Liquid collecting device for substrate cleaning device and substrate cleaning device
By setting up multiple liquid chambers and a chamber wall cleaning device inside the wafer cleaning machine container, and using high-temperature cleaning fluid and bubble deionized water spray, the problem of transferring deposits from the chamber wall to the wafer is solved, thus improving the cleaning effect and yield.
Patent Information
- Application Number
- CN202423188882.7
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-12-24
- Publication Date
- 2025-12-23
- Estimated Expiration
- 2034-12-24
AI Technical Summary
In existing wafer cleaning machines, stubborn byproducts and crystals easily adhere to the container walls, making them difficult to clean with room-temperature water droplets. This causes the deposits on the container walls to transfer to the wafers after cleaning, resulting in yield loss.
Multiple drainage chambers are set up inside the container, and a chamber wall cleaning device is installed in each drainage chamber. High-temperature cleaning liquid or deionized water with bubbles is sprayed onto the chamber wall using a spray device. Combined with nitrogen atomization and a megasonic wave generator, the chamber wall is cleaned efficiently.
It effectively removes byproducts and crystals from the cavity wall, preventing them from transferring to the wafer, thus improving the cleaning effect and reducing yield loss.
Smart Images
Figure CN223698648U_ABST
Abstract
Description
TECHNICAL FIELD
[0001] The utility model relates to the technical field of substrate cleaning, and the substrate is such as wafer, and particularly relates to a liquid collecting device for a substrate cleaning device and the substrate cleaning device. BACKGROUND
[0002] The wafer single-piece cleaning machine is an important equipment in the semiconductor manufacturing process, and is mainly used for cleaning and drying the wafers after wet chemical treatment. The equipment is widely used in the semiconductor industry, especially in the cleaning, photoetching, etching and other process steps of the wafer. The wafer single-piece cleaning machine comprises a container, a rotating base arranged in the container and a mechanical arm arranged above the container. The bottom of the container is provided with a liquid discharge mechanism. The cleaning process of the wafer single-piece cleaning machine is as follows: the wafer is clamped on the rotating base, the nozzle on the mechanical arm sprays deionized water (DIW) on the surface of the wafer, the wafer rotates under the driving of the rotating base, and the rotating centrifugal force throws water droplets to the cavity wall of the container, so as to remove the particles left on the surface of the wafer in the previous process step. The liquid in the container flows to the bottom of the container and is discharged by the liquid discharge mechanism.
[0003] The container in the wafer single-piece cleaning machine is a semi-closed structure. The by-products and crystals generated in the cleaning of the wafer (mainly including the particles left on the surface of the wafer in the previous process step) are easily attached to the cavity wall of the container and are relatively stubborn. The by-products and crystals can be photoresist residues, ammonia crystals, micro-particles after chemical mechanical polishing, or crystals generated after the vaporization of sulfuric acid in the cleaning cavity, etc. The main reasons are as follows: on the one hand, the water droplets thrown by the rotating base usually are normal temperature negative ion water or ultrapure water, which cannot clean the attached by-products and crystals, because the by-products and crystals need high temperature or special chemical liquid to remove; on the other hand, the angle of the water droplets thrown by the rotating base is limited, and cannot completely cover the cavity wall of the container. Therefore, after cleaning a large number of wafers, many by-products and crystals are attached to the cavity wall of the container. There is a high probability that the by-products and crystals are transferred to the wafer during the cleaning process, causing yield defects (such as hemispherical defects, particles or micro-particles on the surface of the wafer) of an indefinite degree, resulting in yield loss.
[0004] Therefore, it is necessary to design a container for the wafer single-piece cleaning machine which can be cleaned. UTILITY MODEL CONTENTS
[0005] The utility model aims at providing a liquid collecting device for a substrate cleaning device and the substrate cleaning device, which can clean the cavity wall in the container of the liquid collecting device, avoid the attachment of particles to the cavity wall of the container, and then be transferred to the substrate (such as wafer), causing yield loss.
