Semi-automatic laser marking equipment for scrap mark for PCB (Printed Circuit Board)

Abstract

The utility model discloses semi-automatic laser marking equipment for scrap marks for PCBs. The semi-automatic laser marking equipment comprises a rack; the overhaul stand is arranged on the rack, and the overhaul stand is arranged close to the PCB production line; the protective cylinder is movably arranged on the overhaul stand; and the laser device is arranged in the protective cylinder and provided with a laser head, and the laser head is located in the protective cylinder. A to-be-scrapped PCB is placed on the overhaul stand, the to-be-scrapped PCB is covered by the protective cylinder, at the moment, the laser is started, a wire on the to-be-scrapped PCB is burnt out, and a scrapping mark is printed on the to-be-scrapped PCB. The laser height can be fixed through the arrangement of the protective cylinder, and the situation that a product is burnt through or a wire is not cut off is avoided. Through the above steps, it can be ensured that the wires on the PCB to be scrapped are burnt out, it is ensured that the PCB to be scrapped cannot pass the conduction test, and therefore it is ensured that the PCB to be scrapped cannot flow into the subsequent process, and greater loss is avoided. And the operations of burnout of the wire and marking of the scrap label are simple, and the efficiency can be improved.

Description

TECHNICAL FIELD

[0001] The application relates to the technical field of laser marking, in particular to a semi-automatic laser marking device for scrap marking of PCBs. BACKGROUND

[0002] Defective products are generated in the production process of PCBs, and the defective PCBs need to be scrapped.

[0003] The traditional scrap method of PCBs is to transport the PCBs to be scrapped to a scrap point, and a special person uses a repair knife to scratch patterns and cut off the leads at the scrap point, so that the PCBs cannot pass the conduction test.

[0004] However, the traditional scrap method has the following problems: when the repair knife is used for scrap processing by manual operation, the leads are not completely cut off, the conduction test is still qualified, and the defective products flow into the subsequent process or even the customer, causing economic losses.

[0005] Therefore, it is urgent to provide a semi-automatic laser marking device for scrap marking of PCBs to ensure that the leads of the PCBs to be scrapped can be damaged. CONTENT OF THE INVENTION

[0006] The application provides a semi-automatic laser marking device for scrap marking of PCBs, which aims to solve the problem that in the prior art, the leads are not completely cut off by manual operation using a repair knife, the conduction test is still qualified, and the defective products flow into the subsequent process or even the customer, causing economic losses.

[0007] To achieve the above-mentioned purpose, the application provides a semi-automatic laser marking device for scrap marking of PCBs, which comprises: a rack; a maintenance table, which is arranged on the rack and is arranged close to a PCB production line; a protective cylinder, which is movably arranged on the maintenance table; and a laser, which is arranged in the protective cylinder and is provided with a laser head located in the protective cylinder.

[0008] In some embodiments, the device further comprises: a balance support, which is arranged on the maintenance table; a connecting plate, which is arranged on one end of the balance support away from the maintenance table; and an elastic member, one end of which is connected to the connecting plate, and the other end of which is connected to the laser.

[0009] In some embodiments, the device further comprises: a base, which is arranged on the maintenance table; an arm support, which is arranged on the base; a connecting arm, which is rotatably installed on the arm support; a power source, which is used to drive the connecting arm to rotate; and a rotating arm, one end of which is connected to the connecting arm, and the other end of which is connected to the laser.

[0010] In some embodiments, the device further comprises: a connecting head, which is arranged on the rotating arm and is connected to the laser.

[0011] In some embodiments, further comprising: a hook, the hook being disposed on the elastic member; and a connecting portion, the connecting portion being disposed on the connecting head, the connecting portion being configured to connect the hook.

[0012] In some embodiments, the power source comprises:

[0013] a cylinder, the cylinder being rotatably disposed on the base;

[0014] a piston rod, one end of the piston rod being movably disposed in the cylinder, the other end of the piston rod being hingedly connected to the connecting arm.

