Laser degumming equipment

Abstract

The embodiment of the utility model relates to the technical field of glue removing equipment, and discloses laser glue removing equipment which comprises a base, a conveying mechanism, a laser glue removing assembly and a shading sheet, the conveying mechanism is arranged on the base and is used for sequentially conveying to-be-degummed pieces with glue films to preset positions; the laser degumming assembly and the anti-dazzling screen are arranged above the preset position of the conveying mechanism, and when the part to be degummed is conveyed to the preset position, laser emitted by the laser degumming assembly passes through the anti-dazzling screen and then degummed on the part to be degummed. According to the embodiment of the utility model, the glue removing efficiency and precision can be improved, and the product quality can be improved.

Description

TECHNICAL FIELD

[0001] The embodiment of the utility model relates to the technical field of laser glue removing, and particularly relates to a laser glue removing equipment. BACKGROUND

[0002] At present, many electronic processing parts are pasted with a layer of protective film to protect them, and during processing, the corresponding position film on the processing part is removed using a chemical solution, for example, an LED epoxy molding compound (EMC) support is processed by alloy copper material in the production process, and is suitable for packaging of LED medium and high power lamp beads. The LED EMC support is usually processed by metal etching in the production process to ensure processing progress. Metal etching, also known as photochemical metal etching, refers to removing the protective film of the area to be metal etched after exposure and development, so that the area contacts the chemical solution, achieves the effect of dissolution and corrosion, and forms the effect of concave-convex or hollow forming. The inventor found in the research and development that the chemical corrosion method has low glue removing precision and efficiency, and the base material is easily damaged during the glue removing process. SUMMARY

[0003] In view of the above problems, the embodiment of the utility model provides a laser glue removing equipment.

[0004] According to one aspect of the embodiment of the utility model, a laser glue removing equipment is provided, which comprises a base, a conveying mechanism, a laser glue removing assembly and a light shield;

[0005] The conveying mechanism is arranged on the base and is used for conveying the glue film having a glue removing part to a predetermined position in sequence;

[0006] The laser glue removing assembly and the light shield are arranged above the predetermined position of the conveying mechanism, when the glue removing part is conveyed to the predetermined position, the laser emitted by the laser glue removing assembly removes the glue of the glue removing part through the light shield.

[0007] In an optional mode, the conveying mechanism comprises a stepping assembly, a conveying belt and a plurality of installation assemblies, the conveying belt is sleeved on the stepping assembly, and a plurality of the installation assemblies are detachably installed on the conveying belt, and the installation assembly is used for placing the glue removing part.

[0008] In an optional mode, a plurality of first clamping blocks are arranged on the conveying belt, a first clamping groove is arranged below the installation assembly, and the first clamping block is clamped into the first clamping groove.

[0009] In an alternative mode, the first clamping block is a T-shaped strip, the shape of the first clamping slot matches the shape of the first clamping block, and the first clamping block is clamped into the first clamping slot by sliding.

[0010] In an alternative mode, the mounting assembly comprises a mounting plate and a positioning plate, the positioning plate is detachably mounted on the mounting plate, a recess for placing the glue-removing object is arranged above the positioning plate, the size and shape of the recess match the size and shape of the glue-removing object, and the first clamping slot is arranged below the mounting plate.

[0011] In an alternative mode, the mounting plate and the positioning plate are both square plates, one side above the mounting plate is provided with an elastic clamping hook, the opposite side above the mounting plate is provided with a second clamping slot, one side below the positioning plate is provided with a second clamping block, the second clamping block is clamped into the elastic clamping hook, the opposite side below the positioning plate is provided with a third clamping block, and the third clamping block is clamped into the second clamping slot.

[0012] In an alternative mode, a support is further arranged on the base and across the stepping assembly, and a mounting rack is arranged above the support.