[0006] The utility model provides a kind of liquid collecting device for substrate cleaning device, the liquid collecting device includes container and rotatable pedestal for being placed in container can bear substrate, the inner cavity of the container is separated into at least two drainage cavities from inside to outside, the bottom of each drainage cavity has drainage port, the rotatable pedestal is located in the innermost drainage cavity and all drainage cavities are provided with opening above the rotatable pedestal, at least one the drainage cavity is equipped with cavity wall cleaning device, the cavity wall cleaning device includes mounting bracket and is placed on the injection device of mounting bracket, the nozzle of the injection device is arranged towards the cavity wall of the drainage cavity, the injection device is connected with pipeline, and the pipeline is used to be connected with cleaning fluid supply assembly located outside the container.
[0007] Preferably, the cleaning fluid supply assembly includes a nitrogen delivery tube and a liquid delivery tube, both of which are connected to the pipeline, and the liquid delivered by the liquid delivery tube is deionized water or a mixture of deionized water and carbon dioxide.
[0008] Preferably, the cleaning fluid supply assembly further includes a heating device for heating the liquid in the liquid delivery tube.
[0009] Preferably, the cleaning fluid supply assembly includes a megasonic generator and a deionized water delivery tube, which is connected to the pipeline after passing through the megasonic generator.
[0010] Preferably, the cleaning fluid supply assembly includes a control assembly that controls the on-off and delivery flow rate of the nitrogen delivery tube and the liquid delivery tube, and / or controls the on-off of the megasonic generator and the deionized water delivery tube.
[0011] Preferably, the mounting bracket is composed of multiple connection plates that can be detachably connected, and multiple mounting holes are provided on the connection plates, and the injection devices are arranged in some or all of the mounting holes.
[0012] Preferably, the cleaning fluid supply assembly includes a nitrogen and liquid delivery pipeline and a deionized water delivery tube provided with a megasonic generator, and the liquid delivered in the nitrogen and liquid delivery pipeline is deionized water or a mixture of deionized water and carbon dioxide; part of all injection devices are connected to the nitrogen and liquid delivery pipeline, and the remaining part of all injection devices are connected to the deionized water delivery tube.
[0013] Preferably, the cavity wall cleaning device is provided in each drainage cavity.
[0014] Preferably, the nozzle is rotatably arranged in the injection device.
[0015] The utility model discloses still provide a kind of substrate cleaning device, the substrate cleaning device includes injection arm and the liquid collection device as any one described above, the injection arm is equipped with spout, the injection arm is located above the container and the injection path of the spout is through the opening on the container to the rotating base.
[0016] The substrate cleaning device of the utility model has the following beneficial effects: the cavity wall cleaning device is arranged in the container, the cleaning liquid can be directly sprayed to the cavity wall through the nozzle, so that the by-products and crystals on the cavity wall are eliminated, the cavity wall is kept clean, and the by-products and crystals are prevented from being transferred to the substrate (such as a wafer) along with the cleaning process, causing yield loss of the substrate. BRIEF DESCRIPTION OF DRAWINGS
[0017] Figure 1 An embodiment of the liquid collection device for the substrate cleaning device of the utility model is shown.
[0018] Figure 2 An embodiment of the spraying device is shown.
[0019] Figure 3 Another embodiment of the spraying device is shown.
[0020] Figure 4 An embodiment of the connecting plate is shown.
[0021] Figure 5 An embodiment of the substrate cleaning device of the utility model is shown. DETAILED DESCRIPTION
[0022] To make the purpose, technical scheme and advantages of the embodiments of the utility model clearer, the technical scheme in the embodiments of the utility model will be described clearly and completely below. Obviously, the described embodiments are part of the embodiments of the utility model, not all the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by those skilled in the art without creative labor belong to the scope of protection of the utility model. Unless otherwise defined, the technical terms or scientific terms used herein should be the usual meaning understood by those skilled in the art in the field of the utility model. The "includes" and similar words used in this paper mean that the elements or objects before the word cover the elements or objects listed after the word and their equivalents, without excluding other elements or objects.