[0015] The technical scheme of the present application provides a semi-automatic laser marking device for scrap marking of PCBs, comprising: a rack, a maintenance table, a protective cylinder, and a laser. The maintenance table is arranged on the rack and is arranged adjacent to a PCB production line. The protective cylinder is movably arranged on the maintenance table. The laser is arranged in the protective cylinder and is provided with a laser head located in the protective cylinder. The PCB to be scrapped is placed on the maintenance table, and the protective cylinder is used to cover the PCB to be scrapped. At this time, the laser is started, and high-energy laser is emitted through the laser head to burn off the wires on the PCB to be scrapped and mark the PCB to be scrapped. The protective cylinder can fix the height of the laser, avoiding the situation of burning through the product or not cutting off the wires. Through the above steps, it can be ensured that the wires on the PCB to be scrapped are burned off, ensuring that the PCB to be scrapped cannot pass the continuity test, so as to ensure that the PCB to be scrapped cannot flow into the subsequent process, avoiding greater losses. Moreover, the operation of burning off the wires and marking the scrap is simple, which is conducive to improving the efficiency. BRIEF DESCRIPTION OF DRAWINGS

[0016] In order to more clearly illustrate the technical schemes in the embodiments of the present application or the prior art, the drawings needed in the embodiments or the prior art description will be briefly introduced below. Obviously, the drawings in the following description are only some embodiments of the present application, and other drawings can be obtained by those skilled in the art without creative labor.

[0017] Figure 1 FIG. 1 is a perspective view of a semi-automatic laser marking device for scrap marking of PCBs according to an embodiment of the present application;

[0018] Figure 2 FIG. 2 is a side view of the semi-automatic laser marking device for scrap marking of PCBs according to the embodiment of the present application; Figure 1 FIG. 3 is an enlarged view of part A in FIG. 2;

[0019] Figure 3 FIG. 4 is an enlarged view of part B in FIG. 2. Figure 1 FIG. 5 is a sectional view of part B in FIG. 2. DETAILED DESCRIPTION

[0020] With reference to the drawings of the embodiments of the present application, the technical solutions in the embodiments of the present application will be clearly and completely described. Obviously, the described embodiments are only part of the embodiments of the present application, rather than all the embodiments of the present application. Based on the embodiments of the present application, all other embodiments obtained by those of ordinary skill in the art without creative efforts fall within the scope of the present application.

[0021] It should be noted that all directional indications, such as upper, lower, left, right, front, back, and the like, used in the embodiments of the present application are only used to explain the relative position relationship, movement condition and the like between components in a certain posture (as shown in the drawings), and if the certain posture changes, the directional indications also change accordingly.

[0022] It should also be noted that when an element is referred to as being "fixed" or "set" on another element, it can be directly on the other element or can have a middle element. When an element is referred to as being "connected" to another element, it can be directly connected to the other element or can have a middle element.

[0023] In addition, the description involving "first", "second" and the like in the present application is only for the purpose of description, and cannot be understood as indicating or implying the relative importance of the indicated technical features or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "first", "second" can explicitly or implicitly include at least one of the features. In addition, the technical solutions of various embodiments can be combined with each other, but it must be based on the fact that a person of ordinary skill in the art can realize it, and when the combination of technical solutions contradicts each other or cannot be realized, it should be considered that the combination of technical solutions does not exist, and is not within the scope of protection claimed by the present application.

[0024] Referring to Figure 1 As shown in the drawings, the present application provides a semi-automatic laser marking device for scrap marking of PCB, comprising: a rack 1; a maintenance table 2, the maintenance table 2 is arranged on the rack 1, and the maintenance table 2 is arranged near the PCB production line; a protective cylinder 16, the protective cylinder 16 is movably arranged on the maintenance table 2; a laser 10, the laser 10 is arranged on the protective cylinder 16, and the laser 10 is provided with a laser head, and the laser head is located in the protective cylinder 16.

[0025] The rack 1 is the structural basis of the semi-automatic laser marking device for marking scrap PCBs, and other structures on the semi-automatic laser marking device for marking scrap PCBs are directly or indirectly connected with the rack 1. Preferably, the rack 1 is provided with four mounting feet 9, and the mounting feet 9 are beneficial to improving the stability of the rack 1. The maintenance table 2 is arranged on the rack 1, and the maintenance table 2 is the structural basis of all the maintenance or scrap parts in the application. The laser 10 and the protective cylinder 16 constitute the core components of the semi-automatic laser marking device for marking scrap PCBs. The laser 10 emits high-energy laser through the laser head to burn off the wires on the scrap PCB and mark the scrap PCB. The protective cylinder 16 can first avoid laser overflow to protect the eyes of the operator, and the protective cylinder 16 can fix the laser height to avoid the situation of burning through the product or not cutting off the wires.

[0026] Specifically, the scrap PCB is placed on the maintenance table 2, and the protective cylinder 16 covers the scrap PCB. At this time, the laser 10 is started to emit high-energy laser through the laser head to burn off the wires on the scrap PCB and mark the scrap PCB. The setting of the protective cylinder 16 can fix the laser height to avoid the situation of burning through the product or not cutting off the wires. Through the above steps, it can be ensured that the wires on the scrap PCB are burned off, and it can be ensured that the scrap PCB cannot pass the continuity test, so that the scrap PCB cannot flow into the subsequent process, thereby avoiding greater losses. Moreover, the operation of burning off the wires and marking the scrap is simple, which is beneficial to improving the efficiency.

