 111 in the thickness direction of the first body 910 can be reduced, and the formation of the first heat exchange channels 111 on the first target component 100 can be facilitated. Here, the fifth direction can be perpendicular to the thickness direction of the first body 910. Of course, in other examples, the size of the first heat exchange channels 111 in the fifth direction can also be less than or equal to the size of the first heat exchange channels 111 in the thickness direction of the first body 910. As an example, as shown in FIG. 1, the cross section of the first heat exchange channels 111 is rectangular, and the direction of the short side of the rectangular cross section can be the same as the thickness direction of the first body 910. Figure 14

[0165] In the present implementation, the size of the heat conduction assembly 400 in the sixth direction can be greater than the size of the heat conduction assembly 400 in the thickness direction of the first body 910, wherein the sixth direction can be different from the thickness direction of the first body 910, and here the sixth direction can be a direction other than the thickness direction of the first body 910; by setting the minimum size of the heat conduction assembly 400 in the thickness direction of the first body 910, the space occupied by the heat conduction assembly 400 in the thickness direction of the first body 910 can be reduced. Here, the sixth direction can be perpendicular to the thickness direction of the first body 910. Of course, in other examples, the size of the heat conduction assembly 400 in the sixth direction can also be less than or equal to the size of the heat conduction assembly 400 in the thickness direction of the first body 910. As an example, the thickness direction of the heat conduction assembly 400 and the thickness direction of the first body 910 can be the same.

[0166] The minimum size of the heat conduction assembly 400 and the first group of heat exchange channels 110 can be set in the thickness direction of the first body 910. Of course, the heat conduction assembly 400 and the first group of heat exchange channels 110 can also have only one minimum size set in the thickness direction of the first body 910.

[0167] In the present implementation, the electronic device can further include an input assembly, which can be disposed on the outside of the first body 910; so as to input information through the input assembly.

[0168] The structure of the input assembly is not limited. For example, the input assembly can be an input screen, a handwriting screen, a physical keyboard, etc., so that the user can input information outside the first body 910.

[0169] ​In the present embodiment, the electronic device can further include a first display component which can be disposed at an outer side of the first body so that information of the electronic device can be displayed through the first display component.

[0170] The structure of the first display component is not limited. For example, the first display component can be a display, an organic light emitting diode, etc.

[0171] In the present embodiment, the first body can include both the first display component and the input component, or only one of the first display component and the input component.

[0172] In the present embodiment, the electronic device can further include a second body. The second body can be rotatably connected with the first body 910 so that the electronic device can form a device which can be opened and closed.

[0173] The structure of the second body is not limited. For example, the second body can be a plate-shaped structure. For another example, the second body can be a block-shaped structure, a spherical structure, etc. As an example, the second body can be a housing of a mobile phone, a body where a display of a notebook computer is located.

[0174] In the present embodiment, the electronic device can further include a second display component which can be disposed at an outer side of the second body so that information of the electronic device can be displayed through the second display component.

[0175] The structure of the second display component is not limited. For example, the second display component can be a display, an organic light emitting diode, etc.

[0176] As an example, the electronic device can include the first body 910, the second body, the input component, and the second display component, and the electronic device can be similar to a folding mobile phone, a notebook computer, etc.

[0177] In the present embodiment, as Figure 15As shown, the electronic device can further include a second heat-generating component 530, and the second heat-generating component 530 and the first heat-generating component 510 can be arranged in the accommodating space 911 along an eighth direction, where the eighth direction can be different from the thickness direction of the first body 910, and here, by arranging the second heat-generating component 530 in the direction other than the thickness direction of the first body 910, the space occupied by the second heat-generating component 530 in the thickness direction of the first body 910 can be reduced, so that the thinness of the first body 910 can be realized. As an example, the eighth direction can be perpendicular to the thickness direction of the first body 910, and here, the second heat-generating component 530 does not occupy the space of the first body 910 in the thickness direction of the first body 910, so that the thinness of the first body 910 can be realized. Of course, the eighth direction can also be non-perpendicular to the thickness direction of the first body 910, or the eighth direction can also be the same as the thickness direction of the first body 910.