[0013] The laser glue-removing assembly is arranged on the mounting rack, and the laser glue-removing assembly comprises a laser generator, a lifting assembly and a sliding plate, the laser generator and the sliding plate are both arranged on the lifting assembly and can slide up and down in the vertical direction, the light-shielding sheet is arranged on the sliding plate, and two ends below the sliding plate are provided with positioning blocks, and the mounting plate is provided with positioning slots corresponding to the positioning blocks.

[0014] In an alternative mode, the shape of the positioning slot is wide at the top and narrow at the bottom, and the shape of the positioning block matches the shape of the positioning slot.

[0015] In an alternative mode, the lifting assembly comprises a lifting pump, a fixed plate, a fixed rod and a spring, the lifting pump comprises a lifting shaft, the lifting pump is fixedly arranged above the mounting rack, the fixed plate is arranged below the lifting shaft, and the laser generator is arranged below the fixed plate.

[0016] The fixed rod comprises two, the two fixed rods are arranged on the mounting rack and vertically arranged on both sides of the conveying belt, both ends of the fixed plate and both ends of the sliding plate are provided with through holes, and the through holes of both ends of the fixed plate and both ends of the sliding plate are sleeved on the corresponding fixed rods.

[0017] The spring comprises two, one spring is sleeved on the lower part of each fixed rod, the top end of the spring is higher than the horizontal plane above the positioning plate, and the sliding plate is arranged above the spring.

[0018] In an alternative mode, a circular sleeve is arranged below the through hole at each end of the sliding plate, and the diameter of the sleeve is smaller than the diameter of the spring.

[0019] The embodiment sequentially conveys the glue-removing workpiece to the predetermined position through the conveying mechanism, and the glue-removing efficiency is high. The glue-removing workpiece is removed by the laser glue-removing assembly and the light shield, the precision of laser ablation glue removal is high, and the substrate can be effectively protected, so that the product quality and the glue-removing speed can be improved.

[0020] The above description is only a summary of the technical scheme of the present application, in order to more clearly understand the technical means of the present application, the specific embodiments of the present application can be implemented according to the content of the specification, and in order to make the above and other purposes, characteristics and advantages of the present application more obvious and easy to understand, the following specific embodiments of the present application are described. BRIEF DESCRIPTION OF DRAWINGS

[0021] Various other advantages and benefits will become apparent to those of ordinary skill in the art upon reading the following detailed description of the preferred embodiments. The accompanying drawings are included to provide a description of the preferred embodiments and are not meant to limit the present application. Furthermore, the same reference numerals are used throughout the several drawings to refer to same or like parts. In the drawings:

[0022] Figure 1 A perspective view of the laser glue-removing equipment according to an embodiment of the present application is shown;

[0023] Figure 2 A cross-sectional view of the laser glue-removing equipment according to an embodiment of the present application is shown;

[0024] Figure 3 A structure diagram of a conveying belt in the laser glue-removing equipment according to an embodiment of the present application is shown;

[0025] Figure 4 A cross-sectional view of the laser glue-removing equipment according to an embodiment of the present application is shown;

[0026] Figure 5 A structure diagram of a mounting assembly of the laser glue-removing equipment according to an embodiment of the present application is shown;

[0027] Figure 6 A structure diagram of a mounting plate of the laser glue-removing equipment according to an embodiment of the present application is shown;

[0028] Figure 7 A structure diagram of a positioning plate of the laser glue-removing equipment according to an embodiment of the present application is shown;

[0029] Figure 8 A structure diagram of a sliding plate of the laser glue-removing equipment according to an embodiment of the present application is shown.