[0027] In detail, in the embodiment, the PCB needs to be subjected to visual inspection (VRS) during the production process. The visual inspection device is placed on the PCB production line. When the visual inspection device reports that the PCB has an appearance defect, the worker can directly take the PCB with the appearance defect to the maintenance table 2. The PCB with the problem that cannot be repaired is subjected to scrap processing. The PCB without the problem or the repaired PCB can be returned to the production line. By arranging the maintenance table 2 near the PCB production line, the repairable or misjudged PCB can almost not leave the production line, which is beneficial to improving the production efficiency. The computer 8 and other maintenance devices are arranged on the maintenance table 2. Since the other maintenance devices are not the invention points of the application, they are not limited in detail here. The computer 8 is used to adjust the energy parameters of the laser 10 and the shape of the scrap mark. Preferably, the protective cylinder 16 is further provided with an identification unit for identifying the position of the scrap PCB and transmitting a position signal back to the computer 8. The energy parameters of the laser 10 are adjusted by the computer 8 to make the laser head emit laser beams with different energies at different positions, so as to ensure that the wires on the scrap PCB can be burned off and the scrap mark can be marked at the appropriate position.

[0028] Although not specifically limited in the present embodiment, the rack 1 is formed by welding cold-rolled steel plates and cold-rolled steel strips. The surface of the rack 1 is treated by plastic spraying, so that the rack 1 has strong stability and corrosion resistance. Moreover, the rack 1 has excellent mechanical properties, which is conducive to the semi-automatic laser marking equipment for marking the scrap PCB to adapt to various harsh environmental conditions.

[0029] Referring to Figure 1 In some embodiments, as shown in the drawings, the device further comprises a balance bracket 5 arranged on the maintenance table 2, a connecting plate 4 arranged at one end of the balance bracket 5 away from the maintenance table 2, the balance bracket 5 being a structural basis of the connecting plate 4, so that the connecting plate 4 can be installed at a higher position, and an elastic member having one end connected to the connecting plate 4 and the other end connected to the laser 10, the connecting plate 4 being a structural basis of the elastic member, so that the elastic member can be installed at a higher position. Since the laser 10 and the protective cylinder 16 are very heavy, the operator will have a great labor intensity and is prone to accidents when moving the laser 10 and the protective cylinder 16 by brute force. The elastic member can offset part of the gravity through the elastic force, which is convenient for the operator to perform the scrap operation.

[0030] In the present embodiment, the elastic member is a spring balancer 3, one end of the spring balancer 3 is locked on the connecting plate 4, and the other end is connected to the laser 10. The spring balancer 3 reduces the operation difficulty of the laser 10 and the protective cylinder 16, which is conducive to ensuring the normal operation of the scrap operation.

[0031] Referring to Figure 1 and Figure 3 In some embodiments, as shown in the drawings, the device further comprises a base 11 arranged on the maintenance table 2, the base 11 being firmly fixed on the maintenance table 2 by fasteners, the base 11 preferably being provided with a circular bottom, a circle of screws being arranged on the circular bottom to realize the connection with the maintenance table 2, an arm bracket 12 arranged on the base 11, the arm bracket 12 being in the shape of a rectangular cylinder and being provided with a cavity, part of the connecting arm 7 being located in the cavity, the connecting arm 7 being rotatably installed on the arm bracket 12, a bearing being arranged between the connecting arm 7 and the arm bracket 12, a power source for driving the connecting arm 7 to rotate, the power source for driving the rotating arm 6 to rotate, the rotating arm 6 having one end connected to the connecting arm 7 and the other end connected to the laser 10. The rotating arm 6 is used to change the position of the laser 10. Since it is not difficult to rotate the rotating arm 6, no rotating drive is arranged here, and the rotating can be realized by the manpower of the operator. When performing the scrap operation, the power source is disabled under the control of the computer 8, at this time, the power source will not lock the connecting arm 7 nor drive the connecting arm 7, the operator drives the connecting arm 7 to press down by the manpower, and adjusts the rotating arm 6 when necessary, so that the protective cylinder 16 can completely cover the PCB, and the subsequent scrap operation is realized.

[0032] In the embodiment, after the PCB is scrapped, the laser 10 and the protective cylinder 16 need to be lifted to avoid affecting the detection or repair work of other PCBs. Since the laser 10 and the protective cylinder 16 are heavy, it is difficult to lift the laser 10 and the protective cylinder 16. By setting the power source, the laser 10 and the protective cylinder 16 can be driven by the power source after being scrapped, thereby reducing the labor intensity of the workers.