[0178] In the embodiments of the present application, the first heat-generating component 510, the functional component 520, and the second heat-generating component 530 can be directly arranged on the wall of the first body 910. Of course, as shown in FIG. 1, the first heat-generating component 510, the functional component 520, and the second heat-generating component 530 can also be arranged on the carrier 920. The structure of the carrier 920 is not limited. For example, the carrier 920 can be a printed circuit board (PCB), where the carrier 920 and the bottom wall of the first body 910 can be arranged with a space therebetween, and no other structural member is arranged therebetween; here, the top wall of the first body 910 is adjacent to the heat-conducting assembly 400, and a support for the input assembly can be arranged on the top wall of the first body 910, and the heat-conducting assembly 400 can be arranged adjacent to the support. As an example, in the thickness direction of the first body 910, the input assembly, the support, the heat-conducting assembly 400, the first target component 100, the first heat-generating component 510, the carrier 920, and the bottom wall of the first body 910 can be arranged in sequence. Figure 15

[0179] As another example, the first heat-generating component 510 can be a CPU, the functional component 520 can be an SSD, the second heat-generating component 530 can be a GUP, the heat-conducting assembly 400 can dissipate heat for the first heat-generating component 510, the second heat-generating component 530, and the functional component 520, and the first heat exchange medium can dissipate heat for the first heat-generating component 510 and the second heat-generating component 530. Of course, the first heat-generating component 510, the functional component 520, and the second heat-generating component 530 can also be other heat-generating components. The present application is not limited thereto, that is, those skilled in the art can adjust or arrange according to specific needs.

[0180] ​In some optional implementations of the embodiments of this application, the electronic device may further include a carrier 920; the first heating element 510 may be disposed on the carrier 920 so that the carrier 920 can support the first heating element 510.

[0181] In this implementation, the shape of the carrier 920 is not limited. For example, the carrier 920 can be plate-shaped, block-shaped, frame-shaped, etc. The structure of the carrier 920 is not limited. For example, the carrier 920 can be a printed circuit board, etc.

[0182] In this implementation, such as Figure 3 As shown, when the electronic device includes a functional component 520 and a driving component 600, the first heating component 510 and the functional component 520 can be spaced apart on the carrier 920, and the driving component 600 can be disposed in a seventh direction on the side of the carrier near the first set of heat exchange channels 110; the seventh direction can be perpendicular to the thickness direction of the carrier 920; so that the driving component 600 does not occupy the space of the carrier 920 in the thickness direction, and the distance between the driving component 600 and the first set of heat exchange channels 110 is reduced by being close to the first set of heat exchange channels 110, thereby reducing the power consumption of the driving component 600.

[0183] Of course, in other examples, the functional component 520 may not be mounted on the carrier 920, such as... Figure 2 As shown. In other examples, the seventh direction may not be perpendicular to the thickness direction of the carrier 920.

[0184] Here, the carrier 920 can be in the stacking direction A of the heat-conducting component 400, the first target component 100 and the first heating component 510 in the thickness direction.

[0185] It should be noted that when an electronic device includes a first target component 100 and a second target component 200, the at least two target components can be different structural components or different parts of the same structural component.

[0186] It should be noted that, in some other embodiments of the application, the electronic device may also include at least one structural component selected from the following: thermally conductive component 400, first heating element 510, functional component 520, first target component 100, and driving element 600; or, the electronic device may include at least two structural components selected from the following: thermally conductive component 400, first heating element 510, functional component 520, first target component 100, and driving element 600; or, the electronic device may include only at least three structural components selected from the following: thermally conductive component 400, first heating element 510, functional component 520, first target component 100, and driving element 600. This application is not limited to these embodiments, meaning that those skilled in the art can adjust or configure them according to specific needs.

[0187] In the specific embodiments, various specific technical features described can be combined in any suitable manner, for example, different combinations of different specific technical features can form different embodiments and technical solutions. In order to avoid unnecessary repetition, various possible combinations of various specific technical features in the utility model will not be described again.

[0188] The above merely describes specific embodiments of the present application, but the protection scope of the present application is not limited thereto, any person skilled in the art can easily think of changes or replacements within the technical range disclosed by the present application, which should be covered within the protection scope of the present application. Therefore, the protection scope of the present application should be subject to the protection scope of the claims.