[0030] The reference numerals in the detailed embodiments are as follows:

[0031] Base 1; Conveying mechanism 2; Laser adhesive removal assembly 3; Light shield 4; Stepper assembly 21; Conveyor belt 22; Mounting assembly 23; Stepper 211; Stepper bracket 212; Roller 2121; Rotating shaft 2122; First locking block 221; First locking groove 231; Mounting plate 232; Positioning plate 233; Groove 2331; Elastic hook 2321; Second locking groove 2322; Second locking block 2332; Third locking block 2333; Bracket 5; Mounting frame 51; Laser generator 31; Lifting assembly 32; Sliding plate 33; Positioning block 331; Sleeve 332; Positioning groove 2323; Lifting pump 321; Fixing plate 322; Fixing rod 323; Spring 324; Lifting shaft 3211. Detailed Implementation

[0032] The embodiments of the present invention will now be described in detail with reference to the accompanying drawings. These embodiments are merely illustrative of the present invention and should not be construed as limiting the scope of protection of the present invention.

[0033] Please see Figures 1-4 , Figure 1 A perspective view of the laser adhesive removal device according to an embodiment of the present invention is shown. Figure 2 A cross-sectional view of the laser adhesive removal device according to an embodiment of the present invention is shown. Figure 3 This diagram illustrates the structure of the conveyor belt in the laser adhesive removal device according to an embodiment of the present invention. Figure 4 A cross-sectional view of a laser adhesive removal device according to an embodiment of the present invention is shown. The laser adhesive removal device includes a base 1, a conveying mechanism 2, a laser adhesive removal component 3, and a light-shielding plate 4. The conveying mechanism 2 is disposed on the base 1 and is used to sequentially convey parts with adhesive film to be removed to a predetermined position. Optionally, the conveying mechanism 2 includes a power device such as a motor and a conveyor belt. The conveyor belt is driven by the motor, and the parts to be removed are placed on the conveyor belt. The power device such as the motor drives the conveyor belt to move the parts to be removed to the predetermined position. The laser adhesive removal component 3 and the light-shielding plate 4 are disposed above the predetermined position of the conveying mechanism 2. The light-shielding plate 4 is designed according to the specifications of the parts to be removed. The light-shielding plate 4 can protect the parts to be removed from the light in the shaded areas, while the open areas can allow the laser to pass through. When the parts to be removed from the light are conveyed to the predetermined position, the laser adhesive removal component 3 emits a laser. After the laser is shielded by the light-shielding plate 4, it removes the adhesive from the parts to be removed. Thus, the protective adhesive film on the surface of the parts to be removed can be removed by laser to obtain a product with raised or hollowed-out shapes.

[0034] It can be understood that the laser adhesive removal assembly 3 and the light shield 4 can be fixed above the predetermined position, and the laser adhesive removal assembly 3, the light shield 4 and the adhesive removal piece are close to each other. When the adhesive removal piece is conveyed to the predetermined position, the laser is emitted to perform laser adhesive removal. When the adhesive removal of the adhesive removal piece is completed, the laser is turned off, and the product after the adhesive removal is conveyed away from the predetermined position, and the next adhesive removal piece is conveyed. The laser adhesive removal assembly 3 and the light shield 4 can also be arranged in a movable manner. When the adhesive removal piece is conveyed to the predetermined position, the laser adhesive removal assembly 3 and the light shield 4 move downward and close to the adhesive removal piece, and the laser is emitted to perform laser adhesive removal. When the adhesive removal of the adhesive removal piece is completed, the laser is turned off, and the laser adhesive removal assembly 3 and the light shield 4 move upward and away from the adhesive removal piece. The product after the adhesive removal is conveyed away from the predetermined position, and the next adhesive removal piece is conveyed. In this way, the next adhesive removal piece is conveyed.

[0035] The embodiment conveys the adhesive removal piece to the predetermined position through the conveying mechanism 2, has high adhesive removal efficiency, removes the adhesive from the adhesive removal piece through the laser adhesive removal assembly 3 and the light shield 4, has high precision in laser ablation adhesive removal, and can effectively protect the substrate. The product quality and the adhesive removal speed can be effectively improved.