[0033] Referring to FIGS. 1 and 2, in some embodiments, the device further comprises a connecting head 15, the connecting head 15 is arranged on the rotating arm 6, and the connecting head 15 is connected to the laser 10. Figure 1 Figure 2 Referring to FIGS. 1 and 2, in some embodiments, the device further comprises a connecting head 15, the connecting head 15 is arranged on the rotating arm 6, and the connecting head 15 is connected to the laser 10.

[0034] Referring to FIGS. 1 and 2, in some embodiments, the device further comprises a connecting head 15, the connecting head 15 is arranged on the rotating arm 6, and the connecting head 15 is connected to the laser 10. Figure 1 Figure 2 Referring to FIGS. 1 and 2, in some embodiments, the device further comprises a connecting head 15, the connecting head 15 is arranged on the rotating arm 6, and the connecting head 15 is connected to the laser 10.

[0035] Referring to FIGS. 1 and 2, in some embodiments, the device further comprises a connecting head 15, the connecting head 15 is arranged on the rotating arm 6, and the connecting head 15 is connected to the laser 10. Figure 1 Figure 3 Referring to FIGS. 1 and 2, in some embodiments, the device further comprises a connecting head 15, the connecting head 15 is arranged on the rotating arm 6, and the connecting head 15 is connected to the laser 10.

[0036] In the embodiment, the base 11 is further provided with an air cylinder, an air pump and a plurality of electromagnetic valve bodies, and the action of the power source is controlled by the computer 8. The piston rod 14 is hinged to a pair of sleeve plates 13, and the two sleeve plates 13 of the same pair are arranged on the two sides of the piston rod 14. The sleeve plate 13 is rotatably arranged on the force arm support 12, and the sleeve plate 13 is connected to the connecting arm 7 to transmit power to the connecting arm 7.

[0037] The above description is only some or preferred embodiments of the present application, neither the text nor the drawings can limit the scope of protection of the present application, any equivalent structural transformation using the content of the present application specification and drawings, or direct / indirect application in other related technical fields is included in the scope of protection of the present application.​​​

Claims

1. A semi-automatic laser marking apparatus for scrap marking of PCBs, characterized in that, The utility model relates to a kind of laser head movable device, including: Rack (1); Maintenance platform (2), the maintenance platform (2) is set to the rack (1), and the maintenance platform (2) is adjacent to PCB production line setting; Protective cylinder (16), the protective cylinder (16) is movably set to the maintenance platform (2); Laser (10), the laser (10) is set to the protective cylinder (16), the laser (10) is provided with laser head, and the laser head is located in the protective cylinder (16).

2. A semi-automatic laser marking apparatus for scrap marking of PCBs as claimed in claim 1, wherein, Further including: Balancing bracket (5), the balancing bracket (5) is set to the maintenance platform (2); Connecting plate (4), the connecting plate (4) is set to the balancing bracket (5) away from one end of the maintenance platform (2); Elastic member, one end of the elastic member is connected the connecting plate (4), and the other end of the elastic member is connected the laser (10).

3. A semi-automatic laser marking apparatus for scrap marking of PCBs as claimed in claim 2 wherein, Further including: Base (11), the base (11) is set to the maintenance platform (2); Force arm support (12), the force arm support (12) is set to the base (11); Connecting arm (7), the connecting arm (7) is rotatably installed to the force arm support (12); Power source, the power source is used to drive the connecting arm (7) rotation; Rotating arm (6), one end of the rotating arm (6) is connected the connecting arm (7), and the other end of the rotating arm (6) is connected the laser (10).

4. A semi-automatic laser marking apparatus for scrap marking of PCBs as claimed in claim 3 wherein, Further including: Connector (15), the connector (15) is set to the rotating arm (6), and the connector (15) is connected the laser (10).

5. A semi-automatic laser marking apparatus for scrap marking of PCBs as claimed in claim 4 wherein, Further including: Lifting hook (17), the lifting hook (17) is set to the elastic member; Connecting portion (18), the connecting portion (18) is set to the connector (15), and the connecting portion (18) is used to connect the lifting hook (17).

6. A semi-automatic laser marking apparatus for scrap marking of PCBs as claimed in claim 3 wherein, The power source includes: Air cylinder, the air cylinder is rotatably set to the base (11); Piston rod (14), one end of the piston rod (14) is movably set to the air cylinder, and the other end of the piston rod (14) articulates the connecting arm (7).

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