Claims

1. An electronic device, comprising: Thermal conductive components; A first heating element is disposed on the first surface side of the heat-conducting component and is spaced apart from the heat-conducting component. Functional components are at least partially disposed on the first surface side of the thermally conductive assembly; The functional component is located at a position that limits the movement of the heat-conducting component toward the first heat-generating component; A first target component is at least partially disposed between the heat-conducting component and the first heat-generating component, the first target component being used to dissipate heat from the first heat-generating component; the first target component has a first set of heat exchange channels; the first set of heat exchange channels is used to accommodate a first heat exchange medium; A driving component is used to drive the first heat exchange medium to flow within the first set of heat exchange channels.

2. The electronic device according to claim 1, The first heating element is in contact with a first side of the first target component, and a second side of the first target component is in contact with a first surface side of the heat-conducting assembly. The second side of the first target component is opposite to the first side of the first target component. The functional component is in contact with the first surface side of the thermally conductive assembly; in, The heat-conducting component includes a first region and a second region. The first region is the orthographic projection area of ​​the first heating element toward the heat-conducting component, and the second region is the orthographic projection area of ​​the functional component toward the heat-conducting component. The projection direction of the first heating element toward the orthographic projection area of ​​the heat-conducting component is the first direction, and the projection direction of the functional component toward the orthographic projection area of ​​the heat-conducting component is the second direction. The first direction and the second direction are the same. The first region of the heat-conducting component and the second region of the heat-conducting component are coplanar in the first direction; Wherein, a first portion of the first target component is located between the first heating component and the first surface of the heat-conducting assembly; a second portion of the first target component is in contact with at least one side of the heat-conducting assembly; and the side of the heat-conducting assembly is disposed adjacent to the first surface of the heat-conducting assembly. Wherein, a first portion of the first target component and a second portion of the first target component form a receiving groove, and at least a portion of the heat-conducting component is located within the receiving groove; Wherein, the first target component is used to conduct the first part of the heat absorbed by the first heating component to the heat conduction component, and the first target component is also used to transfer the first heat exchange medium that absorbed the second part of the heat from the first heating component away through the driving member. The first group of heat exchange channels includes at least two first heat exchange channels; The electronic device also includes: An outlet channel is connected to the outlet of the drive component; the cross-sectional area of ​​the outlet channel is larger than the cross-sectional area of ​​the first heat exchange channel. An inlet channel is connected to the inlet of the drive component; the cross-sectional area of ​​the inlet channel is larger than the cross-sectional area of ​​the first heat exchange channel. The first set of heat exchange channels is connected to the outlet channel and the inlet channel respectively. The driving component is spaced apart from the first target component. The driving component is used to drive the first heat exchange medium to circulate in the outlet channel, the first set of heat exchange channels and the inlet channel. The electronic device further includes: The first body has a storage space; The first heating element, the first target element, and the heat-conducting component are stacked in the accommodating space in the thickness direction of the first body; The first heating element and the functional element are spaced apart in the receiving space along a third direction, wherein the third direction is different from the thickness direction of the first body; The driving component and the first target component are spaced apart in the receiving space along a fourth direction, wherein the fourth direction is different from the thickness direction of the first body; The first group of heat exchange channels includes at least two first heat exchange channels; The dimension of the first heat exchange channel in the fifth direction is larger than the dimension of the first heat exchange channel in the thickness direction of the first body; wherein, the fifth direction is different from the thickness direction of the first body; and / or, The dimension of the heat-conducting component in the sixth direction is larger than the dimension of the heat-conducting component in the thickness direction of the first body, wherein the sixth direction is different from the thickness direction of the first body; The electronic device further includes: The second body is rotatably connected to the first body; An input component or a first display component is disposed on the outside of the first body; A second display component is disposed on the outside of the second body; and / or, The electronic device further includes: The load-bearing component is plate-shaped; The first heating element and the functional element are spaced apart on the support member, and the driving element is disposed in a seventh direction on the side of the support member close to the first set of heat exchange channels; the seventh direction is perpendicular to the thickness direction of the support member.

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