[0036] Optionally, the conveying mechanism 2 includes a stepping assembly 21, a conveying belt 22 and a plurality of installation assemblies 23. The stepping assembly 21 includes a stepping motor 211. The stepping motor 211 is a motor that operates at a fixed angle. The stepping motor 211 moves one step every time an electric pulse is input. The stepping motor 211 can control the translational motion with high precision requirements. The conveying belt 22 is sleeved on the stepping motor 211. The plurality of installation assemblies 23 are installed on the conveying belt 22. Each installation assembly 23 can place one adhesive removal piece. The adhesive removal piece is accurately conveyed to the preset position through the stepping motor 211, the conveying belt 22 and the installation assembly 23, so as to improve the adhesive removal precision. In addition, the installation assembly 23 is detachably installed on the conveying belt 22. For different specifications (for example, different sizes and shapes) of the adhesive removal piece, the laser adhesive removal equipment can be widely applied by replacing the installation assembly 23 and the light shield 4 of the corresponding specification. The adhesive removal piece of different specifications is removed, so that the laser adhesive removal equipment is a universal adhesive removal equipment. Figure 1 Figure 4 As shown in FIGS. 21 and 22, the stepping assembly 21 further includes a stepping bracket 212. The stepping bracket 212 includes a rotating shaft 2122. The rotating shaft 2122 is provided with a roller 2121. In addition, the stepping motor 211 also includes a rotating shaft. The rotating shaft is also provided with a roller. The conveying belt 22 is sleeved on the two rollers and rotates under the driving of the stepping motor 211.

[0037] ​The first clamping block 221 is arranged on the conveying belt 22, and the first clamping groove 231 is arranged below each mounting assembly 23. The first clamping block 221 of the conveying belt 22 is clamped into the first clamping groove 231 of the mounting assembly 23, so that the mounting assembly 23 is detachably mounted on the conveying belt 22. This mounting method is stable and fast. The embodiment is not limited to the above-mentioned method of clamping the first clamping block 221 into the first clamping groove 231 to realize the detachable mounting of the mounting assembly 23. Other methods of detachable connection of parts can also be used, for example, the mounting assembly 23 can be detachably mounted on the conveying belt 22 by means of screws, and the like.

[0038] In an embodiment, the first clamping block 221 is a T-shaped strip, and the shape of the first clamping groove 231 matches that of the first clamping block 221, which is also a T-shaped slot. Before using the laser adhesive removal device to remove the adhesive, the first clamping block 221 is clamped into the first clamping groove 231 by sliding, and the mounting assembly 23 is mounted on the conveying belt 22. After using the laser adhesive removal device to remove the adhesive, the mounting assembly 23 is slid to make the first clamping block 221 slide out of the first clamping groove 231, so that different specifications of the mounting assembly 23 can be replaced.

[0039] In an embodiment, in combination with reference to Figures 5 to 7 The mounting assembly 23 includes a mounting plate 232 and a positioning plate 233, and the positioning plate 233 is detachably mounted on the mounting plate 232. The positioning plate 233 is provided with a recess 2331 for placing the adhesive removal part above the positioning plate 233. The size and shape of the recess 2331 match those of the adhesive removal part, and one adhesive removal part is placed in each recess 2331 of the positioning plate 233. The first clamping groove 231 is arranged below the mounting plate 232. Before using the laser adhesive removal device to remove the adhesive, the appropriate light-shielding piece 4 and positioning plate 233 are selected according to the specification of the adhesive removal part, the positioning plate 233 is mounted on the mounting plate 232, the adhesive removal part is placed in the recess 2331, and the adhesive removal part is conveyed to a predetermined position for laser adhesive removal.