[0023] The embodiments of the utility model provide a liquid collection device for substrate cleaning device, such as Figure 1As shown, the liquid collecting device comprises a container 1 and a rotating base 2 for carrying a substrate (in this embodiment, a wafer) in the container 1, the inner cavity of the container 1 is divided into at least two liquid discharging cavities from inside to outside in the radial direction, in this embodiment, a partition 11 is arranged in the container to divide the container into two liquid discharging cavities 101, 102, each of the liquid discharging cavities 101, 102 has a liquid discharging port (not shown), the rotating base 2 is located in the innermost liquid discharging cavity 102 and all the liquid discharging cavities 101, 102 are provided with openings above the rotating base 2, at least one of the liquid discharging cavities 101, 102 is provided with a cavity wall cleaning device, the cavity wall cleaning device comprises a mounting frame 3 and a spraying device arranged on the mounting frame 3, the nozzle of the spraying device 4 is arranged towards the cavity wall of the liquid discharging cavity, the spraying device 4 is connected with a pipeline, and the pipeline is connected with a cleaning liquid supply assembly located outside the container. The substrate cleaning device of this embodiment has a container 1 with multiple liquid discharging cavities 101, 102, which is mainly used to collect different cleaning liquids through different liquid discharging cavities according to the wafer cleaning process. In this embodiment, the cavity wall cleaning device is arranged, the nozzle of the spraying device 4 sprays cleaning liquid towards the cavity wall of the liquid discharging cavity, and the cavity wall of each liquid discharging cavity 101, 102 is cleaned, the cleaning liquid is collected and discharged from the liquid discharging port at the bottom of each liquid discharging cavity, thereby avoiding the adhesion of by-products and crystals A on the cavity wall in the cleaning process. In this embodiment, the by-products and crystals A can be photoresist residues, ammonia crystals, small particles after chemical mechanical polishing, or crystals generated after sulfuric acid vaporization in the cleaning cavity, etc., the cavity wall is kept clean, and the by-products and crystals A are prevented from being transferred to the substrate (such as a wafer) during the cleaning process, causing yield loss of the substrate.
[0024] In order to better clean the by-products and crystals easily adhered to the cavity wall, an embodiment of the cleaning liquid supply assembly is shown in Figure 2 The cleaning liquid supply assembly comprises a nitrogen delivery pipe and a liquid delivery pipe, both of which are connected with the pipeline, the nitrogen and the liquid are combined to make the spraying device 4 spray atomized liquid uniformly to the cavity wall of the liquid discharging cavity, and the by-products and crystals A are effectively removed. In this embodiment, the liquid delivered by the liquid delivery pipe is deionized water, or a mixture of deionized water and carbon dioxide, or a chemical liquid (such as hydrogen peroxide). More preferably, the cleaning liquid supply assembly further comprises a heating device for heating the liquid in the liquid delivery pipe, and the removal rate of the crystals can be improved by increasing the temperature of the liquid. The above-mentioned cleaning liquid supply assembly can further comprise a control assembly for controlling the on-off and delivery flow rate of the nitrogen delivery pipe and the liquid delivery pipe, so as to adjust the atomization intensity. In addition, the cleaning intensity can be set according to the nitrogen flow rate, and the greater the nitrogen flow rate, the stronger the cleaning intensity.
[0025] Another embodiment of the cleaning liquid supply assembly is shown in Figure 3As shown, the cleaning liquid supply assembly comprises a megasonic generator 5 and a deionized water delivery pipe, the deionized water delivery pipe is connected to the pipeline after passing through the megasonic generator 5, the deionized water in the deionized water delivery pipe is converted into deionized water containing bubbles after passing through the megasonic generator 5, the bubbles can act on the cavity wall to break and thus the impact force generated can effectively remove the ultrafine crystals attached to the cavity wall. The above-mentioned cleaning liquid supply assembly can also comprise a control assembly, which controls the opening and closing of the megasonic generator and the on-off of the deionized water delivery pipe, and realizes automatic control of the cavity wall cleaning.
[0026] Another embodiment of the cleaning liquid supply assembly, the cleaning liquid supply assembly comprises the structure in the above two embodiments, that is, part of the spraying device 4 is connected to the nitrogen delivery pipe and the liquid delivery pipe, the nozzles of this part spray atomized liquid to form the first cleaning mode; the remaining part of the spraying device 4 is connected to the deionized water delivery pipe with the megasonic generator 5, the nozzles of this part spray deionized water containing bubbles to form the second cleaning mode. When cleaning the cavity wall, different cleaning modes can be used according to needs, or both modes can be used for cleaning at the same time. Specifically, the above-mentioned cleaning liquid supply assembly can also comprise a control assembly, which controls the on-off of the nitrogen delivery pipe and the liquid delivery pipe and the delivery flow rate, and controls the opening and closing of the megasonic generator and the on-off of the deionized water delivery pipe. Through the setting of the control assembly, the cleaning mode can be selected and switched, or both cleaning modes can be synchronized to improve the efficient removal of by-products and crystals.
[0027] In order to facilitate the installation of the above-mentioned spraying device, as shown in Figure 4 and Figure 5 , the mounting frame 3 in this embodiment is composed of multiple detachably connected connecting plates 31, 32, wherein multiple mounting holes 301 are provided on the connecting plates 31, 32, and part or all of the mounting holes 301 are provided with spraying devices 4. Through the setting of the mounting holes 301, the spraying devices 4 can be flexibly installed, such as according to the detection of the attachments on the cavity wall in the container, determining the positions of the cavity wall that are easy to attach, and setting the nozzles to aim at these positions. In addition, the mounting frame 3 can be adjusted through the detachably connected connecting plates 31, 32, such as two, three or more connecting plates 31, 32, which can specifically include a first connecting plate installed vertically, a second connecting plate installed obliquely on the first connecting plate, and a third connecting plate connected horizontally on the second connecting plate, and the third connecting plate can be selectively provided. In this way, the height of the mounting frame 3 in the container 1 and the inclination relative to the center line of the container can be adjusted, which is convenient for setting the angle of the nozzles in the spraying device to achieve better coverage and cleaning of the cavity wall.
[0028] More preferably, the nozzles of the above-mentioned spraying device 4 can be rotatably provided to flexibly adjust the spraying angle and increase the spraying area. In order to efficiently clean the cavity walls of each row of liquid cavities, as shown in Figure 5As shown in the drawings, the cavity wall cleaning device is arranged in each of the liquid discharge cavities 101, 102, or only in the liquid discharge cavities in which the by-products and the crystals are more likely to adhere to the cavity walls, or is arranged in a form that is adjustable in height (for example, the connecting plates 31, 32 can be driven to move relative to each other by a driving mechanism to increase the length or height of the mounting frame) through the mounting frame 3, so that the cavity walls of the liquid discharge cavities can be cleaned, and the number of the cavity wall cleaning devices is not limited.
[0029] The utility model discloses still provide a kind of substrate cleaning device, see Figure 5 As shown in the drawings, the substrate cleaning device includes a spray arm 7 and a liquid collection device according to any one of the above, the spray arm 7 is provided with a spray port, and the spray arm 7 is located above the container and the spray path of the spray port passes through the opening on the container to the rotating base 2. When the substrate cleaning device of the present embodiment is used to clean the wafer, the spray port on the spray arm 7 sprays cleaning liquid, the rotating base 2 drives the wafer 6 to rotate, and the rotating centrifugal force throws the cleaning liquid onto the cavity walls of the liquid discharge cavities 101, 102, so that the by-products and the crystals A in the cleaning liquid are easily attached to the cavity walls. In the present embodiment, the cavity wall cleaning device is operated to make the spray nozzles in the spray device spray cleaning liquid towards the cavity walls. The cleaning liquid can be atomized liquid containing nitrogen gas, and the atomized liquid can be deionized water, deionized water containing carbon dioxide or other chemical liquids, or the cleaning liquid is deionized water with bubbles. The cleaning liquid is used to remove the by-products and the crystals A on the cavity walls.