[0040] Optionally, the positioning plate 233 is clamped on the mounting plate 232, and other detachable mounting modes of the positioning plate 233 on the mounting plate 232 can also be adopted, for example, the mounting can also be achieved by means of screws, which is not limited herein. For the detachable mounting mode of the positioning plate 233 clamped on the mounting plate 232, the mounting plate 232 and the positioning plate 233 are both square plates, one side of the upper portion of the mounting plate 232 is provided with an elastic clamping hook 2321, the opposite side of the upper portion of the mounting plate 232 is provided with a second clamping groove 2322, one side of the lower portion of the positioning plate 233 is provided with a second clamping block 2332, the second clamping block 2332 is clamped into the elastic clamping hook 2321, the opposite side of the lower portion of the positioning plate 233 is provided with a third clamping block 2333, the third clamping block 2333 is clamped into the second clamping groove 2322, and the positioning plate 233 is clamped on the mounting plate 232 in this way. Of course, the embodiment is not limited to the above-mentioned mode of clamping the clamping block into the elastic clamping hook 2321 and clamping the clamping block into the clamping groove, and other clamping modes of clamping the positioning plate 233 on the mounting plate 232 are also within the protection scope of the embodiment.

[0041] In an embodiment, the laser adhesive removal device further comprises a support 5 arranged on the base 1 and crossing the stepping assembly 21; the support 5 is provided with a mounting rack 51 above, and the laser adhesive removal assembly 3 is arranged on the mounting rack 51 and above the predetermined position, the laser adhesive removal assembly 3 comprising a laser generator 31, a lifting assembly 32 and a sliding plate 33, the laser generator 31 and the sliding plate 33 are both arranged on the lifting assembly 32 and can slide up and down in the vertical direction, and the laser generator 31 is provided with a laser emitter 311, and the sliding plate 33 is provided with a light-shielding piece 4 above. Figure 8 The light-shielding piece 4 is arranged on the sliding plate 33, and both ends of the lower portion of the sliding plate 33 are provided with positioning blocks 331, and the upper portion of the mounting plate 232 is provided with positioning grooves 2323 at positions corresponding to the positioning blocks 331.

[0042] After the corresponding specification of the light-shielding piece 4 is selected, the light-shielding piece 4 is mounted on the sliding plate 33, when the adhesive removal part is conveyed to the predetermined position, the laser generator 31 and the sliding plate 33 are driven by the lifting assembly 32 and slide downward, after the positioning blocks 331 of the sliding plate 33 are inserted into the positioning grooves 2323 of the mounting plate 232, the light-shielding piece 4 is pressed and adheres to the adhesive removal part, the laser generator 31 emits laser to perform laser ablation on the adhesive film on the surface of the adhesive removal part, after the adhesive removal is completed, the laser is turned off, the laser generator 31 and the sliding plate 33 are driven by the lifting assembly 32 and slide upward, and the positioning blocks 331 are inserted into the positioning grooves 2323, so that the positioning and calibration of the light-shielding piece 4 and the adhesive removal part can be achieved, thereby further improving the precision of the adhesive removal.

[0043] Optionally, the shape of the positioning groove 2323 is wide at the upper portion and narrow at the lower portion, for example, a trapezoidal shape, and the shape of the positioning block 331 matches that of the positioning groove 2323, which is also wide at the upper portion and narrow at the lower portion, and such shape can improve the positioning accuracy.

[0044] In an embodiment, the lifting assembly 32 comprises a lifting pump 321, a fixed plate 322, fixed rods 323 and springs 324, the lifting pump 321 can be a hydraulic lifting pump, the lifting pump 321 comprises a lifting shaft 3211, the lifting pump 321 is fixedly arranged above the mounting frame 51, the fixed plate 322 is arranged below the lifting shaft 3211, the laser generator 31 is arranged below the fixed plate 322; the fixed rods 323 comprise two, the two fixed rods 323 are arranged on the mounting frame 51 and vertically arranged on both sides of the conveying belt 22, both ends of the fixed plate 322 and both ends of the sliding plate 33 are provided with through holes, the through holes at both ends of the fixed plate 322 and the through holes at both ends of the sliding plate 33 are sleeved on the corresponding fixed rods 323, the springs 324 comprise two, one spring 324 is sleeved on the lower part of each fixed rod 323, the top end of the spring 324 is higher than the horizontal plane above the positioning plate 233, and the sliding plate 33 is arranged above the spring 324.

[0045] In the embodiment, when the glue-removing object is conveyed to the predetermined position, the lifting pump 321 works and the lifting shaft 3211 vertically moves downward, the lifting shaft 3211 drives the fixed plate 322 and the laser emitter to move downward, the laser emitter drives the sliding plate 33 to press downward, when the positioning block 331 of the sliding plate 33 is inserted into the positioning groove 2323 of the mounting plate 232, the spring 324 is compressed, the light shield 4 is pressed and adheres to the glue-removing object, the laser generator 31 emits laser for laser ablation, when the glue-removing is completed, the laser is turned off, the lifting shaft 3211 vertically moves upward, drives the fixed plate 322 and the laser emitter to move upward, at this time, the sliding plate 33 also moves upward under the elastic force of the spring 324, so that the light shield 4 is away from the glue-removing object, after the spring 324 is not compressed, since the top end of the spring 324 is higher than the horizontal plane above the positioning plate 233, there is a certain distance between the sliding plate 33 and the positioning plate 233, and the sliding plate 33 does not hinder the conveying of the glue-removing object. Optionally, the lower part of the through hole at each end of the sliding plate 33 is provided with a circular sleeve 332, and the diameter of the sleeve 332 is smaller than the diameter of the spring 324.

[0046] It should be noted that, unless otherwise specified, the technical terms or scientific terms used in the embodiments of the present application should be the usual meanings understood by the persons skilled in the art to which the embodiments of the present application belong.

[0047] In the description of the embodiments of the utility model, the orientation or positional relation indicated by the technical terms "center", "longitudinal", "transverse", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential" and the like is based on the orientation or positional relation shown in the drawings, which is only for the convenience of describing the embodiments of the utility model and simplifying the description, and does not indicate or imply that the devices or elements indicated must have a particular orientation, be constructed and operated in a particular orientation, and therefore cannot be understood as a limitation on the embodiments of the utility model.

[0048] In addition, the technical terms "first", "second" and the like are only for the purpose of description, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features.

[0049] In the description of the embodiments of the utility model, unless otherwise explicitly specified and limited, the technical terms "mounting", "connection", "connecting", "fixing" and the like should be understood in a broad sense, for example, can be fixed connection, can also be detachable connection, or integrated; can be mechanical connection, can also be electrical connection; can be directly connected, can also be indirectly connected through an intermediate medium, can be the communication inside two elements or the interaction relationship between two elements. For ordinary skilled in the art, the specific meaning of the above terms in the embodiments of the utility model can be understood according to the specific circumstances.

[0050] In the description of the embodiments of the utility model, unless otherwise explicitly specified and limited, the first feature "on" or "under" the second feature can be that the first and second features are in direct contact, or the first and second features are indirectly in contact through an intermediate medium. Moreover, the first feature "above", "over" and "on" the second feature can be that the first feature is directly above or obliquely above the second feature, or only indicates that the horizontal height of the first feature is higher than that of the second feature. The first feature "below", "under" and "under" the second feature can be that the first feature is directly below or obliquely below the second feature, or only indicates that the horizontal height of the first feature is less than that of the second feature.

[0051] It should be finally pointed out that: the above embodiments are only used to illustrate the technical solutions of the present application, but not limited to them; although the present application has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that: it can still modify the technical solutions recorded in the foregoing embodiments, or make equivalent replacement to part or all of the technical features; and these modifications or replacements do not make the essence of the corresponding technical solutions deviate from the scope of the technical solutions of the embodiments of the present application, and they should be covered in the scope of the claims and the specification of the present application. Especially, as long as there is no structural conflict, each technical feature mentioned in each embodiment can be combined in any way. The present application is not limited to the specific embodiments disclosed in the text, but includes all technical solutions falling within the scope of the claims.