[0030] In one embodiment, the cavity wall cleaning device is arranged in each of the liquid discharge cavities 101, 102, part of the spray devices sprays atomized liquid containing nitrogen gas, and the remaining spray devices sprays deionized water with bubbles.
[0031] Although the embodiments of the utility model have been described in detail above, it is obvious for those skilled in the art that various modifications and changes can be made to these embodiments. However, it should be understood that such modifications and changes are within the scope and spirit of the utility model in the claims. Moreover, the utility model described herein can have other embodiments, and can be implemented or realized in various ways.
Claims
1. A liquid collecting device for a substrate cleaning apparatus, said liquid collecting device comprising a container and a rotary susceptor for carrying a substrate disposed in the container, an inner space of said container is divided into at least two drain chambers from inside to outside, a bottom of each drain chamber has a drain port, said rotary susceptor is located in the innermost drain chamber and all the drain chambers are provided with openings above said rotary susceptor, characterized in that, At least one of the liquid discharge chambers is provided with a chamber wall cleaning device, which comprises a mounting frame and a spraying device arranged on the mounting frame, a nozzle of the spraying device is arranged towards the chamber wall of the liquid discharge chamber, the spraying device is connected with a pipeline, and the pipeline is used to connect with a cleaning liquid supply assembly arranged outside the container.
2. The liquid collector device of claim 1, wherein: The cleaning liquid supply assembly comprises a nitrogen gas delivery pipe and a liquid delivery pipe, both of which are connected with the pipeline, and the liquid delivered by the liquid delivery pipe is deionized water or a mixture of deionized water and carbon dioxide.
3. The liquid collector device of claim 2, wherein: The cleaning liquid supply assembly further comprises a heating device for heating the liquid in the liquid delivery pipe.
4. The liquid collector of claim 2, wherein: The cleaning liquid supply assembly comprises a megasonic generator and a deionized water delivery pipe, which is connected with the pipeline via the megasonic generator.
5. The liquid collector device of claim 4, wherein: The cleaning liquid supply assembly comprises a control assembly, which controls the on-off and delivery flow rate of the nitrogen gas delivery pipe and the liquid delivery pipe, and / or controls the on-off of the megasonic generator and the deionized water delivery pipe.
6. The liquid collector of claim 1, wherein: The mounting frame is composed of multiple detachably connected connection plates, multiple mounting holes are arranged on the connection plates, and the spraying device is arranged in part or all of the mounting holes.
7. The liquid collector device of claim 6, wherein: The cleaning liquid supply assembly comprises a nitrogen gas and liquid delivery pipeline and a deionized water delivery pipe provided with a megasonic generator, the liquid delivered in the nitrogen gas and liquid delivery pipeline is deionized water or a mixture of deionized water and carbon dioxide, part of all the spraying devices are connected with the nitrogen gas and liquid delivery pipeline, and the remaining part of all the spraying devices are connected with the deionized water delivery pipe.
8. The liquid collection device of claim 1, wherein: The chamber wall cleaning device is arranged in each of the liquid discharge chambers.
9. The liquid collection device of claim 1, wherein: The nozzle is rotatably arranged in the spraying device.
10. A substrate cleaning apparatus, characterized by: The substrate cleaning device comprises a spraying arm and the liquid collecting device according to any one of claims 1 to 9, a spout is arranged on the spraying arm, the spraying arm is arranged above the container, and a spraying path of the spout passes through the opening on the container to the rotary base.