Claims

1. A laser adhesive removal device, characterized in that, include: Base, conveying mechanism, laser adhesive removal assembly and light shield; The conveying mechanism is located on the base and is used to sequentially convey the parts with adhesive film to be removed to a predetermined position. The laser adhesive removal component and the light-shielding plate are positioned above the predetermined position of the conveying mechanism. When the part to be adhesive removed is conveyed to the predetermined position, the laser emitted by the laser adhesive removal component removes the adhesive from the part after passing through the light-shielding plate.

2. The laser adhesive removal equipment according to claim 1, characterized in that, The conveying mechanism includes a stepping component, a conveyor belt, and multiple sets of mounting components. The conveyor belt is sleeved on the stepping component, and the multiple sets of mounting components are detachably mounted on the conveyor belt. The mounting components are used to place the parts to be degummed.

3. The laser adhesive removal equipment according to claim 2, characterized in that, The conveyor belt is provided with a plurality of first card blocks, and the mounting component is provided with a first card slot below it, and the first card blocks are inserted into the first card slot.

4. The laser adhesive removal equipment according to claim 3, characterized in that, The first card block is a T-shaped strip, and the shape of the first card slot matches the shape of the first card block. The first card block is inserted into the first card slot by sliding.

5. The laser adhesive removal equipment according to claim 3 or 4, characterized in that, The mounting assembly includes a mounting plate and a positioning plate. The positioning plate is detachably mounted on the mounting plate. The positioning plate has a groove on its upper part for placing the part to be de-adhesive removed. The size and shape of the groove match the size and shape of the part to be de-adhesive removed. The first slot is located below the mounting plate.

6. The laser adhesive removal equipment according to claim 5, characterized in that, Both the mounting plate and the positioning plate are square plates. The mounting plate has an elastic hook on one side of its upper part and a second slot on the opposite side of its upper part. The positioning plate has a second block on one side of its lower part, which engages with the elastic hook. The positioning plate has a third block on the opposite side of its lower part, which engages with the second slot.

7. The laser adhesive removal equipment according to claim 6, characterized in that, It also includes a bracket, which is mounted on the base and spans the stepper assembly, and a mounting bracket is provided above the bracket; The laser adhesive removal assembly is mounted on the mounting frame. The laser adhesive removal assembly includes a laser generator, a lifting assembly, and a sliding plate. The laser generator and the sliding plate can be slidably mounted on the lifting assembly in a vertical direction. The light-shielding plate is mounted on the sliding plate. Positioning blocks are provided at both ends below the sliding plate. A positioning groove is provided on the upper part of the mounting plate at a position corresponding to the positioning block.

8. The laser adhesive removal equipment according to claim 7, characterized in that, The positioning groove is wider at the top and narrower at the bottom, and the shape of the positioning block matches the shape of the positioning groove.

9. The laser adhesive removal equipment according to claim 7, characterized in that, The lifting assembly includes a lifting pump, a fixing plate, a fixing rod, and a spring. The lifting pump includes a lifting shaft. The lifting pump is fixedly mounted above the mounting frame. The fixing plate is located below the lifting shaft. The laser generator is located below the fixing plate. The fixed rod includes two rods, which are mounted on the mounting frame and vertically positioned on both sides of the conveyor belt. Both ends of the fixed plate and both ends of the sliding plate are provided with through holes, and the through holes at both ends of the fixed plate and the sliding plate are fitted onto the corresponding fixed rods. The springs include two springs, with one spring sleeved on the lower part of each fixed rod. The top of each spring is higher than the horizontal plane above the positioning plate, and the sliding plate is located above the spring.

10. The laser adhesive removal equipment according to claim 9, characterized in that, Below the through holes at both ends of the sliding plate, there is an annular sleeve, the diameter of which is smaller than the diameter of the spring.

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